Abstract: A substrate is transferred from an environment at about vacuum into a load lock through a first door. The substrate is then sealed within the load lock. The pressure within the load lock is raised to a high pressure above vacuum. A second door coupling the load lock to a high-pressure processing chamber is then opened and the substrate moved from the load lock into the high-pressure chamber. The substrate is then sealed within the high-pressure chamber. High-pressure processing, such as high pressure cleaning or high pressure deposition, is then performed on the substrate within the high-pressure chamber. Subsequently, the second door is opened and the substrate transferred into the load lock. The substrate is then sealed within the load lock. The pressure within the load lock is lowered to about vacuum and the first door opened. The substrate is then removed from the load lock into the environment.

Abstract: A cleaning method preventing foreign matter attached to a brush from being transferred back to a magnetic transfer carrier by removing foreign matter attached to a cleaning tool such as the brush with a dummy carrier having a recess equivalent to that on a surface of the magnetic transfer carrier.

Abstract: Methods and compositions for on-line cleaning of internal surfaces of selected sections of a hydrocarbon fuel burning gas turbine and associated heat recovery equipment, during operation. Cleaning solutions containing graphite and/or molybdenum-based particles and oil soluble corrosion inhibitors, aromatic solvents, and surfactants are selectively introduced directly into the combustion chamber (combustor) of the gas turbine, into the fuel stream, water washing system, or the combustion air system (hot gas path). The cleaning process dislodges unwanted ash deposit buildup and, thereby restores the gas turbine to rated power. When introduced into the compressor section, the particles impinge on the metal surfaces, cleaning them prior to entering the hot gas section where the process may be repeated. They may also be carried through the exhaust to additionally clean attendant heat recovery equipment, if present.

Abstract: Disclosed is a substrate processing method including a substrate rotating step for rotating a substrate with the substrate held almost horizontally within a chamber; a peripheral edge processing step for discharging a processing liquid to a lower surface of the substrate rotated in the substrate rotating step and causing the processing liquid to flow around an upper surface of the substrate at a peripheral edge thereof from the lower surface of the substrate to process the peripheral edge of the upper surface of the substrate in the chamber; and a both-surface processing step for discharging the processing liquid to both the surfaces of the substrate rotated in the substrate rotating step to process both the surfaces of the substrate in the chamber.

Abstract: A test apparatus, for testing electric properties of an integrated circuit, may include: a housing; a chuck on which an integrated circuit is placed as an object of the testing, the chuck being disposed in the housing; a tester part, having a probe needle, to test electric properties of the object, the tester part being attached to the housing; and a cleaning part to clean the probe needle, the cleaning part being disposed in the housing, and the cleaning part including a supporter, a mounting stand removably/attachably coupled to the supporter, and a polishing pad attached to the mounting stand to polish the probe needle.

Abstract: The invention provides a method of preventing contamination of a dryer of a paper machine so that predetermined effects of contamination prevention over the long term can always be ensured while maintaining satisfactory drying efficiency. With the method of preventing contamination of the surface of the drum dryer used in a paper machine, a predetermined amount of a surface treatment agent P is continuously supplied to the surface of the drum dryer C1 in rotation, facing a paper strip W, while the paper strip is being fed by the paper machine in operation.

Abstract: A cleanling apparatus for removing contaminants from the surface of a substrate includes two parts: one which produces an aerosol including frozen particles and directs the aerosol onto the surface of the substrate to remove contaminants from the surface by physical force, and another part in which a fluid including a gaseous reactant is directed onto the surface of the substrate while the surface is irradiated to cause a chemical reaction between the reactant and organic contaminants on the surface, to chemically removing the organic contaminants. In the method of cleaning the substrate, the physical and chemical cleaning processes are carried out in a separate manner from one another so that the frozen particles of the aerosol are not exposed to the effects of the light used in irradiating the surface of the substrate. Therefore, the effectiveness of the aerosol in cleaning the substrate is maximized.

Abstract: A method for separating a substance such as a hydrocarbon from a particulate material such as soil is provided. An aqueous slurry is formed and a shear force is applied to the slurry, such as in a reversible helical screw conveyor, while the slurry is vibrated. The substance thus separated can then be removed from the particulate material.

