Abstract: A cutting belt comprises a guide bar system that includes a guide bar. The guide bar has a first end section, a second end section, and a central section between the first end section and the second end section. A first upper fluid channel is defined through the guide bar. The first upper fluid channel has an entrance opening in the first end section of the guide bar and extends to the central section of the guide bar where it is in fluid communication with a bottom channel. The second upper fluid channel has an entrance opening in the second end section of the guide bar and extends to the central section of the guide bar where it is in fluid communication with the bottom channel.

Abstract: A multiplicity of wafers are simultaneously cut from an ingot using a structured sawing wire having indentations and protrusions along its length, wherein the structured sawing wire is guided through grooves of two wire guide rolls, and a bottom of each groove, on which the structured wire bears, has a curved groove bottom with a radius of curvature which, for each groove, is equal to or up to 1.5 times as large as the radius of the envelope of the structured wire which the structured wire has in the respective groove.

Abstract: A seed crystal for single crystal 4H-SiC growth of the present invention is a disk-shaped seed crystal for single crystal 4H-SiC growth having a diameter of more than 150 mm and having a thickness within a range of more than or equal to 1 mm and less than or equal to 0.03 times of the diameter, in which one surface on which the single crystal 4H-SiC is grown is a mirror surface and an Ra of the other surface is more than 10 nm, and an absolute value of magnitude of waviness in a state where the seed crystal is freely deformed so that an internal stress distribution is reduced is less than or equal to 12 ?m.

Abstract: A wire saw apparatus including: a plurality of wire guides; a wire row formed of a wire which is wound around the plurality of wire guides and configured to reciprocatively travel in an axial direction; a nozzle configured to supply a coolant or slurry to the wire; a workpiece-holding portion configured to suspend and hold a workpiece plate having a workpiece bonded thereto with a beam interposed therebetween; a workpiece-feeding mechanism configured to press the workpiece against the wire row; and a mechanism configured to adjust a parallelism of axes of the plurality of wire guides around which the wire row is formed. Thereby, a wire saw apparatus and a method for manufacturing a wafer are provided which enable manufacturing of a wafer having any warp shape by controlling a warp in a wire travelling direction of a sliced workpiece.

Abstract: A device for cutting a plate or panel of porous construction material includes a movement structure that moves the plate or panel and includes at least one conveyor, and which is able to move in a direction (X). The device also includes a wire to cut the plate or panel and a structure for passing the wire in a direction (Y) perpendicular to the direction (X) of travel of the plate or panel. The device for cutting allows a cut to be made that greatly limits the waste and dust generated.

Abstract: A cutting device of cutting a soft honeycomb mold body in a cutting direction perpendicular to an axial direction of the honeycomb mold body. A cutting device has a wire, a tension supply part and a pair of ultrasonic generators. The wire has a contact part which is stretched and in contact with the honeycomb mold body when the honeycomb mold body is cut. The tension supply part supplies tensile to the contact part when the honeycomb mold body is cut. The pair of ultrasonic generators have respective vibrator terminals arranged in contact with the contact part of the wire. The ultrasonic generators generate ultrasonic vibration in the cutting direction and supply the generated ultrasonic vibration directly to the wire.

Abstract: An apparatus (10) for machining a workpiece (12) comprises at least two machining elements (14a, 14b) and a rotating belt (16) for moving the machining elements (14a, 14b) relative to a workpiece (12) to be machined. The machining elements (14a, 14b) each comprise a main body (20a, 20b) and a first connecting element (22a, 22b) connected to the main body (20a, 20b), which first connecting element is connectable to a second connecting element (24a, 24b) complementary to the first connecting element (22a, 22b) and connected to the belt (16). The first connecting element (22a, 22b) comprises a rotary body (26a, 26b). The second connecting element (24a, 24b) has a connection area (28a, 28b) for connection with the rotary body (26a, 26b). When the rotary body (26a, 26b) is rotated in a first rotary direction (R1) the rotary body (26a, 26b) is connected to the connection area (28a, 28b).

