Abstract: The device (1) for wire sawing of a piece (10) to be sawed that is mounted on a support table (20) comprises fastening means (15, 26, 40) for fastening said piece (10) to be sawed to a carriage (18) apt to cooperate with a guide rail of said support table (20), said fastening means (15, 26, 40) consisting of a mounting plate (15) apt to be manufactured to which said piece (10) to be sawed is bonded, and of anchoring means (26, 40) for anchoring said mounting plate (15) directly on said carriage (18).

Abstract: Wire for cutting feedstock and a method for cutting feedstock with the wire. The wire may include an iron based alloy comprising at least 35 at % iron, nickel and/or cobalt in the range of about 7 to 50 at %, at least one non-metal or metalloid selected from the group consisting of boron, carbon, silicon, phosphorus, and/or nitrogen present in the range of about 1 to 35 at %, and one metal selected from the group consisting of copper, titanium, molybdenum, aluminum, and/or chromium present in the range of about 0 to 25 at %, wherein the wire has an aspect ratio of greater than one and exhibits metallic and/or crystalline phases of less than 500 nm in size.

Abstract: Abrasive grain powder, in particular intended for machining silicon ingots, such that the granulometric fraction D40-D60 comprises more than 15% and less than 80%, as percentages by volume, of grains having circularity of less than 0.85.

Abstract: The method relates to the manufacture of a reinforced diamond-coated cable for cutting structures and materials of steel, concrete, steel and concrete, stone materials or the like, in which such diamond-coated cable comprises a plurality of outer strands (101) of metal material such as steel or the like wound in a helix around an inner central strand (201) and a series of sheaths (2) inserted along such outer strands (101) and having on their external profiles (202) projecting members of strongly abrasive materials such as industrial diamonds or the like.

Abstract: A superabrasive wire saw-wound structure includes a superabrasive wire saw (10) formed with an average diameter D and a reel (1). The superabrasive wire saw (10) includes a core wire (11), a bonding material (12) surrounding a surface of the core wire (11), and a plurality of superabrasive grains (13) bonded to the surface of the core wire (11) with the bonding material (12). The reel (1) includes a peripheral surface (2) having one end (3) and the other end (4). The superabrasive wire saw (10) which is to be unreeled successively toward a workpiece is wound around the peripheral surface (2) reciprocatingly between the one end (3) and the other end (4) to be multi-layered. A pitch P for winding the superabrasive wire saw (10) around the peripheral surface (2) between the one end (3) and the other end (4) satisfies a relation of D<P<2D.

Abstract: The device (1) for wire sawing of a piece (10) to be sawed that is mounted on a support table (20) comprises fastening means (15, 26, 40) for fastening said piece (10) to be sawed to a carriage (18) apt to cooperate with a guide rail of said support table (20), said fastening means (15, 26, 40) consisting of a mounting plate (15) apt to be manufactured to which said piece (10) to be sawed is bonded, and of anchoring means (26, 40) for anchoring said mounting plate (15) directly on said carriage (18).

Abstract: Embodiments of the disclosure provide an aggregate cutting saw chain having a pitch in the range of approximately 0.440 to approximately 0.450. Embodiments also include tie straps and/or other components having fluid distribution features.

Abstract: The present invention is a method for slicing a workpiece into wafers by pressing a cylindrical workpiece held with a workpiece holder against a wire row formed by a wire spirally wound between a plurality of wire guides and making the wire travel while supplying a slurry to a contact portion between the workpiece and the wire, wherein the workpiece is sliced with an axis direction of the workpiece inclined with respect to a plane formed by the wire row, after the workpiece is inclined in such a manner that a side far from the wire row plane is a side where the wire guides are to be axially expanded. As a result, there is provided a method for slicing that enable wafers having a good Warp shape to be obtained by precisely slicing a workpiece with a wire saw.

Abstract: A system and method for slicing an ingot into wafers using the wire saw process. A slurry collection system collects and supplies slurry to a slurry handling system for controlling temperatures and/or flow rates of the slurry thereby providing slurry output at a controlled temperature and/or a controlled flow rate to slicing system for cutting the ingot, which may be preheated.

