Abstract: A fine particulate flux, an aqueous flux preparation comprising this flux, a method for the manufacture of a coated part of aluminum, aluminum alloys, steel, copper or titanium using such flux, and a method for brazing parts of aluminum or aluminum alloys to parts of aluminum, aluminum alloys, steel, copper or titanium using such flux. The flux can be obtained by sieving, or it can be obtained by removing solids, e.g., in a cyclone, from the drying gases obtained when wet fluxes are dried, especially after their manufacture. Fine particulate flux increases the viscosity of flux preparations comprising the flux dispersed in water or an aqueous or liquid organic carrier.

Abstract: A flux for resin cored solder containing a thermosetting resin is disclosed which is excellent in storage stability and productivity, and a resin cored solder having the flux built in. The flux for resin cored solder comprises a solid-state first flux containing a thermosetting resin, and a solid-state second flux containing a curing agent having redox activity, the first flux and the second flux being present in a non-contact state. A resin cored solder comprises the flux for resin cored solder and a lead-free solder alloy having a melting point ranging from 130° C. to 250° C. The resin cored solder is made up of a first resin cored solder in which the first flux is built into the lead-free solder alloy, and a second resin cored solder in which the second flux is built into the lead-free solder alloy.

Abstract: A sintering method is provided which allows components to be joined to each other in a stable way, wherein the processing temperature is less than 200° C. and stable contact points are produced, which have low porosity and also high electrical and thermal conductivity. The method for joining components includes (a) providing a sandwich arrangement having at least (a1) one component 1, (a2) one component 2, and (a3) a metal paste located between component 1 and component 2, and (b) sintering the sandwich arrangement. The metal paste contains (A) 75-90 weight percent of at least one metal present in the form of particles having a coating containing at least one organic compound, (B) 0-12 weight percent of at least one metal precursor, (C) 6-20 weight percent of at least one solvent, and (D) 0.1-15 weight percent of at least one sintering agent selected from the group comprising (i) organic peroxides, (ii) inorganic peroxides, and (iii) inorganic acids.

Abstract: A sintering method allows components to be joined to each other in a stable way at a processing temperature of less than 200° C., producing stable contact points having low porosity and high electrical and thermal conductivity. The method includes (a) providing a sandwich arrangement having at least a first component, a second component, and a metal paste located between the first and second components, and (b) sintering the sandwich arrangement. The metal paste includes (A) 75-90 wt. % of at least one metal present in the form of particles having an organic compound-containing coating, (B) 0-12wt % of at least one metal precursor, (C) 6-20wt % of at least one solvent, and (D) 0.1-15 wt % of at least one sintering agent selected from (i) salts of C1-C4 organic acids, (ii) esters of C1-C4 organic acids, and (iii) carbonyl complexes.

Abstract: The present invention relates to an intermediate product for joining and coating by brazing comprising a base metal and a blend of boron and silicon, said base metal having a solidus temperature above 1040° C., and the intermediate product has at least partly a surface layer of the blend on the base metal, wherein the boron in the blend is selected from a boron source, and the silicon in the blend is selected from a silicon source, and wherein the blend comprises boron and silicon in a ratio of boron to silicon within a range from about 3:100 wt/wt to about 100:3 wt/wt. The present invention relates also to a stacked intermediate product, to an assembled intermediate product, to a method of brazing, to a brazed product, to a use of an intermediate product, to a pre-brazed product, to a blend and to paint.

Abstract: A soldering flux is disclosed which exhibits improved shape retention properties during printing, can inhibit sagging upon heating, and exhibits high electrical reliability between conductors. The soldering flux contains an epoxy resin, an organic carboxylic acid and, as a heat-resistant shape-retaining agent, and a plastic having a linear structure, wherein the epoxy resin and the organic carboxylic acid are blended so that the quantity of carboxyl groups in the organic carboxylic acid is 0.8 to 2.0 equivalents relative to 1.0 equivalent of epoxy groups in the epoxy resin, and the total quantity of the epoxy resin, the organic carboxylic acid and the plastic having a linear structure is 70 mass % or more relative to the total mass of the flux.

