Abstract: An apparatus and method for drying substrates. The inventive apparatus comprises: an object support member for supporting at least one substrate in a process tank having one or more support sections comprising capillary material. The inventive method is a method of removing liquid from a wet substrate in a process tank comprising contacting the wet substrate with capillary material. In another aspect, the invention is a method of drying at least one substrate having a surface in a process tank comprising: submerging the substrate in a liquid having a liquid level; supporting the submerged substrates in the process tank; supplying a drying vapor above the liquid level; lowering the liquid level or raising the substrate so that the liquid level is below the substrate, thereby removing a major portion of liquid from the substrate surface; and removing remaining liquid from the substrate surface with capillary material.

Abstract: This is a method of cassette-to-cassette batch demounting process that includes providing an apparatus having two cassettes for holding and separating semiconductor substrates. A first cassette is placed on top of a second cassette, using the first cassette as the top cassette that holds the semiconductor substrate and the support substrate, and the second cassette at the bottom as a bottom cassette that receives the semiconductor substrate after demounting process. The semiconductor substrate is loaded with its support substrate into a slot in the top cassette. The top cassette will let only the semiconductor substrate to descend to the bottom cassette while blocking the support substrate from exiting the top cassette. The two cassettes are then soaked in a hot solvent that can dissolve or melt an adhesive that adheres the semiconductor substrate to the support substrate in order to weaken the cohesive force between the two substrates.

Abstract: The pickling process of the present invention is designed for pickling electrical steel strip in a continuous fashion and comprises at least one pickling tank equipped with at least one set of sprayers designed to spray the top and bottom surfaces of a steel strip with a solution comprised of hydrogen peroxide prior to and/or after the strip is immersed in a solution contained in a pickling tank. The set(s) of sprayers in each of the pickling tanks are located above the level of the pickle bath solution, rather than being located in separate spray tanks. Upon exiting the final pickling tank, the strip is brushed/scrubbed to loosen any residual scale to form a clean strip.

Abstract: A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10.

Abstract: A method for removing the circumferential edge of a dielectric layer on a semiconductor wafer is disclosed. First, a semiconductor wafer having a dielectric layer on its upper surface is provided. Second, the semiconductor wafer is placed and secured on a susceptor. Third, the circumferential edge of the dielectric layer is removed by a ring cutter. Then, the semiconductor wafer is cleaned from its central portion to its edge portion by water jets.

Abstract: A floating cleaning device that cleans marine growth from float and skirt type oil booms. The cleaning device is a floating platform with ramps at the front and rear with tracks that guide the movement of the oil boom past a series of spray washers supplied with pressurized water to remove the marine growth from the oil boom.

Abstract: A method of cleaning using an insonified, pressurized liquid to cleanse and then wash off particulates. The liquid is used to focus and direct the acoustical energy while enabling the trapping of the partials being cleaned and then used to wash off the partials. The acoustical frequency and power is described as optimized to be below the energy level to cause cavitation at the surface of the part being cleaned. The manufacturing process of loading, cleaning and unloading is also described. In another embodiment, a small amount of cavitation is acceptable if the cavitation is below a threshold in which shock waves occur.

Abstract: In order to remove impurities, especially liquids (5) and/or particles (4) from surfaces of plate-shaped workpieces (2) contaminated or wetted with liquid (5), at least one wiping element (3) is provided which moves with respect to the surface (2a) the wiping element (3) to be cleaned and contacts this surface (2a). The wiping element (3) is cooled down so that the liquid (5) coming into contact with this wiping element (3) and bristles (8) preferably provided thereon assumes a higher viscosity or even solidifies and consequently remains adhered together with the particles (4) contained in the liquid (5) to the wiping element (3) or its bristles (8). This cleaning principle can be assisted and influenced by heating of the surface of workpiece (2) upstream of the wiping element or elements (3) in the feed direction.

