Abstract: Holding devices for receiving a plurality of substrates in a substrate treatment system are disclosed. Holding devices comprise a flange, at least one segment that is releasably disposed on the flange, and at least one carrier for receiving one or a plurality of substrates. The flange has connection faces for disposing the at least one segment on the flange. The at least one segment has a segment support structure. The at least one carrier is assembled on the segment support structure.

Abstract: This disclosure is directed to an improved process for making glass articles having optical coating and easy-to clean coating thereon, an apparatus for the process and a product made using the process. In particular, the disclosure is directed to a process in which the application of the optical coating and the easy-to-clean coating can be sequentially applied using a single apparatus. Using the combination of the coating apparatus and the substrate carrier described herein results in a glass article having both optical and easy-to-clean coating that have improved scratch resistance durability and optical performance, and in addition the resulting articles are “shadow free.

Abstract: A placement member (1) in accordance with an embodiment of the present invention includes a base (4) having a placement section (3) on which an object (2) is placed, and a coating film (5) that coats at least a part of the placement section (3). The placement section (3) has a bottom face (8), a plurality of projections (9) projecting from the bottom face (8), and an annular protrusion (10) that protrudes from the bottom face (8) at the same height as the plurality of projections (9) and surrounds the plurality of projections (9). The coating film (5) has a first region (15) that coats top faces (11) of the projections (9) and a second region (16) that coats a top face (13) of the annular protrusion (10) and has a smaller thickness than that of the first region (15).

Abstract: A substrate holding device includes a base body that has a flat plate-like shape and that includes gas passages that open in an upper surface of the base body, and a plurality of protrusions that protrude from the upper surface of the base body. At least an upper part of each of the protrusions has a conical frustum shape having a base angle of 70° or more and 85° or less.

Abstract: Hydrating an object bearing a latent fingerprint and then selectively drying the object leaving the fingerprint hydrated. The hydrated fingerprint is then coated with cyanoacrylate ester, preferably in a heat accelerated cyanoacrylate ester vacuum chamber. Hydrating is preferably accomplished by chilling the object below a dew point and then exposing the object to humidified air to condense a thin uniform layer of water over the object and latent fingerprint. Drying is preferably done with a vacuum. After drying reaches the preferred state, the CE is heated and coats the condensation-hydrated latent fingerprint. Preferably, the method is implemented in an automated system using one computer-controlled chamber for chilling, condensing, vacuum drying, and CE coating the latent fingerprint. The operator simply puts the object in the chamber, initiates the process by computer, and is prompted by the computer to remove the recovered latent print. Prints unrecoverable by prior art means are recovered.

Abstract: A susceptor having a recessed portion and a ring-like step portion is arranged in a reaction chamber, and a plurality of through bores are formed in a bottom wall in the recessed portion excluding the step portion. A lift pin inserted in each of the through bores temporarily holds a wafer, then a lower surface of an outer peripheral portion of the wafer is mounted on the step portion to accommodate the wafer in the recessed portion, and a raw material gas is circulated in the reaction chamber to form an epitaxial layer on a wafer surface in the recessed portion. When forming the epitaxial layer on the wafer surface, the lift pin protrudes upwards from an upper surface of the bottom wall, and a height h of a top portion of the lift pin based on the upper surface of the bottom wall as a reference is set to the range from a position where the height h exceeds 0 mm to a position immediately before the lift pin comes into contact with the wafer.

Abstract: Provided are a substrate moving unit for use with a deposition apparatus that allows a deposition material to be precisely deposited on a target site of a substrate. The substrate moving unit includes an electrostatic chuck having a first surface on which a substrate is fixable and a magnetic force applying unit disposed on a second surface of the electrostatic chuck. A deposition apparatus including the substrate moving unit, a method of manufacturing an organic light-emitting display apparatus, and an organic light-emitting display apparatus manufactured by using the method are also presented.

