Abstract: An apparatus for depositing a ta-C thin film for a magnetic recording medium includes a film deposition chamber; a plasma beam formation portion for supplying a plasma beam to the film deposition chamber to form the ta-C thin film on a substrate with a magnetic recording layer thereon; a substrate holder rotatably arranged in the film deposition chamber; a tilting member for continuously changing an inclination angle of the plasma beam to a surface of the magnetic recording layer; and a rotating member for rotating the substrate about a rotation axis of the substrate holder. A control member rotates the substrate holder with the substrate thereon and operates the tilting member to continuously change the inclination angle from a minimum inclination angle to a maximum inclination angle according to an increase in film thickness of the ta-C thin film being formed by the plasma beam formation portion.

Abstract: Described are apparatus and methods for forming silicon interfacial layers on germanium or III-V materials. Such silicon layers may be deposited by atomic layer deposition at specific temperatures to avoid interdiffusion of silicon and the germanium or III-V material.

Abstract: A droplet discharge device is configured to control the drive corresponding to a prescribed set of the nozzles selected to discharge droplets during a main scan when the droplets are arranged in the first partition regions, based on a pre-measured distribution of a droplet discharge amount of each of the prescribed set of the nozzles so that the droplet discharge amount approximates a predetermined optimal amount, and to control the drive waveforms corresponding to the nozzles included in a plurality of potential combinations of the nozzles selected to discharge droplets during a main scan when the droplets are arranged in the second partition regions, based on a pre-measured distribution of an average droplet discharge amount calculated from an amount of droplets discharged from the each of the nozzles in all the potential combinations so that the droplet discharge amount approximates the predetermined optimal amount.

Abstract: A method of applying a coating solution onto an upper surface of a glass plate that is transported in a substantially horizontal attitude, according to the first aspect of the present invention, the method including the steps of transporting the glass plate into a coating chamber, and opening the plurality of coating nozzles which are positioned in a row at constant intervals therebetween along a curved shape of the upper surface of the glass plate in a width direction of the glass plate perpendicular to the direction of transporting the glass plate by the nozzle position adjusting means and the nozzle height adjusting means, to thereby inject the coating solution when the coating nozzles are located in a region of the upper surface of the glass plate which extends from the leading edge of the glass plate to the rear edge of the glass plate.

Abstract: A chuck and a wafer supported thereon are rotated during a plasma process or a film deposition process to reduce thickness non-uniformity of a film processed or deposited on the wafer.

Abstract: An apparatus for determining an endpoint of a process by measuring a thickness of a layer is provided. The layer is disposed on the surface by a prior process. The apparatus includes means for providing a sensor that is coplanar with the surface, wherein the sensor is configured to measure the thickness. The apparatus also includes means for exposing the plasma chamber to a plasma, wherein the thickness is changed by the exposing, and means for determining the thickness as a function of time. The apparatus further includes means for ascertaining a steady state condition in the thickness, the steady state condition being characterized by a substantially stable measurement of the thickness, a start of the steady state condition representing the endpoint.

Abstract: Embodiments of the invention relate to a method and apparatus for coating a medical device. In one embodiment, the method for preparing a substantially uniform coated medical device includes (1) preparing a coating solution comprising a solvent, a therapeutic agent, and an additive; (2) loading a metering dispenser with the coating solution; (3) rotating the medical device about the longitudinal axis of the device and/or moving the medical device along the longitudinal or transverse axis of the device; (4) dispensing the coating solution from the metering dispenser onto a surface of the medical device and flowing the coating solution on the surface of the medical device while the medical device is rotating and/or linearly moving; and (5) evaporating the solvent, forming a substantially uniform coating layer on the medical device.

Abstract: The apparatus and method use an optical feedback system to align a brush assembly with a stent strut. Once alignment is achieved, a coating is dispensed onto the stent strut via the brush assembly and the brush assembly is moved along the stent strut to coat the stent strut.

Abstract: A method and apparatus for controlling coating material deposition on to a medical device. Images of material drops in flight are captured and an average single drop volume value is calculated by conversion of the captured drop images to a volume measurement. The average single drop volume value is used to calculate a total number of drops necessary to apply a desired amount of coating. Alternately, material is applied and the amount of material deposited is accumulated and adjustments are made to deposit only a desired amount of coating material. A drop volume is determined for either every drop or a sampling of drops as the drops are being applied. Adjustments to the coating process include changing drop size and changing a number of drops to be deposited.