Abstract: A deflection device for a rope saw assembly, includes a deflection roller (12; 52; 92); a stationary protective cover (13; 53, 93) surrounding art least some regions of the deflection roller (12; 52; 92); and at least one cover member (23; 63; 102, 103) pivotally arranged on the protective cover (13; 53, 93) surrounding at least some regions of the deflection roller, and displaceable along a path radially spaced from the axle (15; 55; 95) of the deflection roller (12; 52; 92).

Abstract: A method of making a compound semiconductor substrate includes providing a GaN compound semiconductor single crystal ingot, and cutting the ingot with a cutter to form a GaN single crystal substrate. The cutting is performed while controlling a temperature in a contact portion between the ingot and the cutter to be not more than 160° C. such that a cut surface of the GaN single crystal substrate has an arithmetical mean waviness (Wa) not more than 9 ?m.

Abstract: A multiplicity of wafers are sliced from a workpiece which has a longitudinal axis and a cross section, the workpiece fastened on a table being fed by a relative movement directed perpendicularly to the longitudinal axis of the workpiece between the table and the wire gang of a wire saw, with a variable forward feed rate through the wire gang formed by a sawing wire moved with an effective speed, the effective speed of the sawing wire being regulated as a function of the forward feed rate and the workpiece cross section so as to result in uniform wear of the sawing wire.

Abstract: The present invention is a wire saw in which a wire is wound around a plurality of grooved rollers, the workpiece is sliced into wafers by causing the wire to travel and pressing the workpiece against the wire while a slurry is supplied to the grooved rollers, the wire saw controlling in such a manner that the workpiece is sliced while a supply temperature of the slurry is increased from the start to the end of slicing the workpiece. As a result, there is provided a wire saw in which Warp of the workpiece to be sliced can be improved by suppressing a decrease in a temperature of the workpiece in the vicinity of the slicing end portion of the workpiece and by making an increase in displacement of the grooved roller during slicing straight, that is, by making the slicing trajectory depicted in the workpiece close to a straight line.

Abstract: The present invention is a wire saw in which a wire for slicing is wound around a plurality of rollers to form a wire row; the wire for slicing is driven axially in a reciprocating direction; a workpiece is sliced simultaneously at a plurality of points arranged in an axial direction by feeding the workpiece against the wire row with the workpiece cut into while a slurry is supplied to the wire for slicing; the wire saw controlling in such a manner that the workpiece is extracted while the wire is caused to travel at a speed of 2 m/min or less at the time of extracting the workpiece from the wire row after slicing the workpiece. As a result, there is provided a wire saw in which the workpiece sliced with the wire row of the wire saw can be extracted from the wire row with a simple structure without a negative influence on its slicing surface.

Abstract: A diamond wire saw with an improved structure is provided. The diamond wire saw is capable of cutting operation along curved paths with small radii of curvature. In addition, the diamond wire saw is configured to prevent a diamond particle layer covering a surface thereof from flaking off. Thus, the diamond wire saw has improved durability and enhanced sharpness as well as low production cost.

Abstract: A device suitable for sawing a workpiece, contains a wire web formed by a sawing wire or adapted to receive such a wire web, a forward feed instrument holding a semiconductor workpiece to be sawed and feeding the workpiece in the direction of the wire web, and a reservoir filled with a sawing suspension, the reservoir being arranged and filled such that at least the part of the sawing wire which is in engagement during the sawing process is immersed into the sawing suspension of the reservoir.

Abstract: A machine for cutting blocks of natural or similar types of stone includes a plurality of diamond-wire loops, wound about an assembly for the support and transmission of the cutting motion to said diamond-wire loops and at least one assembly for supporting, tensioning and guiding the diamond-wire loops; said assemblies move vertically in unison on the structure of the machine; and presents said supporting, tensioning and guiding assembly comprising a set of pulleys for the support and return of each diamond-wire loop, which are mounted and registered, for wire tensioning, on a movable tensioning means whose registration movement is actuated by a tensioning control means, independently of the movable tensioning means of contiguous diamond wires.

