Metal Foil Lamina Patents (Class 156/233)
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Patent number: 5597434Abstract: A light-reflective decorative article is made by placing a foil sheet over a plurality of discrete, shaped particles of synthetic plastic material, thereupon fixing portions of the foil sheet on upper surfaces of the particles, and thereupon peeling the foil sheet off the particles but leaving behind the fixed foil sheet portions.Type: GrantFiled: July 7, 1994Date of Patent: January 28, 1997Assignee: Jay J. KukoffInventor: Michael L. Kukoff
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Patent number: 5592737Abstract: A process for manufacturing a multi-layer printed wire board, also referred to as a multilayer, comprising at least two electrically insulating substrates with electrically conductive traces or layers provided on at least three surfaces thereof, in which process, by means of lamination under pressure, a cured basic substrate based on a UD-reinforced synthetic material, provided on either side with traces, is combined with and bonded to a back-up substrate, wherein during the laminating process the back-up substrate is added to the basic substrate, the back-up substrate comprising a UD-reinforced cured core layer provided at least on the side facing the conducting traces of the basic substrate with a still plastically deformable (flowable) adhesive layer, and such a pressure is exerted on the laminate as to bring said cured core layer of the back-up substrate into contact or practically into contact with the conducting traces of the basic substrate, and the space between these traces is filled with the adhesivType: GrantFiled: December 3, 1993Date of Patent: January 14, 1997Assignee: Akzo Nobel N.V.Inventors: Erik Middelman, Pieter H. Zuuring
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Patent number: 5589022Abstract: The object of the present invention is to provide a method of manufacturing an emblem in which high frequency induction heating is applied to a soft thermoplastic synthetic resin film such as a thermoplastic PVC film including a metal vapor deposition film and a polyurethane film. By a polyurethane film, the metal vapor deposition film is not damaged by hydrogen chloride gas or chlorine gas generated during the process of manufacturing the emblem by means of high frequency induction heating.Type: GrantFiled: June 5, 1995Date of Patent: December 31, 1996Inventor: Eiji Kuwahara
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Patent number: 5587037Abstract: A process for producing a multi-layer sheet material having a refractive foil layer therein. The multi-layer sheet material providing an image having depth, dimension, contrasts, glow and brilliance.Type: GrantFiled: November 23, 1994Date of Patent: December 24, 1996Assignee: Custom GraphicsInventor: Alan E. Fellner
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Patent number: 5585153Abstract: A method for applying a decorative coating to glass and the resulting glass products.Type: GrantFiled: April 28, 1995Date of Patent: December 17, 1996Assignee: Revlon Consumer Products CorporationInventors: Melvin E. Kamen, Bhupendra Patel, Phillip Bernstein
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Patent number: 5571359Abstract: A pigmented ink composition comprising a radiation curable component and a pyrrolopyrrol or isoindolinone pigment; a method for decorating a substrate with the pigmented ink compositions; and a method for decorating a substrate with hot stamping foil and the pigmented ink compositions.Type: GrantFiled: February 22, 1994Date of Patent: November 5, 1996Assignee: Revlon Consumer Products CorporationInventors: Melvin E. Kamen, Bhupendra Patel
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Patent number: 5545466Abstract: The present invention provides a copper-clad laminate characterized in that an electrolytic copper foil on the glossy (shiny) surface side of which a copper electrodeposit is formed, is bonded at its glossy surface side to one side or each of both sides of a substrate, which has a fine-pitch wiring (circuit) pattern and exhibits a high etching factor. The present invention further provides a copper-clad laminate which can be suitably employed in the production of such a printed wiring board.Type: GrantFiled: July 11, 1995Date of Patent: August 13, 1996Assignee: Mitsui Mining & Smelting Co., Ltd.Inventors: Muneo Saida, Yutaka Hirasawa, Katsuhiro Yoshimura
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Patent number: 5525280Abstract: A monolithic capacitive pressure transducer is shown composed of ceramic material having a closed cavity formed near a surface thereof and having capacitor plates formed on two opposed surfaces defining the cavity. Vias are formed extending from the capacitor plates to permit electrical connection therewith. The transducer is made by separately forming under pressure a diaphragm and a base having a recess in the top surface using ceramic powder coated with an organic binder. A metal layer is deposited on the two pieces and the pieces are then joined together to form a single unit. A spacer may be inserted in the recess to ensure that a predetermined gap is maintained between the two parts during the joining operation. The parts are then debinderized by heating in air to a first temperature level to allow the binder organics, as well as the spacer organics if a spacer is employed, to be vaporized and/or decomposed and removed through the open pores of the diaphragm and base.Type: GrantFiled: April 7, 1994Date of Patent: June 11, 1996Assignee: Texas Instruments IncorporatedInventors: Vishwa N. Shukla, Stanley J. Lukasiewicz, Francois A. Padovani