Abstract: A method of processing thin flat articles, particularly semiconductor wafers, utilizing sonic energy. In one aspect, the invention is a method comprising: supporting a substrate in a generally horizontal orientation and transmitting sonic energy to the substrate while flowing liquid onto both sides of the substrate to loosen particles on both sides of the substrate while maintaining said orientation. In another aspect, the invention is a cleaning method comprising: applying cleaning fluid to one side of a thin flat article while supporting the article in a generally horizontal orientation; and applying energy to the other one of the sides with sufficient power to produce vibration on the one side in the area of the cleaning fluid to loosen particles on the one side, while maintaining said orientation.

Abstract: There are provided a substrate drying method and apparatus by which an attachment amount of particles to surfaces of substrates can be reduced when the substrates are exposed from pure water, and occurrence of non-uniform drying can be prevented by improving drying efficiency of the substrates. Air or an inert gas, and gaseous or droplet-like isopropyl alcohol (hereinafter, referred to as IPA) are supplied into a space on a liquid level of the pure water in a drying chamber, and pure water on a liquid level side is drained from the liquid level or the vicinity of the liquid level of the pure water, while raising the pure water in which the substrates are immersed together with the substrates, the substrates are exposed from the pure water above the liquid level in the drying chamber, and, at the same time, the pure water held on the exposed surfaces of the substrates is replaced by IPA, whereby the substrates are dried.

Abstract: The present invention relates generally to cleaning systems, and more specifically to substrate cleaning systems, such as textile cleaning systems, utilizing an organic cleaning solvent and a pressurized fluid solvent. However, unlike conventional cleaning systems, a conventional drying cycle is not necessary. Particularly, the present invention provides a process for cleaning substrates by cleaning the substrates with an organic solvent in absence of liquid carbon dioxide, and removing the organic solvent from the substrates using a pressurized fluid solvent.

Abstract: The apparatus for cleaning a wafer includes an energy concentration relieving member positioned at the side of the wafer. An elongated portion of a probe extends over and substantially parallel to the wafer surface. A vibrator is attached to a rear end of the probe for vibrating the probe such that the elongated portion transfers acoustic vibrational energy to the wafer and dislodges debris.

Abstract: A high pressure water stream (14) is discharged onto a surface to be cleaned. An ozone/water stream (16) is discharged on the same surface for sanitizing the surface. The high pressure water and ozone/water streams (14, 16) are discharged simultaneously along closely adjacent paths that are either parallel (FIG. 3) or concentric (FIG. 2). The water pressure is at least about 100 p.s.i. and is preferably between 100 p.s.i. and 1000 p.s.i. The nozzles that discharge the streams (14, 16) may be movable relative to the object(s) that receives the high pressure water and ozone/water (FIG. 1) Or, they may be fixed and the object may be movable relative to them (FIG.

Abstract: A high pressure water stream (14) is discharged onto a surface to be cleaned. An ozone/water stream (16) is discharged on the same surface for sanitizing the surface. The high pressure water and ozone/water streams (14, 16) are discharged simultaneously along closely adjacent paths that are either parallel (FIG. 3) or concentric (FIG. 2). The water pressure is at least about 100 p.s.i. and is preferably between 100 p.s.i. and 1000 p.s.i. The nozzles that discharge the streams (14, 16) may be movable relative to the object(s) that receives the high pressure water and ozone/water (FIG. 1) Or, they may be fixed and the object may be movable relative to them (FIG. 4).

Abstract: A method for spinning a wafer to enable rinsing and drying is provided. The method includes engaging the wafer at a wafer processing plane and spinning the wafer. The method further includes moving a wafer backside plate from a first position to a second position as spinning of the wafer proceeds to an optimum spinning speed. The second position defines a reduced gap between an under surface of the wafer and a top surface of the wafer backside plate. The method also includes repositioning the wafer backside plate from the second position to the first position as the spinning reduces in speed. The first position defines an enlarged gap to enable loading and unloading of the wafer from the engaged position.

Abstract: A screenings washer having a hopper, a grinder downstream of the hopper, and a washer downstream of the grinder. The washer includes an auger rotor that receives the screenings ground by the grinder, a spray wash system that sprays a wash fluid directly onto a portion of said auger rotor and the ground screenings, a perforated trough, and tubular casing directly coupled to the discharge end of said auger rotor and having a severe bend proximate to the discharge end of said auger rotor. The severe bend partially obstructing transportation of the ground screenings transported by said auger rotor so as form a compaction zone that compacts and de-waters the ground screenings.

