Abstract: Heat dissipating Silicon-on-Insulator (SOI) structures which utilize thermoelectric effects to more effectively dissipate thermal energy from SOI-based electronic circuits.

Abstract: The invention provides a temperature control device with excellent temperature uniformity and thermal response, which can be manufactured easily, and a manufacturing method for the same. A thermoelectric device 21 is arranged between a substrate mounting plate 1 and a cooling plate 3. Copper foil electrodes 5, 5, . . . on the upper side of the thermoelectric device 21 are adhered to a lower surface of the substrate mounting plate 1 with an adhesive sheet 17 covering substantially the entire lower surface of the substrate mounting plate 1, and copper foil electrodes 7, 7, . . . on the lower side of the thermoelectric device 21 are adhered to an upper surface of the cooling plate 3 with an adhesive sheet 19 covering substantially the entire upper surface of the substrate mounting plate 1.

Abstract: The invention provides a solid-state cooler that provides counter-current electricity flow through a device that includes Peltier junctions interconnecting the opposing flow of current through the device. The combination of counter-current flow with the Thompson,Peltier, and Seebeck thermoelectric effects provides an apparatus having the advantages of high energy efficiency, very small size and the ability to reach very low temperatures (near liquid nitrogen temperatures) with minimal energy input. The cooling apparatus is suitable for use in variety of applications, including superconductive devices such a superconductive Quantum Interference Devices (SQUID's) used in medical imaging to increase the sensitivity and resolution of NMR techniques. It is also provides a useful tool for cryosurgery apllications without the risks associated with the use and storage of liquid nitrogen. In addition, the device can be operated in the reverse to generate current from small gradients of temperature.

Abstract: A plurality of n-type bar-shaped devices (51) consisting of an n-type thermoelectric semiconductor and a plurality of p-type bar-shaped devices (52) consisting of a p-type thermoelectric semiconductor are regularly disposed or fixed through an insulating layer (50) to form a thermoelectric device block (53). End portions of the n-type bar shaped device (51) and the p-type bar-shaped device (52) are connected with an interconnection conductor (58a) on an upper surface (53a) and a lower surface (53b), which will be interconnecting end faces of the thermoelectric device block (53), to form a plurality of thermocouples connected in series.

Abstract: A heat dissipating apparatus includes a base member that has an upright surrounding wall portion confining a receiving space, and a top wall for closing a top side of the receiving space. The base member is adapted to be disposed on a circuit board with an integrated circuit device accommodated within the receiving space. The top wall is formed with a serpentine fluid groove that opens downwardly, and that has a fluid inlet in fluid communication with a first groove end, and a fluid outlet in fluid communication with a second groove end. A thermoelectric cooling unit is disposed in the receiving space, and has a heat-absorbing side adapted to be placed in contact with a heat-generating side of the integrated circuit device, and a heat-releasing side opposite to the heat-absorbing side. The cooling unit is adapted to separate the integrated circuit device from the fluid groove. A washer member is disposed in the receiving space below the cooling unit.

Abstract: Each of the n-type and p-type thermoelectric semiconductors (8, 9) are regularly arranged so that both end faces thereof form approximately flush interconnection end faces (3a, 3b) and are joined together through insulation, and interconnection electrodes (7) for alternately electrically connecting the n-type and p-type thermoelectric semiconductors (8, 9) are formed on both interconnection end faces (3a, 3b) to electrically connect the n-type and p-type thermoelectric semiconductors in series, thus obtaining a thermoelectric device block (3). A pair of connecting electrodes (6a, 6b) is formed to be electrically connected to the respective thermoelectric semiconductors corresponding to one end and the other end of a set of thermoelectric semiconductors connected in series in the thermoelectric device block (3).

Abstract: A plurality of n-type bar-shaped devices (51) consisting of an n-type thermoelectric semiconductor and a plurality of p-type bar-shaped devices (52) consisting of a p-type thermoelectric semiconductor are regularly disposed or fixed through an insulating layer (50) to form a thermoelectric device block (53). End portions of the n-type bar shaped device (51) and the p-type bar-shaped device (52) are connected with an interconnection conductor (58a) on an upper surface (53a) and a lower surface (53b), which will be interconnecting end faces of the thermoelectric device block (53), to form a plurality of thermocouples connected in series.