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Patent number: 5520763Abstract: Colored or metallic foil is applied to toner printed onto a substrate, such as paper, in a high speed, versatile manner, using a rotating impression cylinder, and a rotating transfer cylinder having circumferentially spaced heated raised portions. The toner, which preferably includes a thermoplastic component, is applied to the paper with any suitable printer, such as a computer controlled MIDAX (ion deposition) print engine. The toner may be heated by an infra red heater just before the paper is fed to the nip between the impression and transfer cylinders. A foil strip having an adhesive layer facing outwardly, a foil layer, and a release coating on a backing, is also fed to the nip, and the backing taken up downstream of the nip. Heat and pressure applied at the nip transfer the adhesive and foil from the foil strip to the tacky toner, producing the desired foil printed paper, which then may be further processed.Type: GrantFiled: February 3, 1992Date of Patent: May 28, 1996Assignee: Moore Business Forms, Inc.Inventor: Robert H. Johnstone
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Patent number: 5520973Abstract: A method for decorating a substrate with hot stamping foil comprising the steps of:a) applying an ink composition comprised of a cationically radiation cured cycloaliphatic epoxide to the substrate in a predetermined design, said ink being operable when cured to bond to the substrate,b) curing the ink on the substrate by exposing to the radiation by which it is curable, thereby bonding the ink composition to the substrate,c) pressing a sheet of hot stamping foil against the substrate with a die heated to a temperature sufficient to cause a portion of the hot stamping foil to adhere to the heated, cured ink design but not to the ink-free areas of the substrate, andd) removing the die, thereby leaving behind a portion of the foil adhered to the ink design.Type: GrantFiled: March 20, 1995Date of Patent: May 28, 1996Assignee: Revlon Consumer Products CorporationInventors: Melvin E. Kamen, Bhupendra Patel
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Patent number: 5505808Abstract: Vapor deposited metal nitride or oxide thin films serve as a wear layer for surface coverings after being formed on a release layer and transferred to an organic layer. A release layer such as sodium chloride on glass can be dissolved by water; while a self-supporting release layer can be removed by solvent, etching, laser abatement, or delamination.Type: GrantFiled: July 15, 1993Date of Patent: April 9, 1996Assignee: Armstrong World Industries, Inc.Inventors: Robert A. Hallman, Jeffrey S. Ross
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Patent number: 5489355Abstract: The present invention relates to a method for producing decorative boards excelling in brightness, the method comprising the steps of: providing a transfer sheet (1) comprising a releasable film (20), a metallized layer (5) formed on the releasable film (20) and an adhesive layer (6) formed on the metallized layer (5) over its entire surface or according to a desired pattern; transferring selectively a part of the metallized layer of the transfer sheet where the adhesive layer is formed onto a decorative board base (2) over its entire surface or a part of the decorative board base surface and/or a back side thereof by superposing the decorative board base (2) and the transfer sheet (1) of its adhesive layer side and pressing the thus obtained laminate; impregnating the thus obtained decorative board base having the metallized layer (5) with a thermosetting resin; and hot-pressing the thus impregnated decorative board base to obtain the decorative board having excellent brightness.Type: GrantFiled: September 20, 1994Date of Patent: February 6, 1996Assignee: Dai Nippon Insatsu Kabushiki KaishaInventors: Kazuhiko Shimizu, Hajime Kubota, Satoshi Nishida
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Patent number: 5482586Abstract: Two aluminum-copper foils, each composed of a layer of copper and a layer of aluminum, are held back to back with the aluminum surfaces against each other, thereby providing an outer layer material (20) for a multilayer printing wiring board. To manufacture a multilayer printed wiring board, an outer layer material (20), a prepreg (2), an inner layer laminate (1), a prepreg (3), and an outer layer material (21) are successively stacked or built up in the order named. The aluminum surface of the outer layer material (20) replaces the mirror finished steel plate and dummy plate which have heretofore been employed. Since the aluminum surfaces can easily be separated from each other, they perform the function of conventional parting films.Type: GrantFiled: October 29, 1993Date of Patent: January 9, 1996Assignee: Fanuc Ltd.Inventors: Katsuhiko Fujikake, Hidetaka Miyama
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Patent number: 5478421Abstract: A warp-free laminate is produced by winding a first set of strands or filaments about a flat mandrel with a second set of strands being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern determining punching out or high speed drilling of hole openings for subsequent printed circuit applications.Type: GrantFiled: September 28, 1993Date of Patent: December 26, 1995Assignee: Compositech Ltd.Inventors: Jonas Medney, Fred E. Klimpl