Abstract: A method of cleaning encrusted ballast comprises the steps of screening the encrusted ballast to separate detritus from the ballast, washing the screened ballast with water while removing the separated detritus on a conveyor belt unit, clarifying the washing water to produce a clarified water portion and washing water sludge, and disposing of the washing water sludge by moving it to the detritus on the conveyor belt unit for common removal with the detritus.

Abstract: A substrate is cleaned by supplying an ultrasonically-agitated cleaning liquid onto the substrate from a nozzle provided above the substrate while spinning the substrate. The substrate being cleaned is spun at a rotational speed of 2600 rpm or more and 3500 rpm or less, or at a rotational speed of 260×V/D (rpm) or more and 350×V/D (rpm) or less, where D (mm) is a diameter of the nozzle and V (mm/sec) is a moving velocity of the nozzle.

Abstract: A method for post-etch cleaning of a substrate with MRAM structures and MJT structures and materials is disclosed. The method includes inserting the substrate into a first brush box configured for double-sided mechanical cleaning of the substrate. A non-HF, copper compatible chemistry is introduced into the first brush box for cleaning the active and backside surfaces of the substrate. The substrate is then inserted into a second brush box which is also configured to provide double-sided mechanical cleaning of the active and backside surfaces of the substrate. A burst of chemistry is introduced into the second brush box followed by a DIW rinse. The substrate is then processed through an SRD apparatus for final rinse and dry.

Abstract: A wafer chuck is configured to hold a wafer efficiently for spin process cleaning of wafer edges and back sides. A first group of retractable tips extend to hold the wafer during a first portion of the cleaning period. A second group of retractable tips extend to hold the wafer during a second portion of the cleaning period. Residues left between the tips and the wafer edge areas during the first portion of the cleaning period are removed during the second portion. The change from the first group of tips to the second group of tips occurs while the wafer is rotating.

Abstract: A gel is produced by magnetically treating and mixing two solutions and in one embodiment subsequently introducing carbon dioxide gas. The first solution is comprised of water and sodium bicarbonate, and the second solution is comprised of water and sodium silicate. The first solution is passed through a positively charged magnetic field, and the second solution is passed through a negatively charged magnetic field. The two solutions are then mixed together to form a gel. The resulting gel has excellent fire-fighting capabilities because of its high heat absorption and emissive qualities. Also disclosed is a method for using the gel to aid in the removal of surface coatings.

Abstract: A method for cleaning and drying a front and a back surface of a substrate is provided. The method includes brush scrubbing the back surface of the substrate using a brush scrubbing fluid chemistry. The method further includes applying a front meniscus onto the front surface of the substrate upon completing the brush scrubbing of the back surface. The front meniscus includes a front cleaning chemistry that is chemically compatible with the brush scrubbing fluid chemistry.

Abstract: The present invention is directed to a gas turbine cleaner. The composition of the present invention includes a glycol alkyl ether compound, an alkoxylated surfactant with an alkyl chain length of from about 3 to 18 carbons and a metal corrosion inhibitor component.

Abstract: There is disclosed a substrate treating method comprising supplying a treating solution onto a substrate, and continuously discharging a first cleaning solution to the substrate from a first discharge region disposed in a nozzle, while moving the nozzle and substrate with respect to each other in one direction, wherein a length of a direction crossing at right angles to the direction of the first discharge region is equal to or more than a maximum diameter or longest side of the substrate, the nozzle continuously spouts a first gas to the substrate from a first jet region, and the length of a direction crossing at right angles to the direction of the first jet region is equal to or more than the maximum diameter or longest side of the substrate.

Abstract: A method of cleaning a surface from ferrous particles, in a magnetic resonance apparatus in which a first magnetic field is applied in a first direction in an interrogation zone for creating a net magnetisation within a sample located within the interrogation zone and an alternating magnetic field is applied in a second direction in the interrogation zone for temporarily changing the net magnetisation of the sample located within the interrogation zone, with monitoring of energy emitted by the sample as the net magnetisation of the sample returns to its original state and generating an output signal having a characteristic which is proportional to the energy emitted; the method including disposing in effective proximity to the surface to be cleaned, a permanent magnet cleaning device, the magnet cleaning device being located outside the interrogation zone.

