Plural Transferring Operations And/or With Additional Laminating Patents (Class 156/235)
  • Patent number: 11731377
    Abstract: In a method for producing workpieces comprising fibre composite material, in which a base unit (5) held by retaining means (97) of a conveying device is guided by at least one application station (2, 14, 17, 20, 23, 27, 29,2, 14, 17, 20, 23, 27, 29, 39-41, 67-72) and, in order to form the workpieces at the application station (2, 14, 17, 20, 23, 27, 29,2, 14, 17, 20, 23, 27, 29, 39-41, 67-72) or at least at one of the application stations (2, 14, 17, 20, 23, 27, 29,2, 14, 17, 20, 23, 27, 29, 39-41, 67-72), during a translational movement of the base unit (5) through the application station (2, 14, 17, 20, 23, 27, 29,2, 14, 17, 20, 23, 27, 29, 39-41, 67-72) in question at least one strip (6) belonging to the fibre composite material is placed on the base unit (5), it is proposed that the spatial orientation of the base unit (5) is altered by means of at least one rotation relative to the retaining means (97) before the application station (2, 14, 17, 20, 23, 27, 29,2, 14, 17, 20, 23, 27, 29, 39-41, 67-72) or b
    Type: Grant
    Filed: June 25, 2019
    Date of Patent: August 22, 2023
    Assignees: AZL Aachen GmbH, RHEINISCH-WESTFÄLISCHE TECHNISCHE HOCHSCHULE (RWTH) AACHEN
    Inventors: Thomas Weiler, Richard Schares, Albert Wendt, Lazlo Giesgen, Ruben Johannes Matthias Timmermanns
  • Patent number: 11651709
    Abstract: A multilayered sheet assembly for forming a sign on an object includes a carrier layer including a first side and a second side, a sign layer that is arranged on the first side of the carrier layer via a first adhesive layer, and a strip layer that is arranged on the second side of the carrier layer via a second adhesive layer in an adhesively separable manner. The sign layer carries a third adhesive layer at an exposed side that is across from the carrier layer to allow a sign that is formed by the sign layer to adhere to the object at the exposed side while releasing from the carrier layer.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: May 16, 2023
    Assignee: W.R.R. HOLDING LEIDEN B.V.
    Inventor: Willem Klaas Rollfs Of Roelofs
  • Patent number: 11648749
    Abstract: Embodiments disclosed herein are directed to a method of producing a rigid board plastic flooring. The method includes extruding a bottom layer without adding a plasticizer, overlapping sequentially a back embossment board, the bottom layer, a first connecting layer, a decoration layer, and a wear layer to form a sandwich, hot pressing the sandwich with temperature and pressure and applying a UV treatment to a top surface of the sandwich after hot pressing the sandwich. The method continues by annealing the sandwich after applying the UV treatment, cooling the sandwich to ambient temperature, and cutting the sandwich to size.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: May 16, 2023
    Assignee: Danie Flooring Development (JiangSu) Co., Ltd.
    Inventor: Hsu-Ming Ting
  • Patent number: 11592941
    Abstract: Electronic equipment includes a pressed body as either a housing or a display, a pressure-sensitive sensor, a support configured to support the pressure-sensitive sensor such that the pressure-sensitive sensor is opposed to the pressed body, and a filler provided between the pressed body and the pressure-sensitive sensor. The filler has a thickness that changes with distance between the pressed body and the pressure-sensitive sensor.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: February 28, 2023
    Assignee: SONY CORPORATION
    Inventors: Akira Ebisui, Ken Kobayashi, Hayato Hasegawa, Yoshiaki Sakakura, Manami Miyawaki
  • Patent number: 11515221
    Abstract: The invention relates to a housing for an optoelectronic device and to a method for producing such a housing. For producing a lid for the housing, an infrared-transparent material is used, into which at least one glass window is integrated.
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: November 29, 2022
    Assignee: Schott AG
    Inventor: Robert Hettler
  • Patent number: 11351767
    Abstract: A method for manufacturing a thermal transfer from a high-loft substrate such as velvet. The method begins with a high-loft material sheet. The sheet is registered in a vacuum press, and a vacuum is applied to one side. A sublimation graphic is printed onto an opposing side of the high-loft material sheet. Next, an adhesive layer is laminated onto the opposing side of the printed sheet. The sheet is optionally laser-etched on the printed side, and is laser-cut into a desired shape. A protective release sheet is applied over the printed graphic. The method makes it possible to sublimation-print the transfer onto high-loft fabric such as velvet and yet still retain fine graphical registration and detail.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: June 7, 2022
    Inventor: Paul Weedlun
  • Patent number: 11312168
    Abstract: A printing system is disclosed for thermal transfer printing onto a surface of a substrate. The system comprises a transfer member having opposite front and rear sides with an imaging surface on the front side, a coating station at which a monolayer of particles made of, or coated with, a thermoplastic polymer is applied to the imaging surface, an imaging station at which energy is applied by a thermal print head via the rear side of the transfer member to selected regions of the imaging surface to render particles coating the selected regions tacky, and a transfer station at which the imaging surface of the transfer member and the substrate surface are pressed against each other to cause transfer to the surface of the substrate of the particles that have been rendered tacky.