Abstract: A method and apparatus for processing multiple substrates simultaneously is provided. Each substrate may have two major active surfaces to be processed. The apparatus has a substrate handling module and a substrate processing module. The substrate handling module has a loader assembly, a flipper assembly, and a factory interface. Substrates are disposed on a substrate carrier at the loader assembly. The flipper assembly is used to flip all the substrates on a substrate carrier in the event two-sided processing is required. The factory interface positions substrate carriers holding substrates for entry into and exit from the substrate processing module. The substrate processing module comprises a load-lock, a transfer chamber, and a plurality of processing chambers, each configured to process multiple substrates disposed on a substrate carrier.

Abstract: The present invention is an imprint system including an imprint unit transferring a transfer pattern to a coating film formed on a substrate using a template having the transfer pattern formed on a front surface thereof to form a predetermined pattern in the coating film, the imprint system including: a substrate carry-in/out station connected to the imprint unit, capable of keeping a plurality of the substrates, and carrying the substrate into/out of the imprint unit side; and a template carry-in/out station connected to the imprint unit, capable of keeping a plurality of the templates, and carrying the template into/out of the imprint unit side at a predetermined timing.

Abstract: The invention relates to a deposition device for comprising a processing space with a substrate support disposed therein, as well as several lift pins (50), which can be moved into and out of the plane of the substrate support to assist in introducing a semiconductor substrate into the processing space and removing it therefrom. The device is characterized in that the contact surface (52) of the lift pin (50) that is to be brought into contact with the semiconductor substrate and/or the substrate support is provided with a material layer (54) which has a lower hardness than the semiconductor substrate and/or the substrate support. This eliminates the risk of damage being caused to the substrate and/or to the substrate support as a result of said substrate shifting undesirably upon being lifted from and lowered onto the substrate support (susceptor). Thus there is no risk of scratches being formed and of particles being released, which might adversely affect the semiconductor manufacturing process.

Abstract: A substrate temperature regulation fixed apparatus has a base substance on which a vacuumed object is placed, an adhesive layer and a base plate. The base substance is fixed on the base plate through the adhesive layer. The adhesive layer contains a substance having plasma resistance.

Abstract: A portable fingerprint development system having a container and a base plate. The container includes a plurality of joined walls that present an opening and a rim surrounding the opening. The base plate has opposed first and second surfaces. The first surface mounts a heater that is operable to heat a fingerprint development material. The base plate is moveable between a transport position, in which the first surface is adjacent the container's rim and the heater is positioned within the container, and an operation position, in which the second surface is adjacent the container's rim to enclose an interior volume defined by the container's walls and the base plate. Preferably, an exhaust system is mounted on the first surface of the base plate for removing and/or filtering fumes within the container.

Abstract: The invention provides a multi-film forming apparatus including a substrate holder stock chamber for storing a plurality of substrate holders separately from a path in the multi-film forming apparatus, so that production can be performed without being affected by the process of removing a film accumulated on the surface of the substrate holder and the process of replacing the substrate holder, or by the process of removing a film accumulated on the surface of the substrate holder or the process of replacing the substrate holder, and hence high-throughput production is possible. A branch path is provided on the path of the multi-film forming apparatus, and a substrate holder stock chamber for storing a plurality of substrate holders which enables retrieval of the substrate holder from the path and feeding of the substrate holder to the path is provided.

Abstract: A substrate holding apparatus can meet the request for a smaller-sized compact apparatus while ensuring a sufficient immersion depth of a substrate in a processing liquid. The substrate holding apparatus includes: a substrate holder for supporting a substrate (W) by bringing a peripheral portion of a surface of the substrate (W) into contact with a first sealing member; and a substrate pressing section for lowering relative to the substrate holder so as to press the substrate (W) held by the substrate holder downward, thereby bringing a first sealing member into pressure contact with the substrate (W). The substrate pressing section is provided with a second ring-shaped sealing member which makes pressure contact with an upper surface of a ring-shaped holding section of the substrate holder, thereby sealing the peripheral region of the substrate pressing section.

