Abstract: The present invention relates to a semi-conductive polymer composition, the present invention provides a semi-conductive polymer composition comprising an ethylene copolymer comprising polar co-monomer units; an olefin homo- or copolymer; and a conductive filler; wherein the olefin homo- or copolymer has a degree of crystallinity below 20%. The invention also relates to a wire or cable comprising said semi-conductive polymer composition, and to the use of said composition for the production of a layer, preferably a semi-conducting shield layer of a wire or cable.

Abstract: A flexible pipe of multilayer structure with unbonded layers, where the pipe has an interior lining which comprises the following layers: a) at least one layer of which the material is composed of a moulding composition based on a polymer selected from the group of: polyarylene ether ketone, polyphenyl sulphone, polyphenylene sulphide, polyarylene ether ketone/polyphenylene sulphide blend and semiaromatic polyamide, where from 5 to 100 mol % of the dicarboxylic acid content thereof derives from an aromatic dicarboxylic acid having from 8 to 22 carbon atoms, and which has a crystallite melting point Tm of at least 260° C.; b) at least one layer of which the material is composed of a fluoropolymer moulding composition can be operated at temperatures above 130° C. The pipe has particular suitability for offshore applications in the production of oil or of gas.

Abstract: Disclosed herein is a method comprising transporting a conduit and a template through a guide tube; the template being disposed on an outer surface of the conduit between the conduit and the guide tube; and transferring a texture from the template to the conduit as the conduit and the template are transported through the guide tube. Disclosed herein too is an apparatus comprising a guide tube; the guide tube being operative to facilitate a transfer of a pattern from a template to a conduit; a first feed spool and a first take-up spool for feeding the conduit through the guide tube and for taking up the conduit after it has travelled through the guide tube respectively; and a second feed spool and a second take-up spool for feeding the template through the guide tube and for taking up the template after it has travelled through the guide tube respectively.

Abstract: A substrate bonding method which enables forming a precision fine space using a method that is simpler and easier than conventional methods; and a laminated body production method that uses the substrate bonding method. This substrate bonding method includes disposing a first substrate on a photoresist pattern formed on a support film so as to bring the first substrate into contact with a surface of the photoresist pattern located on the side opposite to the support film, and pressure-bonding the support film, the photoresist pattern, and the first substrate; releasing the bonded support film after the pressure-bonding; and disposing a second substrate on the photoresist pattern so as to bring the second substrate into contact with the surface of the photoresist pattern located on the side opposite to the first substrate, and pressure-bonding the first substrate, the photoresist pattern, and the second substrate.

Abstract: Panels having a decorative surface may include a plate shaped substrate and a top layer, and the top layer may include a paper layer having a printed pattern. A method for manufacturing such panels may involve providing the paper layer with a treatment, including providing the paper layer with an ink receiving substance. The treated paper layer may be provided with at least a portion of the printed pattern by depositing pigment containing inks using a digital inkjet printer of a single pass type. The printed pattern may have a definition of at least 200 dpi. The pigment containing inks may be water-based. The printed pattern may be a wood pattern. The pigment containing inks may include colored pigments and may comprise up to 8 different colors, including brownish and/or reddish colors. The digital inkjet printer may include print heads with nozzles for firing droplets of pigment containing inks onto the treated paper layer. The paper layer may be fed from a roll, printed upon, and rolled back up again.

Abstract: A tire sensor dock for installing an electronic tire sensor module on the inner surface of a tire, including a base portion with an upper side and an underside, the underside configured for affixation on the inner surface of a pneumatic tire, and a body portion integrally formed on the upper side and configured to receive and securely capture a tire sensor in a fixed position and unchanging orientation relative to the tire sensor dock. The tire dock may include an energy generator which converts tire kinetic energy into electrical current provided to the tire sensor module.

Abstract: Panels having a decorative surface may include a plate shaped substrate and a top layer, and the top layer may include a paper layer having a printed pattern. A method for manufacturing such panels may involve providing the paper layer with a treatment, including providing the paper layer with an ink receiving substance. The treated paper layer may be provided with at least a portion of the printed pattern by depositing pigment containing inks using a digital inkjet printer of a single pass type. The printed pattern may have a definition of at least 200 dpi. The pigment containing inks may be water-based. The printed pattern may be a wood pattern. The pigment containing inks may include colored pigments and may comprise up to 8 different colors, including brownish and/or reddish colors. The digital inkjet printer may include print heads with nozzles for firing droplets of pigment containing inks onto the treated paper layer. The paper layer may be fed from a roll, printed upon, and rolled back up again.

