Metal Foil Lamina Patents (Class 156/233)
  • Patent number: 11607958
    Abstract: Embodiments of an article comprising a cold-formed glass substrate in a curved shape, a plurality of separate mechanical retainers, and a frame are disclosed. The cold-formed glass substrate has a first major surface, and a second major surface opposing the first major surface. In one more embodiments, the plurality of separate mechanical retainers are attached to the second major surface of the cold-formed glass substrate. The mechanical retainers may be attached to the frame to define a position for each of the plurality of mechanical retainers, such that the mechanical retainers define the curved shape. Embodiments of processes to form such articles are also provided. Such processes can include attaching a plurality of separate mechanical retainers to a flexible glass substrate such that the glass substrate maintains its flexibility, and attaching the mechanical retainers to a frame, such that the mechanical retainers attached to the frame define a cold-formed curved shape for the flexible glass substrate.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: March 21, 2023
    Assignee: Corning Incorporated
    Inventors: Atul Kumar, Cheng-Chung Li, William Michael Seiderman, Yawei Sun
  • Patent number: 11429021
    Abstract: A method of forming a patterned device includes depositing at least one nanostructure comprising self-assembled nucleic acids formed into a predetermined conformation upon a surface of a substrate, depositing a stabilizing layer of material mechanically stronger than the at least one nanostructure over the at least one nanostructure and the surface of the substrate to form a positive pattern template, depositing a layer of a first polymer over the positive pattern template, and removing the layer of the first polymer from connection with the positive pattern template, wherein the layer of the first polymer includes a surface having a negative imprint of the positive pattern template.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: August 30, 2022
    Assignee: University of Pittsburgh—Of the Commonwealth System of Higher Education
    Inventors: Haitao Liu, Cheng Tian, Hyo Jeong Kim
  • Patent number: 11345134
    Abstract: An inexpensive decorative sheet has a fine three-dimensional metallic design. A base vapor deposition film and a transfer sheet are provided. The base vapor deposition film includes a transparent film base of primarily a thermoplastic resin and is light-transmissive, and an underlying metal layer. The transfer sheet includes a transfer base film and a reflection pattern formation layer including a pattern metal layer. The transfer sheet is placed onto the base vapor deposition film, and a transfer roller is pressed against the transfer base film to embed a portion of the reflection pattern formation layer onto the base vapor deposition film and bond the portion to the base vapor deposition film. The transfer roller includes a transfer surface, which corresponds to a predetermined design. The transfer sheet is peeled away from the base vapor deposition film to transfer a reflection pattern to the base vapor deposition film.
    Type: Grant
    Filed: January 20, 2017
    Date of Patent: May 31, 2022
    Assignee: NISSHA CO., LTD.
    Inventors: Michiyasu Okuda, Yasuhide Fukada, Hiroyasu Shigeta, Shinichi Kitamura, Tetsuya Ito
  • Patent number: 11080579
    Abstract: A card assembly includes an insulating planar body and a magnetic stripe assembly coupled with the planar body. The magnetic stripe assembly includes a magnetic layer configured to magnetically store information and a metal layer that provides at least one of a security feature, a decorative feature, or other functional feature. The metal layer has a small thickness such that the metal layer prevents conduction of electrostatic discharge (ESD) through the magnetic stripe assembly.
    Type: Grant
    Filed: February 15, 2018
    Date of Patent: August 3, 2021
    Assignee: ILLINOIS TOOL WORKS INC.
    Inventors: Daniel Szumski, Suwit John Sangkaratana, Roger D. Strasemeier
  • Patent number: 10981368
    Abstract: Provided are a decorative glass panel having a three-dimensional metal design and a manufacturing method for the decorative glass panel, the method exhibiting enhanced productivity. A decorative glass panel 10 includes: a glass substrate 15; an adhesive layer 11 formed on the glass substrate 15; a non-uniform pattern layer 12 formed on the adhesive layer 11; and a vapor-deposited metal layer 13 formed on the non-uniform pattern layer 12. In the glass substrate 15, a section that is a portion of a back surface of the glass substrate 15 and that is bent from a flat surface section 30 to an upright section 31 forms a curved surface 32. The non-uniform pattern layer 12 has, in a surface facing the vapor-deposited metal layer 13, which is a top surface thereof, a non-uniform pattern formed by depressions 40 and protrusions 41.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: April 20, 2021
    Assignee: NISSHA CO., LTD.