Abstract: A method for cleaning a silicon-based substrate in an ammonia-containing solution without incurring any damages to the silicon surface by NH4OH vapor is described. The method can be conducted by first providing a silicon-based substrate that has a silicon surface, then forming a silicon oxide layer of very small thickness, i.e. less than 10 Å, on the silicon surface. The silicon-based substrate can then be cleaned in an ammonia-containing solution without incurring any surface damage to the silicon, i.e. such as the formation of silicon holes. The present invention novel method can be carried out by either adding an additional oxidation tank before the SC-1 cleaning tank, or adding an oxidant to a quick dump rinse tank prior to the SC-1 cleaning process.

Abstract: The present invention provides a method and an apparatus for cleaning substrates. The cleaning chamber defines a processing cavity adapted to accommodate a substrate therein. In one embodiment, the cleaning chamber includes an upper plate, a lower plate and a gas manifold disposed there between. A substrate is disposed in the processing cavity without contacting other chamber components by a Bernoulli effect and/or by a fluid cushion above and/or below the substrate. Fluid is flowed into the processing cavity at an angle relative to a radial line of the substrate to induce rotation of the substrate during a cleaning and drying process. A cleaning process involves flowing one or more fluids onto a surface of the substrate during its rotation. One-sided and two-sided cleaning and drying is provided.

Abstract: A method and apparatus for the treatment of surfaces of substrates of organic or inorganic materials, reactive fragments such as radicals or ions are produced by ultraviolet radiation from at least one ultraviolet radiator disposed at a given distance. The apparatus has a gas-filled, elongated discharge chamber whose walls are formed by a dielectric, and the ultraviolet radiator is provided on the side facing away from the discharge chamber with at least one electrode. During irradiation, a translational and/or rotatory relative movement is performed between the substrate and the ultraviolet radiator at a comparatively slight distance between radiator and substrate surface, in order to achieve, in a simple manner, an intense and uniform illumination of the surface being irradiated. The treatment is directed especially to silicon substrates or glass substrates.

Abstract: A method of washing a container,including charging a material to be contained into a container body having a mouth-and-neck portion; mounting a container closure on the mouth-and-neck portion of the container body, the container closure having a top panel wall, a cylindrical skirt wall extending downwardly from a peripheral edge of the top panel wall, and a washing liquid passage formed in at least one of an upper portion of the skirt wall and a peripheral edge portion of the top panel wall; and jetting a washing liquid at the container closure so that the washing liquid passes through the washing liquid passage and enters a space between the mouth-and-neck portion of the container body and the skirt wall of the container closure, thereby washing an outer peripheral surface of the mouth-and-neck portion of the container body and an inner peripheral surface of the skirt wall of the container closure. The washing liquid is at a temperature of 65° C. to 70° C.

Abstract: A method of removing graphite from metal molds used in the glass fabrication industry, the method including placing a metal glass-fabricating mold with graphite bonded thereto in a chamber, providing an oxygen rich mixture of combustible gases in the chamber, said oxygen rich mixture containing from about 10 to about 25% stoichiometric excess of oxygen, and igniting the oxygen rich mixture of combustible gases in the chamber to produce a temperature of at least about 6,000° F. and a pressure wave. A high temperature wave front and the pressure wave thereby produced remove graphite from the metal mold by ablation of the graphite.

Abstract: An outer covering wall (26) and an inner covering wall (27), which are capable of surrounding a rotor (24), can be horizontally moved. A wafer carrier waiting portion (30) is disposed right below the rotor (24). A wafer holding member (41) included in a wafer lifter (40) moves into a wafer carrier (C) containing wafers (W) and mounted on a stage (31) (sliding table 32) included in the wafer carrier waiting portion (30), lifts up the wafers (W) and transfers the wafers (W) to the rotor (24). The outer covering wall (26) or the inner covering wall (27) surrounds the rotor (24) to define a processing chamber. The wafers (W) held on the rotor (24) are subjected to a cleaning process in the processing chamber.