Abstract: In various aspects, the diamond wire saw apparatus disclosed herein includes a frame formed in a U-shape from a first rail and a second rail secured to a base, the first rail and the second rail being parallel to one another and perpendicular to the base. Several pulleys are disposed about the frame, and a diamond wire is engaged with the several pulleys to be cycled about the several pulleys. Some of the several pulleys traverse portions of the frame in opposing directions to maintain a selected tension in the diamond wire as the diamond wire is advanced while being cycled to cut a workpiece releasably engaged with the frame. The first rail, the second rail, and the base are formed in sections to be sized to correspondingly size an interior region of the frame to accommodate a workpiece by selective inclusion of sections in the first rail, the second rail, and the base.

Abstract: There is provided a method of making a tool blade, in which a backing strip is provided, binding material in powder form is cascaded onto the backing strip, abrasive particles are provided and the binding material powder is heated by laser beam to form a binder layer which binds the abrasive particles to the backing strip. The laser beam is used to form discrete regions of binder layer as teeth. The binding material is typically braze material. A blade made according to the method is also provided.

Abstract: A cutting bead (13) for a saw rope (15) comprises a geometrically defined cutting portion (2) and tapers from the geometrically defined cutting portion (2) contrary to a sawing direction. With such cutting beads (13), a saw rope (15) is formed. In a method for manufacturing a saw rope (15), a cutting element (1) with a geometrically defined cutting portion (2) and an abrasive element (6) with a geometrically undefined cutting portion (14) or a neutral element (8) are joined. With the cutting element (1) and the abrasive element (6) or the neutral element (8), a cutting bead (13) is formed. The cutting bead (13) is joined onto the support rope (16).

Abstract: A workpiece holder for slicing the workpiece by a wire saw including a workpiece plate which is bonded and fixed to the workpiece through a pad plate, and a holder main body which supports the workpiece plate. The workpieces at an x axis direction and a direction vertical to the same is a y axis direction, the workpiece plate is bonded and fixed to the workpiece to correct a deviation of a crystal orientation axis of the workpiece in the x axis direction. The workpiece holder can adjust a tilt in the y axis direction of the workpiece by tilting the workpiece plate in the y axis direction. The workpiece holder can realize slicing an ingot conforming to specifications with rigorous orientation standards in an external setup manner without using a wire saw including an orientation adjustment mechanism for a single crystal ingot, and a method for slicing a workpiece.

Abstract: A method of shaping a laminated glass structure comprising a flexible glass sheet having a thickness of no greater than about 0.3 mm laminated to a non-glass substrate by an adhesive layer is provided. The method includes cutting the laminated glass structure with an abrasive cutting jet including a pressurized cutting fluid and abrasive particles thereby forming a shaped laminated glass structure. A glass edge strength of a cut edge of the shaped laminated glass structure is at least about 20 MPa.

Abstract: A device for cutting a block of stone that includes a support bar including a monolithic metallic plate. The device also includes a wear bar that is secured to the monolithic metallic plate and has a longitudinal slot, and a cutting belt positioned in the longitudinal slot of the wear bar and including a cutting surface to cut the stone. A method of cutting the stone is also disclosed.

Abstract: A pressing head of the ingot slicing apparatus includes: a head main body in which a plurality of pneumatic supply ports configured to supply compressed air are formed so that pressure on each portion of the pressing head is separately controlled; pressing units installed on a lower end of the head main body, located to correspond to the pneumatic supply ports, and each configured to apply pressure to a side surface of an ingot by the compressed air supplied through each of the pneumatic supply ports; pneumatic correction units each installed on a lower surface of each of the pressing units and configured to control a pressure deviation between the plurality of pressing units; an adhesive plate installed to be in contact with lower side surfaces of the pneumatic correction units so that a lower surface of the adhesive plate is in direct contact with and presses the side surface of the ingot; and a coupling support unit configured to couple and support the head main body, the pressing units, the pneumatic corr

Abstract: A polysilicon chip reclamation assembly includes a polysilicon cleaning apparatus configured to clean a plurality of bodies of polysilicon. Also included is a plurality of polysilicon chips generated from the bodies of polysilicon during cleaning thereof, wherein each of the plurality of polysilicon chips has a longest dimensional length ranging from 0.1 mm to 25.0 mm. Further included is a polysilicon apparatus drain line configured to route the plurality of polysilicon chips from the polysilicon cleaning apparatus to a main chip drain line, wherein the main chip drain line is oriented at a downward slope away from the polysilicon apparatus drain line. Yet further included is a fluid source fluidly coupled to the main chip drain line and configured to inject a fluid into the main chip drain line to drive the plurality of polysilicon chips through the main chip drain line.