    Inventors: Takushi Mitsugi, Hiroyasu Shigeta, Daichi Hama, Chuzo Taniguchi
  • Patent number: 10914906
    Abstract: An optical fiber cable having a slot core which includes a plurality of ribs formed along a cable longitudinal direction and in which slot grooves for housing optical fibers are formed between the ribs. The optical fiber cable includes: subunits each of which is formed by bundling a plurality of intermittent-connection-type optical fiber ribbons in which a connection part where adjacent optical fibers are connected to each other and a non-connection part where adjacent optical fibers are not connected to each other are intermittently provided in the longitudinal direction among some or all of optical fibers; and a thin-skin-shaped tube having Young's modulus lower than Young's modulus of a material forming the slot core. The subunits are housed in the slot grooves, and among the subunits in the slot grooves, at least a subunit located at an outer peripheral part of the slot grooves is covered with the tube.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: February 9, 2021
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Fumiaki Sato, Kenta Tsuchiya, Kuushin Ryan
  • Patent number: 10795313
    Abstract: An image forming device that prints a first image using first toner and prints a second image using foil on a sheet of paper, includes: a former that forms a first toner image by the first toner of the first image on the paper and forms a second toner image by second toner different from the first toner of the second image on the paper; a fixer that fixes the first toner image and the second toner image formed on the paper; a melter that melts the second toner out of the first toner and the second toner fixed to the paper; and a foil printer that prints the second image by bonding the foil to the melted second toner.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: October 6, 2020
    Assignee: KONICA MINOLTA, INC.
    Inventors: Tetsuya Sakai, Yoshinori Tsutsumi, Kenji Tsuru, Munenori Nakano
  • Patent number: 10774242
    Abstract: A design transfer sheet of one embodiment of the present disclosure contains a release layer and a design transfer layer releasably mounted on the release layer, and the design transfer layer contains a thermally adherable first surface layer and a thermally adherable second surface layer in that order from the release layer side.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: September 15, 2020
    Assignee: 3M Innovative Properties Company
    Inventors: Daigo Yasuda, Yorinobu Takamatsu, Minori Kawagoe, Akihiko Nakayama
  • Patent number: 10749216
    Abstract: A battery includes a first substrate having a first main surface, a second substrate made of a conducting material or semiconductor material, and a carrier of an insulating material. The carrier has a first and a second main surfaces, the second substrate being attached to the first main surface of the carrier. An opening is formed in the second main surface of the carrier to uncover a portion of a second main surface of the second substrate. The second main surface of the carrier is attached to the first substrate, thereby forming a cavity. The battery further includes an electrolyte disposed in the cavity.
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: August 18, 2020
    Assignee: Infineon Technologies AG
    Inventors: Ravi Keshav Joshi, Alexander Breymesser, Bernhard Goller, Kamil Karlovsky, Francisco Javier Santos Rodriguez, Peter Zorn
  • Patent number: 10710388
    Abstract: A heat transfer film having a) a carrier film, b) at least one coating layer arranged directly on the carrier film, and c) at least one hot-sealable polymer adhesive layer is disclosed. The coating layer is based on a non-aqueous, radiation-curable, liquid composition which contains at least 60 wt %, based on the total weight of the composition, of curable constituents selected from organic oligomers which have ethylenically unsaturated double bonds. Use of the heat transfer films for the dry coating of surfaces, production of such heat transfer films, and methods for coating or lacquering surfaces of objects using the heat transfer films are also disclosed.
    Type: Grant
    Filed: April 19, 2019
    Date of Patent: July 14, 2020
    Assignees: BASF SE, LS Industrielacke GmbH
    Inventors: Manfred Biehler, Dieter Litzcke
  • Patent number: 10696089
    Abstract: Decals with dimensional offsets are disclosed. The decals may be part of a decal kit or may be applied to an article. The decals include an overlay having multiple dimensional spacers. When applied to an article, the decal overlay bonds to the article, securing the dimensional spacers between the overlay and the article creating dimensional offsets. The dimensional offsets are positioned on an interior surface of the article so that contact with a wearer's skin is minimized, reducing the perception of cling.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: June 30, 2020
    Assignee: NIKE, Inc.
    Inventors: Yuki Aihara, Kimberly D. Baschak, Jorge E. Carbo, Jr., David Sagan
  • Patent number: 10611594
    Abstract: An apparatus for coating a part that has an asymmetrical edge. The apparatus includes a film dispenser, a film retriever, a mandrel; and a part holder. Preferably one or both of the mandrel and the part holder move in an angular relationship to one another, and the film dispenser and the film retriever move co-operatively in at least two dimensions with respect to the part holder. There is further provided a film having a first edge and a second edge, and the film can be a decorative coating, a protective coating or combinations of these. The film dispenser holds the first edge of the film, the film is positioned between the mandrel and the part holder and the film retriever holds the film second edge.