Abstract: An apparatus and method for conveying integrated circuits is disclosed. The method includes providing a plurality of integrated circuits. The method further includes capturing the integrated circuits. The method additionally includes sliding the integrated circuits along a surface. The method also includes substantially retaining the integrated circuits relative to the surface so as to keep the integrated circuits in a desired movement path as they are slid along the surface.

Abstract: A method for drying a disk-shaped substrate. The substrate is typically a substrate used for the manufacture of magnetic disks, and has a centrally located opening. The substrate is lowered into a liquid bath by a first holder, which also becomes immersed in the bath. The first holder lifts the substrate until the substrate extends partially out of contact with the liquid. A second, dry holder grabs a dry portion of the substrate that extends out of the bath, and continues to lift the substrate out of contact with the liquid.

Abstract: In one embodiment of a liquid processing apparatus, a cleaning unit (CLN) 12 includes a rotary plate 61, supporting members 64a, holding members 64b, a chemical nozzle 51 for supplying a wafer W with a chemical liquid, a spring 120 and a pressing mechanism 121 both of which moves each of the holding members 64b. The pressing mechanism 121 moves the corresponding holding member 64b so that the wafer W is held by the holding members 64b while the wafer W is apart from the supporting members 64a and conversely, the wafer W is supported by the supporting members 64a while the wafer W is apart from the holding members 64b. The spring 120 holds the corresponding holding member 64b so that the wafer W is held by the holding members 64b while the wafer W is apart from the supporting members 64a. By supplying the wafer W held by the holding members 64b with the cleaning liquid, it is possible to prevent an occurrence of unprocessed portions on the cleaned wafer W, accomplishing a uniform cleaning for the wafer W.

Abstract: In a method of cleaning a metallic article, in particular for removing oxide deposits, whereby the metallic article is made of a hardenable steel having a carbon content of at least 0.1% by weight and is at least partially hardened, the metallic article is placed in a vessel containing a liquid cleaning agent with a pH value in the range of 4 to 8, and exposed to sound waves.

Abstract: A reticle having a pellicle frame and pellicle membrane is cleaned without removing or damaging the pellicle membrane. A cover encases the pellicle membrane and pellicle frame, sealing the pellicle from the external environment during a cleaning process. The cover fits around the periphery of the pellicle frame and covers the pellicle membrane. An edge of the cover in contact with the reticle forms a seal. The reticle is fastened to reticle supports on a spin chuck during the cleaning process. An anchor plate presses the cover to the reticle, maintaining the pellicle sealed from the external environment. The cover and reticle are sandwiched together between the anchor plate and spin chuck.

Abstract: A substrate processing method of the present invention prevents the reattachment of particles to substrates, such as semiconductor wafers, when processing and cleaning the substrates by immersing the substrates held in a vertical attitude in a processing liquid and a cleaning liquid. After processing the substrates in the processing liquid, they are drawn out from the processing liquid. Then, lower parts of the processed substrates are immersed in the cleaning liquid and temporarily kept stationary in the cleaning liquid. Alternatively, the cleaning liquid is sprayed onto the lower parts of the processed substrates. After a predetermined time, the substrates are immersed entirely in the cleaning liquid.

Abstract: A method of manufacturing an electrophotographic photosensitive member includes the steps of: cleaning a substrate of the electrophotographic photosensitive member by cleaning step using a vessel and machining the substrate. The cleaning step includes a first overflowing step and a second overflowing step. In the first overflowing step, the liquid is allowed to be overflowed from a vessel while the substrate of the electrophotographic photosensitive member is immersed in the liquid contained in the vessel. In the second overflowing step, the liquid is allowed to overflow from a vessel while the substrate of the electrophotographic photosensitive member is pulled up in the liquid contained in the vessel. A flow rate Q2 of the overflowing liquid of the second overflowing step is higher than a flow rate Q1 of the overflowing liquid of the first overflowing step. The machining step forms a film of a photosensitive substance on the substrate.