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Patent number: 5470644Abstract: A laminated sheet allows circuit boards to be fabricated without any special equipment. The laminated sheet can be printed using an ordinary laser printer on a personal computer. The sheet has a conductive layer, such as copper, attached to a nonconductive flexible substrate, such as Kapton. The outer surface of the copper is coated with an ink which provides a receiving surface for toner when the laminated sheet is fed through a printer. The other side of the flexible substrate is attached to a removable layer of paper which provides support for the laminated sheet during the printing process. The paper is removed after printing and the adhesive which held the paper is used to attach the flexible substrate to a rigid substrate. Alcohol is used to remove the ink and expose the copper for etching. The alcohol does not remove the toner which acts as a mask during the etching process. The toner is removed after board fabrication.Type: GrantFiled: April 21, 1994Date of Patent: November 28, 1995Inventor: David Durant
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Patent number: 5470412Abstract: A process for producing circuit substrate is prepared by preparing at least one ceramic greensheet containing glass and sinterable at a low temperature for forming the circuit substrate, and at least one unsintered transfer sheet unsinterable at a sintering temperature of the ceramic greensheet, printing a wiring pattern on the unsintered transfer sheet, stacking the unsintered transfer sheet on the ceramic greensheet to form a laminated body and thermocompressing the laminated body to form a compressed body, firing the compressed body at a sintering temperature of the ceramic greensheet to form a ceramic substrate, thereby preparing a fired body by transferring the wiring pattern on the unsintered transfer sheet to the ceramic substrate, and removing the unsintered transfer sheet from the fired body to prepare a circuit substrate.Type: GrantFiled: July 27, 1993Date of Patent: November 28, 1995Assignee: Sumitomo Metal Ceramics Inc.Inventors: Junzo Fukuta, Masashi Fukaya, Hideaki Araki
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Patent number: 5435882Abstract: The direct drive applicator for foil printing of the present invention discloses a light weight, portable, device advantageous in performing foil printing and laminating which is about the size of a type writer, and contains separate speed and temperature controls so that an operator can rapidly adjust the operation of the machine to quickly optimize the printing or laminating characteristics. The inventive machine contains a foil laminate supply reel and foil laminate takeup reel which are properly tensioned to provide an area of foil laminate under tension on both sides of a heated pressure roller to insure that crumpling or wrinkling of the foil laminate does not occur on printing.Type: GrantFiled: December 19, 1994Date of Patent: July 25, 1995Assignee: Mark McKellerInventors: Ernesto Azamar, Timothy Wehrfritz, Alberto Flores
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Patent number: 5401346Abstract: A hologram decal including a hologram layer having first and second surfaces, a first polymer layer secured to the first hologram surface, a second polymer layer secured to the second hologram surface, a pressure sensitive adhesive layer disposed on the non-hologram side of one of the first and second polymer layers, and a release liner covering said pressure sensitive adhesive layer, and techniques for making the hologram decal.Type: GrantFiled: March 3, 1994Date of Patent: March 28, 1995Assignee: Hughes Aircraft CompanyInventors: Khin S. Yin, John E. Wreede, Kevin H. Yu
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Patent number: 5391247Abstract: A method for applying a decorative coating to glass and the resulting glass products.Type: GrantFiled: May 6, 1994Date of Patent: February 21, 1995Assignee: Revlon Consumer Products CorporationInventors: Melvin E. Kamen, Bhupendra Patel, Phillip Bernstein
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Patent number: 5362348Abstract: A method of applying a foil indicia on a video cassette including the steps of mounting a video cassette on a conveyor, indexing the video cassette to a stamping position adjacent a first hot foil stamping means and a second hot foil stamping means, applying a foil indicia on a first predetermined surface of the video cassette, applying a second foil indicia on a second predetermined surface of the video cassette, where the first predetermined surface and second predetermined surface are disposed at a substantial angular relation to each other, indexing the video cassette to an exit position, and removing the video cassette from the conveyor. An apparatus for carrying out the method of the present invention is also disclosed.Type: GrantFiled: October 29, 1993Date of Patent: November 8, 1994Inventor: William T. Gutherie