    Type: Grant
    Filed: September 18, 2017
    Date of Patent: April 7, 2020
    Assignee: The Procter & Gamble Company
    Inventors: Norm H. Tiilikka, Susana E. Borrero, Ingo Dieter Erhardt, Stefan Rudi Wicklein, Werner Mischer
  • Patent number: 10583459
    Abstract: Actinic radiation curable inks are selectively applied to flexible films which allow the transmission of actinic radiation and then are applied such that the side of the flexible films on which the curable inks are applied contact surfaces of three dimensional substrates. Actinic radiation is applied to the flexible films which cause the ink to cure on the three dimensional substrate. The flexible films are removed leaving the cured ink on the substrates.
    Type: Grant
    Filed: December 27, 2013
    Date of Patent: March 10, 2020
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Krishna Balantrapu, Robert K. Barr, Brian D. Amos
  • Patent number: 10580869
    Abstract: A stacked body includes: a substrate made of silicon carbide and having a first main surface forming an angle of 20° or less with a silicon plane; and a graphene film disposed on the first main surface and having an atomic arrangement oriented in relation to an atomic arrangement of silicon carbide forming the substrate. In an exposed surface of the graphene film which is a main surface opposite to the substrate, an area ratio of a region having a full width at half maximum of G? of 40 cm?1 or less under Raman spectroscopy analysis is 50% or more. Accordingly, the stacked body is provided that enables a high mobility to be stably ensured in an electronic device manufactured to include the graphene film forming an electrically conductive portion.
    Type: Grant
    Filed: April 19, 2017
    Date of Patent: March 3, 2020
    Assignees: Sumitomo Electric Industries, Ltd., Tohoku University
    Inventors: Masaya Okada, Fuminori Mitsuhashi, Yasunori Tateno, Masaki Ueno, Maki Suemitsu, Hirokazu Fukidome
  • Patent number: 10549704
    Abstract: Disclosed herein are applique assemblies (200) comprising a substrate (210) comprising a first non-planar surface (220) defining a recess and a glass sheet (230) having a thickness of less than about 3 mm, wherein the glass sheet is configured to fit within the recess, and further wherein the glass sheet is cold formed to conform to the first non-planar surface. The applique assembly may include a chemically strengthened or non-chemically strengthened glass sheet having a thickness ranging from about 0.1 mm to about 2 mm. The applique assembly may be used to cover structural elements on the exterior of a vehicle.
    Type: Grant
    Filed: July 10, 2015
    Date of Patent: February 4, 2020
    Assignee: CORNING INCORPORATED
    Inventor: Michael James McFarland
  • Patent number: 10542789
    Abstract: A method for making a wadding strip element, in particular to be used for making paddings of clothing articles such windcheaters and/or shoes, the wadding material being adapted for depositing thereon at least an auxiliary material, comprises at least the further step of subjecting the wadding strip element to a combined chemical, mechanical and thermal treatment process adapted to increase the mechanical strength of the wadding strip element and reduce its porosity, thereby allowing the deposit on at least a surface of at least a printing material or an auxiliary material thereby the deposited material only slightly penetrates the wadding material to create on the surface a predetermined printed pattern configuration adapted to withstand washing operations and inevitable wear, without decomposing.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: January 28, 2020
    Assignee: FISI FIBRE SINTETICHE S.P.A.
    Inventor: Lucio Siniscalchi
  • Patent number: 10529807
    Abstract: A stacked body includes: a substrate made of silicon carbide and having a first main surface forming an angle of 20° or less with a carbon plane; and a graphene film disposed on the first main surface and having an atomic arrangement oriented in relation to an atomic arrangement of silicon carbide forming the substrate. In an exposed surface of the graphene film as seen in plan view, 10 or less regions are present per 1 mm2, the exposed surface being a main surface opposite to the substrate, and the regions each including 10 or more graphene layers and having a circumcircle with a diameter of 5 ?m or more and 100 ?m or less. Accordingly, the stacked body is provided that enables a high mobility to be stably ensured in an electronic device manufactured to include the graphene film forming an electrically conductive portion.