Abstract: Systems and methods for adjusting a moisture concentration of veneer are provided. In at least one specific embodiment, the method for adjusting a moisture concentration of a veneer can include estimating a moisture concentration of a veneer surface at one or more locations thereon. The method can also include comparing the one or more estimated locations to a minimum moisture concentration level. The method can also include moisturizing at least a portion of the one or more estimated locations that are below the minimum moisture concentration level to increase the moisture concentration thereof.

Abstract: A process of coating at least one substrate with a plurality of deposition sources, a method of tooling, a carrier unit and a deposition system are described. The systems and methods provide for or allow for exposing a first substrate portion 112a of said at least one substrate 112 to a first deposition source 118a through an aperture 122 of a carrier unit 110, 510, depositing a first layer 126a over the first substrate portion, said first layer including material from said first deposition source, varying a relative position between said at least one substrate and said aperture for exposing a second substrate portion of said at least one substrate, or another substrate, to a second deposition source, and depositing a second layer 126b over the second substrate portion 112b, said second layer including material from said second deposition source.

Abstract: A method of forming a standard mask for an inspection system is provided, the method comprising providing a substrate within a chamber, and providing a tetraethylorthosilicate (TEOS) precursor within the chamber. The method further includes reacting the TEOS precursor with an electron beam to form silicon oxide particles of controlled size at one or more controlled locations on the substrate, the silicon oxide particles disposed as simulated contamination defects.

Abstract: A method for depositing a film includes arranging a substrate in a plasma enhanced chemical vapor deposition chamber. A first ashable hardmask (AHM) layer that is carbon-based is deposited on the substrate. During the depositing of the first AHM layer, doping is performed with at least one dopant selected from a group consisting of silicon, silane, boron, nitrogen, germanium, carbon, ammonia, and carbon dioxide. An atomic percentage of the at least one dopant is greater than or equal to 5% of the first AHM layer.

Abstract: A squeegee holder including a self-cleaning sliding mechanism, a squeegee blade, two end caps at each end of the squeegee blade. The end caps include a flange and a hole. Two actuating motors are attached to the flanges, the motors include drive shafts pointing downwards. A wiper blade is attached to a blade mount slidable along the squeegee blade and a drill rod is secured at each end with press fittings into the holes in the end caps.

Abstract: To provide a coating apparatus and a coating method capable of accurately control the coating width of a coating liquid on an article to be coated.

Abstract: A semiconductor manufacturing apparatus includes: a treatment chamber treating a treated film of a wafer using a desired chemical fluid; a film thickness measurement unit measuring an initial film thickness of the treated film before treatment and a final film thickness of the treated film after treatment; and a main body controlling unit calculating a treatment speed of the chemical fluid from the initial film thickness, the final film thickness, and a chemical fluid treatment time taken from the initial film thickness to the final film thickness to calculate a chemical fluid treatment time for a wafer to be treated next from the calculated treatment speed.

Abstract: A method and a configuration provide dynamic control of a liquid supply for a moisturizing storage device for sealing glued edges of a envelope flap of letter envelopes. Once a measured value has been measured for a sealing liquid which is stored in the tank of a moisturizing apparatus, the type of sealing liquid that is used is qualitatively analyzed on the basis of the measured value and of at least one material parameter as a comparison value. The amount of liquid stored in the moisturizing storage device is then measured by at least one further measurement to allow dynamic control of the liquid supply to the moisturizing storage device as a function of the material parameter and of at least one measured value, which is related to the liquid consumption, in the result of the at least one measurement of the amount of liquid stored in the moisturizing storage device.

Abstract: An apparatus and method of manufacturing a light emitting diode (LED) device, and more particularly, an apparatus and method of manufacturing an LED device by dispensing a fluorescent solution prepared by mixing a fluorescent material with a liquid synthetic resin, onto an LED chip. An apparatus and method of manufacturing an LED device, whereby an appropriate amount of fluorescent solution simultaneously in consideration of several factors, such as characteristics of an LED chip and viscosity of the fluorescent solution may be dispensed onto the LED chip, is provided. An apparatus and method of manufacturing an LED device, whereby an appropriate amount of fluorescent solution may be calculated actively in consideration of viscosity of the fluorescent solution, a change in characteristics of an LED chip, or the like, and the appropriate amount of fluorescent solution may be dispensed onto the LED chip, is provided.