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Patent number: 5342468Abstract: A joint forming sheet comprising a substrate having an easy release surface having a contact angle with water of at least 50.degree., having provided on the easy release surface thereof an inorganic thin layer, the interfacial adhesive force of the inorganic thin layer to the substrate surface being greater than the tensile strength of the inorganic thin layer. The inorganic thin layer can be released and transferred to a part on which an electrical joint is to be formed with high precision to form a joint causing no electrical connection failure.Type: GrantFiled: September 2, 1992Date of Patent: August 30, 1994Assignee: Nitto Denko CorporationInventors: Shozo Kawazoe, Hidehito Okano
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Patent number: 5338615Abstract: A flexible multi-layered transfer film medium for computer-aided sign-making is provided in which the letter or graphic making medium is genuine gold film. The genuine gold film is highly fade resistant in use due to its natural resistance to attack by ultra violet light. The genuine gold film will not fade under normal exposure to UV light for long periods of time. The genuine gold film is to be cut using a computer-aided sign making system.Type: GrantFiled: April 28, 1993Date of Patent: August 16, 1994Assignee: Signgold CorporationInventors: Charles E. Quick, Jamie R. Quick
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Patent number: 5333549Abstract: A method of printing an image on a foil-covered surface wherein a portion of the surface is coated with opaque white ink provides a unique high-quality graphic wherein the designs printed on bare foil are more prominently presented than, and are sharply differentiated from, designs printed on the surfaces coated with opaque white ink.Type: GrantFiled: September 14, 1992Date of Patent: August 2, 1994Assignee: Playoff CorporationInventor: William Feldman
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Patent number: 5328537Abstract: A method of manufacturing a screen printing plate which can be obtained without using a mother mesh sheet and a resist film including a step of providing a non-plating area on the roll and exposing the roll coated with high-sensitivity photosensitive film by a multiple number of laser beams. The multiple number of laser beams are controlled by preset electric data so that the desired halftone points of negative halftone image are exposed on the roll.Type: GrantFiled: April 15, 1992Date of Patent: July 12, 1994Assignee: Think Laboratory Co., Ltd.Inventor: Tatsuo Shigeta
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Patent number: 5328534Abstract: A method of forming a transferable pattern or image of an inorganic film by coating an embossed substrate with an inorganic layer, that may comprise one or more films, over both recessed and raised surface portions, adhesively laminating a transfer substrate to the inorganic layer coating the raised surface portions of the embossed substrate and separating the embossed substrate and the transfer substrate. The adhesive is selected such that the bond between the transfer substrate and the inorganic film on the raised surface portions is greater than the bond between the inorganic layer on the raised surface portions and the embossed substrate.The embossed substrate resulting after removal of the inorganic layer coating the raised surface portions may be modified to include additional inorganic layers over the recessed surface portions by tinning or electroplating methods such that this thickened inorganic layer may also be transferred from the embossed substrate to a transfer substrate as set forth above.Type: GrantFiled: February 22, 1993Date of Patent: July 12, 1994Assignee: Minnesota Mining and Manufacturing CompanyInventors: Clyde D. Calhoun, David C. Koskenmaki
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Patent number: 5326412Abstract: A corrosion resistant barrier is provided for isolated circuity. An isolated circuit (10, 12) with raised interconnection features (16, 18) having a corrosion resistant gold coating (34) is formed on a reusable stainless steel mandrel (22) which is provided with indentations to define raised features. A seed layer (32) of copper is electroplated on the mandrel in a pattern of the isolated circuit to be formed. The copper seed layer (32) is then followed by electroplated layers of gold (34), nickel (36) and copper (38) until a total desired conductor thickness is achieved. A dielectric substrate (44, 46) is laminated on the multilayer conductive traces of the circuit. After removal of the multilayer circuit from the mandrel, a predrilled dielectric coverlay (50) is laminated to the circuit with holes in the coverlay receiving the raised circuit features (52). The finished part is then etched to remove the copper seed layer from the raised features.Type: GrantFiled: December 22, 1992Date of Patent: July 5, 1994Assignee: Hughes Aircraft CompanyInventors: Christopher M. Schreiber, Haim Feigenbaum
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Patent number: 5307561Abstract: Shaped contacts (40, 42) for interconnecting circuits or for use in an integrated circuit test probe are electroplated as integral parts of circuit traces (34) upon a stainless steel mandrel (10). A shaped, hardened steel indentation tool (16, 18, 26, 28) makes indentations (24a, 24b) of predetermined shape in the surface of the mandrel (10), which is provided with a pattern of dielectric, such as Teflon (12), or photoresist. Areas of the steel mandrel, including the indentations (24a,24b), are electroplated with a pattern of conductive material (34, 36, 38), and a dielectric substrate (32) is laminated to the conductive material. The circuit features formed by the indentations define raised contacts of a conical (18) or pyramidal (28) shape, having free ends with a small area that allows higher pressures to be applied to a surface against which the contacts are pressed.Type: GrantFiled: November 27, 1992Date of Patent: May 3, 1994Assignee: Hughes Aircraft CompanyInventors: Haim Feigenbaum, William R. Crumly, Christopher M. Schreiber