Abstract: A method is provided for connecting at least two components, in which a sintering preform is used. This preform includes a carrier having a surface that has at least one structuring element containing hardened paste, wherein the hardened paste contains: (a) metal particles having a coating that contains at least one organic compound; and (b) at least one sintering aid selected from the group consisting of (b1) organic peroxides, (b2) inorganic peroxides, (b3) inorganic acids, (b4) salts of organic acids, wherein the organic acids have 1-4 carbon atoms, (b5) esters of organic acids, wherein the organic acids have 1-4 carbon atoms, and (b6) carbonyl complexes. The surface of the carrier having the hardened paste is not reactive to the constituents of the paste.

Abstract: To provide flux for flux cored solder that allows flux residue to have flexibility and can be used without depending on any soldering method. The flux for flux cored solder contains rosin, high molecular compound that prevents melt viscosity of the flux from being increased and allows a flux residue to have flexibility after heating by soldering, and halide that prevents the melt viscosity of the flux from being increased and by a combination of the high molecular compound that allows the flux residue to have flexibility after the heating by the soldering, allows the flux to cover a surface of solder melted during the heating by the soldering.

Abstract: In solder paste of the present invention, a first metal powder, a second metal powder, and a third metal powder are dispersed in a flux or a thermosetting resin. The first metal powder includes a first metal material such as Cu, Ag, Au, or Pd that serves as a base metal. A second metal material such as Sn or In that has a melting point lower than that of the first metal material is coated on the surface of the first metal material. The second metal powder is made of a metal material such as Sn or In that has a melting point lower than that of the first metal material. The third metal powder such as a Cu, Ag, Au or Pd powder has an average particle diameter smaller than that of the first metal material and can form compounds with the second metal material and the second metal powder.

Abstract: A flux coating composition may include a composition paste including an elastomer solution mixed with a flux powder or a flux paste. When the composition is heated during a brazing operation, the composition yields no metal oxides and ?50 ppm of carbon, ash, fumes, smoke, or other by-product contaminants. The flux may include a binder with an acrylic resin and a plurality of synthetic rubber compounds.

Abstract: There is provided a water-soluble flux composition for soldering which is excellent particularly in heat resistance and flux residues after soldering of which can be easily removed by washing with water or warm water. The flux composition for soldering contains a compound of formula (1): wherein R1, R2, R3, R4, R5 and R6 independently of one another are a hydrocarbon group or hydrogen atom, and A1, A2 and A3 independently of one another are hydroxy group or an organic group of formula (2): and at least one of A1, A2 and A3 is an organic group of formula (2).

Abstract: Pre-flux coating for the manufacturing of components by brazing, in particular manufacturing of heat exchangers of aluminium components including one or more fluxes and filler material. The coating is composed of one ore more fluxes in the form of potassium aluminum fluoride K1-3AIF4.6, potassium trifluoro zincate, KZnF3, lithium aluminum fluoride Li3AIF6, filler material in the form of metallic Si particles, Al—Si particles and/or potassium fluoro silicate K2S1F6, and additive in the form of alumminium oxide and/or other suitable oxide or material forming a post braze ceramic layer, and further including solvent and binder containing at least 10% by weight of a synthetic resin which is based, as its main constituent, on methacrylate homopolymer or methacrylate copolymer.

Abstract: In solder powder having an average particle size of 5 ?m or less and constituted by a center core and a covering layer covering the center core, wherein the center core consists of an intermetallic compound of silver and tin, or silver and the intermetallic compound of silver and tin, the covering layer consists of tin, and an intermediate layer which consists of an intermetallic compound of copper and tin is interposed between the center core and the covering layer so that at least a part of the center core is covered thereby.

Abstract: A solder composite is provided. The solder composite may include: a metal-based solder matrix, a capsule dispersed in the solder matrix, and a self-healing material that is encapsulated in the capsule. The self-healing material may be configured to react with the solder matrix when in contact with the solder matrix such that at least one of an electrically conductive intermetallic compound and an electrically conductive alloy is formed.