Abstract: A method of manufacturing a plurality of secondary containment panels and assembling and installing the panels in a secondary containment system of an above-ground liquid storage tank or other retention facility includes forming a plurality of flexible substrate pieces. A liquid impermeable coating is applied to the upper surface of each piece such that an edge segment of the piece remains uncoated. The coating is applied to the substrate piece in an indoor enclosure using a computer controlled robotic sprayer that applies a uniform coating. Metal plates are embedded in the floor used for quality control testing of the coating thickness using magnetic gauges. At least a pair of the pieces are juxtaposed relative to one another such that a first one of the pieces overlaps the uncoated segment of the second piece to form a seam.

Abstract: A resin layer formation method, resin layer formation device, disk and disk manufacturing method for making a resin layer uniform on a substrate before lamination or on a substrate to be coated by a simple procedure are provided. Adhesive A is coated at the inner circumference side while rotating a substrate P at low speed, a first adhesive layer AL1 is formed on the surface of the substrate P by rotating the substrate P at high speed, a step difference section H is formed around a rotation center of the substrate P by irradiating ultraviolet on an area in the inner circumference side of the first adhesive layer AL1 and hardening the area, the adhesive A is coated at the rotation center side from the step difference section H on the substrate P, and a second adhesive layer AL2 is formed on the first adhesive layer AL1 by rotating the substrate P at high speed. The first adhesive layer AL1 and the second adhesive layer AL2 are integrated to form a uniform adhesive layer B as a whole.

Abstract: A method for generating a motion path for a spray gun for coating a component is disclosed. Path templates for surface segments of the component are defined, the surface is analyzed, a first motion path is generated, a model of the spray profile is simulated, the coating thickness is simulated for the motion path based on the simulated model of the spray profile and the generated first motion path. The simulated coating thickness is compared with tolerances and when the simulated coating thickness does not achieve the tolerances, an adapted motion path is generated. The coating thickness is simulated for the motion path based on the simulated model of the spray profile and the generated adapted motion path. Repeating the comparing, the motion path generation, and the simulation of the coating thickness based on the generated adapted motion path until the simulated coating thickness achieves the tolerances.

Abstract: A flux spraying system controls a flux sprayer to selectively spray soldering flux onto a printed circuit board (PCB) by a fixture. The fixture is disposed between the PCB and the flux sprayer, and comprises a plurality of openings corresponding to target areas of the PCB. The flux spraying system comprises a statistic module, a calculation module, and a control module. The statistic module records attributes of the fixture to determine spraying areas on the fixture. The calculation module calculates movement parameters of the flux sprayer, a movement length during a movement period and spraying segments of the flux sprayer, and spray duration of the flux sprayer based on the movement length during one movement period and the spraying segments of the flux sprayer. The control module directs the flux sprayer to coat the target areas of the PCB through the openings of the fixture.

Abstract: The imprint apparatus of the present invention includes a holding unit configured to hold a mold; a particle inspection unit configured to inspect whether or not particle is present on an imprint area, in which the resin pattern is formed, of the substrate; a dispenser configured to apply an uncured resin to the imprint area; a movable unit configured to move the imprint area with respect to the holding unit; and a controller. The movable unit is capable of moving the imprint area to each of an inspection position by means of the inspection unit, an application position by means of the dispenser, and a contacting position by means of the holding unit. Also, the controller causes the inspection unit to perform inspection of the imprint area in association with the movement of the imprint area by means of the movable unit.

Abstract: A process for measuring, monitoring and/or controlling directed product movements of fluidized products in process systems (1) selected from fluidized bed and spouted bed systems during a spraying process for coating and/or granulation, which includes, with the aid of one or more microwave sensor devices (8), injecting microwave radiation without contact into one or more product streams, receiving the microwave radiation reflected by the particles of the particular product stream and, on the basis of the microwave radiation received, forming and transmitting a measurement signal for the characterization of the product stream, the corresponding use of microwave sensor devices (8) and correspondingly equipped apparatus (1).

Abstract: Provided is a vacuum vapor deposition system including: a vapor depositing source; a film thickness sensor for monitoring; and a film thickness sensor for calibration, in which a distance L1 from a center of an opening of the vapor depositing source to the film thickness sensor for calibration and a distance L2 from the center to the film thickness sensor for monitoring satisfy a relationship of L1?L2, and angle ?1 formed by a perpendicular line from the center of the opening of the vapor deposition source to a film formation surface of the substrate and a straight line connecting the center of the opening of the vapor depositing source to the film thickness sensor for calibration, and angle ?2 formed by the perpendicular line and a straight line connecting the center of the opening of the vapor depositing source to the film thickness sensor for monitoring satisfy a relationship of ?1??2.