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Patent number: 5281291Abstract: A molding with the cross-section thereof varying in the longitudinal direction, the molding including a support strip; and a protector provided along the length of the support strip so as to bring the molding into contact with a window glass; the support strip including a mounting portion, an outer piece with the height thereof varying along the length of the support strip and a top portion for connecting the mounting portion and the outer piece; and the protector being integrally provided with the outer piece of the support strip at the lower portion thereof by extrusion molding.Type: GrantFiled: October 23, 1991Date of Patent: January 25, 1994Assignee: Tokai Kogyo Kabushiki KaishaInventors: Yukihiko Yada, Kazuyoshi Higuchi
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Patent number: 5277964Abstract: A discharge recording medium comprising a substrate and a thin metal layer which is formed on the substrate layer and is made of aluminum containing at least one metal selected from the group consisting of manganese, copper and magnesium, which has good environmental resistance and printing characteristics.Type: GrantFiled: March 18, 1992Date of Patent: January 11, 1994Assignee: Hitachi Maxell, Ltd.Inventors: Ryuzo Fukao, Taiji Matsumoto
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Patent number: 5240778Abstract: A flexible multi-layered transfer film medium for computer-aided sign-making is provided in which the letter or graphic making medium is genuine gold film. The genuine gold film is highly fade resistant in use due to its natural resistance to attack by ultra violet light. The genuine gold film will not fade under normal exposure to UV light for long periods of time. The genuine gold film is to be cut using a computer-aided sign making system.Type: GrantFiled: September 17, 1992Date of Patent: August 31, 1993Assignee: SignGold CorporationInventors: Charles E. Quick, Jamie R. Quick
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Patent number: 5238516Abstract: Method for producing a material embodying an interference pattern, in which there is solvent-coated a transparent, thermoformable lacquer on one side of a base film, which lacquer is capable of forming a releasable direct bond with the base film. The lacquer is dried so as to form a solid lacquer layer. An interference pattern is formed by embossing the side of the solid lacquer layer which faces away from the base film with a printing device carrying the negative of the interference pattern. The embossed side of the lacquer layer is clad with a metal layer. A substrate is glued onto the metal layer, and the base film is released from the lacquer layer. A second base film is provided with a second transparent lacquer layer, and an interference pattern is introduced in this second lacquer layer. Then the second lacquer layer is applied by means of a transparent glue onto the first lacquer layer, and the second base film is removed.Type: GrantFiled: June 24, 1991Date of Patent: August 24, 1993Assignee: Koninklijke Emballage Industrie van Leer B.V.Inventors: Gijsbertus van Suylekom, Edward J. van der Laan
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Patent number: 5223326Abstract: A corrugated metal-clad sandwich panel with a wafer composite core is provided. The single stage process for the panel manufacture involves utilizing a press platen system which is mechanically convertible between a planar and a corrugated configuration. The metal sheet is first placed on the lower platen which is in the planar configuration. The wafers and an isocyanate resin in admixture are uniformly distributed over the metal sheet. Optionally, a second metal sheet is placed over the wafer/resin mat. The platens are biased together to precompress the mat. Finally, the platens are converted from the planar to the corrugated configuration, thus forming the corrugated metal-clad sandwich panel having a waferboard core in a single stage.Type: GrantFiled: April 23, 1991Date of Patent: June 29, 1993Assignee: Alberta Research CouncilInventor: Lars Bach
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Patent number: 5197184Abstract: A pressure-type contact for flexible or conventional wire cable terminations is fabricated from electroformed thin metallic wafers (100) in which one wafer is plated with a raised conductive interconnection feature (122). The electrical circuitry (118, 120) is made on a stainless steel mandrel (10, 10a) having a TEFLON pattern (16, 16a) on its surface that allows the desired electrical circuit (30, 32, 34, 30a, 32a, 34a, 78) to be electrolytically plated upon the conductive mandrel surface. The mandrel surface is formed with projecting features in the form of depressions (24, 24a) that will form a series of dots or raised interconnection features on the termination wafers. The mandrel also has projecting posts (76) for providing electrical connection through the substrate.Type: GrantFiled: September 11, 1990Date of Patent: March 30, 1993Assignee: Hughes Aircraft CompanyInventors: William R. Crumly, Christopher M. Schreiber, Haim Feigenbaum