Abstract: A device for generating power to run an electronic component. The device includes a heat-conducting substrate (composed, e.g., of diamond or another high thermal conductivity material) disposed in thermal contact with a high temperature region. During operation, heat flows from the high temperature region into the heat-conducting substrate, from which the heat flows into the electrical power generator. A thermoelectric material (e.g., a Bi2Te3-based film or other thermoelectric material) is placed in thermal contact with the heat-conducting substrate. A low temperature region is located on the side of the thermoelectric material opposite that of the high temperature region. The thermal gradient generates electrical power and drives an electrical component.

Abstract: An electronic equipment power charging system has a temperature difference producing device for converting external electrical energy to heat. The temperature difference producing device has heat sources for outputting heat having different temperatures to produce a temperature difference. An electronic equipment has an electrothermal power generator for generating electrical power using the temperature difference produced by the temperature difference producing device to drive the electronic equipment. A measurement device measures the temperatures of the heat outputted by the heat sources of the temperature difference producing device. A control device controls the temperatures of the heat outputted by the heat sources of the temperature difference producing device in accordance with the temperatures measured by the measurement device.

Abstract: The invention refers to a thermoelectric generator unit comprising a plurality of thermoelectric elements (1) of alternately p and n character and electrically series connected by means of metal connector members (2), the elements having essentially cylindrical shape.

Abstract: A microcooler with channels through which coolant flows. The channels are formed by individual cooler layers having a region which is structured in the manner of a screen and having a plurality of openings with edge lines closed and with material bridges or material regions remaining between these openings. None of the openings on any of the cooler layers form a continuous channel which extends from a collection space for feed of the coolant to a collection space for drainage of the coolant. The individual breaches, and the material bridges or material regions, provided between them are offset from cooler layer to cooler layer such that flow of the coolant through the cooler is possible only with continuous changing of the layers. Using the breaches within the cooler results in a highly branched labyrinth through which coolant flows.

Abstract: A magnetoresistive sensor in the magnetic storage device includes a magnetoresistive element for sensing magnetic fields carried on storage medium. A cooling device is thermally coupled to the magnetoresistive element and arranged to conduct heat in a direction away from the magnetoresistive element to thereby cool the magnetoresistive element during normal operation of the storage device.

Abstract: The present invention provides a structure and a method of fabricating a thermoelectric Cooler directly on the backside of a semiconductor substrate. The thermoelectric (TE) cooler (thermoelectric cooler) disperses heat from an integrated circuit (IC) that is formed on the front-side of the silicon substrate. Spaced first bonding pad holes 28 are formed in the backside of a substrate that expose bonding pads 24. Second holes 32 are formed between the spaced first bonding pad holes 28. A first insulating layer 34 is formed over the backside of the substrate, but not over the bonding pad 24. A metal layer is formed lining the first bonding pad holes 28. A polysilicon layer 46 is formed over the surface of the backside of the substrate in the second holes. The polysilicon layer is implanted thereby forming alternating adjacent N and P doped sections 46p 46n in the second holes. The adjacent N and P doped polysilicon sections 46n 46p are electrically connected to the bonding pads 24 by the metal layer 38.

Abstract: The present invention provides an alkali metal thermal to electric conversion cell having radially projecting beta-alumina type solid electrolyte elements and a central heat input region.

Abstract: A multi-stage electronic cooling device has an electrically insulating base plate, a first thermoelectric converter portion having the Peltier effect and disposed on one surface of the electrically insulating base plate, and a second thermoelectric converter portion having the Peltier effect and disposed on another surface of the electrically insulating base plate. A through hole is formed in the electrically insulating base plate. An electrically conductive member interconnects the first thermoelectric converter portion and the second thermoelectric converter portion via an interior of the through hole.