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: April 26, 2022
    Assignee: Landa Labs (2012) LTD.
    Inventor: Benzion Landa
  • Patent number: 11104172
    Abstract: An intermediate transfer medium that allows formation of high-density images on a transfer layer while suppressing printing unevenness and provides good foil cutting properties of the transfer layer, a combination of the intermediate transfer medium and a thermal transfer sheet, and a method for forming a print using the intermediate transfer medium. In an intermediate transfer medium having a transfer layer on a substrate, the transfer layer has a single layer structure including only a receiving layer or a layered structure including the receiving layer. When the transfer layer has the layered structure, the receiving layer is located furthest from the substrate among layers constituting the transfer layer. The receiving layer contains a binder resin having a number average molecular weight of 8000-32000 and a release agent. The content of the release agent based on the total mass of the receiving layer is 6% by mass or more.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: August 31, 2021
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Shinya Yoda, Yasushi Yoneyama
  • Patent number: 11072157
    Abstract: A composite structure such as a stringer is produced by laying up composite charges at a layup station, spooling the charges onto a roll and transporting the roll to a forming station where the charges are unrolled and formed into individual components of the stringer. The components are then transferred to an assembly station where they are assembled together and vacuum bagged in preparation for curing.
    Type: Grant
    Filed: June 23, 2015
    Date of Patent: July 27, 2021
    Assignee: The Boeing Company
    Inventor: Doan D. Pham
  • Patent number: 11066236
    Abstract: A refuse container having an indicator assembly for informing a waste generator of contamination in a waste stream. A refuse container includes a container body comprising a receptacle portion and a lid coupled with the receptacle portion. The receptacle portion includes a plurality of walls that together define an enclosed space for containing refuse. An indicator device is coupled with the container body. The indicator device is movable relative to the container body between a first position and a second position. First indicia is provided on one of the indicator device or the container body. When the indicator device is in the first position, the first indicia are visible from the exterior of the refuse container, and when the indicator device is in the second position, the first indicia are not visible from the exterior of the refuse container.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: July 20, 2021
    Assignee: Wastequip LLC
    Inventors: Kristin Kinder, Jennifer Coates, Tyler Brown
  • Patent number: 11062948
    Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of cutting the wafer by using a cutting apparatus to thereby divide the wafer into individual device chips, and a pickup step of picking up each device chip from the polyester sheet.
    Type: Grant
    Filed: May 2, 2019
    Date of Patent: July 13, 2021
    Assignee: DISCO CORPORATION
    Inventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
  • Patent number: 10964489
    Abstract: An upper mold for MLCC lamination comprising: a vacuum head comprising a first area formed by a plurality of base holes, which communicate with an air channel formed on the upper surface, and by through-holes that connect the lower surface and respective base holes so as to communicate with each other such that air flows between the base holes and the lower surface, the first area having a predetermined area, and the vacuum head comprising a second area configured, thereby suctioning air; a mesh plate fixed to the lower surface of the vacuum head to have a size corresponding to that of the first area, the mesh plate having a porous structure such that, when air flows through the through-holes of the first area, suction and discharge can occur evenly; and a contact plate fixed to the lower surface of the vacuum head by adhesion of the second area.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: March 30, 2021
    Assignee: 21TH CENTURY CO., LTD
    Inventor: Sung Hwan Kim
  • Patent number: 10950572
    Abstract: A method includes bringing into contact respective first sides of a plurality of dies and a die attach film on a major surface of a carrier wafer, and simultaneously heating portions of the die attach film contacting the plurality of dies in order to simultaneously bond the plurality of dies to the die attach film.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: March 16, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Shing-Chao Chen, Chung-Shi Liu, Ming-Da Cheng
  • Patent number: 10899120
    Abstract: A process for transferring microstructures to a flexible or rigid final substrate that offers advantages in both speed and precision is provided. The inventive process involves subjecting a transfer film in a continuous roll-to-roll process to the following operations: either forming microstructures on, or transferring microstructures to a surface of the transfer film; and then transferring the microstructures from the transfer film onto a surface of the final substrate. The microstructures are single or multi-layer structures that are made up of: voids in a substantially planar surface, the voids optionally filled or coated with another material; raised areas in a substantially planar surface; or combinations thereof.