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Patent number: 5190608Abstract: A flexible belt having an outwardly facing surface, a welded seam having irregular protrusion on the outwardly facing surface and a thin flexible strip laminated and covering the welded seam and protrusions. This belt may be fabricated by providing a flexible belt having an outwardly facing surface and a welded seam having irregular protrusion on the outwardly facing surface and laminating a thin flexible strip to the welded seam. This belt may be used in an electrostatographic imaging process.Type: GrantFiled: December 27, 1990Date of Patent: March 2, 1993Assignee: Xerox CorporationInventors: John J. Darcy, Karl V. Thomsen, Eugene A. Swain
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Patent number: 5186787Abstract: Pre-imaged high resolution transfer foil comprising a carrier having a surface. A releasable hardcoat is disposed on the surface. A vacuum coating is deposited on the hardcoat and an image formed in the vacuum coating.Type: GrantFiled: March 25, 1991Date of Patent: February 16, 1993Inventors: Roger W. Phillips, Kraig R. Willison
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Patent number: 5174847Abstract: The circuit arrangement has at least one electrically conductive cut conductor track on at least one surface of a support film, the support film being free of deformations and fluctuations in the thickness, both in the region of the conductor track covering it and outside this region. The edges of the conductor track have a projection in the form of a stamping burr. A negative circuit is applied to a stamping substrate or embossed in the latter by means of embossing dies or punching tools constituting a block; the conductor track representing the remaining positive circuit is transferred to the support film.Type: GrantFiled: March 8, 1991Date of Patent: December 29, 1992Inventor: Fritz Pichl
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Patent number: 5158818Abstract: A conductive die attach tape is described which allows for mounting of diced semiconductor chips thereon, followed by removal of the chip with an adherent conductive adhesive, and the mounting of the chip/adhesive combination in a chip carrier preparatory to the wire bonding operation.Type: GrantFiled: September 9, 1989Date of Patent: October 27, 1992Assignee: National Starch and Chemical Investment Holding CorporationInventor: Joseph A. Aurichio
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Patent number: 5156720Abstract: A process for producing a released film made of at least two layers, one or more of which has been formed by a vapor deposition technique. The process involves anodizing a metal substrate comprising a valve metal or valve metal alloy to form an anodic oxide layer on the substrate, the anodization being carried out in the presence of an adhesion-reducing agent (e.g. fluoride) which makes the anodic layer detachable from the valve metal, coating the anodic layer with one or more layers of desired materials by a vapor deposition technique (e.g. sputtering or vacuum evaporation, etc.) to form a film of desired structure which is releasable from the metal substrate, and then detaching the releasable film from the metal substrate. The film can, if desired, be transferred to another substrate by attaching the other substrate to the releasable film before the releasable film is detached from the metal substrate.Type: GrantFiled: February 3, 1989Date of Patent: October 20, 1992Assignee: Alcan International LimitedInventors: Aron M. Rosenfeld, Paul Smits
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Patent number: 5149386Abstract: The invention relates to a laminated tamper-evident structure which exhibits an irreversible color change upon delamination. The structure includes a laminate of at least two layers capable of generating a color by a light interference and absorption phenomenon that requires direct and intimate contact between an adjacent two of the layers. The strength of attachment among the layers of the laminate is such that the laminate can be uniformly and reliably peeled apart at the interface between the adjacent two layers. An overlying flexible strip of transparent or translucent material is adhered to the laminate to facilitate the peeling operation. Upon peeling apart the laminate, the generated color is irreversibly lost, thus providing evidence that the structure has been tampered with. The structure can be incorporated into a variety of closable articles or products to provide evidence of opening or tampering.Type: GrantFiled: December 17, 1990Date of Patent: September 22, 1992Assignee: Alcan International LimitedInventors: Paul Smits, Aron M. Rosenfeld, Howard F. DeFerrari