Abstract: A thin film deposition apparatus and an organic light-emitting display device by using the same. The thin film deposition apparatus includes an electrostatic chuck, an a plurality of chambers; at least one thin film deposition assembly; a carrier; a first power source plug; and a second power source plug. The electrostatic chuck includes a body having a supporting surface that contacts a substrate to support the substrate, wherein the substrate is a deposition target; an electrode embedded into the body and applying an electrostatic force to the supporting surface; and a plurality of power source holes formed to expose the electrode and formed at different locations on the body. The plurality of chambers are maintained in a vacuum state. The at least one thin film deposition assembly is located in at least one of the plurality of chambers, is separated from the substrate by a predetermined distance, and is used to form a thin film on the substrate supported by the electrostatic chuck.

Abstract: An exemplary film coating holder includes a main body, a plurality of workpiece holders, and a driving module. The main body includes a plurality of through holes defined therein and a central axis. The main body is capable of rotating around the central axis. Each workpiece holder is arranged in each through hole and pivotally connected with the main body by an axle. A rotating guide groove is defined around each axle. The driving module includes a control unit and a shaft. The control unit inserts the shaft in the rotating guide groove of the workpiece holder. When the main body is rotating around the central axis, the shaft can drive the workpiece holder to turn over by the guiding of the rotating guide groove.

Abstract: A system is provided for plasma treating a plastic component having an exterior surface and an inside surface. The system comprises at least one fixture. The fixture includes a support structure, a plurality of locating features, and a plurality of holding devices which cooperate to position a portion of the exterior surface to within a specified tolerance. The system further comprises at least one APAP nozzle configured to move relative to the exterior surface along a path, wherein the APAP nozzle directs a plasma jet onto the portion producing a functionalized polymer layer covering the portion.

Abstract: A substrate holding apparatus can meet the request for a smaller-sized compact apparatus while ensuring a sufficient immersion depth of a substrate in a processing liquid. The substrate holding apparatus includes: a substrate holder for supporting a substrate (W) by bringing a peripheral portion of a surface of the substrate (W) into contact with a first sealing member; and a substrate pressing section for lowering relative to the substrate holder so as to press the substrate (W) held by the substrate holder downward, thereby bringing a first sealing member into pressure contact with the substrate (W). The substrate pressing section is provided with a second ring-shaped sealing member which makes pressure contact with an upper surface of a ring-shaped holding section of the substrate holder, thereby sealing the peripheral region of the substrate pressing section.

Abstract: During fluid treatment of a substrate surface, a carrier/wafer assembly containing a substrate wafer closes the top of a microcell container. The carrier/wafer assembly and the container walls define a thin enclosed treatment volume that is filled with treating fluid, such as electroless plating solution. The thin fluid-treatment volume typically has a volume in a range of about from 100 ml to 500 ml. Preferably a container is heated and the treating fluid is pre-heated before being injected into the container. Preferably, the chemical composition, temperature, and other properties of fluid in the thin enclosed fluid-treatment volume are dynamically variable. A rinse shield and a rinse nozzle are located above the container. A carrier/wafer assembly in a rinse position substantially closes the top of the rinse shield.

Abstract: Provided are a method of effectively manufacturing an organic EL element with high quality and an apparatus therefor. A surface to be processed of a substrate in an upper electrode forming step is held downward, and the surface to be processed of the substrate in a passivation layer forming step is held upward.

Abstract: The subject invention relates to a method of applying the hydrocarbon barrier inside plastic fuel tanks. The plastic fuel tanks are supported on a carrier in an upright position for movement in a loop through inverted positions. While upright, hot and dry air treats the inside of the plastic fuel tanks followed by injecting SO3 inside the plastic fuel tanks through the nozzles. The SO3 is extracted from the plastic fuel tanks followed by injecting ammonia into the tanks through a second nozzle. After extracting ammonia from the plastic fuel tanks, the tanks are inverted and drained followed by a rinsing with a high pressured water and drying with hot air.