Abstract: It is an object of the present invention to provide a multilayer wire which can accomplish both ball bonding property and wire workability simultaneously, and which enhances a loop stability, a pull strength, and a wedge bonding property. A semiconductor bonding wire comprises a core member mainly composed of equal to or greater than one kind of following elements: Cu, Au, and Ag, and an outer layer formed on the core member and mainly composed of Pd. A total hydrogen concentration contained in a whole wire is within a range from 0.0001 to 0.008 mass %.

Abstract: High Impact Toughness Alloy The invention provides an alloy, preferably a lead-free solder alloy, comprising: from 35 to 59% wt Bi; from 0 to 0.0 wt % Ag; from 0 to 1.0% wt Au; from 0 to 1.0% wt Cr; from 0 to 2.0% wt In; from 0 to 1.0% wt P; from 0 to 1.0% wt Sb; from 0 to 1.0% wt Sc; from 0 to 1.0% wt Y; from 0 to 1.0% wt Zn; from 0 to 1.0% wt rare earth elements; one or more of: 10 from greater than 0 to 1.0% wt Al; from 0.01 to 1.0% wt Ce; from greater than 0 to 1.0% wt Co; from greater than 0 to 0.0% wt Cu; from 0.001 to 1.0% wt Ge; from greater than 0 to 0.0% wt Mg; from greater than 0 to 1.0% wt Mn; from 0.01 to 1.0% wt Ni; and from greater than 0 to 1.0% wt Ti, and the 1 balance Sn, together with any unavoidable impurities.

Abstract: An electroconductive material that includes a metal component containing a first metal and a second metal having a higher melting point than the first metal, and has a configuration in which the first metal is Sn or an alloy containing Sn, and the second metal is a Cu—Cr alloy which forms, with the first metal, an intermetallic compound exhibiting a melting point of 310° C. or higher. The first metal can be Sn alone or an alloy containing Sn and at least one of Cu, Ni, Ag, Au, Sb, Zn, Bi, In, Ge, Al, Co, Mn, Fe, Cr, Mg, Pd, Si, Sr, Te, and P.

Abstract: An electroconductive material that includes a metal component containing a first metal and a second metal having a higher melting point than the first metal, and has a configuration in which the first metal is Sn or an alloy containing Sn, and the second metal is a Cu—Al alloy which forms, with the first metal, an intermetallic compound exhibiting a melting point of 310° C. or higher. The first metal can be Sn alone or an alloy containing Sn and at least one of Cu, Ni, Ag, Au, Sb, Zn, Bi, In, Ge, Al, Co, Mn, Fe, Cr, Mg, Pd, Si, Sr, Te, and P.

Abstract: A composition including a solder flux including a rosin material have a property to maintain a less than 10 percent drop in tackiness from an initial tackiness value of 20 gf to 120 gf over a temperature regime of 20° C. to 200° C. A composition including a solder powder; and a solder flux including a rosin material including a softening temperature of 150° C. to 200° C. and a molecular weight of 300 g/mol to 600 g/mol. A method including introducing a solder paste to one or more contact pads of a substrate, the solder paste including a solder powder and a solder flux including a rosin material including a softening temperature of 150° C. to 190° C. and a molecular weight of 300 g/mol to 600 g/mol; contacting the solder paste with a solder ball of a package substrate; and heating the solder paste.

Abstract: A wire for use in a brazing or soldering operation is provided. The wire preferably includes a body formed of a metallic material. A flux solution is provided within a channel along at least a portion of the length of the body and a surface of the flux solution is exposed. The body is preferably formed into an annular ring having an inner wall and an opposing outer wall. The flux solution preferably includes a solvent, a polymer dissolved in the solvent, and a powdered flux added to the polymer solution.

Abstract: Disclosed herein is a solder composition comprising a metal or a metal alloy; and an electrically conductive high temperature polymeric composition; where the electrically conductive high temperature polymeric composition is dispersed homogeneously in the metal; and where the electrically conductive high temperature polymeric composition has a higher glass transition temperature or a melting point than the flow temperature of the metal or metal alloy. Disclosed herein too is a method comprising mixing an electrically conductive high temperature polymeric composition with a metal or a metal alloy to form the solder composition; where the electrically conductive high temperature polymeric composition is dispersed homogeneously in the metal; and where the electrically conductive high temperature polymeric composition has a higher glass transition temperature or a melting point than the flow temperature of the metal or metal alloy.