    Type: Grant
    Filed: April 19, 2017
    Date of Patent: January 7, 2020
    Assignees: Sumitomo Electric Industries, Ltd., Tohoku University
    Inventors: Masaya Okada, Fuminori Mitsuhashi, Masaki Ueno, Yasunori Tateno, Maki Suemitsu, Hirokazu Fukidome
  • Patent number: 10486393
    Abstract: A stiff, lightweight metal laminate includes a first continuous metal layer, a second continuous metal layer, and a reduced density metal core layer disposed between the first and second continuous metal layers. The reduced density metal core layer comprises a core metal and has an average density that is less than the density of the core metal. Planar metallurgical bonds secure the first and second continuous metal layers to the reduced density metal core layer. The metal laminate may be manufactured by press rolling the reduced density metal core layer sandwiched between the two continuous metal layers, after removing or overcoating the native oxide layer on each layer surface that contacts another layer in the metal laminate.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: November 26, 2019
    Assignee: MATERION CORPORATION
    Inventors: Joseph G. Kaiser, Aaron M. Vodnick
  • Patent number: 10479072
    Abstract: A method for decorating substrates, in particular packaging, comprising the steps: printing at least one first decorative pattern (2) on the substrate using a first radiation-curable, preferably UV-curable, printing ink composition (3); printing at least one second decorative pattern (4), using a second radiation-curable, preferably UV-curable, printing ink composition (5), on at least part of the substrate (1) in a region near to the first pattern (2), chronologically before, after, or during the printing of the first pattern; radiation curing of the first and second printing ink compositions (3, 5), preferably directly after the printing of each pattern, the radiation-cured second printing ink composition having a lower glass transition temperature than the radiation-cured first printing ink composition; application of a decorative coating to the second pattern by means of a hot foil stamping process, a hot stamping foil comprising a decorative coating material being pressed against the printed substrate by
    Type: Grant
    Filed: October 1, 2014
    Date of Patent: November 19, 2019
    Assignee: Marabu GmbH & Co. KG
    Inventors: Wolfgang Schaefer, Markus Rodrigo-Fuentes, Martin Hehl-Heinz
  • Patent number: 10405421
    Abstract: A layup for multiple-layer printed circuit board manufacturing is formed according to a process that includes selectively applying a dielectric resin to a high resin demand region of a circuitized core layer without applying the dielectric resin to another region of the circuitized core layer. The process also includes partially curing the dielectric resin within the high resin demand region. The process further includes forming a layup that includes a layer of pre-impregnated (prepreg) material adjacent to the partially cured dielectric resin within the high resin demand region of the circuitized core layer.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: September 3, 2019
    Assignee: International Business Machines Corporation
    Inventors: Bruce J. Chamberlin, Matthew S. Kelly, Scott B. King, Joseph Kuczynski
  • Patent number: 10336034
    Abstract: A carrier-attached metal foil includes a plate-shaped carrier, a metal foil laminated on at least one of surfaces of the carrier, and a fixing unit configured to fix a periphery of the carrier and a periphery of the metal foil to each other.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: July 2, 2019
    Assignee: FREESIA MACROSS CORPORATION
    Inventor: Beji Sasaki
  • Patent number: 10244623
    Abstract: A method and apparatus for forming a circuit on an uneven two-dimensional (2-D) or three-dimensional (3-D) surface of an object is described. An amount of electrically conductive material to form a circuit between two points on the object is determined. The determined amount of electrically conductive material is deposited on a first surface of a stretchable substrate. The stretchable substrate with the deposited electrically conductive material is applied to the object to form a circuit between two points on the object.
    Type: Grant
    Filed: June 29, 2016
    Date of Patent: March 26, 2019
    Assignee: FLEXTRONICS AP, LLC
    Inventors: Anwar Mohammed, Weifeng Liu, Murad Kurwa
  • Patent number: 10232601
    Abstract: A decoration method of a printed matter includes: forming a printed layer on a surface of a sheet or of a mounting paper with a transparent varnish, printing a predetermined pattern on the surface of the printed layer by an ink or by a resin which are capable of being adhered to the printed layer; and pressing a metal foil onto the pattern printed by the ink or the resin with an adhesive agent. The adhesive agent does not adhere to the printed layer but adheres to the pattern. As a result, the metal foil 6 is printed only to the pattern.
    Type: Grant
    Filed: March 10, 2017
    Date of Patent: March 19, 2019
    Assignee: Japan Card Products Co., Ltd.
    Inventors: Yoshiyuki Kawakami, Tomoki Tsunoda
  • Patent number: 10178773
    Abstract: Provided is a method for manufacturing a metal printed circuit board, the method including: printing a circuit pattern on a release film; applying a heat conductive insulating layer on the circuit pattern; laminating a heat conductive base layer on the heat conductive insulating layer and hot pressing the laminated heat conductive base layer and the heat conductive insulating layer; and removing the release film therefrom.
    Type: Grant
    Filed: December 24, 2012
    Date of Patent: January 8, 2019
    Assignee: INKTEC CO., LTD.