Abstract: The present invention provides an alkali metal thermal to electric conversion (AMTEC) cell of the type employing an alkali metal flowing between a high-pressure zone and low-pressure zone in the cell through a solid electrolyte structure. The cell preferably includes a condenser communicating with the low-pressure zone for condensing alkali metal vapor migrating through the low-pressure zone from the solid electrolyte structure. An artery is coupled to the condenser for directing condensed alkali metal from the condenser toward a hot end of the cell. An evaporator for evaporating the condensed alkali metal is coupled to the artery and communicates with the high-pressure zone. A heat shield is disposed in the low pressure zone of the cell for reducing the radiative heat transfer between the hot end of the cell and the cold end of the cell. The heat shield preferably includes a first end having a known area transitioning to a second end encompassing a smaller area than the first end.

Abstract: An integrated circuit cooling device in which a thermoelectric module (TEM) is built into a printed circuit board (PCB) so that the TEM converts heat generated by an integrated circuit on the PCB into DC power that is then supplied to a DC--DC regulator to drive a cooling fan. In one embodiment, the cooling fan is incorporated within a heat sink disposed on one side of the PCB so that the built-in TEM is between the heat sink and the integrated circuit being cooled. In an alternate embodiment, the cooling fan is located remotely from the heat sink.

Abstract: A thermoelectric radiator for generating a direct current while providing at least a portion of the necessary cooling is formed with a first and second plurality of interdigitated thermoelectric lamella which are electrically joined and are connected to the positive and negative portions of the electrical system. The result is direct current flow when a heated coolant is passed over the lamella.

Abstract: A thermoelectric device fabricated of at least two dissimilar thermoelements and at least one of the thermoelements has a conductor in parallel therewith increasing the Figure of Merit. The thermoelements are also surrounded by a conductor along the leg lengths thereby simplifying the manufacturing process.

Abstract: A method of manufacturing a thermoelectric module is provided. A first electrically conductive pattern is defined on a first substrate and a second electrically conductive pattern is defined on a second substrate. Alternating bars of a first thermoelectric material and a second thermoelectric material are arranged parallel to each other. The bars are fixed into place on the first conductive pattern by an effective thermal and electrical connection with the conductive pattern. One such connection means is soldering. Then the bars are separated into elements. The second substrate is positioned over the elements and fixed to the elements to complete the manufacture of the TEM.

Abstract: A cooling device for lowering the temperature of a heat-dissipating device. The cooling device includes a heat-conducting substrate (composed, e.g., of diamond or another high thermal conductivity material) disposed in thermal contact with the heat-dissipating device. During operation, heat flows from the heat-dissipating device into the heat-conducting substrate, where it is spread out over a relatively large area. A thermoelectric cooling material (e.g., a Bi.sub.2 Te.sub.3 -based film or other thermoelectric material) is placed in thermal contact with the heat-conducting substrate. Application of electrical power to the thermoelectric material drives the thermoelectric material to pump heat into a second heat-conducting substrate which, in turn, is attached to a heat sink.

Abstract: A reversible thermoelectric converter includes first and second quantum well diodes and an electrical connection between the first and second quantum well diodes without a thermal barrier between them. Each quantum well diode includes first and second electrodes wherein electrons are quantized in discrete energy levels and a dielectric layer providing a potential barrier between the first and second electrodes. When electrons in the first quantum well diode have a higher temperature than the electrons in the second quantum well diode, electric voltage fluctuations resulting from transitions of the electrons between the energy levels in the first quantum well diode are coupled from the first quantum well diode to the second quantum well diode. The reversible thermoelectric converter can be operated for power conversion of thermal energy to electric energy, as a heat pump or a refrigerator, or as an amplifier.

Abstract: A thermoelectric cooling system having an electric circuit including a d.c. power source providing direct current through the electric circuit, a thermoelectric module having at least one heat sink and at least one heat source capable of being cooled to a predetermined temperature range, and a control assembly. The d.c. power source, the control assembly, and the thermoelectric module being connected to each other in series. The control assembly comprising a thermostat control switch mechanism and a resistive element connected to each other in parallel. The thermostat control switch mechanism having a sensor generally coupled to the heat source of the thermoelectric module, the thermostat control switch mechanism being open in the predetermined temperature range.