Abstract: To provide a flux that can suppress occurrence of migration surely in a soldered portion on which flux residue is formed. In the flux that forms solder paste by mixing the flux with solder powders, the flux contains phosphonate ester with an amount thereof such that a hydrophobic film is formed. The phosphonate ester is adsorbed to a surface of a soldered portion during soldering. The addition amount of phosphonate ester is preferably not less than 1 mass % through less than 30 mass %. It is preferable that the phosphonate ester is diethyl benzylphosphonate, diethyl allylphosphonate, diethyl (p-methylbenzyl)phosphonate or (2-ethylhexyl)-2-ethylhexyl phosphonate.

Abstract: A brazing ring with integrated fluxing product and methods for production thereof is described. The brazing ring has a c-shaped body with a plurality of channels extending the thickness of the ring and disposed about the circumference thereof. The channels are separated by radially extending flanges with enlarged distal ends that extend into the channels. The enlarged ends at least partially enclose the channels to aid in retention of a fluxing product disposed in therein. The c-shape may enable flexure of the ring for installation on a pipe or fitting and a friction fit to maintain an installed position. The brazing ring is formed by extruding a filler material to form a tube with the desired profile and compressing the fluxing product into the channels of the profile. The tube is subsequently sectioned perpendicularly to its length to produce a plurality of the brazing rings.

Abstract: Embodiments in accordance with the present invention encompass polymer compositions that act as both a tack agent and a fluxing agent for the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions embodiments encompass a sacrificial polymer, a carrier solvent, a thermal acid generator and, optionally, formic acid.

Abstract: A composition for welding or brazing aluminum comprises silicon (Si) and magnesium (Mg) along with aluminum in an alloy suitable for use in welding and brazing. The Si content may vary between approximately 4.7 and 10.9 wt %, and the Mg content may vary between approximately 0.15 wt % and 0.50 wt %. The alloy is well suited for operations in which little or no dilution from the base metal affects the Si and/or Mg content of the filler metal. The Si content promotes fluidity and avoids stress concentrations and cracking. The Mg content provides enhanced strength. Resulting joints may have a strength at least equal to that of the base metal with little or no dilution (e.g., draw of Mg). The joints may be both heat treated and artificially aged or naturally aged.

Abstract: A self-shielding welding electrode and a method of making the same are provided. The self-shielding welding electrode contains lithium aluminate in either the flux or the electrode portion of the electrode.

Abstract: The present invention relates to a soldering paste flux, and the soldering paste flux includes (A) a thermosetting prepolymer, (B) a polyfunctional epoxy monomer or oligomer having three or more functional groups in a molecule, (C) a carboxylic acid having a melting point of 80 to 170° C., and (D) a cyanate ester having two or more cyanato groups in a molecule.

Abstract: Embodiments of the present disclosure are directed towards flux materials for heated solder placement and associated techniques and configurations. In one embodiment, a method includes depositing a flux material on one or more pads of a package substrate, the flux material including a rosin material and a thixotropic agent and depositing one or more solder balls on the flux material disposed on the one or more pads, wherein depositing the one or more solder balls on the flux material is performed at a temperature greater than 80° C., and wherein the rosin material and the thixotropic agent are configured to resist softening at the temperature greater than 80° C. Other embodiments may be described and/or claimed.

Abstract: Disclosed is a solder material which enables to realize a lower mounting temperature when an electronic component is mounted. Also disclosed are a solder paste and a conductive adhesive. Specifically disclosed is a solder material having a basic composition composed of Sn, Bi and In. This solder material may further contain at least one metal selected from the group consisting of Cu, Ge and Ni. A solder paste which enables to realize a low-temperature mounting can be obtained by blending a flux component into the solder material. A conductive adhesive which enables to realize a low-temperature mounting can be obtained by blending a resin component into the solder material.