    Inventors: Kwang-Choon Chung, Nam Boo Cho, Young-Koo Han, Myung Bong Yoo, Woong Ku On
  • Patent number: 10064273
    Abstract: Control panels with antimicrobial copper sheet overlays are disclosed. In some embodiments, the antimicrobial copper used in the copper sheet overlays can be selected from copper or copper alloys containing from about 60 to about 100 wt % copper. In other embodiments, the copper sheet overlays have one or more deflection spots to permit an operator to use the control panel to operate an electronic device. Some embodiments include methods to manufacture the control panels comprising antimicrobial copper sheet overlays. Further embodiments include methods for operating an electronic device using the control panels comprising antimicrobial copper sheet overlays.
    Type: Grant
    Filed: October 20, 2015
    Date of Patent: August 28, 2018
    Assignee: MR Label Company
    Inventor: Patrick H. Meehan, Jr.
  • Patent number: 10042308
    Abstract: Herein is disclosed a method of electrostatic printing and foiling comprising: forming a colored toner image on a print substrate by electrostatically printing an electrostatic ink comprising a first resin component comprising an ethylene acrylic acid resin, an ethylene methacrylic acid resin or combinations thereof; forming an adhesive toner image disposed on the colored toner image on the print substrate by electrostatically printing a liquid electro photographic (LEP) printing composition comprising a first resin component comprising an ethylene acrylic acid resin, an ethylene methacrylic acid resin or combinations thereof, and a second resin component present in an amount of about 20% to about 80% by weight of total solids content of the LEP printing composition, the second resin component having a melting point of from about 50° C. to about 75° C.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: August 7, 2018
    Assignee: HP Indigo B.V.
    Inventors: Hannoch Ron, Shai Lior, Mark Sandler, Gleb Romantcov, Daniel Skvirsky
  • Patent number: 10030309
    Abstract: A chemical engraving machine to engrave a plate of stainless steel moved along an horizontal direction, said machine comprising a base, an acid liquid circuit adapted to chemically attack said plate of stainless steel at locations where it is not protected by a protection mask, a lower guiding device, an upper guiding device, the lower and upper guiding devices being configured to maintain said plate of stainless steel substantially vertically, and a nozzle support bearing a plurality of spraying nozzles projecting horizontally the acid liquid toward the plate of stainless steel. A method chemically engraves a plate of stainless steel in a vertical position.
    Type: Grant
    Filed: February 10, 2012
    Date of Patent: July 24, 2018
    Assignee: THE DILLER CORPORATION
    Inventors: Franck Dupuy, Joël Harmand, Inocencio Marcos, François Lapeyre
  • Patent number: 10010785
    Abstract: A gaming ticket and method for providing the same includes foil applied to the gaming ticket surface such that the foil covers less than the entire surface of any surface of the gaming ticket.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: July 3, 2018
    Assignee: Muncie Novelty Company, Inc.
    Inventor: Brian Overholt
  • Patent number: 9966472
    Abstract: A stacked structure includes: an insulating substrate; a graphene film that is formed on the insulating substrate; and a protective film that is formed on the graphene film and is made of a transition metal oxide, which is, for example, Cr2O3. Thereby, at the time of transfer of the graphene, polymeric materials such as a resist are prevented from directly coming into contact with the graphene and nonessential carrier doping on the graphene caused by a polymeric residue of the resist is suppressed.
    Type: Grant
    Filed: April 24, 2017
    Date of Patent: May 8, 2018
    Assignee: FUJITSU LIMITED
    Inventor: Junichi Yamaguchi
  • Patent number: 9849624
    Abstract: A film-embossing apparatus with a hot-embossing device which has a heated embossing stamp. With the formation of a contact pressure, a transfer layer, arranged on a carrier film, of a hot-embossing film is transferred to a surface of a workpiece. The hot-embossing device has control inputs and outputs. The film-embossing apparatus has an industrial robot with control inputs and outputs. The control inputs and outputs of the hot-embossing device and of the industrial robot are connected to a control unit. The industrial robot is formed such that it guides the workpiece to the hot-embossing device, positions the workpiece on the embossing stamp, guides the workpiece past the embossing stamp, and guides the embossed workpiece away from the hot-embossing device. The industrial robot can also position the hot-embossing device on the workpiece.
    Type: Grant
    Filed: March 19, 2014
    Date of Patent: December 26, 2017
    Assignee: LEONHARD KURZ STIFTUNG & CO. KG
    Inventors: Ljubisa Drinic, Michael Triepel, Ralf Friedmann, Thomas Meier
  • Patent number: 9839141
    Abstract: There is provided a method for manufacturing a component interconnect board (150) comprising a conductor structure for providing electrical circuitry to at least one component (114) when mounted on the component board, the method comprising providing a conductor sheet (100) with a first predetermined pattern (115), providing a solder resist sheet (112) with a second predetermined pattern for defining solder areas (125) of the component board, forming a subassembly (120) by laminating the solder resist sheet on top of the conductor sheet, applying solder onto the subassembly, placing the at least one component onto the subassembly, performing soldering, and laminating the subassembly to a substrate (130). The solder resist sheet is further arranged to act as a carrier for the conductor sheet.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: December 5, 2017
    Assignee: PHILIPS LIGHTING HOLDING B.V.