Abstract: The invention provides a micro-climate control unit. The invention uses a thermoelectric stack to provide both heating and cooling of a temperature controlled element. The heating and cooling uses a temperature controller which senses the need for heating or cooling and provides the current to the thermoelectric stack which provides heating or cooling. The thermoelectric stack is improved by the use of a hard spacer.

Abstract: A self-powered fan for circulating air for use in cooperation with a heat source, said fan comprising a heat transfer member having a heat transfer surface operably cooperable with said heat source, electric motor, fan blades, thermocouple means cooperable with said electric motor and said heat transfer member, the improvement comprising said heat transfer member being of suitable size, mass and shape as to provide a suitable temperature gradient between said thermocouple means and said heat source to operably allow of sufficient heat transfer from said heat transfer member to said thermocouple means to generate sufficient power to effect rotation of said blades but not to cause thermal damage to said thermocouple means.

Abstract: A reversible thermoelectric converter includes first and second quantum well diodes and an electrical connection between the first and second quantum well diodes without a thermal barrier between them. Each quantum well diode includes first and second electrodes wherein electrons are quantized in discrete energy levels and a dielectric layer providing a potential barrier between the first and second electrodes. When electrons in the first quantum well diode have a higher temperature than the electrons in the second quantum well diode, electric voltage fluctuations resulting from transitions of the electrons between the energy levels in the first quantum well diode are coupled from the first quantum well diode to the second quantum well diode. The reversible thermoelectric converter can be operated for power conversion of thermal energy to electric energy, as a heat pump or a refrigerator, or as an amplifier.

Abstract: A configuration of solid state thermoelectric heat transfer or removal elements is provided to enhance the rate and amount of heat removal from electrical and electronic circuit devices. By rotating the thermoelectric heat transfer modules ninety degrees and by disposing them between the interdigitated fingers of a cold plate and a heat transfer plate possessing fins, improved thermal transfer is produced without the necessity of liquid coolants or moving part cooling devices. Accordingly, a method and apparatus is provided for enhancing heat transfer using thermoelectric modules. One embodiment of the present invention is particularly seen to be easy to manufacture. Additionally, this embodiment also possesses desirable heat transfer characteristics in terms of the cross sections of thermally conductive components.

Abstract: A heater mechanism incorporating a thermoelectric converter for use with a self-powered, solid, liquid or gaseous fueled, heater. During operation of the heater mechanism the thermoelectric converter supplies sufficient electrical power to (a) sustain the heater in operation, (b) maintain the starter battery at full charge, and (c) provide auxiliary power to remove and transport heat to desired locations away from the heater. The converter is a highly compact design (high power output per unit volume of space) and lends itself to high volume (mass production) and automated assembly techniques to produce it inexpensively. The thermoelectric converter is made of fewer components than prior art devices. A number of components in the thermoelectric stack serve dual or even multi-functions. The thermoelectric stack components are bonded or mounted together in such a manner as to permit handling as a unit.

Abstract: A thermoelectric heat pump which is resistant against thermal stresses incurred during thermal cycling of Thermal Cyclers or the like between cold and hot temperatures of about 0.degree. C. at a ramping rate up to about 1.degree. C. per second has improved joints between the thermoelements and electrical conductors which have low electrical resistance and which substantially reduce fractures during thermal cycling. The joints include a tin-silver-indium solder containing by weight about 95% tin, 3.5% silver, and 1.5% indium, or a tin-silver-cadmium solder containing by weight about 95.5% tin, 3.5% silver, and 1.0% cadmium. A robust nickel diffusion barrier between the joints and thermoelectric elements ends provides additional improvement against joint fracture.