Abstract: A method for altering polymer properties for the molding of parts comprises exposing, to a scission-causing stressor, a region of a polymer form. The scission-causing stressor is controlled to achieve, in a relatively higher molecular-weight polymer at the region, an amount of scission that results in a reduction in the molecular weight of the relatively higher molecular-weight polymer, thereby forming a relatively lower molecular-weight polymer at the region.

Abstract: A method for thermally joining thermoplastic fiber composite components, including jointly covering thermoplastic fiber composite components to be joined, at least in the region of a joining zone, with a pressurization arrangement, which is flexible, at least in some section or sections, and extensive pressurization of thermoplastic fiber composite components to be joined by the pressurization arrangement, with the result that the fiber composite components are pressed against one another, at least in the joining zone. The fiber composite components are welded in the joining zone during pressurization. The pressurization is maintained by the pressurization arrangement until the joining zone solidifies. A cover is also disclosed, in particular a mold or diaphragm, for a pressurization device for thermally joining thermoplastic fiber composite components, and an apparatus for thermally joining thermoplastic fiber composite components.

Abstract: A method for producing an at least partially transparent optical component including a laminate including fabricating a precursor laminate by bonding a transparent substrate and a transparent film to each other with a transparent photocurable adhesive layer interposed therebetween; curing the transparent photocurable adhesive layer by applying light thereto to change the precursor laminate into the laminate thereby, such that a shear modulus G? of the transparent photocurable adhesive layer of the laminate measured under a condition of a temperature of 25° C. and a frequency of 1 Hz reaches a value within a range of 3×105 Pa?G??3×107 Pa; and forming a flush and surface of the laminate by cutting the laminate in a thickness direction, such that the flush end surface includes respective cut surfaces of the transparent film, the transparent photocurable adhesive layer, and the transparent substrate.

Abstract: A sealing structure, a sealing method, an electronic device and a sealing layer recycling method are provided. The sealing structure is configured for sealing a functional device and includes a sealing layer and a stripping adhesive layer. The sealing layer covers the functional device; the stripping adhesive layer is bonded between the sealing layer and the functional device, and the stripping adhesive layer has a changeable stickiness to assist stripping off of the sealing layer.

Abstract: The present application relates to a field system and methods that can be deployed in the application of pipe welding. The field system provides many embodiments relating to pipe welding systems and methods, that can be used in combination with one another, or individually. Such welding systems and methods, include, for example, internal welding systems and methods, tie-in welding system and methods, pipe inspection systems and methods, pipe handling systems and methods, internal pipe cooling systems and methods, non-destructive testing systems and methods, as well as remote interface and database systems and methods (uLog), to name a few. The application further relates to welded pipes that result from some or all of such processes.

Abstract: A resin composition for sealing an organic electronic device element, containing a polyisobutylene resin (A), a hydrogenated cyclic olefin resin (B), and a polymer (C) obtained by any one of radical polymerization, anionic polymerization or coordination polymerization and exhibiting rubber elasticity, a resin sheet using the same, organic electroluminescent element, and image display apparatus.

Abstract: The present specification relates to a sheet laminate for a solid oxide fuel cell, a precursor for a solid oxide fuel cell including the same, an apparatus for manufacturing a sheet laminate for a solid oxide fuel cell, and a method for manufacturing a sheet laminate for a solid oxide fuel cell.

Abstract: A semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, and a first encapsulant covering at least a portion of each of the inactive surface and a side surface of the semiconductor chip. A metal layer is disposed on the first encapsulant, and includes a first conductive layer and a second conductive layer, sequentially stacked. A connection structure is disposed on the active surface of the semiconductor chip, and includes a first redistribution layer electrically connected to the connection pad. A lower surface of the first conductive layer is in contact with the first encapsulant and has first surface roughness, and an upper surface of the first conductive layer is in contact with the second conductive layer and has second surface roughness smaller than the first surface roughness.

Abstract: Extended fingerlifts and their use in closure assemblies typically provided in absorbent articles such as diapers are described.

Abstract: Techniques and mechanisms for bonding a first wafer to a second wafer in the presence of a fluid, the viscosity of which is greater than a viscosity of air at standard ambient temperature and pressure. In an embodiment, a first surface of the first wafer is brought into close proximity to a second surface of the second wafer. The fluid is provided between the first surface and the second surface when a first region of the first surface is made to contact a second region of the second surface to form a bond. The viscosity of the fluid mitigates a rate of propagation of the bond along a wafer surface, which in turn mitigates wafer deformation and/or stress between wafers. In another embodiment, the viscosity of the fluid is changed dynamically while the bond propagates between the first surface and the second surface.