    Inventor: Antonius Petrus Marinus Dingemans
  • Patent number: 9823394
    Abstract: The present disclosure relates to prismatic retroreflective articles that includes a security mark and to methods of making such articles.
    Type: Grant
    Filed: September 20, 2012
    Date of Patent: November 21, 2017
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Suman K. Patel, Bruce D. Orensteen, Mikhail L. Pekurovsky
  • Patent number: 9789995
    Abstract: A method for manufacturing an ammonia storage cartridge includes a step for supplying a material by ammonia absorption or adsorption by absorbent salts, a step for producing an intermediate element, including compacting the material to form the intermediate element, a step for stacking at least two intermediate elements in a shell of the cartridge, and a step for compressing the stack of intermediate elements in the shell.
    Type: Grant
    Filed: July 1, 2011
    Date of Patent: October 17, 2017
    Assignee: Faurecia Systemes D'Echappement
    Inventor: Serge Saint-Dizier
  • Patent number: 9719263
    Abstract: A system, kit, and method of resurfacing and/or embellishing a surface is provided. The kit includes a plurality of materials, such as cleaner, primer, adhesive, paper, and sealer. Each material is provided in a quantity for covering a pre-determined area such that the kit is capable of refinishing and/or embellishing a surface having a size equal to the pre-determined area. The kit also includes tools for refinishing and/or embellishing the surface. The method includes cleaning and priming the surface, cutting and/or tearing paper, adhering the paper to the primed surface, and sealing the paper between the surface and a sealer layer. The system and method enables a user to resurface a variety of surfaces, including surfaces that include a variety of edges, corners, curves, and/or recessed areas, enabling the user to transform the appearance of the surface so that it resembles a more expensive surface, such as natural stone.
    Type: Grant
    Filed: September 28, 2015
    Date of Patent: August 1, 2017
    Assignee: King Conroy, LLC
    Inventors: Kelly S. King, Michael C. Conroy
  • Patent number: 9688062
    Abstract: A method of fabricating a device includes providing a process substrate on a carrier substrate, where the process substrate has a rectangular shape with a pair of long sides and a pair of short sides, providing a device on the process substrate, and continuously peeling the process substrate from the carrier substrate along a curve passing through a starting point which is one of vertices the process substrate, where the curve substantially perpendicularly passes through one of the short sides spaced apart from the starting point.
    Type: Grant
    Filed: September 8, 2014
    Date of Patent: June 27, 2017
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventor: Yukinori Asakawa
  • Patent number: 9585261
    Abstract: A manufacturing method of a multilayer printed wiring board in which a copper foil with carrier foil consists of at least four layers, a carrier foil/a release layer/a heat-resistant metal layer/a copper foil layer is used; a supporting substrate is manufactured by laminating an insulating layer constituting material on the surface of the copper foil layer constituting the copper foil with carrier foil; a supporting substrate with build-up wiring layer is manufactured by forming a build-up wiring layer on the surface of the carrier foil constituting the copper foil with carrier foil in the supporting substrate; the resulted supporting substrate with build-up wiring layer is separated at the release layer to manufacture a multilayered laminate; the resulted multilayered laminate is processed a necessary procedures to manufacture a multilayer printed wiring board.
    Type: Grant
    Filed: March 29, 2012
    Date of Patent: February 28, 2017
    Assignee: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Ayumu Tateoka, Shinichi Obata, Toshiyuki Shimizu
  • Patent number: 9570952
    Abstract: A disk motor including: a rotor; a stator; an output shaft concentrically fixed to the rotor; at least one coil disk which is provided to one of the rotor or the stator, a coil pattern which includes a plurality of radial patterns or radial pattern groups extending outwards in a radial direction from a center part of the coil disk being formed on at least one surface of the coil disk; an electric current supply portion which supplies electric current to the coil pattern; a magnetic flux generating portion which is provided to another of the rotor or the stator and faces the coil pattern; and an intermediate pattern which is formed between adjacent radial patterns or adjacent radial pattern groups on the coil disk.
    Type: Grant
    Filed: January 31, 2012
    Date of Patent: February 14, 2017
    Assignee: HITACHI KOKI CO., LTD.