Abstract: The specification discloses a structure and method for measuring the etching speed. A test layer is connected with several resistors. Etching the metal layer disconnects in order the resistors from the circuit. The equivalent resistance of the sensing resistor system is measured to obtain the etching speed. In consideration of the errors of the resistors, the invention also provides a structure that utilizes an IC layout technique to put an interdigitized dummy resistor beside the sensing resistors. By taking the ratio of the equivalent resistance of the sensing resistors and the dummy resistor, the invention can compute to obtain the etching speed.

Abstract: A machine for processing a flat workpiece or wafer has a head, which spins the wafer between upper and lower weirs in a base. The head is spaced apart from the base by an air gap. A vacuum source attached to an exhaust opening in the base draw air through the air gap, to reduce or eliminate movement of process chemicals into the head. Corrosion of head components by process chemicals is reduced. The disadvantages of having a mechanical seal between the base and the head are also eliminated.

Abstract: An article (e.g. a semiconductor wafer) is held in an article holder by means of a number of gas flows emitted from gas vortex chambers. Some of the gas flows act to cool an adjacent article portion more than the other gas flows. For example, some of the vortex chambers emit more gas per unit of time than the other chambers. More cooling is provided to those portions of the article which are heated more during processing. Greater temperature uniformity can be achieved.

Abstract: To achieve a uniform coating of a substrate, with an apparatus and a method for coating substrates, according to which the substrate is supported on a substrate holder in such a way that a substrate surface that is to be coated is exposed, and the substrate is rotated together with the substrate holder, a cover can be secured to the substrate holder and together with the substrate holder forms a sealed chamber for the substrate.

Abstract: To move an article in and out of plasma during plasma processing, the article is rotated by a first drive around a first axis, and the first drive is itself rotated by a second drive. As a result, the article enters the plasma at different angles for different positions of the first axis. The plasma cross-section at the level at which the plasma contacts the article is asymmetric so that those points on the article that move at a greater linear velocity (due to being farther from the first axis) move longer distances through the plasma. As a result, the plasma processing time becomes more uniform for different points on the article surface. In some embodiments, two shuttles are provided for loading and unloading the plasma processing system. One of the shuttles stands empty waiting to unload the processed articles from the system, while the other shuttle holds unprocessed articles waiting to load them into the system.

Abstract: An apparatus for application of a chemical process to a workpiece in which movement and precise location of the workpiece within the apparatus is accomplished by means of a single linear actuator and two locator components. A sequence of liquid solutions may be applied to a surface of the workpiece during processing, and a sequence of controlled atmospheres may be provided within a reaction chamber of the apparatus to thereby facilitate implementation of chemical processes that utilize both liquid-phase and gas-phase reactions in concert.

Abstract: An etching apparatus for manufacturing semiconductor devices which reduces contamination of the processing surface of a wafer by transporting a plurality of wafers stacked in a cassette with their processing surfaces facing down from the cassette supply chamber to one or more process chambers where the etching operation is performed on each wafer, one at a time. The apparatus has a load lock chamber for transferring the wafers stacked in the cassette from the cassette supply chamber, which is maintained under atmospheric conditions, to the process chamber, which is maintained under a strong vacuum. The process chamber has a cathode to which a wafer is clamped by a wafer holder with its processing surface facing down; the process chamber may also have a removable lower cover for easy repair and cleaning.

Abstract: An etching apparatus for manufacturing semiconductor devices which reduces contamination of the processing surface of a wafer by transporting a plurality of wafers stacked in a cassette with their processing surfaces facing down from the cassette supply chamber to one or more process chambers where the etching operation is performed on each wafer, one at a time. The apparatus has a load lock chamber for transferring the wafers stacked in the cassette from the cassette supply chamber, which is maintained under atmospheric conditions, to the process chamber, which is maintained under a strong vacuum. The process chamber has a cathode to which a wafer is clamped by a wafer holder with its processing surface facing down; the process chamber may also have a removable lower cover for easy repair and cleaning.