Abstract: A thermoelectric cooling device for a thermoelectric refrigerator is described. The device is composed of p-type and n-type semiconductor layers, a first inner heat conductor, a first outer heat conductor, a second inner heat conductor, and a second outer heat conductor. The p-type and n-type semiconductor layers are electrically connected in series via the electrodes. The p-type and n-type semiconductor layers have a specific average thickness. The average figures of merit of the p-type and n-type semiconductor layers are controlled to a particular value. The thermal conductances of the first and second, inner and outer heat conductors fall within specific ranges, respectively. The coefficient of performance defined in terms of the ratio of the quantity of absorbed heat to inputted power is at least 0.6. Also described are a process for the fabrication of a semiconductor suitable for use in the thermoelectric cooling device and also a thermoelectric refrigerator using the thermoelectric cooling device.

Abstract: Multijunction thermal converters are formed in an integral multifilm membrane form over a through opening in a nonmagnetic, dielectric substrate. Through the use of conventional photolithographic and etching techniques, very compact, rugged and precise integrated structures are formed to include either single linear elongate heater elements, bifilar or trifilar heater elements, and multijunction thermopiles at reasonable cost. Disposition of the heater element and hot junctions of the thermopiles over a through opening in the substrate, with the cold junctions of the thermopiles disposed over the substrate thickness, enables the heating element to provide a substantially isothermal uniform heating of the thermocouple hot junctions to obtain high thermal efficiency and reduce Thompson and Peltier heating effects. Forming the essential elements into an integrated multifilm membrane also makes possible minimization of interconnections between the elements, and this results in minimized reactance.

Abstract: Heat transfer apparatus, whether in panel or tubular form, comprises bimetallic laminations, at least one of the metals being ferromagnetic. A temperature differential causes thermoelectric current circulation (in effect, a d.c. eddy-current) within each lamination which develops a magnetizing H-field. A transverse electric potential may also be used to enhance thermoelectric activity across a bimetallic junction. The ferromagnetic B-field enhancement develops in turn a circulating diamagnetic reaction current which augments the thermoelectric activity and causes an overriding thermal feedback and bistable direction-of-heat-flow operation. Control involves the priming action of an applied electric and/or magnetic field or preheating by electrical resistors in the heat sinks. Application in a thermally powered electric transformer generator is described.

Abstract: In the conventional thermoelectric conversion module, P-type thermoelectric semiconductor chips and N-type thermoelectric semiconductor chips are alternately arranged in both the longitudinal and the transverse directions. Consequently, assembling work is complicated and there arises the problem in quality that erroneous types of chips are arranged. In the present invention, therefore, each of either rows of chips or columns of chips is constituted by thermoelectric semiconductor chips of the same type, thereby to improve assembling workability as well as to prevent erroneous arrangement. Furthermore, as a preferred fabricating method, bar-shaped thermoelectric semiconductors are used and are jointed to one substrate and then, are electrically disconnected between the leads.

Abstract: A thermopile 30 comprises a stacked assembly of bimetallic layers in which there is full conductor interface contact over the distance separating hot and cold surfaces 31, 32. The assembly may include dielectric layers forming a capacitor stack. A.C. current through the stack is matched in strength to the Seebeck-generated thermoelectric current circulating in each bimetallic layer. The resulting current snakes through the stack to cause Peltier cooling at one heat surface and heating at the other. A.C. operation at a kilocycle frequency enhances the energy conversion efficiency as does heat flow parallel with the junction interface.

Abstract: A thermoelectric transducer apparatus comprises a group of thermoelectric elements having N-type elements and P-type elements alternately arranged in a single line and a number of alternately arranged heat-absorbing-type and heat-liberating-type plate electrodes to electrically and serially connect said N- and P-type elements.

Abstract: Thermoelectric heat pumps using recuperative heat exchange are described. These devices use sets of thermocouples (thermoelectric couples) arranged side-by-side to form a plate. The plate is positioned in a fluid-containing vessel and heat exchanging fluid is flowed down one side of the plate and up the other side. In these devices the heat flow, and thus the driving thermal gradient on each thermoelectric couple in the device, is in a direction from one side of the plate to the other side, i.e., other than the direction of the device's working thermal gradient, which is the direction of the flow of fluid. Generally these two directions (driving gradient on the thermoelectric couples and fluid flow-working thermal gradient) are essentially orthogonal to each other.