Abstract: The coating instrument is provided with a coating head which has a plurality of head members, and in which a groove-like slot is formed, an adjustment unit accommodated in a recessed groove installed on a leading end face continuing to an outer face opposite to an inner face or to the inner face in the head member to adjust the width of the slot by pressing a side wall face of the recessed groove, and a controller for controlling a pressing force to the side wall face of the recessed groove by the adjustment unit. The adjustment unit is provided with a fluid pressure chamber into which a fluid is sealed, a pressing portion for pressing the side wall face of the recessed groove by the fluid pressure of the fluid pressure chamber, and an operating portion for allowing the fluid pressure of the fluid pressure chamber to change.

Abstract: In the present invention, a substrate is first rotated at a first rotation speed, and a resist solution is applied to the rotated substrate. Subsequently, the rotation of the substrate is decelerated to a second rotation speed lower than the first rotation speed so that the substrate is rotated at the low speed to smooth the resist solution on the substrate. The rotation of the substrate is then accelerated to a third rotation speed higher than the second rotation speed, and a solvent for the coating solution and/or a dry gas are/is supplied to the resist solution on the substrate. In this event, the solvent gas is supplied to a portion of the resist solution on the substrate thicker than a set thickness, and the dry gas is supplied to a portion of the coating solution on the substrate thinner than the set thickness. This thins the thicker portion of the resist solution and thickens the thinner portion to uniform the resist solution.

Abstract: Embodiments of the invention generally provide a solar cell formation process that includes the formation of metal contacts over heavily doped regions that are formed in a desired pattern on a surface of a substrate. Embodiments of the invention also provide an inspection system and supporting hardware that is used to reliably position a similarly shaped, or patterned, metal contact structure on the patterned heavily doped regions to allow an Ohmic contact to be made. The metal contact structure, such as fingers and busbars, are formed on the heavily doped regions so that a high quality electrical connection can be formed between these two regions.

Abstract: There is provided a liquid application apparatus capable of performing stable application without providing a new mechanism, by efficiently removing an application liquid increased in viscosity and fixedly adhered to an abutting portion between an application member and a liquid supplying member. A liquid application apparatus includes an application member that applies a liquid supplied to an applied face to a printing medium by rotating an application roller and a liquid holding member that abuts against the applied face to form a liquid holding space for holding the liquid, and the amount of liquid that is held in the liquid holding space and makes contact with the application member in unit time is larger before an applying operation for applying the liquid to the printing medium than in the applying operation.

Abstract: A hot melt adhesive system includes a melting unit configured to liquefy a bulk form of hot melt adhesive and deliver the liquefied hot melt adhesive to an application location. The melting unit includes a controller for establishing and/or verifying at least one system condition, such as temperatures associated with system operation. A machine reading unit is coupled with the controller and is capable of receiving information from a machine readable element and communicating the information to the controller for use in establishing and/or verifying the system condition. A method of operating the system includes scanning information on at least one system condition into the controller from a machine readable element, and using the scanned information during operation of the melting unit.

Abstract: An impurity doping system is disclosed, which includes an impurity doping device for doping an impurity into a surface of a solid state base body, a measuring device for measuring an optical characteristic of an area into which the impurity is doped, and an annealing device for annealing the area into which the impurity is doped. The impurity doping system realizes an impurity doping not to bring about a rise of a substrate temperature, and measures optically physical properties of a lattice defect generated by the impurity doping step to control such that subsequent steps are optimized.

Abstract: An electron gun evaporation apparatus capable of efficiently using an evaporation source includes an electron beam position controller which determines, as an applicable range, a range within which the distribution of the film thickness growth rate is almost constant in each scanning direction of an electron beam to be applied to an evaporation source in a crucible for the irradiation position of the electron beam, on the basis of information pertaining to the electron beam irradiation position and the film thickness growth rate in the electron beam irradiation position.

Abstract: The liquid coating method includes the step of ejecting droplets from nozzles of a recording head onto an imaging region of a surface of a substrate placed on a support plate, wherein a dot pitch ? that is an interval between landing positions of the droplets on the surface of the substrate satisfies a following condition: ? ? 2 ? 3 ? V ? ( 1 + cos ? ? ? a ) ? sin ? ? ? a ? ? ( 1 - cos ? ? ? a ) ? ( 2 + cos ? ? ? a ) 3 where V stands for a volume of a droplet ejected from each of the nozzles and ?a stands for an advancing contact angle of the droplet against the substrate.