Abstract: A method for producing a semiconductor laser device includes the steps of: forming a reflection protective film on a light-emitting facet of a semiconductor laser device; and removing an unwanted reflection protective film formed on a portion other than the light-emitting facet by an etching technique. Furthermore, an apparatus for producing a semiconductor laser device, includes: a formation section forming a reflection protective film on a light-emitting facet of a semiconductor laser device; an etching section removing an unwanted reflection protective film formed on a portion other than the light-emitting facet by an etching technique; a device inverting section turning the semiconductor laser device upside down; and a device transferring section transferring the semiconductor laser device among the formation section, the etching section, and the device inverting section in a predetermined order.

Abstract: For coating substrates (17,18,20,21,22) in a vacuum-coating chamber (2) the substrates are introduced by an air lock into the coating chamber (2) and moved along a transport path in front of the coating sources (50a,b,c,d) producing a coating cloud. To this end, the substrates (17,18,20,21,22) are led past the coating sources (50a,b,c,d) by means of holding devices (24) arranged movably on a transport belt (9) during at least two successive coating phases. During the one coating phase, the substrates (17,18,20,21,22) are oriented along one transport direction T.sub.3 oriented towards the coating sources (50a,b,c,d) such that essentially the substrate bottom of the cylindrical substrate is coated. During the subsequent second coating phase, the substrates are oriented in front of the coating sources (50a,b,c,d) in a direction T.sub.4 opposite the transport direction T.sub.3, wherein the substrates (17,18,20,21,22) are oriented such that essentially the cylindrical side surface is coated.

Abstract: A vacuum coating apparatus includes a carrier accommodating substrates to be coated; and an evaporation source vertically spaced from the carrier and emitting a vapor stream onto the substrates mounted on the carrier. The carrier includes at least two radially adjoining segments each accommodating at least one substrate to be coated and a hinge interconnecting adjoining segments for allowing a tilting motion of the segments to either side relative to one another up to a predetermined angle.

Abstract: A PECVD coating apparatus includes a vacuum coating chamber for performing a PECVD process. At least one pair of spaced apart electrodes is positioned within the chamber and powered by an electric power supply generator to produce a plasma discharge generating voltage between the electrodes. Gas is fed between the electrodes in the chamber for producing a plasma discharge reaction that, in turn, forms a coating reaction product. A holding member is placed in the chamber for positioning one or more workpieces with their opposite surfaces at equally spaced positions from each of the electrodes of the pair of electrodes. The workpieces are electrically isolated from the chamber through the holding member so that a free floating electrical potential is maintained on the workpieces. As a result, the opposite surfaces of the workpieces are substantially identically coated in the chamber using the PECVD process.

Abstract: The present invention relates to a processing chamber that processes an object to be processed in an atmosphere of a processing gas. The processing chamber is provided with a mounting stand having a holder mechanism that holds the object to be processed within the processing chamber. The mounting stand is connected to a rotational mechanism and is free to rotate, and the holder mechanism on the mounting stand is also provided with a separate, independent rotational mechanism whereby the front surface and rear surface of the object to be processed can be rotated (inverted) relative to the mounting stand. Thus the present invention provides a processing method and apparatus therefor in which the front surface and rear surface of the object to be processed can be processed under the same conditions, without having to change the atmospheric status of the object to be processed.

Abstract: The invention provides apparatus and methods for improving systems which expose samples to reactive plasmas, and more particularly for inverting the sample within these systems. The systems are of the type which have one or more process chambers, at least one intermediate chamber, and a robot transport mechanism to transport the sample between the several chambers. The invention includes flipping and gripping assemblies which mount within the intermediate chamber. These assemblies grasp and remove the sample as transported by the robot mechanism, and invert the sample within the intermediate chamber. The inverted sample is re-positioned at the robot mechanism so that the sample can be transported to one or more process chambers for deposition in a "face down" orientation, which reduces contamination.