Abstract: A cutting chain for cutting concrete and other similar materials having wear and stretch resistant features. In one embodiment, the cutting chain can include chain links having a debris trap for hindering the entry of debris onto bearing surfaces. In one embodiment, side links and a center link can have cooperating members forming a maze-like debris trap and can include a lubricant and/or other barrier material. In a particular arrangement, side links can have annular ribs which can be partially received in annular grooves on a center link to create the maze-like debris trap. In another embodiment, the cutting chain can include chain links having anti-rotation structures to hinder rotation of the fastener relative to the side links. In a particular arrangement, side links can have a protrusion or slot for cooperating with a complementary mating slot or protrusion on the fastener.

Abstract: The sawing machine according to the invention comprises a double portal structure (11) with two pairs of uprights (11.1), along which slides a respective ram (13). The rams (13) bear four support shafts (15), superposed in pairs and each supporting a coaxial roller, respectively a plurality of coaxial pulleys (18), mutually juxtaposed in packet fashion, having coplanar races according to respective vertical planes. A shaft (15) rotates integrally with the respective roller, or with the respective packet of pulleys (18). The other rollers, or packets of pulleys (18) are idle. On sets of four coplanar races is wound a corresponding wire or cutting tool (19) in closed loop, to execute the cut in a corresponding vertical plane of a block of material (B).

Abstract: Slicing multiple cylindrical workpieces into wafers by a multi wire saw with a gang length LG, is performed by: a) selecting a number n?2 of workpieces from a stock of workpieces with different lengths, satisfying the inequality L G ? ( n - 1 ) · A min + ? i = 1 n ? ? L 1 ( 1 ) and making right-hand side of the inequality as large as possible, where Li with i=1 . . . n are for the lengths of the workpieces and Amin is a predefined minimum spacing, b) fixing the n workpieces successively in the longitudinal direction on a mounting plate while maintaining a spacing A?Amin therebetween such that the relationship L G ? ( n - 1 ) · A + ? i = 1 n ? ? L i ( 2 ) is satisfied, c) clamping mounting plates workpieces in a multi wire saw, and d) slicing the n workpieces perpendicularly to their longitudinal axis by means of the multi wire saw.

Abstract: A movable machine, for example a saw, has a light construction using composite materials such as fiber reinforced resins and a closed cell foam. The saw may have a housing formed from multiple skins of the composite materials sandwiching the closed cell foam. Metallic inserts may be used to bond to either or both of the foam and the composite skin to accept working components. A saw is also described which uses gears sharing the same support element.

Abstract: The present invention relates to a method and a system for manufacturing wafer-like slices from a body of a substrate material, especially for use in the manufacture of semiconductor devices. The method comprises providing a slicing device with a cutting wire equipped on its surface with abrasive particles; providing an aqueous cooling and lubricating fluid, said fluid having an ionic strength corresponding to an electrical conductivity of about 30 ?S/cm or less; cutting said body with said cutting wire into slices while dispensing said cooling and lubricating fluid into a kerf area where said cutting wire contacts and cuts said body, said cooling and lubricating fluid promoting removal of powdered substrate material from said kerf area resulting in spent fluid; and removing said spent fluid from said cutting device and recovering said powdered substrate material from said spent fluid.

Abstract: The present invention is a slicing method and a wire saw apparatus including winding a wire around a plurality of grooved rollers and pressing the wire against an ingot to be sliced into wafers while supplying a slurry for slicing to the grooved rollers and causing the wire to travel in a reciprocating direction, in which the ingot is sliced with controlling a temperature of the ingot by supplying a slurry for adjusting an ingot temperature to the ingot independently from the slurry for slicing while the slurry for adjusting an ingot temperature is supplied to the ingot only at the exit side of the wire caused to travel in the reciprocating direction. As a result, there is provided a method and a wire saw apparatus in which rapid cooling of an ingot especially in a time close to end of slicing of the ingot can be alleviated, consequently degradation of a nano-topography can be suppressed, and further high-quality wafers having a uniform thickness can be sliced when slicing the ingot by using a wire saw.