Abstract: The wire saw device includes at least one wire, which is provided tightly to be capable of travelling in a direction crossing a workpiece to be cut, a workpiece holder, which is configured to hold the workpiece and to move the workpiece relative to the wire, slurry suppliers, which are configured to supply slurry to cut the workpiece from an upstream side in a travelling direction of the wire, and slurry collectors, which are configured to collect the slurry scattered due to contact with the workpiece. The slurry collector is configured to be movable in conjunction with the workpiece in the state where the slurry collector is disposed adjacent to the workpiece and also configured to be retractable with respect to the workpiece to be prevented from contacting the wire.

Abstract: A wire sawing apparatus of one embodiment comprises: a wire for cutting an ingot; an ingot conveyor unit for conveying the ingot to the wire; a nozzle for supplying slurry to the wire; and a dispersed slurry blocking unit disposed above the ingot sawed by the wire, so as to absorb at least a part of the slurry dispersed from the lateral sides of the ingot cut by the wire.

Abstract: Provided are a porous media bearing for a band saw, a band saw for cutting cant and a method of cutting cant using the band saw. The band saw has a continuous loop blade supported by a drive wheel and first and second support arms having porous media bearings. A location of a blade cutting section, an angle of the blade in relation to the cant being cut, and tension on the blade can be adjusted by moving the first and second support arms.

Abstract: A plurality of bushings are coupled to one another via a series of bolts to provide an interlocking, articulating cutter. The bolts have a cylindrical end and a convex end. The convex ends are seated inside a concave socket coupled to the bushings. The cylindrical ends are coupled to a convex nut seated inside another concave socket coupled to an adjacent bushing. The convex ends of the bolts are configured to articulate inside the seat of the concave sockets. A washer may be placed between the bushings to provide a desired amount of flexibility and/or rigidity. The outer surface of the bushing comprises a cutting structure, such as a milled or clad cutting structure.

Abstract: Method for slicing a workpiece, including measuring a crystal axis orientation while holding a workpiece with a workpiece holder, setting the workpiece holder to a wire saw in such a manner that the measured crystal axis orientation is maintained, then adjusting a sliced plane orientation, pressing the workpiece against a wire row to slice the workpiece; the workpiece holder includes a portion slidable while holding the workpiece and a portion for fixing the slide portion, after measuring the crystal axis orientation, sliding the slide portion to move to the workpiece holder center in a manner that the measured crystal axis orientation is maintained, fixing the slide portion, setting the workpiece holder to the wire saw, then adjusting the sliced plane orientation, and slicing the workpiece. This enables an orientation measurement without limitation of distance between an orientation measuring instrument and plane to be measured can inhibit warpage deterioration and workpiece breakage.

Abstract: A machine (12) for working slabs of natural stone, agglomerate or ceramic material comprises: a work bench (14) adapted to receive a slab to be machined; a machining head (16) comprising a spindle (18); and movement means (20) for moving the machining head (16) above the work bench (14). The spindle (18) comprises coupling means (40) which allow a diamond chain tool (42) to be operatively fixed.

Abstract: A wire guide roll for use in wire saws for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece is provided with a coating having a thickness of at least 2 mm and at most 7.5 mm of a material which has a Shore A hardness of at least 60 and at most 99, and which contains a multiplicity of grooves through which the sawing wire is guided, the grooves each having a curved groove base with a radius of curvature which is 0.25-1.6 times the sawing wire diameter, and an aperture angle of 60-130°. A multiplicity of wafers are simultaneously sliced from a cylindrical workpiece by a wire saw using such wire guide rolls.

Abstract: The present invention relates to a wire cutting system and method for subsea cutting of large structures (6). The system includes two feeding towers (2) with feeding tower first ends secured into a seabed floor. A crossbeam (1) is located between the two feeding towers (2). Wire feeding trolleys (8) are connected to the feeding towers (2), whereby the wire feeding trolleys (8) are allowed to move a cutting distance along the feeding towers. A cutting wire (4) traverses between the wire feeding trolleys.