Abstract: Provided is a method of forming a tantalum oxide-based film having good step coverage while controlling an oxygen concentration in the film. The method includes forming a tantalum nitride layer on a substrate by supplying a source gas including a tantalum and a nitriding agent into a process chamber wherein the substrate is accommodated under a condition where a chemical vapor deposition (CVD) reaction is caused; oxidizing the tantalum nitride layer by supplying an oxidizing agent into the process chamber under a condition where an oxidation reaction of the tantalum nitride layer by the oxidizing agent is unsaturated; and forming on the substrate a conductive tantalum oxynitride film wherein an oxygen is stoichiometrically insufficient with respect to the tantalum and a nitrogen by alternately repeating forming the tantalum nitride layer on the substrate and oxidizing the tantalum nitride layer a plurality of times.

Abstract: Embodiments of the invention also generally provide a solar cell formation process that includes the formation of metal contacts over heavly doped regions that are formed in a desired pattern on a surface of a substrate. Embodiments of the invention also provide an inspection system and supporting hardware that is used to reliably position a similarly shaped, or patterned, metal contact structure on the patterned heavily doped regions to allow an Ohmic contact to be made. The metal contact structure, such as fingers and busbars, are formed on the heavily doped regions so that a high quality electrical connection can be formed between these two regions.

Abstract: A photoresist-coating apparatus includes a substrate on which a particle-detecting area and an invalid particle-detecting area are defined, a nozzle discharging photoresist to the substrate and moving along a direction, and a particle-detecting sensor controlling on and off of the nozzle in the particle-detecting area according to presence of particles, wherein in the invalid particle-detecting area, the nozzle operates independently from detection of the particle-detecting sensor.

Abstract: An apparatus for processing coating material includes a crucible having a receptacle for receiving coating material, a drive member having a drive shaft, a cover coupled to the drive shaft, and a monitor system including a light source and a camera module. The cover includes a flat surface, a slot defined in the flat surface, a first through hole and a second through hole respectively communicating with opposite ends of the slot. The drive shaft drives the cover to rotate between a closed position where the cover covers the receptacle, and the flat surface presses and flattens the coating material, and an open position where the cover is moved away from the receptacle. The light source is for emitting light through the first through hole to illuminate the coating material. The camera module is for capturing images of the illuminated coating material through the second through hole.

Abstract: The present disclosure provides a detecting device of a birefringent lens grating. The detecting device includes a projection pattern disposed adjacent to the birefringent lens grating; an illuminating light source for projecting light onto the projection pattern and the birefringent lens grating; an image capturing device for capturing the light out from the birefringent lens grating and obtaining a projection pattern image of the projection pattern; and a controller for comparing the projection pattern image with a reference to determine a refractive index matching degree of the birefringent lens grating. The present disclosure further provides a detecting method, a manufacture method and a manufacture device of the birefringent lens grating.

Abstract: An apparatus (20) for producing a particle film according to the present invention is an apparatus for producing a particle film by sweeping a meniscus area (5) in a particle dispersion liquid (4) filling a space between a first substrate (1) and a second substrate (2) facing the first substrate (1) and by forming the particle film on the first substrate (1) while evaporating a solvent in the meniscus area (5), including: particle concentration measuring means (3) for measuring a concentration of particles in the meniscus area (5); and particle concentration adjusting means (13) for adjusting the concentration of particles in the meniscus area (5) in accordance with the particle concentration measured by the particle concentration measuring means (3).

Abstract: A plasma etching apparatus capable of performing processing with excellent in-plane uniformity on an object to be processed having a large diameter is provided.

Abstract: A method and a system for manufacturing two-dimensional and three-dimensional nanostructures and nanodevices are described, wherein the formation of the nanostructure (of the nanodevice) on a target substrate is made, at a millimetric or super-millimetric distance from the substrate, by the deposition of material emitted in the form of an atomic/molecular beam having a selected pattern corresponding, at an enlarged scale, to the desired pattern of the nanostructure (nanodevice). The projection of the patterned beam through a diaphragm, associated with the substrate at a micrometric or sub-micrometric distance and having at least one shaped aperture of nanometric size, brings about the formation of a nanostructure pattern which is a convolution of the patterned beam with the diaphragm aperture.