    Inventors: Kenichirou Yoshida, Hideyuki Tanimoto
  • Patent number: 9554468
    Abstract: Generally discussed herein are systems and apparatuses that can include a releasable core panel. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include coupling an inner foil to a base, situating an adhesive layer on the inner foil, such that the inner foil is substantially flush with a periphery of the base, situating an outer conductive foil on the adhesive layer, or covering an interface between the adhesive layer, the inner foil and the outer conductive foil with a protective material.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: January 24, 2017
    Assignee: Intel Corporation
    Inventors: Ching-Ping Janet Shen, Charan K. Gurumurthy, Dilan Seneviratne, Ravi Shankar, Liwen Jin, Deepak Arora
  • Patent number: 9554472
    Abstract: Generally discussed herein are systems and apparatuses that can include a releasable core panel. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include coupling an inner foil to a substantially rectangular base, situating an outer conductive foil situated on the inner foil, or coupling, using a connective material, the inner foil and the outer conductive foil near edges of the outer conductive foil and the inner foil.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: January 24, 2017
    Assignee: Intel Corporation
    Inventors: Ching-Ping Janet Shen, Ravi Shankar, Yonggang Li, Dilan Seneviratne, Charan K. Gurumurthy
  • Patent number: 9522521
    Abstract: In various embodiments, an apparatus for separating a stacked arrangement including a first layer, a second layer and a release layer between the first layer and the second layer may be provided. The apparatus may include an attachment surface configured to suspend the stacked arrangement by attaching to the first layer. The apparatus may further include an actuating mechanism configured to form a curvature of the first layer by bending the attachment surface. The apparatus may also include a holder to hold an etchant for etching the release layer to separate the first layer from the second layer.
    Type: Grant
    Filed: April 17, 2013
    Date of Patent: December 20, 2016
    Assignee: Nanyang Technological University
    Inventors: Soon Fatt Yoon, Dawei Xu, Chiew Yong Yeo
  • Patent number: 9278512
    Abstract: A substrate bonding and debonding method includes the steps of: providing a substrate; forming a first silicone glue layer on a peel-off region of the substrate and a second silicone glue layer on a peripheral region of the substrate, in which the first and second silicone glue layers contain the same silicone main agent and silicone curing agent in a different ratio; adhering an opposite substrate to the first and second silicone glue layers; curing the first and second silicone glue layers to bond the substrate to the opposite substrate; and separating a portion of the substrate from the opposite substrate.
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: March 8, 2016
    Assignee: AU OPTRONICS CORPORATION
    Inventors: Shuo-Yang Sun, Wan-Chen Huang, Wei-Ting Lin, Chun-Cheng Cheng
  • Patent number: 9247649
    Abstract: Methods for fabricating printed circuit boards, devices for use in the fabrication of printed circuit boards, and structures for a printed circuit board. A mold may be formed as a device that includes a plurality of features, such as recesses, corresponding to a layout of a plurality of conductors for the printed circuit board. A sheet comprised of an electrically-conductive material may be deformed to match the features of the mold. A substrate may then be added to support the sheet, and the sheet may be selectively removed with a mechanical process to define the conductors of the printed circuit board.
    Type: Grant
    Filed: May 6, 2013
    Date of Patent: January 26, 2016
    Assignee: GLOBALFOUNDRIES INC.
    Inventor: Craig N. DeVarney
  • Patent number: 9023166
    Abstract: A method of transferring graphene is provided. A method of transferring graphene in accordance with an exemplary embodiment of the present invention may include forming a graphene layer by composing graphene and a base layer, depositing a self-assembled monolayer on the graphene layer, and separating a combination layer comprising the self-assembled monolayer and the graphene layer from the base layer.
    Type: Grant
    Filed: June 21, 2013
    Date of Patent: May 5, 2015
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Jin Sik Choi, Young-Jun Yu, Jin Tae Kim, Kwang Hyo Chung, Doo Hyeb Youn, Choon Gi Choi
  • Publication number: 20150114551
    Abstract: A carrier film of thermoplastic polyester has releasable metal adhesive properties suitable for a metal transfer in which the polyester film is metalized and the metal layer is subsequently transferred to a permanent adhesive-coated substrate. The metal layer is in direct contact with the polyester carrier film and no intermediate release layer is present. Desired metal adhesion is provided by dispersing an suitable surfactant, and optionally, a hydrocarbon wax, uniformly into the polyester film. Surfactant on the outer surface of the carrier film modifies metal adhesion to the polyester such that the metal can be removed in a metal transfer operation.
    Type: Application
    Filed: December 30, 2014
    Publication date: April 30, 2015
    Applicant: TORAY PLASTICS (AMERICA), INC.