Abstract: Methods and apparatus for automating the fiber laying process during the repair of composite structures made of fiber-reinforced plastic material based on the three-dimensional printing technique. Continuous fiber rovings (e.g., carbon fibers) impregnated with liquid epoxy can be directly printed onto the damaged surface of the composite structure (e.g., an aircraft component made of carbon fiber-reinforced plastic) without human manipulation in an autonomous manner.

Abstract: The invention relates to a denture, made of teeth, in particular prefabricated teeth, and of a denture base made of a gingival material, comprising cavities for teeth in which cavities for the teeth are mounted, in particular attached by bonding, characterized in that the denture base (12) is produced by a CAD/CAM process forming the cavities (20) for the teeth (14), and in that cervical areas (40a) of the teeth (14) extending through the basal surface (16, 18) of the denture base (12) are removed, in particular abraded or milled.

Abstract: The present invention provides a friction material used for a disc brake pad, which is able to secure the braking effectiveness and the wear resistance under the high speed and high load braking conditions while satisfying laws and regulations relating to the required amount of the content of the copper component. A friction material used for a disc brake pad, which is manufactured by forming a non-asbestos organic friction material composition, in which the friction material composition contains 1-15 weight % of ferrous sulfide (FeS) particles relative to the total amount of the friction material composition as a lubricant, and the total amount of the copper component involved in the friction material composition is less than 5 weight % relative to the total amount of the friction material composition. Furthermore, it is preferable to contain 0.

Abstract: A system architecture of a gift transaction system is disclosed. The gift transaction system can include a buyer interface module, a recipient interface module, a merchant backend interface module, a store front interface module, a curation module, a reminder module, an analytics module, or a media plug-in interface module. A method of operating the gift transaction system under the system architecture includes: providing an embedded widget on a website to determine gift intent to initiate a gift transaction by a buyer account for a recipient account; generating a gift buyer interface for a first client device to personalize a gift package including a gift item; generating a gift recipient interface for a second client device to customize the gift package; and communicating with a merchant backend system to complete the gift transaction to ship the gift package.

Abstract: A method of welding erosion resistance metallic material is a method of welding erosion resistance metallic material to a base element (1) of a turbine blade leading edge portion (1A). The method includes the steps of: forming a curved surface in the leading edge portion (1A) to which the erosion resistance metallic material is applied so that a radius R of the curved surface is larger than thickness t of the base element (1); and welding the erosion resistance metallic material to the leading edge portion (1A).

Abstract: A torque converter, including: a cover arranged to receive torque; an impeller including an impeller shell fixedly connected to the cover and including a first surface; a first plurality of blades fixedly connected to the impeller shell; a turbine including a turbine shell with a second surface; a second plurality of blades fixedly connected to the turbine shell; friction material bonded, with an adhesive, to one of the first surface or the second surface; and a stator connected to the turbine and the impeller and including a third plurality of blades. The one of the first surface or the second surface includes a periodic pattern etched into the one of the first surface or the second surface.

Abstract: An example apparatus for produce magnetic fields includes a base plate comprising a plurality of grooves. The apparatus includes an MEMS device disposed on the base plate. The apparatus further includes a number of magnets to produce one or more magnetic fields disposed on the plurality of grooves and adjacent to the MEMS device.

Abstract: The invention discloses a high stable and environment-friendly two-layer parquet and a production method thereof. The parquet comprises a face board and multiple solid wood boards below the face board, the solid wood boards comprise multiple solid wood strips inserted side by side; any adjacent two solid wood strips of the same solid wood board are arranged tightly and alternately, and the face board and solid wood boards are closely bonded with each other by an adhesive. The length directions of the solid wood strips of any adjacent two solid wood boards are vertical to each other; and the length direction of the solid wood strips of the solid wood boards at the two ends of the parquet is vertical to the length direction of the parquet. The invention can effectively reduce the use of high-quality solid wood, save the wood resources and has high stability and high strength.

Abstract: A cover glass lamination structure includes: a glass substrate having opposed first and second surfaces; an ultraviolet (UV) textured layer disposed on the first surface; and a coating layer disposed on the UV textured layer, wherein an inner edge of the coating layer extends beyond an inner edge of the UV textured layer and is attached to the first surface.