Abstract: A method and apparatus of cutting and cleaning wafers in a wire saw is disclosed. In one embodiment, a wire sawing apparatus includes a horizontal ingot feeding wire slicing apparatus which includes a vertical wire web, in which sawing wires of the vertical wire web are located substantially in a vertical plane and move in a substantially vertical direction, a first top outlet and a second top outlet located in a top position with respect to a work piece for applying fluids during sawing, and at least one chute located substantially below the work piece for receiving the fluids, wherein the work piece is impelled against the vertical wire web by horizontal movement and the fluids flow in a vertical direction against and into the work piece for slicing and cleaning wafers.

Abstract: A method and apparatus of cutting wafers by wire sawing is disclosed. In one embodiment, a wire sawing apparatus includes a horizontal ingot feeding wire slicing apparatus which includes a vertical wire web, in which sawing wires of the vertical wire web are located substantially in a vertical plane and move in a substantially vertical direction, a top outlet located in top position with respect to a work piece for applying fluid during sawing, and a chute located substantially below the work piece for receiving the fluid, wherein the work piece is impelled against the vertical wire web by horizontal movement and the fluid moves in a vertical direction against and into the work piece. The wire sawing apparatus further includes a frame for holding the horizontal ingot feeding wire slicing apparatus, and a control panel for operating the wire sawing apparatus.

Abstract: A plating layer 18 of Ni or the like is formed around the outer peripheral face 14 of a wire tool 10, and super abrasive grains 16 are electrodeposited so as to be embedded in the plating layer 18. A coating layer 20 is formed on the surface of the super abrasive grains 16 to increase efficiency during electrodeposition. The thickness of the coating layer 20 formed on the super abrasive grains 16 is less than 0.1 ?m, and preferably not more than 0.05 ?m. The coating layer 20 is thin enough that its mass is less than 10% of the mass of the super abrasive grain 16. Accordingly, the super abrasive grains 16 are electrodeposited in a single layer around the outer peripheral face 14 of the core wire 12. As a result, the super abrasive grains 16 do not readily come off the core wire 12, which means that the wire tool will have a longer life. Also, since there is no need to remove any excess super abrasive grains after their electrodeposition, manufacturing costs can be cut and less work is entailed.

Abstract: The invention is directed to a method for slicing an ingot in the form of a wafer by winding a wire around a plurality of grooved rollers and pressing the wire against the ingot while making the wire travel and supplying slicing slurry to the grooved rollers, in which when the ingot is sliced, an amount of displacement of the ingot changing in an axial direction is measured and an amount of axial displacement of the grooved rollers is controlled so as to correspond to the measured amount of axial displacement of the ingot, and thereby, the ingot is sliced while controlling a relative position of the wire relative to an entire length of the ingot changing in the axial direction. As a result, a slicing method and a wire saw apparatus are provided that can perform slicing in such a way that a Bow or a Warp in a wafer obtained by slicing can be reduced, for example, by controlling a slicing path built into an ingot so that, in particular, the slicing path becomes flattened.

Abstract: Embodiments of stone cutting apparatus may include at least one sheave, which is coupled to a stone cutting belt to drivingly engage the stone cutting belt. Belt may include an endless cable, numerous abrasive segments disposed along the length of the cable, and a flexible belt body encapsulating the cable, and extending into the abrasive segments and between the abrasive segments. The abrasive segments may include a diamond top portion, a metal bottom portion, a first side, a second side, a first end and a second end. At least one bore in each abrasive segment, extending from the first and through the second end, is adapted to house the cable. The perimeter of the bore may be formed by the top diamond portion, the metal bottom portion and the interface between the diamond and metal portions of the abrasive segment. In another embodiment, each abrasive segment may further include a cutting portion and a mounting portion. The cutting portion faces a stone to be cut, and may project above the main belt body.