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Patent number: 5139599Abstract: In the decoration of an article having a conical surface by means of a decoration applied from an embossing foil, the embossing foil strip is unwound from a supply roll and passed around a deflection roller to feed it in the proper orientation to an embossing station in which a decoration is transferred from the embossing foil on to the surface of the article. The deflection roller and the embossing foil supply roll perform a linear movement parallel to the axis of the deflection roller and at the same time a pivotal movement about a pivot axis which is normal to that roller axis. The deflection roller is continuously linearly displaced by a distance corresponding to the deviation between the linear configuration of the embossing foil strip and the arcuate configuration defined by the development of the conical surface of the article to be decorated.Type: GrantFiled: September 14, 1990Date of Patent: August 18, 1992Assignee: Leonard Kurz GmbH & Co.Inventor: Karl Kummerer
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Patent number: 5127158Abstract: A process for producing a printed circuit board includes steps, sequentially conducted of dispersing in water or organic solvent:(A) 95 to 20% by weight of a styrene polymer having a syndiotactic structure, (B) 5 to 80% by weight of a fibrous filler having a fiber length of 1 to 50 mm, and (C) 0.1 to 30 parts by weight of at least one of a binder and a binding fiber in proportion to 100 parts by weight of the total amount of the components (A) and (B), to make a slurry having a concentration of 0.5 to 100 g/l; separating the solids from the slurry and drying and molding them. Thereafter the solids are either subjected to melting with heating and pressure forming into the molded article, or they are impregnated with a thermoplastic resin which is then cured. Finally, a metal layer is provided on the molded article.Type: GrantFiled: August 30, 1990Date of Patent: July 7, 1992Assignee: Idemitsu Kosan Co., Ltd.Inventor: Akikazu Nakano
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Patent number: 5120590Abstract: A conductive copper foil for use in preparing printed circuit boards is protected from damage during storage, shipment and further processing by covering one side of the foil with a sheet of polyethylene film. The film is removably joined with the foil by an adhesive material placed between the film and the foil in a marginal area of the latter. The film is selected to be sufficiently resistant to laminating temperature and pressure conditions so as to remain in its covering, protecting relationship to the foil and avoid sticking to the laminating press plate and retain its removability from the foil after lamination.Type: GrantFiled: January 4, 1991Date of Patent: June 9, 1992Assignee: Gould Inc.Inventors: Rolland D. Savage, John P. Callahan
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Patent number: 5104719Abstract: A decal which is adapted to decorate bottles, containers and similar devices of the type having surfaces with high wetting angles is fabricated without the use of wax. The decal can be printed upon utilizing various inks to provide aesthetic container surfaces as for example utilized in the cosmetic industry. The decal is free of wax and consists of a carrier layer as a plastic or paper having impressed thereon a base and a release layer which typically is a suitable plastic type material. The plastic type material as secured to the base layer has imprinted thereon a suitable pattern employing an ink which can contain metallic pigments or other piggments. The printed pattern has deposited thereon an adhesive layer which is relatively thin and which layer is secured to a desired surface of the container at low temperatures. After securing the decal to the surface of the container the release and base layers are removed thereby leaving the printed matter on the surface of the container.Type: GrantFiled: August 30, 1989Date of Patent: April 14, 1992Assignee: Revlon, Inc.Inventors: Melvin E. Kamen, Bhupendra Patel, Augustine DeFazio
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Patent number: 5104707Abstract: A transfer sheet for making a printed-wiring board by injection molding which is free from circuit damage during injection molding and has excellent releasability comprises a carrier film, a copper foil circuit, and a releasing layer provided between the carrier film and the copper foil circuit. Preferably, said releasing layer has a T-type peeling strength between the carrier film and the copper foil circuit of 0.025-0.25 kg/25 mm. A method for producing such transfer sheet comprises coating a releasing layer on a carrier film, then contact-bonding a copper foil thereto with heat, pattern-printing an etching resist on the resulting laminate film, and subjecting it to etching to form a copper foil circuit.Type: GrantFiled: June 7, 1990Date of Patent: April 14, 1992Assignee: Nitto Boseki Co., Ltd.Inventors: Akihiko Watanabe, Yuuki Numazaki, Naoto Kanno, Hirokazu Inoguchi
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Patent number: 5104471Abstract: An interlaminar sandwich comprises first and second lacquer layers, a diffraction structure embedded between the first and second lacquer layers, a heat activated adhesive layer disposed one one of the lacquer layers, and a transparent stabilization layer disposed over the other lacquer layer, the stabilization layer distributing heat evenly through the interlaminar sandwich so that when heat is applied to the stabilization layer, the adhesive layer will bond the interlaminar sandwich to a substrate. Preferably, the interlaminar sandwich also contains an intermediary layer between the stabilization layer and the first lacquer layer which bonds these layers together. At temperatures below 170.degree. C., the adhesive layer is bonded so intimately to the substrate that the interlaminar sandwich cannot be removed from the substrate without tearing it. At temperatures above 150.degree. C., the lacquer layers soften, thus destroying the diffraction structure.Type: GrantFiled: November 27, 1990Date of Patent: April 14, 1992Assignee: Landis & Gyr Betriebs AGInventors: Gregor Antes, Ohannes Minnetian