Abstract: Butt welding machine (2) adjusting the ends of plastic pipes and welding them to each other, which comprises a cutter (1) having a driving element (16) for moving the trimmer (13) by being driven, at least one movable claw (24, 32, 33) moving depending on a connector to hold pipes which are positioned, a motor (21) which does not have direct connection with the cutter (1) and transfers power to the cutter (1) and to the movable claw (24, 32, 33) via one connector for each, a drive gear unit (22) which provides driving energy from one point to the cutter (1) and the movable claw (24, 32, 33) which wherein the cutter (1) and the movable claw (24, 32, 33) needs to be had two different driving motions performed via two different connectors, a drive gear unit (22) providing driving energy to the movable claw (24, 32, 33) from one point.

Abstract: The present invention relates to a method for manufacturing optical modules comprising the following steps: i) providing a wafer having one or more substrate layers; ii) dicing said wafer into multiple parallel oriented strips; iii) tilting said multiple parallel oriented strips; iv) grinding at least one surface of said tilted, multiple parallel oriented strips; v) bonding said grinded surface of said tilted, multiple parallel oriented strips to at least one substrate; vi) dicing said at least one substrate into optical modules.

Abstract: There is provided a method of manufacturing a composite molded body that can increase a processing speed and a joining strength in a different direction. The method of manufacturing a composite molded body in which a metal molded body and a resin molded body are joined, includes the steps of: continuously irradiating a joint surface of the metal molded body with laser light at an irradiation speed of 2,000 mm/sec or more by using a continuous-wave laser; and arranging, within a mold, a portion of the metal molded body including the joint surface irradiated with the laser light in the preceding step and performing injection molding of a resin forming the resin molded body, or performing compression molding in a state where a portion of the metal molded body including the joint surface irradiated with the laser light in the preceding step and a resin forming the resin molded body are made to contact with each other.

Abstract: A wafer processing method includes a protective film providing step of providing a protective film on the front side of a wafer, a wafer unit forming step of applying a liquid resin curable by an external stimulus to the front side of the wafer and then curing the liquid resin by applying the external stimulus to form a protective member, thereby forming a wafer unit composed of the wafer, the protective film, and the protective member in the condition where the front side of the wafer is covered with the protective member, a grinding step of holding the protective member on a holding surface of a chuck table and then grinding the back side of the wafer of the wafer unit to thereby reduce the thickness of the wafer, and a peeling step of peeling the protective member and the protective film from the wafer reduced in thickness.

Abstract: Disclosed herein is a device having a shaped seal ring comprising a workpiece, the workpiece comprising at least one dielectric layer disposed on a first side of a substrate, a seal ring disposed in the at least one dielectric layer, and at least one groove in the seal ring. A lid is disposed over the workpiece, the workpiece extending into a recess in the lid and a first thermal interface material (TIM) contacts the seal ring and the lid, with the first TIM extending into the at least one groove. The workpiece is mounted to the package carrier. A die is mounted over a first side of workpiece and disposed in the recess. A first underfill a disposed under the die and a second underfill is disposed between the workpiece and the package carrier. The first TIM is disposed between the first underfill and the second underfill.

Abstract: Embodiments herein relate to a printer for printing information on at least one article. The printer receives printing instructions to print information on the at least one article. The printing instructions indicate a remote data provider service from which at least a part of the information to be printed on the at least one article is to be requested. Then, the printer transmits a request to the remote data provider service requesting said at least part of the information from the remote data provider service when printing according to the received printing instructions. Also, the printer prints, on the at least one article, said requested at least part of the information upon receiving said requested at least part of the information from the remote data provider service.

Abstract: Provided is an intake manifold for an internal combustion engine, the intake manifold including an upstream portion, a first downstream portion, and a second downstream portion. The upstream portion includes a first upstream passage and a second upstream passage. The first downstream portion includes a first downstream passage configured to communicate the first upstream passage with an intake port of a first cylinder head. The second downstream portion includes a second downstream passage configured to communicate the second upstream passage with an intake port of a second cylinder head. The upstream portion, the first downstream portion, and the second downstream portion are provided in a separate manner. In the intake manifold, a flange of the first downstream portion is connected to a flange of the upstream portion, and a flange of the second downstream portion is connected to the flange of the upstream portion.