Abstract: A thermoelectric device has a cylindrical structure with a hollow central annulus member in which a fluid is pumped so that the heated fluid is pumped from the center of the structure and discharged on the outer surface of an outer annulus member or with the reversal of electrical current, the heated fluid is pumped from the outer periphery and discharged in the central tube. A plurality of thermoelectric cells are positioned in the space between the inner and outer annulus members with the cells being radially directed relative to the axis of the inner annulus member. A thermoelectric device having a similar structure may be used for the conversion of thermal energy to electrical energy when a thermal gradient is imposed between the inner member of the structure and the peripheral surface.

Abstract: A thermoelectric device has hot and cold sides. The hot and cold sides include a plate of insulation material having "peanut" or rectangularly shaped tabs forming hot and cold side tab patterns. The tabs have circular or polygonal shaped pockets adjacent opposing ends of the tabs. Legs of p-type and n-type semiconductor material are attached in opposing end pockets of the tabs. Spade connectors are attached to end tabs of the cold side plate for connection to a dc source of power. The legs are vibrated into the pockets of one side (either the hot or cold side) and the tabs of the other side are positioned to opposing ends of the tabs of the other side (either the cold or hot side).

Abstract: An apparatus for cooling circuit modules by use of a thermo-electric device which comprises a series of semiconductor regions and etched copper conductors designed to conduct heat in a specified direction by means of the Peltier Effect. The thermo-electric device is sandwiched between two layers of a polymer based, thermally conductive dielectric such as the dielectric used in the manufacture of Thermal Clad.TM.. The hot layer of Thermal Clad.TM. (i.e., the layer that receives heat) is laminated directly to a heat sink. The cold layer of Thermal Clad.TM. is laminated directly to a cold plate which is, in turn, coupled to the circuit module.

Abstract: A flexible heat transfer apparatus used to flexibly connect and thermally couple a thermoelectric cooler to an object to be cooled. The flexible heat transfer apparatus consists of a pair of flexible corrugated sheets made from high thermal conductivity materials such as copper, aluminum, gold, or silver. The ridges of the corrugated sheets are oriented perpendicular to one another and bonded sandwich-fashion between three plates to define an upper section and a lower section. The upper section provides X flexure, the lower section provides Y flexure, and both sections together provide Z flexure.

Abstract: A practical cryogenic Peltier cooler is devised by replacing one of the semiconducting elements in a conventional peltier cooler with an element comprised of bulk, or thin film superconducting material. In the preferred embodiment, a rare-earth, a barium copper oxide superconductor of the form Yb.sub.a Cu.sub.3 O.sub.x is utilized. The superconducing elements are placed in an alternating series with semiconducting elements comprised of bismuth telluride of the form Bi.sub.2 Te.sub.3 (n-type). Performance may be improved in an alternative embodiment by utilizing instead a bismuth antimony semiconductor of the form Bi.sub.85 Sb.sub.15 (n-type). As a result, cryogenic Peltier coolers can be devised with useful refrigeration capacities and stable cold temperatures of 65-80 degrees Kelvin and below, while heat sinked to a higher temperature.

Abstract: A thermoelectric cooler device having thermoelectric elements of n and p type semiconductor material arranged in rows and columns between insulating substrates of alumina or beryllia, or ceramic materials having a known emissivity is coated with material(s) having an emissivity substantially lower than that of the thermoelectric cooler. The coating includes a layer of insulating material on at least a portion of the surfaces of the thermoelectric cooler, a layer of diffusion barrier forming material on the insulating layer, and a layer of low emissivity material on the diffusion barrier layer. For example, the insulating layer is silicon dioxide having a thickness of about 10,000 Angstroms, the diffusion barrier layer is titanium tungsten having a thickness of about 400-500 Angstroms, and the low emissivity layer is gold having a thickness of about 1,000 Angstroms.

Abstract: A thermoelectric module comprises an odd number of thermoelements (1a, 2a, 1b) connected electrically in series and disposed thermally in parallel. The electrical current flowing through a heat exchanger (9) is conducted into the module by metallic members (8a, 8b) and by first and second types of connectors (4a, 4b and 6a, 6b).