Abstract: A method for removing photoresist or other organic material from a substrate such as a semiconductor wafer is provided. The method includes partially immersing the substrate in a solvent (e.g., deionized water) in a reaction chamber, injecting an oxidizing gas (e.g., ozone) into the reaction chamber, and rotating or otherwise moving the substrate through the solvent to coat a thin film of solvent over the organic component on the substrate surface and expose the solvent-coated substrate to the ozone gas to remove the organic material from the surface.

Abstract: A method of cleaning a semiconductor wafer using a cleaning brush assembly having an arbor with: (1) an expandable member configured to have a non-expanded position and an expanded position, and (2) a cleaning brush, located about the expandable member, having an inner diameter greater than an outer diameter of the expandable member in the non-expanded position and less than an outer diameter of the expandable member in the expanded position.

Abstract: A method for treating an object is provided. The method comprises supporting the object above a level of a process liquid and applying megasonic energy to said process liquid to form a vapor from the liquid. The vapor reacts with a surface of the object to process the object. The level of the process liquid is generally maintained below the bottom of the object while processing the object with the vapor. An alternative embodiment of the method employs an acoustically generated vapor and ultraviolet (UV) light for processing objects. The UV light passes through the vapor to treat the object. The vapor and UV light react with a surface of the object to process the object. In a particular example of this embodiment, the vapor includes ozone, which reacts with the UV light to form an oxide at the surface of a semiconductor wafer. UV may also be used in conjunction with ammonia (NH3) to facilitate substrate cleaning.

Abstract: A steel strip is degreased with low power consumption by subjecting the steel strip to electrolytic washing in a degreasing apparatus including an electrolytic washing apparatus in which electrodes confront each other across the steel strip located therebetween, and charge density and current density are maintained within a predetermined range. There is also provided a simple steel strip degreasing apparatus which is especially suitable for the method.

Abstract: Apparatus for cleaning removable oral appliances, such as tooth repositioning aligners, comprise a base having a tray for holding the appliance in a bath of cleaning solution. A low-frequency driver is provided in the base for reciprocating the tray about a horizontal or vertical axis to wash the cleaning solution over the appliance. Usually, the apparatus will further comprise a cradle which is mounted to reciprocate about a horizontal axis within the base. The cradle defines a receptacle which removably receives the cleaning tray. The cleaning tray is preferably reciprocated at frequency in the range from 1 Hz to 10 Hz, usually in the range from 2 Hz to 5 Hz.

Abstract: The invention provides an apparatus and method for cleaning or etching wafers. The invention further provides a megasonic transducer designed to apply mechanical vibrations to a layer of fluid in contact with a wafer. The electromechanical transducer is housed in a quartz or sapphire lens which is chemically compatible with the layer of fluid, and sealed to protect the housing interior from fluids and chemical fumes. An electrical power source produces a signal that is sent to the transducer to generate a megasonic wave. The wave travels between the lens and the wafer, through the layer of fluid, dislodging small particles from the wafer which are then removed in the fluid stream. In one embodiment of the present invention, a wafer to be cleaned is placed on a rotatable support below a transducer assembly. A fluid is introduced through the transducer assembly to provide a layer of fluid between the lens and wafer.

Abstract: A process system for processing a semiconductor wafer or other similar flat workpiece has a head including a workpiece holder. A motor in the head spins the workpiece. A head lifter lowers the head to move the workpiece into a bath of liquid in a bowl. Sonic energy is introduced into the liquid and travels through the liquid to the workpiece, to assist in processing. The head is lifted to bring the workpiece to a rinse position. The bath liquid is drained. The workpiece is rinsed via radial spray nozzles in the base. The head is lifted to a dry position. A reciprocating swing arm sprays a drying fluid onto the bottom surface of the spinning wafer, to dry the wafer.