Abstract: A sawing device for sawing silicon blocks comprises at least one cutting element for sawing silicon blocks, the cutting element being drivable by means of a drive device, at least one guide device, with the at least one cutting element being alignable along a predetermined path by means of the at least one guide device, and at least one monitoring device for monitoring the position of the at least one cutting element.

Abstract: A wire saw (S) for separating a plurality of ceramic components (11-16) from a ceramic component block (1) has a roller system (2), the roller system has a plurality of deflecting rollers (3-5) guiding a wire (6) to form a wire harp (7), wherein at least one of the deflecting rollers (3) is divided into separate discs (31-36) guiding a single wire winding (61-66) of the wire (6) and being inclined at an adjustable angle (a) of less than 90 DEG to an axle (A) connecting the centers (M1-M6) of the discs (31-36).

Abstract: The present invention provides a slicing method comprising winding a wire around a plurality of grooved rollers and pressing the wire against an ingot to be sliced into wafers while supplying a slurry for slicing to the grooved rollers and causing the wire to travel, wherein a supply temperature of the slurry for slicing is controlled, and slicing is performed in such a manner that the supply temperature of the slurry for slicing and a temperature of the ingot become at least 30° C. or above at end of slicing the ingot. As a result, there is provided the slicing method that can alleviate precipitous cooling of an ingot in the time close to end of slicing the ingot and thereby suppress production of a nano-topography when slicing the ingot by using a wire saw.

Abstract: A method of manufacturing a solar cell including a silicon wafer is provided. In certain example instances, the method may include flattening fine roughness existing on a side face of a silicon block or a silicon stack used for manufacturing the silicon wafer for use in the solar cell.

Abstract: A wire saw assembly having a slide frame, support frames, a tensioning carriage, and a diamond wire cutting saw. The slide frame has a mounting plate attached slidably to mounting plate rails. The mounting plate engages a lead screw so that rotation of the lead screw moves the mounting plate along the mounting plate rails towards or away from a work piece. Two support frames are attached to the mounting plate. Each support frame has two drive wheels and a hydraulic motor for each drive wheel. A hydraulic fluid flow divider distributes hydraulic fluid evenly to each hydraulic motor so that the drive wheels operate in unison. The tensioning carriage has a slide plate with an idler pulley attached slidably to the slide plate rails. The slide plate engages a threaded rod so that rotation of the threaded rod moves the slide plate and idler pulley along the slide plate rails to increase or decrease the tension in the wire saw.

Abstract: The sawing machine comprises a guide pulley composed of a plurality of wheels of the same diameter, coaxial and mutually juxtaposed side by side in a pack on a corresponding shaft or the like According to the invention, in said wheel pack of the guide pulley (P2) a wheel (P21) presenting at least an external circumferential groove (P21?) and a wheel (P22) presenting a plurality of external circumferential grooves (P22?) are alternated in a repetitive sequence. Said wheels (P21, P22) comprise a radially internal part (P21.1, P22.1), at which they are mutually juxtaposed in a pack. Each wheel (P21) presenting at least a groove (P21?) comprises a radially external part (P21.2) having an external annular rim (P21.3) of lesser width than the thickness of said internal part (P21.1) thereof, while each wheel (P22) presenting a plurality of grooves (P22?) comprises a radially external part (P22.2) having an external annular rim (P22.3) of a width greater than the thickness of said internal part (P22.

Abstract: A wiresaw beam for use in an apparatus for slicing wafers from an ingot, such as semiconductor wafers from a single crystal ingot or a polycrystalline silicon ingot. The wiresaw beam may be made from a polymer composite material comprising a thermoset polymer resin and carbon nanotubes.