Abstract: A lockable, mechanically secure coupling is provided for heat exchanger tubes which are connected together by end plates into superimposed layers (A or B) to form hydraulic connections between the extremities of two tubes (1) using tubular elbows (3). Each tubular elbow (3) has a coupling member (5) connected to the extremities thereof by welding, brazing or glueing to form a coupling flange. The subassembly comprising an elbow with its coupling member (5) is received in a countersunk recess (10) in the external face of the end plate and is mechanically locked by pairs of straight pins (13) which extend into spaced parallel bores (12) or (15), disposed orthogonally to the axis (XX) of the tubes (1), each pin (13) being received in an external semicircular groove (9) of the coupling member (5). The invention provides a tight, mechanically sound joint for the hydraulic connections between tubular heat exchangers used in thermoelectric devices employed as heat pumps or as electrical generators.

Abstract: A method and apparatus for fabricating a thermoelectric device includes forming a matrix board (12) with an array of orifices (100) formed therein. A plurality of P-type thermoelements (96) are formed and then a vacuum chuck (92) is utilized to dispose alternating ones of the elements (96) into the alternating ones of the orifices (100). A plurality of N-type elements (108) is formed and a vacuum chuck (104) is utilized to dispose alternating ones of the elements (108) into the remaining orifices (100) of the matrix (12). This forms an assembled array (52). A plurality of conductive tabs (114) is placed onto the P-type elements (98) and N-type elements (108) by a vacuum chuck (116). A second set of conductive tabs (120) is disposed on the opposite side of the assembled array by a vacuum chuck (124). A solder flow oven (54) and a solder flow oven (76) are utilized to reflow the solder on the tabs between the two operations.

Abstract: A generator of electric energy by the transformation of thermal, solar energy, or of heat of any source, consisting in one or more thermocouples combined with a cooling device, cooling down the weldings of the thermocouples on which heat is produced by the Peltier effect, also producing a very high thermal gradient. The cooling device exploits, for the functioning thereof, the phenomena which can be observed along the thermocouples. The system for the use of such a generator provides a particular disposition of the same in parabolic collectors, as to increase the sun ray concentration onto the weldings exposed to the heat and as to allow a decentralization in the electric energy supply by means of a plurality of generators consisting in only one thermocouple, said generators being interconnected.

Abstract: An improved method of fabricating thermoelectric power generator modules, which are particularly useful in converting solar energy into electrical power and heat, is disclosed. This method involves the formation of an array of longitudinally elongated n- and p-type semiconductor elements tightly contained in a supporting matrix; slicing the supporting matrix containing the semiconductor elements to provide a plurality of matrix plates; and the application of a pattern of electrically conductive pads on opposite surfaces of the matrix plates to connect n- and p-type semiconductor elements, in series, thereby forming a thermoelectric power generator module. This method is simpler, less expensive and more adaptable to large scale production than methods heretofore proposed.

Abstract: A heat pump having a set of "thermoelements" that have substantially the same thickness and at least two radiant flat elements that permit the diffusion or absorption of the heat, and is characterized by being made in the form of a sandwich comprising, in addition to the said radiant elements, two supports that are electrically insulated and effectively conduct the electricity, placed on either side of the thermoelements, and securing both the electric coupling of the thermoelements to one another and also the thermal coupling of the radiant elements to the thermoelements, while allowing a mechanical coupling of all the elements, each of said supports possessing a first face contacting with its entire surface one of the radiant elements and a second face covered by a layer of discontinuous elements that are effective conductors of electricity, these elements being distributed on the two supports in such a manner that, when the thermoelements are locked between them, the said conductor elements realize the ser

Abstract: Module for conditioning air by the Peltier effect, comprising a hot plate and a cold plate arranged face to face, divided into strip plates and both provided with ribs, the P and N thermoelements connected by the strip plates and arranged between the crests of the cold ribs and the crests of the hot ribs, the cold ribs are vertical and the hot ribs are vertical or horizontal. The air to be conditioned circulates by natural convection along the vertical ribs without forced ventilation.