Abstract: A method for treating substrates, such as silicon wafers, wherein the substrates are immersed for some time in a bath containing a liquid and are taken therefrom so slowly that practically all of the liquid remains in the bath. The substrates are brought from the liquid directly into contact with a vapor of an organic solvent which is mixed with a carrier gas and introduced from gas leads having outlet nozzles. The vapor is miscible with the liquid to yield a mixture having a surface tension lower than that of the liquid, and which does not condense on the substrates. No drying marks with organic or metallic residues or other contaminations remain on the substrates.

Abstract: A method for washing items using an apparatus including at least one conveyor, at least one washing zone, and at least one rinsing zone, items to be washed are guided through the washing apparatus in succession in the process direction of the apparatus and sprayed with a washing fluid in a washing zone and with rinsing water in a rinsing zone. The items to be washed are of different types distinguishable from one another, their types being distinguished by identifying sensors arranged to the washing apparatus. On the basis of the identification a control item of the washing apparatus automatically selects the appropriate washing and/or rinsing programme for the item concerned.

Abstract: A method for cleaning returnable bottles and similar containers used in the food industry. The method uses an enzymatic solution during the cleaning process. The cleaning results are at least as good as conventional methods, without requiring an increase in the duration of cleaning. The method substantially reduces bottle corrosion and waste water pollution compared to conventional methods.

Abstract: A cryogenic cleaner for and a method of performing cleaning of a surface that must be substantially free of contaminants has a resiliently mounted nozzle for spraying a cryogenic cleaning medium on the surface. The nozzle is driven in an oscillatory manner at a predetermined amplitude and frequency so the nozzle spray is delivered in a manner to provide pulsing of the spray and to provide as “snow plow” effect on contaminants as the spray delivers the cleaning medium against the surface. The surface is transported past the nozzle, and the cleaning occurs in an enclosed controlled environment.

Abstract: An apparatus for wet cleaning or etching of flat substrates comprising a tank with an inlet opening and outlet opening for said substrates. Said tank contains a cleaning liquid and is installed in a gaseous environment. At least one of the openings is a slice in a sidewall of the tank and is present below the liquid-surface. In the tank there may be a portion above the liquid filled with a gas with a pressure being lower than the pressure within said environment. The method comprises the step of transferring a substrate through the cleaning or etching liquid at a level underneath the surface of said liquid making use of said apparatus.

Abstract: In a method for cleaning a surface of a substrate an amount of a solution is applied on a surface of the substrate. After the solution is applied on the surface, crystallization of the solution is initiated to form a liquid-crystal mixture. Once the liquid-crystal mixture is formed, relative motion between the liquid-crystal mixture and the substrate is created to dislodge contaminants adhered to the substrate. In one alternative method, the solution is applied on a pad. In another alternative method, the substrate is place in a bath of the solution. A wafer cleaning module also is described.

Abstract: A cleaning apparatus for cleaning solder paste off the bottom side of a printed circuit board stencil includes a container of cleaning solution therein and a blade holder that is movable between a wiping position and the container of cleaning solution. A wiping blade is mounted in the blade holder. The blade holder, with the blade mounted thereon, is reciprocated back and forth when in communication with a stencil to be cleaned. The blade is moved from the wiping position in communication with the stencil into the cleaning solution in the container. A pneumatic piston and rotary actuator provides controlled movement of the wiping blade. The wiping blade may be vibrated during wiping to improve removal of solder paste from the stencil and the cleaning solution may be ultrasonically vibrated to improve removal of solder paste from the wiping blade. The wiping blade may also be pulsed into a sponge to remove excess cleaning solution prior to the next cleaning cycle.

Abstract: Embodiments of the invention provide a method for removing contaminant particles from a substrate surface, where the method includes supporting a substrate in a face up position on a substrate support member and imparting a broadband impulse to the substrate support member in a direction that is substantially perpendicular to a surface of the substrate. The broadband impulse applied to the substrate support is calculated to be of sufficient magnitude to dislodge contamination particles from the surface of the substrate. The method further includes removing dislodged particles from an area proximate the substrate surface.