    Inventor: Jan Moritz
  • Patent number: 9005391
    Abstract: An embodiment of the inventive method of transfer lamination bonding a first metallized side of a film to a substrate. Then a breakaway coating is applied to a second, non-metallized side of the film after the first metallized side has been bonded to the substrate. The bonded film and substrate are then placed in an oven. The film is then stripped from the substrate leaving metal from the film deposited on the substrate. The application of the breakaway coating is performed as an inline part of the transfer lamination process thereby providing an ease of manufacture presently unknown.
    Type: Grant
    Filed: June 10, 2010
    Date of Patent: April 14, 2015
    Assignee: Hazen Paper Company
    Inventor: John Hazen
  • Patent number: 8961725
    Abstract: A method of placement of a component on a stretchable substrate is described. A base substrate, having a stretchable substrate layer, and a flexible foil, having an integral arrangement of multiple flexible foil components, are aligned, so as to be used in a reel based manufacturing process. Through lamination of the base substrate and the flexible foil an electro/optical via connection between in plane interconnecting traces on the stretchable substrate layer and component pads of the integral component arrangement is provided. The integral arrangement of flexible foil components are mechanically separated. The method may be used in a manufacturing process for multi-foil systems.
    Type: Grant
    Filed: February 9, 2011
    Date of Patent: February 24, 2015
    Assignee: Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
    Inventors: Marinus Marc Koetse, Harmannus Franciscus Maria Schoo, Margaretha Maria De Kok
  • Patent number: 8945702
    Abstract: The present invention provides flexible packaging webs comprising a non-oriented metallized sealant film characterized by a secant modulus of less than 120,000 psi and an elongation at break of greater than 150%, wherein the non-oriented metallized sealant film comprises (1) a thermoplastic base layer of a material selected from the group consisting of ethylene/vinyl alcohol copolymer, ethylene/acrylic acid copolymer, ethylene/norbornene copolymer, polyamide and blends thereof; (2) a metal coating deposited on the base layer and having an optical density of 1.0 to 3.0; and (3) a heat sealing layer. The packaging webs of the present invention each exhibit an oxygen gas transmission rate of between 0 to 10.0 cm3/100 in2/24 hours at 73° F. (0 to 155 cm3/m2/24 hours at 23° C.) and 0% relative humidity and a water vapor transmission rate of between 0 to 0.1 g/100 in2/24 hours at 100° F. (0 to 1.55 g/m2/24 hours at 38° C.) and 90% relative humidity. The sealant films are formed by a blown coextrusion method.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: February 3, 2015
    Assignee: Bemis Company, Inc.
    Inventors: Sam Edward Wuest, Curtis Randolph Barr, Chris Scott Mussell, Steven James Dennis
  • Patent number: 8932425
    Abstract: The invention relates to a method and a transfer strip for decorating surfaces, in particular for decorating outer packagings. A transfer strip comprising a strip-like backing film (11), a decorative layer (13) and a release layer (12) arranged between the decorative layer (13) and the backing film is provided. The decorative layer (13) has a multiplicity of identical optically variable decorative elements, which are arranged in first area regions, which are separate from one another and spaced apart from one another in the longitudinal direction of the transfer strip. The decorative layer (13) has second area regions, which are separate from one another and spaced apart from one another in the longitudinal direction of the transfer strip and in which the decorative layer (13) has one or more individualizable layers for providing respectively different machine-readable optical markings.
    Type: Grant
    Filed: June 24, 2011
    Date of Patent: January 13, 2015
    Assignee: Leonhard Kurz Stiftung & Co. KG
    Inventors: Norbert Lutz, Walter Kurz, Ludwig Brehm, Hans Peter Bezold
  • Publication number: 20140356574
    Abstract: Fabrics made for apparel, tents, sleeping bags and the like, in various composites, constructed such that a combination of substrate layers and insulation layers is configured to provide improved thermal insulation. The fabric composites are constructed to form a radiant barrier against heat loss via radiation and via conduction from a body.
    Type: Application
    Filed: June 2, 2014
    Publication date: December 4, 2014
    Inventors: Brian John Conolly, Thomas Kenneth Hussey
  • Publication number: 20140338739
    Abstract: An integrated back-sheet for a back contact photovoltaic module is provided. The integrated back-sheet is formed from a polymer substrate and a conductive metal foil that is die cut to provide a metal foil circuit that is adhered to the polymer substrate. A back contact solar cell module incorporating the integrated back-sheet with the die cut metal foil circuit is also provided. Processes for forming such integrated back-sheets and back contact solar cell modules are also provided.
    Type: Application
    Filed: October 31, 2011
    Publication date: November 20, 2014
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: Zelin Liu, Qiuju Wu