Abstract: A wiresaw cutting fluid composition of the present invention comprises about 25 to about 75% by weight of a particulate abrasive suspended in an aqueous carrier containing a polymeric viscosity modifier that comprises a polymer including a majority of non-ionic monomer units (preferably 100 mol % non-ionic monomer units), has a number average molecular weight (Mn) of at least about 5 kDa, and is present in the composition at a concentration sufficient to provide a Brookfield viscosity for the composition in the range of about 50 to about 1000 cP, e.g., 50 to about 700 cP, at about 25° C. at a spindle rotation rate of about 60 rpm. In one embodiment, the viscosity modifier comprises a polymer having a weight average molecular weight (Mw) of at least about 200 kDa. When a viscosity modifier of 200 kDa or greater Mw is utilized, a preferred wiresaw cutting method the cutting fluid is circulated and applied by pumps and nozzles operating at a relatively low shear rate of not more than about 104 s?1.

Abstract: A stone saw blade (1) includes an elongated base body (2) and a plurality of teeth (3). The teeth (3) are designed and arranged to be unset and to include geometrically defined cutting portions (11). The teeth (3) include a form body (4) being connected to the base body (2). The form body (4) includes a carrier (21) being made of hard metal and a layer (5) forming the cutting portion (11). The layer (5) has a hardness of at least 5,000 HK.

Abstract: A plating layer 18 of Ni or the like is formed around the outer peripheral face 14 of a wire tool 10, and super abrasive grains 16 are electrodeposited so as to be embedded in the plating layer 18. A coating layer 20 is formed on the surface of the super abrasive grains 16 to increase efficiency during electrodeposition. The thickness of the coating layer 20 formed on the super abrasive grains 16 is less than 0.1 ?m, and preferably not more than 0.05 ?m. The coating layer 20 is thin enough that its mass is less than 10% of the mass of the super abrasive grain 16. Accordingly, the super abrasive grains 16 are electrodeposited in a single layer around the outer peripheral face 14 of the core wire 12. As a result, the super abrasive grains 16 do not readily come off the core wire 12, which means that the wire tool will have a longer life. Also, since there is no need to remove any excess super abrasive grains after their electrodeposition, manufacturing costs can be cut and less work is entailed.

Abstract: Monofilament metal saw wire for a wire saw, wherein the saw wire being provided with a plurality of crimps. The crimps are arranged in at least two different planes, such that, when measured, between measuring rods of a micrometer, over a length comprising crimps in at least two different planes, a circumscribed enveloping D diameter of the saw wire is between 1.05 and 1.50 times a diameter d of the saw wire itself.

Abstract: The present invention provides a method for slicing a silicon single crystal ingot having a plane direction (110) by a wire saw to manufacture a (110) silicon wafer, wherein slicing is performed in such a manner that each angle formed between a traveling direction of a wire in the wire saw and a [?112] direction and a [1-12] direction in the (110) silicon single crystal ingot or a direction crystallographically equivalent to the directions exceeds 30°. As a result, the method for manufacturing the (110) silicon wafer that can suppress occurrence of breaking at the time of slicing and improve a production yield ratio can be provided.

Abstract: A system and method for cutting soluble scintillator material are disclosed. The system includes a scintillator cutting apparatus including a filament rotated around a plurality of pulleys in at least one direction and in operative proximity to the material thereby cutting the material. The system also includes a linear motion motor operatively connected to the scintillator cutting apparatus for moving the apparatus to position the filament in operative proximity and a linear motion speed sensor for sensing rate of movement of the apparatus as the apparatus is moved by the linear motion motor to position the filament in operative proximity. The system further includes a master motor controller operatively connected to the linear motion motor and the linear motion sensor, wherein the master motor controller controls the linear motion motor as a function of sensed information obtained from the linear motion speed sensor.

Abstract: Methods, wires, and apparatus for use in cutting (e.g., slicing) hard, brittle materials is provided. The wire can be a super-abrasive wire that includes a wire core and super-abrasive particles bonded to the wire core via a metal bonding layer. This wire, or another type of wire, can be used to slice workpieces useful for producing wafers. The workpieces can be aligned within a holder to produce wafers using the device and methods presently provided. The holder rotates about its central axis, which translates to workpieces moving in orbit around this axis. A single abrasive wire, or multiple turns of wire stretched tightly between wire guides, is then contacted with the rotating holder to slice the workpieces.