Abstract: An improved self-propelled harvester. The self-propelled harvester passes through a field to be harvested, while laborers place produce on a conveyor belt thereon. The produce is passed through a washing station, where it is preferably exposed to sideward and downward spray. Thereafter, the produce is transported upward along an elevator belt assembly, toward a trailer. The elevator belt assembly preferably has a plurality of flights located on rods positioned between side belts. The rods are spaced sufficiently so that leaves, debris and excess water can readily pass therethrough.

Abstract: The invention relates to a process for the removal of deposits formed in a reaction apparatus by the precipitation of solids from a liquid reaction mixture, which process is characterized in that particles of a material that is inert under the reaction conditions are introduced into the reaction apparatus, which particles, by suitable mechanical circulation of the reaction mixture, are so moved through the reactor that, during the reaction, by striking the walls or other built-in elements, they abrasively remove precipitates adhered thereto.

Abstract: The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.

Abstract: An apparatus for collecting impurities on a semiconductor wafer includes an airtight process chamber, a rotary chuck disposed in the process chamber for rotating and horizontally supporting the semiconductor wafer, a first scanning unit for forming a droplet of a first scanning solution and for scanning an upper surface of the semiconductor wafer rotated by the rotary chuck with the droplet to collect first impurities, a driving unit for tilting the rotary chuck and the semiconductor wafer supported on the rotary chuck, and a second scanning unit for receiving a second scanning solution for collecting second impurities from an edge portion of the semiconductor wafer, the second scanning solution being in contact with the edge portion of the semiconductor wafer tilted by the driving unit and rotated by the rotary chuck so that the second scanning solution scans the edge portion of the semiconductor wafer.

Abstract: A method for preparing a workpiece surface utilizing two more fluids of differing density and miscibility which create one or more fluid interfaces wherein the fluids are chosen such that the solubility or affinity of one of the fluids is high for a material to be removed from the workpiece surface while the other fluid has a low solubility or affinity for the material to be removed. The workpiece surface is treated by passing the workpiece through the fluid interface. The two or more fluids are preferably dispensed into an apparatus and allowed to settle into two or more predominant layers separated by an interface. Surface preparation techniques which may benefit from the present invention include etching, cleaning or drying processes and the like.

Abstract: During a washing cycle of a rubber blanket on a blanket cylinder some revolutions of the blanket cylinder are initially performed during which the cleaning element is lifted off the blanket cylinder temporarily when the clamping channel passes under the cleaning element.

Abstract: A produce washing method, which permits the washing of produce from both above and below in the field. The produce washing takes produce along a conveyor belt, from a loading section, to a washing section on which is located a washing unit, upward along an ascending section, and from there the produce travels along a dumping section and into a receptacle. The washing unit features spray nozzles located above and below the washing section, so as to direct spray from above and below the produce so as to more effectively wash it.

Abstract: The invention relates to an arrangement and a method for cleaning fine solid particles from a continuously flowing liquid suspension. According to the invention, alternate emptying of cleaned liquid in at least two decanting chambers (34, 36) of the cleaning arrangement (10) is brought about by alternately opening and closing valve units (48, 50) coordinated with outlets (44, 46) of the decanting chambers (34, 36). Alternatively, valves in feeds to at least two separate inlet tanks of the cleaning arrangement can be opened and closed alternately in order to bring about a continuous outflow of cleaned liquid.

Abstract: Embodiments of the present invention provide a developing method, which can efficiently prevent the developing solution from remaining on the backside surface of the wafer, so as to avoid the influence of the contamination on the subsequent processes. In one embodiment, a developing method comprises providing a wafer in a reaction space, wherein the wafer has an exposed photoresist thereon; coating a developing solution on a surface of the wafer; rotating the wafer; rinsing a normal surface and a backside surface of the wafer; and stopping rinsing the normal surface of the wafer while keeping rinsing the backside surface of the wafer for a specific time period.