Abstract: Panels having a decorative surface may include a substrate and a top layer, and the top layer may include a paper layer having a printed pattern. A method for manufacturing such panels may involve providing the paper layer with a treatment, and providing the treated paper layer with at least a portion of the printed pattern. Providing the portion of the printed pattern may involve depositing pigment containing inks on the treated paper layer using a digital inkjet printer. The pigments may be color pigments. The digital inkjet printer may include print heads with nozzles for firing droplets of the pigment containing inks onto the treated paper layer. A contact angle at the interface between the droplets of pigment containing ink and the treated paper layer may be between 0° and 90°.

Abstract: A method for forming a packaged semiconductor device includes attaching a first major surface of a semiconductor die to a plurality of protrusions extending from a package substrate. A top surface of each protrusion has a die attach material, and the plurality of protrusions define an open region between the first major surface of the semiconductor die and the package substrate. Interconnects are formed between a second major surface of the semiconductor die and the package substrate in which the second major surface opposite the first major surface. An encapsulant material is formed over the semiconductor die and the interconnects.

Abstract: In an example, an article of manufacture includes a composite material. The composite material includes hollow glass filaments that are encapsulated within a polymeric matrix material. The hollow glass filaments are at least partially filled with the polymeric matrix material.

Abstract: A power module includes a power semiconductor element, an interconnection material, a circuit board, an external terminal, a joining material, and a sealing resin. A clearance portion is continuously formed between the sealing resin and each of an end surface of the joining material and a surface of the interconnection material so as to extend from the end surface of the joining material to the surface of the interconnection material, the end surface of the joining material being located between the power semiconductor element and the interconnection material, the surface of the interconnection material being located between the end surface and a predetermined position of the interconnection material separated by a distance from the end surface.

Abstract: A device, a system, and methods for tracking conductive composite pressurized gaseous storage tanks. The system including anchoring an RFID device in a non-conductive blind boss, wherein the anchor material has a low dielectric and has minimal reflection of RF energy.

Abstract: Provided is a vehicle interior material comprising coating layers formed on both surfaces of a veneer layer; a back layer on the coating layer of one surface of the veneer layer; and a front layer on the coating layer of the other surface of the veneer layer. Provided is a method of manufacturing a vehicle interior material comprising steps of: providing a veneer layer; forming coating layers on both surfaces of the veneer layer by applying and drying water-dispersible polyurethane dispersion or water-dispersible acrylic polyurethane dispersion on the both surfaces; pre-forming a real wood film layer prepared by forming the coating layers on the both surfaces of the veneer layer; forming a back layer on the coating layer of one surface of the veneer layer by primary insert molding; and forming a front layer on the coating layer of the other surface of the veneer layer by secondary insert molding.

Abstract: A galley module comprises a base galley section and a top galley section, wherein the base galley section comprises a top end adapted for carrying the top galley section. The base galley section comprises a first functional arrangement with a first access direction in a horizontal plane and the top galley section comprises at least one second functional arrangement having a second access direction in the horizontal plane. The first access direction and the second access direction enclose an angle of at least 90° in the horizontal plane.

Abstract: A semiconductor package structure and a fabrication method thereof are provided. The fabrication method comprises: providing a substrate strip, the substrate strip comprising a plurality of substrate units which comprise a substrate unit; disposing a plurality of chips on the plurality of substrate units; disposing a packaging encapsulant on the substrate strip to encapsulate the chips; forming a warp-resistant layer on a top surface of the packaging encapsulant; and dividing the substrate strip to separate the plurality of substrate units to further fabricate a plurality of semiconductor package structures which comprise a semiconductor package structure comprising the substrate unit, wherein the warp-resistant layer is formed of a selected material with a selected thickness to make a variation of warpage of the semiconductor package structure at a temperature between 25° C. and 260° C. to be smaller than 560 ?m.

Abstract: This invention provides a method for growing monocrystalline silicon by applying Czochralski method comprising forming a melt of silicon-containing materials in a crucible and pulling the melt for monocrystalline silicon growth, which is characterized by, introducing a gas containing argon during formation of the melt, and, applying a magnetic field during the pulling step. This invention also provides a method for producing a wafer based on the above monocrystalline silicon.

Abstract: This disclosure relates generally to an electronic chip package that can include a die and a buildup layer substantially enveloping the die. Electrical interconnects can be electrically coupled to the die and passing, at least in part, through the buildup layer. An optical emitter can be electrically coupled to the die with a first one of the electrical interconnects and configured to emit light from a first major surface of the electronic chip package. A solder bump can be electrically coupled to the die with a second one of the electrical interconnects and positioned on a second major surface of the electronic chip package different from the first major surface.