Abstract: A protection device for a rope saw assembly (5) includes at least two, telescopically displaceable relative to each other, cover members (12, 13) having each a circular cross-section, an extending along a longitudinal axis receiving space (14) for the saw rope (8), and a longitudinally extending opened slot (15, 16), and provided each with a securing device (18, 20) located on one end (17, 19) of each of the cover members (12, 13) for securing a respective cover member (12, 13) to a respective deflection roller (6, 7) of the rope saw assembly (5).

Abstract: An ingot 3 of a hexagonal III-nitride crystal is cut using a wire array 21 composed of a wire 22. On this occasion, the ingot 3 is cut in such a manner that the ingot 3 is sliced with supply of an abrasive fluid while feeding at least one of the ingot 3 and wire 22 in a direction perpendicular to an extending direction B of the wire 22. During cutting the ingot 3, the extending direction B of the wire 22 is inclined at 3° or more to the {1-100} plane of the ingot 3.

Abstract: Apparatus for forming a multiplicity of thin wafers from at least two similar blocks, the apparatus comprising a supply reel (1) to supply wire, an upper pair (3a, 3b) and a lower pair (3c, 3d) of parallel spaced roller guides and a collection reel (4); a wire from the supply reel passes around successive grooves along the roller guides from near the supply reel to near the collection reel, so to form a four sided continuous web of wires along the length of the roller guides. Part way along the roller guides, the wire is diverted around at least two pulley wheels(5a, 5b) removing the wire from the web after it has passed over a roller guide at a predetermined point, and reintroducing the wire into the web via a subsequent roller guide at a point laterally displaced from the point at which it left the web, so that there is a gap in the web of wire which divides the web into two separate sections, and no cutting action can occur in that gap.

Abstract: A wire guide roll for use in wire saws for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece is provided with a coating having a thickness of at least 2 mm and at most 7.5 mm of a material which has a Shore A hardness of at least 60 and at most 99, and which contains a multiplicity of grooves through which the sawing wire is guided, the grooves each having a curved groove base with a radius of curvature which is 0.25-1.6 times the sawing wire diameter, and an aperture angle of 60-130°. A multiplicity of wafers are simultaneously sliced from a cylindrical workpiece by means of a wire saw using such wire guide rolls.

Abstract: The sawing machine according to the invention comprises a double portal structure (11) with two pairs of uprights (11.1), along which slides a respective ram (13). The rams (13) bear four support shafts (15), superposed in pairs and each supporting a coaxial roller, respectively a plurality of coaxial pulleys (18), mutually juxtaposed in packet fashion, having coplanar races according to respective vertical planes. A shaft (15) rotates integrally with the respective roller, or with the respective packet of pulleys (18). The other rollers, or packets of pulleys (18) are idle. On sets of four coplanar races is wound a corresponding wire or cutting tool (19) in closed loop, to execute the cut in a corresponding vertical plane of a block of material (B).

Abstract: The invention relates to a chainsaw chain, especially for use in cutting concrete, comprising a plurality of teeth which are respectively provided with at least one cutting segment carrier and at least one cutting segment. The cutting segment comprises diamond punches which are melted into a binding material in such a way that they are embedded therein.

Abstract: A method for slicing an ingot may improve nanotopography at a surface of a wafer. In the method, an ingot is sliced into a plurality of wafers via a slurry while slurry is supplied to a moving wire. A first wire to form a first slicing portion at the wafer firstly slices one side of the ingot. A second wire secondly slices the remaining portion of the ingot to form a second slicing portion continued from the first slicing portion, wherein the first wire has a smaller diameter than that of the second wire.

Abstract: This invention is directed toward a system for driving a wire loop cutting element. More particularly, the disclosed invention employs a frame and pulleys to drive a wire loop cutting element.