Abstract: An automatic system is used for controlling the cleaning stage of a strip cleaning line, e.g. an aluminum strip cleaning line. The cleaning line includes a chemical cleaning section and at least one rinse section, with cleaning solution being sprayed onto the top and bottom faces of the aluminum strip as it passes through the cleaning section. A programmable logic controller has a dwell time set point for each coil of aluminum strip, which gives for standard conditions of chemical concentration and temperature the time the strip should be exposed to the spray. The controller receives input signals based on the measured temperature and concentration of the cleaning solution and adjusts the dwell time of the cleaning solution spray on the aluminum strip accordingly.

Abstract: A reticle having a pellicle frame and pellicle membrane is cleaned without removing or damaging the pellicle membrane. A cover encases the pellicle membrane and pellicle frame, sealing the pellicle from the external environment during a cleaning process. The cover fits around the periphery of the pellicle frame and covers the pellicle membrane. An edge of the cover in contact with the reticle forms a seal. The reticle is fastened to reticle supports on a spin chuck during the cleaning process. An anchor plate presses the cover to the reticle, maintaining the pellicle sealed from the external environment. The cover and reticle are sandwiched together between the anchor plate and spin chuck.

Abstract: An instrument treatment station includes a station body having a first and second elongate and spaced channel walls. The channel walls define an elongate instrument channel therebetween. The station body defines an elongate drain channel in fluid communication with the instrument channel. The station body further defines a source port in fluid communication with the instrument channel for delivering a fluid flow into the instrument channel for treating an instrument therein. The instrument treatment station may accommodate arrays of aligned instruments.

Abstract: A label removal system for removing a label with a stock portion and an adhesive from a product includes a stripper, an applicator, a remover, and a transportation system. The stripper sprays a first liquid at the label to strip at least a portion of the stock portion of the label off of the product. The applicator applies a chemical substance on at least a portion of the adhesive and any remaining portion of the label on the product. The remover removes at least a portion of the adhesive and any remaining portion of the label on the product. The transportation system moves the product sequentially from the stripper to the applicator and then to the remover. A method for removing a label with a stock portion and an adhesive from a product includes a number of steps. First, at least a portion of the stock portion of the label off is stripped off of the product by spraying a first liquid at the label.

Abstract: Fixtures and methods for clamping workpieces in a workplace to enable the optimized exposure thereof to a stream or flow of a supercritical fluid. Provided is a rotatably indexable chuck or locator mounting the workpiece and enabling orientating the latter in specific static pitch position within a high pressure vessel in order to subject the workpiece to a full frontal exposure to the supercritical fluid stream within the vessel. This mounting arrangement facilitates an optimum positioning of the workpiece being processed in the flow path of the supercritical fluid stream while oriented in selectively indexed rotational positions.

Abstract: An ultrasonic cleaning method for cleaning semiconductor manufacturing equipment with which a blast treated surface of a component of a sputtering equipment is cleaned, wherein de-aerated cleaning water in which the component is immersed has concentration of dissolved gasses of not more than 10 ppm, and ultrasonic power of the ultrasonic vibrator applying ultrasonic to the cleaning water is 50 W or more.

Abstract: A system and process for removing oil containing machine coolant from machining chips in which the chips are deposited in a sluice and flushing jets of citrus oil based cleanser containing water solution used as a washing liquid are used to move the chips down the sluice and into a chip separator tank, the coating of machining fluid scoured from the chips by the action of the flushing jets. The chips are conveyed up a sloping wall of the tank to be moved out of the washing liquid, drained and dried. The washing liquid is pumped out the tank and used to form the flushing jets in the sluice.

Abstract: An automatic control system is provided for acid concentration in an aluminum strip cleaning line wherein an aluminum strip is contacted with an acid solution while passing through an acid cleaning bath and the concentration of the acid in the bath is adjusted by adding either concentrated acid or water to the bath. A conductivity probe is provided in the acid bath and generates a first signal approximately proportional to the free acid concentration of the bath. An on-line process titrator periodically samples the acid bath and by a dual endpoint titration obtains the free acid concentration and total acid concentration of the bath and thereby generates a second signal indicative of the actual free acid concentration and the total acid concentration. These first and second signals are fed to a programmable logic controller, which based on the signal from the titrator calculates a correction factor for the signal from the conductivity probe to thereby obtain a corrected value for free acid concentration.