Abstract: A method for welding profiled elements in plastic material, includes the steps of: preparing two profiled elements, arranged with respective zones to be facing one another; making a groove in correspondence to at least one zone, by a removal operation on a peripheral edge of at least one profiled element; heating the zones to be welded; coupling the zones to be welded to one another, pressing the profiled elements one against the other so as to keep the zones to be welded in reciprocal contact. The coupling step includes: melting the zones to be welded into one another in order to define a welding bead; making a containing compartment defined by the groove, the welding bead being made internally of the containing compartment; and arranging a containing presser in correspondence to the containing compartment for preventing exit of the welding bead from the compartment itself.

Abstract: This disclosure relates generally to an electronic chip package that can include a die and a buildup layer substantially enveloping the die. Electrical interconnects can be electrically coupled to the die and passing, at least in part, through the buildup layer. An optical emitter can be electrically coupled to the die with a first one of the electrical interconnects and configured to emit light from a first major surface of the electronic chip package. A solder bump can be electrically coupled to the die with a second one of the electrical interconnects and positioned on a second major surface of the electronic chip package different from the first major surface.

Abstract: A method for forming a brazed joint between a first part having a first surface and a second part having a second surface may comprise applying at least two beads of braze filler at either of the first surface and the second surface, and assembling the first surface and the second surface to define a shiplap interface therebetween. The shiplap interface may terminate at a first terminus and a second terminus, and may include a first cavity and a second cavity. One of the beads of braze filler may be localized at the first cavity and the other may be localized at the second cavity. The method may further comprise melting each of the beads of braze filler to a braze liquid, and allowing the braze liquid to flow through the shiplap interface from the first cavity towards the first terminus, and from the second cavity towards the second terminus.

Abstract: A pulp in accordance with a particular embodiment includes crosslinked cellulose fibers. The pulp can have high brightness, reactivity, and intrinsic viscosity. The pulp, therefore, can be well suited for use as a precursor in the production of low-color, high-viscosity cellulose derivatives. A method in accordance with a particular embodiment of the present technology includes forming a pulp from a cellulosic feedstock, bleaching the pulp, crosslinking cellulose fibers within the pulp while the pulp has a high consistency, and drying the pulp. The bleaching process can reduce a lignin content of the pulp to less than or equal to 0.09% by oven-dried weight of the crosslinked cellulose fibers. Crosslinking the cellulose fibers can include exposing the cellulose fibers to a glycidyl ether crosslinker having two or more glycidyl groups and a molecular weight per epoxide within a range from 140 to 175.

Abstract: When a GRIN lens fiber is drawn from a preform, control of a fiber diameter is improved in order to increase a production yield of the GRIN lens fiber having a fiber diameter within a desired range. The problem is solved by controlling the drawing speed using a fiber diameter c, which is obtained by correcting a fiber diameter a using the fiber diameter b and a fiber diameter ?. The fiber diameter a is measured using a diameter measuring instrument A that measures an outer diameter of the GRIN lens fiber, which is being elongated inside a heating furnace, the fiber diameter b is measured using a diameter measuring instrument B that measures an outer diameter of the GRIN lens fiber outside the heating furnace, and the fiber diameter ? is a value of the fiber diameter a measured a specified period of time T earlier.

Abstract: Methods and apparatus are provide for an interposer for interconnecting one or more semiconductor chips with an organic substrate in a semiconductor package, the interposer including: a first glass substrate having first and second opposing major surfaces, the first glass substrate having a first coefficient of thermal expansion (CTE1); a second glass substrate having first and second opposing major surfaces, the second glass substrate having a second coefficient of thermal expansion (CTE2); and an interface disposed between the first and second glass substrates and joining the second major surface of the first glass substrate to the first major surface of the second glass substrate, where CTE1 is less than CTE2, the first major surface of the first glass substrate operates to engage the one or more semiconductor chips, and the second major surface of the second glass substrate operates to engage the organic substrate.

Abstract: A method and apparatus for depositing a phosphor using transfer molding. The method includes: forming a plurality of light-emitting devices on a wafer and rearranging the light-emitting devices on a carrier substrate according to luminance characteristics of the plurality of light-emitting devices by examining the luminance characteristics of the plurality of light-emitting devices; depositing the phosphor on the rearranged light-emitting devices using transfer molding; and separating the light-emitting devices on the carrier substrate.