Abstract: There is disclosed a film forming method comprising continuously discharging a solution adjusted so as to spread over a substrate by a given amount to the substrate through a discharge port disposed in a nozzle, moving the nozzle and substrate with respect to each other, and holding the supplied solution onto the substrate to form a liquid film, wherein a distance h between the discharge port of the nozzle and the substrate is set to be not less than 2 mm and to be in a range less than 5×10?5 q? (mm) given with respect to a surface tension ? (N/m) of the solution, discharge speed q (m/sec) of the solution continuously discharged through the discharge port, and a constant of 5×10?5 (m·sec/N).

Abstract: The system (1) for the continuous vacuum coating of a continuously suppliable material in web form (2) provided with feed means; at least one inlet chamber (4), wherein the transition between the inlet atmospheric pressure and the vacuum pressure of a coating chamber (5) incorporating at least one vacuum deposition module (6) for depositing metallic and/or dielectric components on the material in web form is carried out; at least one outlet chamber (7); and collecting means (8) which collect the coated material in web form. The system further comprises drive and support means (9), on which the material in web form is fixed for its transport and by one of its faces, which material follows a preferably straight path at least through the coating chamber.

Abstract: The present invention provides a processing system, a processing method and a program, which can readily control a gas flow rate. A vertical-type heating apparatus 1 includes a plurality of gas supply pipes 16 to 20 each adapted for supplying a processing gas into a reaction vessel 2 configured to contain therein semiconductor wafers W. For the gas supply pipes 16 to 20, flow rate control units 21 to 25 are provided, respectively, for controlling each flow rate. In a control unit 50, processing conditions including the flow rate of the processing gas and a film thickness-flow rate-relationship model indicative of a relationship between the flow rate of the processing gas and a film thickness, are stored.

Abstract: An apparatus includes a housing defining a chamber in which an electric field is generated, and an internal member provided in the chamber. At least one part of the internal member is formed of a dielectric material. A process is executed in the chamber so that a dielectric deposit is formed on the at least one part of the internal member. An m1(d?1/dm1) value of the dielectric material and an m2(d?2/dm2) value of the dielectric deposit are set so that production of particles from the deposit is properly controlled. The term m1 is a mass density of the dielectric material, ?1 is a permittivity of the dielectric material, m2 is a mass density of the dielectric deposit, and ?2 is a permittivity of the dielectric deposit.

Abstract: An application and infusion system for applying a resin to one or more fiber tows and for infusing the fiber tows with the resin, wherein each of the fiber tows is moving at a respective fiber speed. The application and infusion system includes a deposition and infusion system comprising one or more nozzles configured to deposit the resin on a respective one of the fiber tows. The system further includes a controller configured to control a flow rate of the resin through each of the nozzles relative to the fiber speed of the respective ones of the fiber tows. Other aspects of the application and infusion system are also provided.

Abstract: An apparatus for coating a film on a substrate are presented. According to principle of the invention, firstly, a control device controls a first coating device to spray a coating solution onto the substrate. Then, a sensor monitors viscosity data of the coating solution presented between the first coating device and the substrate during movement of the first coating device and sends the viscosity data to the control device, or the sensor monitors viscosity data of the coating solution coated on the substrate and sends the viscosity data to the control device. Lastly, the control device controls a second coating device to spray a coating solution onto the substrate after the first coating device according to signals about the viscosity data from the control device.

Abstract: The liquid ejection apparatus has: a head having a nozzle group including a plurality of nozzles which are aligned in a first direction and performs ejection of resist liquid onto a wiring substrate; a scanning device which causes the head and the wiring substrate to move relatively in the first direction; an ejection control device which controls the ejection of the resist liquid from the head; and a scanning control device which controls the scanning device in such a manner that the head and the wiring substrate are relatively moved only once in the first direction, through a region of the wiring substrate which corresponds to one relative movement in the first direction of the wiring substrate and the scanning device, wherein the ejection control device controls the ejection of the resist liquid from the head to cause the resist liquid to be ejected onto a same position of the wiring substrate sequentially, at prescribed time intervals, from different nozzles of the nozzle group, to deposit the resist liqu

Abstract: Exemplary production methods for producing a paint plant component, e.g., for producing a component of a colour changer, a colour valve, or a spray device, are disclosed. According to the exemplary illustrations, the paint plant component may be produced in a rapid prototyping method. The exemplary illustrations also include a paint plant component that is produced accordingly.

Abstract: An vapor deposition control system includes a multi-level control scheme.