Abstract: Disclosed is a solder bonding structure which is capable of retaining sufficient solder bonding strength and ensuring high bonding reliability even in severe environments having an extremely large temperature difference. In the solder bonding structure, an electronic component 4 is mounted on a main surface 1a of a substrate having an electrode section 2 and an insulating film 3, and the electrode section 2 and the electronic component 4 are electrically bonded to each other through a solder section 5, and a flux residue 6 exuded from the solder section 5 is present between the electronic component 4 and the insulating film 3. The flux contains an acrylic resin, an activating agent, and a thixotropic agent having a hydroxyl group. The glass transition point of the acrylic resin is not higher than ?40° C., or not lower than the softening temperature of the flux residue. The flux residue has a maximum value of 300×10?6/K or less of linear thermal expansion coefficient within a temperature range from ?40° C.

Abstract: Flux formulations that remain pliable and tack-free after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers, surface active agents and other components.

Abstract: The present invention is a flux for soldering, containing a base resin and an activating agent, in which the base resin contains a thermoplastic acrylic resin obtained by polymerizing a monomer component containing a long chain alkyl(meth)acrylate, the long chain alkyl moiety of the long chain alkyl(meth)acrylate has a branched structure having 12 to 23 carbon atoms, and the acrylic resin has a weight average molecular weight of 30000 or less. A solder paste composition of the present invention improves wettability, storage stability and crack resistance in residue portions, and printability for fine portions without adhering to a squeegee when printed.

Abstract: Disclosed herein are a flux and a soldering paste based on the flux. The flux is free from a change in viscosity with age, “skinned surface,” and “rough and crumbling,” and is excellent in printability and solderability. The flux contains, as elements, a resin, a thixo agent, an activator, a solvent and glucopyranosylamine type nanotube. The soldering paste further contains a solder powder. Preferably, the solder powder is free from lead.

Abstract: There is provided a high-temperature Pb-free solder paste having the strength required to join electronic parts to a substrate and having excellence in wettability and workability. The solder paste formed by mixing a solder alloy and a flux, the solder alloy consisting of, based on the total mass of the solder alloy as 100 mass %: 0.4 to 13.5 mass % of Zn, at least one of 0.01 to 2.0 mass % of Cu or 0.03 to 0.7 mass % of Al, and a balance being Bi except for inevitable impurities.

Abstract: To provide flux which has a property of suppression of sedimentation of the solder powder, dissolves by heating at the time of the soldering to remain no residue and does not block any wettability of the solder. In the flux which is mixed with solder powder to produce the solder paste, an amount of methacrylate polymer which suppresses of sedimentation of the solder powder at a normal temperature range and dissolves or vaporizes during a heating course at the time of the soldering. As the methacrylate polymer, polyalkyl methacrylate having an alkyl group is preferable and it is preferable that an addition amount of polyalkyl methacrylate is not less than 0.1 mass % through less than 1.0 mass %. It is also preferable to contain further a solvent having at least three OH groups.

Abstract: To provide flux for producing solder paste, viscosity of which is prevented from varying. In the flux which is mixed with solder powder to produce the solder paste, an amount of methacrylate polymer which reduces a thixotropic index of the solder paste and enhances viscosity thereof is contained. As the methacrylate polymer, polyalkyl methacrylate having an alkyl group is preferable and it is preferable that an addition amount of polyalkyl methacrylate is 0.5-5.0 mass % thereof. Further, as the thixotropic agent, hardened castor oil is preferably added.

Abstract: Embodiments in accordance with the present invention encompass polymer compositions that act as both a tack agent and a fluxing agent for the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions embodiments encompass a sacrificial polymer, a carrier solvent, a thermal acid generator and, optionally, formic acid.

Abstract: A principal object of the present invention is to provide a flux which can be used to produce a lead-free solder paste which is excellent in viscosity stability and exhibits excellent wettability at the time of soldering even in atmospheric air. The flux is a lead-free solder flux having a bromine atom concentration of 400 to 20000 ppm based on 0.1 g of the flux and comprising 0.01 to 0.7% by weight of an amine compound (a) represented by the general formula (1): H2N—(CH2)n—X—(CH2)n—NH2 (wherein n represents an integer of 1 to 6 and X represents —NH—CH2CH2—NH— or a piperazine residue).