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Patent number: 5098495Abstract: A process for coating a packaging film with a transparent barrier coating. The process starts with a metal substrate made of, or having a surface coating of, a valve metal or valve metal alloy. The metal substrate is anodized to form an anodic film of the valve metal on the metal substrate. The anodic film is made readily detachable from the metal by carrying out the anodization step in the presence of an adhesion-reducing agent, e.g. a fluoride. The packaging film is then attached to the anodic film and the anodic film is detached from the metal. The transferred anodic film forms a thin dense oxide coating on the packaging film that acts as a barrier against oxygen and moisture transport. The invention can be used for making packaging films suitable for packaging foodstuffs, and the like.Type: GrantFiled: February 3, 1989Date of Patent: March 24, 1992Assignee: Alcan International LimitedInventors: Paul Smits, Aron M. Rosenfeld, Howard F. DeFerrari
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Patent number: 5096522Abstract: A process for producing a copper-clad laminate is disclosed which includes the steps of (a) contacting the surface of a conductive carrier with a catalyst liquid containing at least one noble metal selected from the group consisting of Pd, Pt, Ru, Au, and Ag; (b) subsequently forming a copper foil layer on the treated surface of the conductive carrier by copper electroplating; (c) laminating an insulating base on the copper foil layer by hot-press bonding; and (d) separating the conductive carrier from the resulting laminate. The copper foil layer in the resulting copper-clad laminate has reduced pinholes and exhibits isotropic mechanical characteristics.Type: GrantFiled: June 22, 1990Date of Patent: March 17, 1992Assignees: Meiko Electronics Co., Ltd., Toagosei Chemical IndustryInventors: Norio Kawachi, Katsurou Aoshima, Tatsuo Wada, Toshiro Miki, Takeharu Kato
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Patent number: 5089310Abstract: An image transferring sheet is made of a combination of a thermally bonding sheet and a developer sheet and a method for fabricating such a sheet is provided. In the image transferring sheet, both sheets are hot-pressed in such a state that a thermoplastic resin layer of the thermally bonding sheet and a developer layer of the developer sheet on which an image has been formed are superposed, and the developer sheet should have a size larger than the thermally bonding sheet. The use of the image transferring sheet ensures easy separation of one sheet from another and transfer of the developer layer of the developer sheet onto the thermally bonding sheet.Type: GrantFiled: July 3, 1990Date of Patent: February 18, 1992Assignee: Brother Kogyo Kabushiki KaishaInventor: Shunichi Higashiyama
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Patent number: 5084120Abstract: A component for cladding apertures in the fuselage of an aircraft is to be of lighter weight and more corrosion resistant as compared with known claddings. The component is manufactured of carbon fibre reinforced curable synthetic resin and comprises a base layer (2) onto which U-profiles (4, 4') and L-profiles (5, 5') are placed in spaced apart interrelationship, which during the manufacture are held in place by a grid (14) comprising angular bridge members. A vacuum foil 7 is applied over this assembly and is adhesively bonded along the edges of the base layer (2') to the supporting surface (1). The space between the vacuum foil (7) and the supporting surface (1) is evacuated and curing proceeds at an elevated temperature and pressure. After complete curing the vacuum foils (7) and the grid (14) are removed.Type: GrantFiled: December 4, 1989Date of Patent: January 28, 1992Assignee: Fischer Advanced Composite Components Gesellschaft m.b.H.Inventors: Josef Fischer, Walter A. Stephan
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Patent number: 5084143Abstract: Process for producing color change devices incorporating areas of contrasting appearance, and the devices so produced. The process involves masking limited areas of a layer of a color generating metal (e.g. Ta or Nb, especially commercially sputtered Ta foil), with a mask made of a material which permits anodization of an underlying surface and permits penetration of fluoride as an adhesion-reducing agent at levels employed in the process. The masked metal layer is anodized to form an anodic film on the metal, the anodization being carried out in an electrolyte containing fluoride at a concentration high enough to (a) weaken the adhesion of the anodic film to the underlying metal over the entire area of the film, and (b) to introduce voids in the anodic film in areas not covered by the mask to reduce the density, and thus the refractive index, of the film in these areas compared to areas covered by the mask. Finally the mask is removed.Type: GrantFiled: March 19, 1991Date of Patent: January 28, 1992Assignee: Alcan International LimitedInventor: Gary J. Smith