Abstract: A flat substrate carrier comprising a machined main surface for supporting substrates to be treated, a surface opposite to the main surface and coating on all sides. The main surface may have been machined with a view to the removal of the treated substrates from the main surface following treatment. The opposite surface has been subjected to such a machining operation or treatment that the mechanical stresses at both surfaces substantially compensate each other. The opposite surface may be machined over substantially the same area as the main surface, for example by using a material-removing operation or an EDM-operation. Both surfaces may have been subjected to the same operation. In case a treatment is carried out, which treatment may be a physical or a chemical treatment, just like the treatment by which the coating is applied, the thickness of the coating at the opposite surface may be less than the maximum thickness of the coating at the main surface.

Abstract: A coating apparatus has one coating station with a downwardly directed device to coat both opposite surfaces of two sided circuit boards. One upwardly facing surface of a first board is coated at the coating station and moved to a handling station while a second board is moved to the coating station where its upwardly facing surface is coated while the first board is inverted at the handling station. The first board is then moved to the coating station while the second board is removed to a handling station, and the opposite side of the first board is coated at the coating station while the second board is inverted at the handling station. The two boards are exchanged in the coating station and then the opposite side of the second board is coated there while the first board is exchanged with a third board at the handling station.

Abstract: A suspension system for hanging a susceptor inside a reactor for processing semiconductor wafers. A hanger is provided with a flange at its lower end for supporting the susceptor. A collar has an internal flange which engages with another flange at the upper end of the hanger. The collar flange and the hanger flange each have a trucated, conical contact surface which are in substanitally continuous contact with each other. The mating flanges permit the susceptor to self-center and provide for different rates of thermal expansion of the collar and hanger.

Abstract: In a vacuum vapor deposition apparatus for coating one side of an optical substrate in an evacuable container, above at least one vapor source, a rotatable support structure is provided. The support structure includes a plurality of at least approximately circular segment-shaped pivotable support plates which are positionable cup-like relative to each other and are supported on a common rotating axle, each pivotable about 180.degree.. Each of the pivotable support plates has support areas on both sides with mechanisms for clamping securely substrates which are to be coated on one side and which sit on the respective supporting areas.

Abstract: The sputtering apparatus for the present invention is used for manufacturing optical discs. On loading and unloading of disc substrates to and from a vacuum chamber, a disc entrance and exit opening provided on the vacuum chamber is closed by a tray having an opening at the center thereof on which the disc substrate is placed and a push up rod having a closing side closing the opening of the tray on the lower side thereof. Sealing of the disc entrance and exit opening may be made positive and the vacuum chamber is uniformly evacuated so that an excellent sputtering can be performed.

Abstract: A lens holder, particularly for eyeglass lenses to be coated in a high-vacuum vapor deposition or sputtering system, is formed as a ring pair. The ring pair is connectable to a substrate holder that is mounted in the process chamber of the high-vacuum system in the proximity of a coating source. The lens can be placed between the rings of the ring pair, which are secured to one another by resilient wires. An outer surface of a first ring is provided with ramps that interact with resilient wires that are secured to the outer surface of a second ring. One of the rings includes two diametrically opposite pegs which serve to pivotably mount the lens holder in bearing forks mounted on the substrate holder. The lens holder is capable of 180.degree. of rotation.

Abstract: A method and apparatus for manufacturing a magnetic recording medium at high efficiency. A flexible web is passed around first and second cooling cans. The web is reversed between the two cans so that the same surface of the web is directed to the outside on both cans. A single evaporation source produces an evaporated stream of magnetic film forming material which impinges on the web as it passes around both cans, thereby to form two films of the evaporated magnetic material on the same surface of the web.