Abstract: A lead-free solder composition including about 90% to about 99% by weight of a lead-free tin solder based on the total weight of the lead-free solder composition and about 1% to about 10% by weight of a polyhedral oligomeric silsesquioxane based on the total weight of the lead-free solder composition.

Abstract: The aim of the invention is to provide a fluxing agent for soldering components, which creates one or more specific surface characteristics during the soldering process itself, thus obviating the need for the surface treatment process that is conventionally carried out after the soldering process. To achieve this, nanoparticles are added to a base substance.

Abstract: Embodiments in accordance with the present invention encompass polymer compositions that are useful in the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions providing for both holding the microelectronic components at desired positions on a substrate, providing fluxing for the solder bonding of such components to the substrate and remaining in place as an underfill for such components.

Abstract: A conductive material that includes a metal component consisting of a first metal and a second metal having a melting point higher than that of the first metal, wherein the first metal is Sn or an alloy containing 70% by weight or more of Sn, and the second metal is a metal or alloy which forms an intermetallic compound having a melting point of 310° C. or higher with the first metal and has a lattice constant difference of 50% or greater between itself and the intermetallic compound generated at the circumference of the second metal.

Abstract: Systems and methods for brazing and soldering using low and non-silver based filler metals are described. The present invention includes methods and systems for brazing and soldering using copper based or bronze type filler metals in lieu of silver containing filler metals. The systems and methods provide advantages in that the bronze filler metals are substantially cheaper than silver alloy filler metals that are commonly used. Furthermore, the present invention uses a low-temperature, water-soluble flux that provides for easier cleanup after the completion of the brazing process. Additionally, the present invention provides significant advantages over traditional copper brazing in that it allows for a one-piece workflow and eliminates the need for large component pieces and filler metal inventories. This results in a significant decrease in capital expenditures and utility costs.

Abstract: The inventive concept provides flux compositions for forming a solder bump and methods of fabricating a semiconductor device using the same. The flux composition may include a resin, an activator, and a solvent. The resin may include gum rosin and rosin ester, and a mass ratio of the gum rosin versus the rosin ester may have a range of about 60:40 to about 90:10.

Abstract: A self-shielding welding electrode and a method of making the same are provided. The self-shielding welding electrode contains lithium aluminate in either the flux or the electrode portion of the electrode.

Abstract: The invention relates to a composition of matter comprising a soldering flux, wherein the flux consists essentially of a combination of a fluxing agent and a solvent, and wherein the fluxing agent comprises a keto acid such as levulinic acid or acetylbutyric acid. The flux may also comprises an ester acid, or comprises a mixture of the keto acid with the ester acid. The solvent comprises a mixture of a tacky solvent with a non-tacky solvent. The invention also relates to a process comprising soldering at least two surfaces together, each of which comprises a metal area to which solder can adhere by employing the following steps in any order: applying solder to at least one of the metal areas, aligning the metal areas so that they are superimposed over one another, heating at least one of the areas to a temperature that comprises at least the melting temperature of the solder. The last step comprises joining the superimposed areas to one another.

Abstract: A flux composition is provided, comprising, as initial components: a carboxylic acid; and, a polyamine fluxing agent represented by formula I: with the proviso that when the polyamine fluxing agent represented by formula I is according to formula Ia: then zero to three of R1, R2, R3 and R4 is(are) a hydrogen. Also provided is a method of soldering an electrical contact using the flux composition.

Abstract: A flux composition is provided, comprising, as an initial component: a carboxylic acid; and, a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) a hydrogen. Also provided is a method of soldering an electrical contact using the flux composition.

Abstract: A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) a hydrogen; and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable flux composition.

Abstract: A wire preform suitable for use in brazing components to one another. The preform is made from a length of wire having a core of flux material, and a longitudinal seam or gap that extends over the length of the wire. The seam is formed so that when heated, the flux material flows from the core and out of the seam. The length of wire is in the form of a loop having a certain circumference so that when the preform is heated, the flux material disperses uniformly from the circumference of the preform for evenly treating the surface of a component on which the preform is placed. The length of wire may include a silver alloy.