Abstract: The present invention is a fixed-abrasive-grain wire including a core wire and abrasive grains fixed on a surface of the core wire, wherein an abrasive grain density is 1200 grains/mm2 or more, where the abrasive grain density is the number of the abrasive grains per unit area on the surface of the core wire, and 2% or less of all distances between centroids of the abrasive grains are equal to or shorter than an average circle equivalent diameter of the whole abrasive grains. There can be provided a fixed-abrasive-grain wire, a wire saw, and a method for slicing a workpiece that can suppress meandering of the fixed-abrasive-grain wire during slicing a workpiece and improve TTV and warp of wafers sliced from the workpiece.

Abstract: The present invention is a coping saw for performing a coping operation. The saw is operable in a first orientation for performing a first cut and in a second orientation for performing a coping second cut and comprises a handle having one or more power switches for activating and deactivating the drive system in both the first orientation and in the second orientation.

Abstract: A method to make sawing beads by means of laser cladding is disclosed whereby metal matrix powder is molten by means of a laser beam on a rotating sleeve while diamonds are thrown in the molten metal pool. By carefully controlling the temperature of the molten metal pool at or above 1150° C. for less than 200 ms the internal graphitization of the diamonds can be limited. Although some of the diamonds in the sawing bead show internal graphitization it is demonstrated by the inventors that a sawing cord using the bead obtained by the method has an above standard sawing performance.

Abstract: A sample preparation apparatus and method of preparing a rock sample using such an apparatus, as useful in connection with the digital numerical simulation of properties of the rock. The disclosed apparatus includes a fixably mounted diamond wire cutter. Three linear translation stages are coupled to a specimen holder. One of the translation stages moves the specimen in a direction parallel to the plane of the cutting wire. The other two translation stages move the specimen in different directions from one another, and when actuated together, advance the specimen into the wire for short distances in a direction out of the plane of the cutting wire. Short piecewise linear cuts are made in the specimen, to provide a sample of the desired shape with a small cross-section.

Abstract: A diamond wire saw and method provides a frame that includes a clamp that attaches to a target (e.g. piling, beam, tubular), an elongated toothed rack extending away from the mount and target, and a moving portion that carries the diamond wire and motor drives that advance the moving portion toward the target and along the toothed rack while driving the wire around roller guides.

Abstract: A wire saw which has excellent cutting ability and which is not easily clogged by chips formed by cutting is provided. It has a body 6 having a first metal wire 1 which is made of a cobalt-based alloy, two second metal wires 2a and 2b which are made of a cobalt-based alloy, and three third metal wires 3a-3c which are made of a cobalt-based alloy and are wound on the first metal wire 1. The second metal wires 2a and 2b are helically wound on each of the third metal wires 3a-3c in opposite directions so as to cross each other. Cutting teeth are constituted by projections 8 which are formed by the crossing points of the two second metal wires 2a and 2b.

Abstract: Methods and apparatus are provided for selective surgical removal of tissue, e.g., for enlargement of diseased spinal structures, such as impinged lateral recesses and pathologically narrowed neural foramen. In some embodiments, a surgical tissue removal device includes a flexible elongate body that is adapted to conform with the target anatomy and a guidewire connector at the distal end region of the flexible elongate body configured to removably connect to the end of a guidewire so that the guidewire and flexible elongate body can be pulled distally. The body may have at least one blade edge, and the flexible elongate body may be a thin, flat, ribbon shaped flexible body that comprises a profile having a width that is substantially greater than a height.

Abstract: The invention relates to a wire saw having a saw wire drive sheave (2) for driving an endless saw wire, a motor having a motor output shaft directly or indirectly connected to the drive sheave (2) characterized in a at least one torsion suspension device (27), between the motor output shaft and the drive sheave (2), for dampening or absorbing torsion jerk/s to or from the endless saw wire (1).

Abstract: A method of manufacturing a silicon carbide substrate includes the steps of preparing an ingot of single crystal silicon carbide and obtaining a substrate by cutting the ingot. Then, in the step of obtaining a substrate, cutting proceeds in a direction ? in which an angle ? formed with respect to a <11-20> direction or a <1-100> direction of the ingot is 15°±5° in an orthogonal projection on a {0001} plane.

Abstract: An abrasive article may include a substrate, a tacking film overlying the substrate, abrasive particles that may include a coating layer bonded to the tacking film such that a bond between the coating layer and the tacking film defines a metallic bonding region, and a bonding layer overlying the abrasive particles and the tacking film.