Abstract: A method of collecting impurities existing on the surface of a semiconductor wafer and in a thin film formed on the semiconductor wafer is provided with a process for dripping collecting liquid on the surface of the semiconductor wafer to which hydrophobic processing is applied, a process for elongating the collecting liquid dripped and turned spherical by surface tension in a direction of the radius of the semiconductor wafer with the surface tension kept, a process for relatively rolling and scanning the elongated collecting liquid, touching the collecting liquid to the surface of the semiconductor wafer and incorporating impurities into the collecting liquid, a process for restoring the elongated collecting liquid to the original spherical shape after the impurities are incorporated and a process for withdrawing the collecting liquid restored to the spherical shape from the surface of the semiconductor wafer.

Abstract: A method for separating a substance such as a hydrocarbon from a particulate material such as soil is provided. An aqueous slurry is formed and a shear force is applied to the slurry, such as in a reversible helical screw conveyor, while the slurry is vibrated. The substance thus separated can then be removed from the particulate material.

Abstract: A cleaning station for a vertical nozzle plate of an ink jet printer includes a cylindrical cleaning roller that has an outer surface, and has a substantially vertical central axis and a substantially vertical rotational axis. The roller is spaced from the nozzle plate to form a cleaning cavity between the roller and the nozzle plate. The roller has a top end above the nozzle plate and a bottom end below the nozzle plate. A drive element is connected to the roller to rotate the roller about its rotation axis. A fluid outlet near the top of the roller directs cleaning fluid onto the outer surface of the roller, and into the cleaning cavity between the roller and the nozzle plate. A fluid reservoir stores cleaning fluid, and a fluid conduit conducts cleaning fluid from the fluid reservoir to the fluid outlet.

Abstract: The stripping agent is sprayed from the tip of the nozzle 33 onto the wafer surface, while the first supply nozzle 33 is actuated to scan from the central portion of the wafer to the outer portion thereof. This operation provides the situation, in which the interface of the residual droplet 38 is pulled back from the center of the wafer to the outer portion of the wafer by the surface tension of the stripping agent supplied from the nozzle. Meanwhile, the second supply nozzle 36 also scans at a same scanning speed as the first supply nozzle 33 scans. Vapor IPA is sprayed from the orifice of the second supply nozzle 36. This provides that vapor IPA is sprayed onto the wafer surface immediately after the stripping agent is sprayed thereon from the first supply nozzle 33, and the residual stripping agent on the wafer surface is efficiently replaced with IPA.

Abstract: A washer and method for cleaning poultry pads or similar items includes a tub which rotates around a horizontal axis. The tub is mounted on a wheeled frame for towing by a car, tractor or other vehicle. Dirty, soiled pads are placed in the tub on-site and the door is then secured. As the tub rotates during its washing cycle the pads are sprayed by water jets positioned along the interior central water conduit. Water collected in a drain is discharged at each revolution through an open gate valve located on the bottom of the drain. Baffles inside the tub agitate the pads and water, thus improving the cleaning ability of the washer.

Abstract: The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.

Abstract: A device for the side-specific cleaning of a microelectronic workpiece having a front side, a back side, and an edge includes a chamber, a fixture within the chamber that is adapted to hold one or more microelectronic workpieces. At least one transducer is located within the chamber and preferably adjacent to the edge of the microelectronic workpiece. The method includes the steps of immersing the front side, back side, and edge of the microelectronic workpiece in a first processing fluid while preferably rotating the microelectronic workpiece. The microelectronic workpiece is then rinsed and dried and immersed in a second processing fluid such that the back side and edge of the microelectronic workpiece are immersed in the second processing fluid, while preferably rotating the microelectronic workpiece, without exposing the front surface of the microelectronic workpiece to the second processing fluid.

Abstract: An immersion processing system is provided for cleaning wafers with an increased efficiency of chemical use. Such a system advantageously uses less cleaning enhancement substance that may be provided as gas, vapor or liquid directly to a meniscus or wafer/liquid/gas bath interface so as to effectively modify surface tensions at the meniscus with minimized chemical usage. Such a delivery system design may be applied for single wafer processing or for processing multiple wafers together within a single liquid bath vessel. For single wafer processing, in particular, cleaning enhancement substance can be delivered along one or both major sides of the wafer, preferably at the meniscus that is formed as the wafer and liquid are relatively moved, while a processing vessel usable for such single wafer processing may itself be designed with a minimized size to accommodate a single wafer.