Abstract: When trying to keep the amount of a liquid treating chemical in a treating bath constant by discharging almost the same amount of the liquid treating chemical as the liquid treating chemical supplied, the flow of the liquid treating chemical in the treating bath fell into disorder, which made it hard to keep the flow of the liquid treating chemical in the treating bath in the laminar state. A down-flow type chemical treating apparatus 1 in which a liquid treating chemical 21 is supplied from the outside of a treating bath 2 (main bath 3) while the liquid treating chemical 21 is discharged from the bottom portion of the treating bath 2 (main bath 3), comprising a pump 5 on the chemical discharging side of the main bath 3 which consists of a rotary pump allowing to discharge the liquid treating chemical 21 to the outside of the main bath 3 keeping the flow of the liquid treating chemical 21 substantially in the main bath 3 almost in the laminar state.

Abstract: The present invention comprises a conveyor assembly for carrying an item that has been painted by over-spray or dipping to a cleaning chamber where a cleaning means, typically a high pressure water cleaning device, is used to remove paint layers from an inadvertently painted item. The cleaning chamber further comprises a pool having an elongated drainage element such that water may be drained off from the top of the surface of the pool while the paint layers are deposited into the pool. The paint layers may subsequently be removed from the pool and disposed of properly. The invention further comprises a method of using the cleaning chamber, high pressure water cleaning device, pool and drainage device to clean items used to hold items to be painted.

Abstract: A method for removing non-stick coatings from cookware or bakeware products is disclosed. The method includes the step of determining the angles of the primary surfaces of a pan having a coating to be removed. The method further includes the step of configuring a high-speed, multiport, rotating cleaning head to provide at least one water jet associated with each primary surface. The method further includes the step of employing the cleaning head to deliver an ultra-high pressure water jet directed at the pan while tracking the cleaning head along a plane substantially parallel to the upper surface of the pan. Using the method of the present invention, a coating may be removed from a pan in a single pass.

Abstract: A scrub washing apparatus comprises a spin chuck for holding a substrate to be processed substantially horizontally, a nozzle for supplying a washing liquid to the substrate mounted on the spin chuck, an arm vertically and horizontally movably supported, an output shaft provided at the arm, a sponge brush connected directly or indirectly to the output shaft, for scrubbing the substrate on the spin chuck in contact therewith, a press mechanism moving the sponge brush downward together with the output shaft, for pressing the sponge brush against the substrate on the spin chuck, and a rotation drive mechanism provided above the press mechanism at a position where the rotation drive mechanism is capable of being engaged with the output shaft, for directly rotating the sponge brush by engaging with the output shaft.

Abstract: A method of cleaning substrates is provided. Prior to, during or prior to and during a cleaning process, fluid is applied to a substrate surface to form a fluid film thereon. Ice crystals are introduced into the fluid film on the substrate surface. The ice crystals have a temperature that is lower than the temperature of the fluid such that the fluid changes the ice crystals into a gaseous state to form a pulse generated in the fluid film. The depth of penetration of the ice crystals into the fluid film is controlled such that the ice crystals do not strike the substrate surface. The substrate surface is cleaned with the pulse.

Abstract: After a substrate is completely cleaned in a processing bath, de-ionized water is discharged from the processing bath while a supply nozzles supplies nitrogen gas. The supply nozzle discharges IPA vapor toward an opening of the processing bath while the substrate is held in the processing bath. Thus, the IPA vapor flows into the processing bath for drying the substrate held in the processing bath. Consequently, it follows that the IPA vapor may sufficiently be supplied to the processing bath having a smaller volume than a chamber, whereby consumption of vapor of an organic solvent can be reduced.