Abstract: An abrasive article including a substrate in the form of an elongated member having a core and a barrier layer in direct contact with an peripheral surface of the core. The barrier layer consists essentially of tin. A bonding layer is overlying the elongated substrate and abrasive particles are secured in the bonding layer.

Abstract: The present invention provides a method of resuming operation of a wire saw in which slicing of a workpiece is suspended and then resumed, including slicing the workpiece while detecting a traveling direction and a traveling speed of the reciprocating wire and recording them chronologically; and resuming the slicing while controlling the traveling direction and a traveling time in the traveling direction of the wire on a basis of a wire traveling history recorded until the suspending of the slicing of the workpiece such that the reciprocating cycle of the wire becomes continuous between before the suspending and after the resuming of the slicing of the workpiece. This method enables the slicing to be completed while the nanotopography of the sliced wafer is surely prevented from degrading, even when the slicing of the workpiece with a wire saw is suspended due to, for example, breaking of the wire.

Abstract: The invention a fixed abrasive sawing wire comprising diamond particles held in a metallic retention layer on a steel wire. The steel wire has a diameter less than 300 ???. More than half of the diamond particles (102, 102?, 104, 104?, 104?, 104??) have a cubo-octahedral morphology as obtained in the diamond synthesis by high pressure at high temperature. 95% of the diamond particles have a size of 80 pm or less. The diamond particles predominantly show low elongation below or equal to 0.2 and are not obtained by crushing larger diamonds.

Abstract: An abrasive article includes an elongated body, a bonding layer including a metal overlying a surface of the elongated body, and a coating layer including a polymer material overlying the boding layer. The abrasive article further includes abrasive grains contained within the bonding layer and coating layer, and wherein the bonding layer comprises an average thickness (tbl) at least about 40% of the average grit size of the abrasive grains.

Abstract: An apparatus, a system and a method may use a diamond-impregnated wire loop to cut an underwater pipeline. The apparatus may have a frame, a carriage attached to the frame and/or pulleys connected to the carriage. The diamond-impregnated wire loop may be connected to the pulleys. The carriage may move relative to the frame to direct the diamond-impregnated wire loop in a forward direction relative to the frame and/or through the pipeline.

Abstract: An aqueous coolant fluid for cutting or machining a semiconductor substrate, comprising at least one organic phosphorous containing acid or salt thereof, at least one polyol; and at least one surfactant, and a method of cutting a silicon ingot or wafer using the coolant fluid.

Abstract: The present invention provides a method of cutting a workpiece efficiently with high accuracy by utilizing tension adjusters to approximate tension in a wire in a wire saw to a predetermined target tension while effectively reducing only tension in a winder-side wire. The method comprises a forward-driven cutting step of cutting a workpiece while moving a wire forward, a first switching step of reversing a driving direction of the wire, a backward-driven cutting step of cutting the workpiece while moving the wire backward, and a second switching step of reversing a driving direction of the wire and returning to the forward-driven cutting step, the steps being repeated in this order. In both switching steps, only tension in a winder-side wire is reduced by tension manipulators. A reduction in target wire tension therefor is performed after completion of deceleration of the wire in each switching step.

Abstract: A method for simultaneously cutting a multiplicity of wafers from a cylindrical workpiece having an axis and a notch applied parallel to the axis in a lateral surface of the workpiece includes applying a cut-in beam on the workpiece where the cut-in beam has a head end and a foot end. The head end is inserted into the notch of the workpiece. The workpiece is held with a feed device so as to position an axis of the work piece parallel to the axes of cylindrical wire guide rollers of a wire saw. The cut-in beam is moved through a planar wire web, where the planar wire web has sections of wire arranged parallel to one another and perpendicular to the axes of the wire guide roller. The wire sections are moved the longitudinal wire direction in the presence of abrasives.

Abstract: A method for cooling a cylindrical workpiece during wire sawing includes applying a liquid coolant to a surface of the workpiece. The workpiece is made of semiconductor material having a surface including two end faces and a lateral face. The method includes sawing the workpiece with a wire saw including a wire web having wire sections arranged in parallel by penetrating the wire sections into the workpiece by an oppositely directed relative movement of the wire sections and the workpiece. Wipers are disposed so as to bear on the surface of the workpiece. The temperature of the workpiece is controlled during the wire sawing using a liquid coolant applied onto the workpiece above the wipers so as to remove the liquid coolant with the wipers bearing on the workpiece surface.