Abstract: A method for minimizing galvanic corrosion effects in a single-wafer cleaning system is provided. The method initiates with spraying a cleaning chemistry containing corrosion inhibitors onto a surface of a wafer. Then, the surface of the wafer is exposed to the cleaning chemistry for a period of time. Next, a concentration gradient at an interface of the cleaning chemistry and the surface of the wafer is refreshed. Then, a rinsing agent and a drying agent are applied simultaneously to remove the cleaning chemistry, wherein the drying agent dries the surface of the wafer prior to a concentration of the corrosion inhibitors being diluted to a level insufficient to provide corrosion protection.

Abstract: A method and apparatus for dispensing a liquid on the surface of a localized zone of a substrate, for example for cleaning of etching purposes. Along with the liquid, a gaseous tensio-active substance is supplied, which is miscible with said liquid and when mixed with the liquid, reduces the surface tension of said liquid, thus containing the liquid in a local zone of the substrate surface.

Abstract: Embodiments of the invention include a megasonic energy cleaning apparatus that has the ability to rotate the wafer to be cleaned, as well as rotate the cleaning probe during the cleaning process. Rotating the cleaning probe while the wafer is being cleaned is effective to increase the cleaning action of the apparatus while also minimizing damage to the wafer. Curved grooves, such as a spiral groove, can be etched into the cleaning probe to minimize forming harmful waves that could potentially cause damage to the wafer surface or to structures already made on the surface. Using a cleaning probe having a curved groove while also rotating the cleaning probe effectively cleans particles from a wafer while also limiting damage to the surface of the wafer.

Abstract: Systems and methods for harvesting fresh produce using a produce harvesting apparatus wherein the method includes trimming the fresh produce and placing the trimmed produce into a container. The container is placed onto a transport device located on the produce harvesting apparatus. The container is then transported on the transport device to a wash station and it is washed at the wash station. The container may be shaken during transport after the wash station.

Abstract: A stripping solution is supplied onto the surface of a substrate and an alternating magnetic flux is applied to the substrate. The alternating magnetic flux induces a current in a conductive pattern of the substrate which heats the conductive pattern while the stripping solution is in contact with the substrate. The stripping solution, containing particles to be cleaned off the substrate, is then removed from the substrate.

Abstract: The invention relates to a device for removing loose cinder from the surface of a slab, especially a thin slab of a mini mill. One such mini mill comprises at least one slab casting machine, a slab separating device, a thermal compensation furnace and at least one roll stand comprising a reeling installation. The inventive device is improved in that a spray device (11) comprises at least one lower spray pipe (2) and at least one upper spray pipe (3) in relation to the slab (1), each spray pipe being fitted with a number of spray nozzles (4). Said spray device (11) is arranged in front of the roller hearth furnace (5) of the mini mill and is connected to a water supply (6) having the technologically required pressure and a volume flow which is adapted to the number of spray nozzles (4). The invention also relates to an operating method for the spray device (11).

Abstract: A chemical-mechanical polishing (CMP) method includes applying a solid abrasive material to a substrate, polishing the substrate, flocculating at least a portion of the abrasive material, and removing at least a majority portion of the flocculated portion from the substrate. Applying solid abrasive material can include applying a CMP slurry or a polishing pad comprising abrasive material. Such a method can further include applying a surfactant comprising material to the substrate to assist in effectuating flocculation of the abrasive material. Such surfactant comprising material may be cationic which includes, for example, a quaternary ammonium substituted salt. Also, for example, the surfactant comprising material may be applied during polishing, brush scrubbing, pressure spraying, or buffing.

Abstract: The present invention provides a system (200, 300) for remediating aberrations along the perimeter of a semiconductor wafer (202). The system includes a cleaning apparatus (204) within which the wafer is spun within a confined area. A chuck (208) defines the confined area, having a sidewall that extends above the upper surface (214) of the wafer and surrounds the perimeter of the wafer. The chuck also has a bottom wall, with an aperture formed therein, beneath the wafer. The system includes an isolation barrier (220), disposed atop the bottom wall of the chuck and around the aperture, in proximity to the lower surface so of the wafer. This forms a narrow gap (226) between the barrier and the wafer. A pressurized source forcefully directs a gas (218) at and along the lower surface of the wafer. The system also includes a remediation solution (228) that is applied to the upper surface of the wafer.