Abstract: An apparatus for holding and turning lenses, particularly for eyeglass lenses to be coated in a high-vacuum vapor deposition or sputtering system. A ring pair carrying the lens to be held is seated on a substrate holder in the process chamber of the high-vacuum system. The substrate holder is a sheet metal part shaped like a half shell, and is rotatable about a vertical axis. A sickle shaped sheet metal blank forms a rake that partially overlaps the substrate holder. The rake is held and guided by a guide ring that is displaceable in the direction of the rotational axis of the substrate holder. The rake is displaceable by a lifting element of a lifting motor secured to the wall of the chamber. The rake includes individual tines having lower edges facing toward the substrate carrier. The tines engage pinions or gear wheels on the individual lens holders. The lens holders are mounted to the substrate via pegs, which allow the lens holders to pivot 180.degree..

Abstract: A very economical process for coating both sides of boards, in particular printed circuit boards, with a liquid coating material, includes the insertion of the boards in a turnover device, wherein first one side is coated, then the board is turned over and the other side is coated. Alternatively, the first side is coated, then the board is turned in a stationary turnover device and its second side is then coated. The process is carried out as follows: 1. Coating the first side of the board. 2. Turning over the board. 3. Coating the second side of the board. 4. Drying both sides together. The board is held or supported during the process by two of its opposite edges.

Abstract: The cup like support of a vacuum vapor deposition apparatus for substrates to be coated comprises a plurality of pivotable support plates each with a plurality of openings for substrate holders. The substrate holders can have a frame partially embracing the substrate received in it in which the substrate sits acted on by a retaining spring and which is attached to the support plate freely tiltable on both sides about a tilting axle. Alternatively at least one of the substrate holders is tiltable and each of the remaining holders is nontiltable having a gripping arm attached at its inner end to a tension providing spring at the edge of an opening in the support plate which is covered by a pair of circular plates. Because of these features a nearly complete fit of the shape of the support to the ideal shape of a cup can be attained by the freely tiltable substrate holders which tilt from the support plate plane to a predetermined angle.

Abstract: Wafers are unloaded from a hot wafer processing boat of the type having a plurality of elongated parallel electrodes defining elongated processing gaps therebetween with the wafers being serially spaced apart lengthwise of the gap. A wafer carrier, into which the wafers are to be unloaded from the hot boat, has elongated receiving means, preferably formed by folds of the wafer carrier, extending lengthwise of the elongated electrodes of the boat. The wafer carrier is positioned over the boat and the boat and the carrier are inverted so that the wafers drop from the hot boat into the receiving means of the wafer carrier. In a preferred embodiment, once the wafers have been unloaded onto the folded wafer carrier, the wafer carrier is unfolded to facilitate access to the wafers.

Abstract: A pinchuck is formed in accordance with this invention by using lithographic techniques to define and to etch a pattern of pins from an extremely flat etchable surface. Since the pins are formed from a surface which is already flat, it is not necessary to level or polish the pins after they are formed. Since lithographic techniques are used, the pin head dimensions, the number of pins, the arrangement of pins, and the density of pins all may be freely chosen without affecting the fabrication cost. By surrounding the region of etched pins with an unetched band, a raised peripheral ring will be formed which can act as a vacuum sealing ring when the pinchuck is used as a vacuum pinchuck. By fabricating the pins from an electrically conductive material (such as doped silicon) and then covering the pins with a dielectric film (such as silicon dioxide), the pinchuck can be used as an electrostatic pinchuck.

Abstract: Automated reactor system and process for etching or otherwise processing semiconductor wafers in a plasma environment. The wafers are carried into and out of a reaction chamber by a conveyor and processed on an individual basis. Within the chamber, an electrode mounted on a swinging arm carries each wafer from the conveyor to a processing position adjacent to a stationary electrode. Gas is admitted to the chamber, and the electrodes are energized to ionize the gas and form a plasma for processing the wafer between the electrodes.