Abstract: A device for cutting a block of stone that includes a support bar including a monolithic metallic plate, and a number of fluid ports attached to the plate. The device also includes a wear bar that is secured to the monolithic metallic plate and a lower longitudinal slot, and a cutting belt positioned in the lower longitudinal slot of the wear bar and including a downward-facing cutting surface to cut the block of stone. A method of cutting the stone block is also disclosed.

Abstract: The present invention provides a wiresaw cutting method comprising cutting a workpiece with a wiresaw while applying an aqueous cutting fluid to the wiresaw from a recirculating reservoir of cutting fluid, monitoring at least one of a chemical property, a physical property, or both, and adjusting the chemical composition of the cutting fluid while cutting the workpiece to maintain the property being monitored. The present invention additionally provides an apparatus to perform the inventive method.

Abstract: A cutting chain for a hand-operated implement for cutting metal and mineral materials such as a stone cutter has central connecting links which are connected to one another by lateral connecting links. The central connecting links comprise first central connecting links which each have a drive tooth. The cutting chain has two central connecting links with drive teeth shaped differently to the drive teeth on the first central connecting links; or located a different distance from the leading drive teeth; or having no drive teeth. A hand-operated implement for cutting mineral materials has a drive motor which drives the cutting chain around a guide bar by a drive sprocket. The cutting chain is guided round part of the circumference of the drive sprocket and round a nose sprocket on the guide bar. The drive sprocket or nose sprocket have different first and second areas matched to the cutting chain.

Abstract: A chain bar unit for a wall saw is presented herein. The chain bar unit can include a bar configured to receive a circulating chain or wire around a perimeter of the bar. The chain bar unit also can include a driving gear for driving the chain or wire around the bar, the driving gear configured to be coupled to an output shaft of the wall saw. The chain bar unit further includes the bar being tapered from an end proximate to the driving gear to a distal end having a distal end radius, wherein a width of the bar at the proximate end, is at least two times the distal end radius of the distal end.

Abstract: A fixed abrasive grain wire saw that can improve precision of a cut plane of a workpiece and grinding efficiency and can prolong product life, a method of manufacturing the fixed abrasive grain wire saw, and a method of machining a workpiece by the fixed abrasive grain wire-saw. To fasten abrasive grains to an outer circumferential surface of a metal core wire, a plurality of transfer rollers, in each of which many tiny holes filled with an adhesive are formed, are used to transfer the adhesive to the outer circumferential surface of the core wire to form, on the outer circumferential surface, a plurality of rows of punctiform adhesive layers that are linearly arrayed in the axial direction at regular intervals. The abrasive grains are tentatively fastened to the adhesive layers, after which the abrasive grains are permanently fastened with a metal plated layer formed by electrolytic deposition.

Abstract: The present invention provides a wire saw which cuts a workpiece using a cutting wire and is capable of adjusting wire tension with high responsiveness. The wire saw includes first and second workpiece cutting units 1A and 1B. Each of the workpiece cutting units 1A and 1B includes a pair of guide rollers 10a and 10b around which a wire W is wound to form a workpiece-cutting wire group. The wire saw further includes a tension detector 18 which detects tension in the wire W between the workpiece cutting units 1A and 1B, and a control device 50. The control device 50 changes a rotational speed of the guide rollers 10a and 10b of at least one of the workpiece cutting units based on the tension detected by the tension detector 18 so as to keep the tension within an acceptable range.

Abstract: A method including providing a ceramic log (300) with a first end and an opposing second end; providing one or more cutting devices (100) comprised of a dual bladed cutting member (200); and removing material by cutting at least the first end with the dual bladed cutting member (200), wherein a first blade (210) of the dual bladed cutting member (200) provides a finished surface and a second blade (220) removes a percentage of scrap above the finished surface. An apparatus (100) for cutting a ceramic log (300).

Abstract: A method of making a glass forming apparatus with reduced weight includes forming a cavity in the glass forming apparatus and expanding the size of the cavity by abrasively removing material from the glass forming apparatus through application of a wire saw.