    Type: Grant
    Filed: November 23, 2018
    Date of Patent: January 26, 2021
    Assignee: Visual Physics, LLC
    Inventors: Jonathan D. Gosnell, Gregory R. Jordan, Caroline B. Kennedy
  • Patent number: 10889136
    Abstract: A printing target holder includes a platen to hold a printing target portion of a printing target to which printing is applied, and the platen is configured to hold the printing target in a flat state. The platen includes a support face disposed on a top side of the platen and configured to support the printing target portion of the printing target; and an escape portion lower in height than the support face.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: January 12, 2021
    Assignee: Ricoh Company, Ltd.
    Inventors: Satoshi Kunioka, Kazuyoshi Matsumoto, Masaharu Ohtani
  • Patent number: 10891713
    Abstract: Provided are an automated process and system for rendering an image on a conical surface, the process comprising: transforming a two-dimensional (2D) planar representation of an image to a 2D planar representation of the image configured for a conical shape; applying the 2D transformed representation onto a planar template; and manufacturing a conically-shaped object from the planar template on which the 2D transformed representation has been applied.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: January 12, 2021
    Assignee: HUHTAMAKI CUPPRINT LTD
    Inventor: Terry Fox
  • Patent number: 10879104
    Abstract: The pressure sensitive adhesive tape for semiconductor processing of the present invention is a pressure sensitive adhesive tape for semiconductor processing, which, in a step of grinding a back face of a semiconductor wafer having a groove formed on a front face thereof or having a modified region formed therein to singulate the semiconductor wafer into semiconductor chips, is stuck on the front face of the semiconductor wafer and used, the pressure sensitive adhesive tape for semiconductor processing including a base, a buffer layer provided on one face of the base, and a pressure sensitive adhesive layer provided on the other face of the base, and having a ratio (D2/D1) of a thickness (D2) of the buffer layer to a thickness (D1) of the base of 0.7 or less and an indentation depth (X) of the front face on the buffer layer side of 2.5 ?m or less.
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: December 29, 2020
    Assignee: LINTEC CORPORATION
    Inventors: Tomochika Tominaga, Katsuhiko Horigome
  • Patent number: 10864711
    Abstract: A laminating device and method for laminating a decor layer onto a carrier part includes a lower tool with a support region for receiving the carrier part, an upper tool including a pressing surface for exerting a pressing pressure onto the decor layer which is arranged between an upper side of the carrier part and the pressing surface, and at least one movable slider for edge-folding an overhang of the decor layer around an edge of the carrier part by way of pressing the slider against the overhang of the decor layer. A distance between the lower tool and the pressing surface can be enlarged or reduced. The lower tool includes a first membrane, wherein the arrangement of the first membrane and the slider to one another is such that the first membrane is movable onto the slider, for pressing the slider against the overhang of the decor layer.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: December 15, 2020
    Assignee: Faurecia Innenraum Systeme GmbH
    Inventors: (Gerhard) Wilfried Schilles, Sabine Lindemann
  • Patent number: 10852659
    Abstract: A method of producing a foil formed member, includes: preparing a formed member on which a plastic toner image having plasticity is formed; and pressing foil against the formed member at a temperature of 70° C. or lower to form a foil image on the plastic toner image of the formed member, and a method of producing a wiring substrate, includes: preparing a substrate on which a toner image of a toner, in which a volume fraction of particles having a particle diameter of 16 ?m or more is less than 1%, is formed; and forming a foil image on the toner image of the substrate.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: December 1, 2020
    Assignee: FUJI XEROX CO., LTD.
    Inventors: Yasuo Matsumura, Sumiaki Yamasaki, Satoshi Hiraoka, Shiori Chonan, Takashi Imai
  • Patent number: 10804467
    Abstract: A method of manufacturing an organic light-emitting device by using a solution process is provided. The method entails forming a first organic layer between a first electrode and a second electrode, and forming a second organic layer between the first organic layer and the second electrode. The forming of the first organic layer comprises performing a solution process using a composition comprising a first compound, a second compound, and a solvent. The forming of the second organic layer comprises depositing a third compound on the first organic layer. An absolute value of a difference between a relative polarity of the first compound and a relative polarity of the solvent is about 0.03 or less.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: October 13, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Sehun Kim, Jongwon Park, Jaekook Ha, Jaehong Kim, Seunguk Noh
  • Patent number: 10752036
    Abstract: The present application is directed to a transferable film for dye sublimation, the film comprising, in an example implementation, a carrier film; and a dye sublimation-receptive layer comprising a base resin that undergoes crosslinking at elevated temperatures. In an example implementation, the dye sublimation-receptive layer comprises an acrylic copolymer with acrylate reactive groups. Methods of using the transferrable film to create a dye sublimation-receptive surface are also provided, as are substrates having a substantially non-receptive to dye sublimation inks onto which is formed a thermally crosslinked layer to the substrate surface.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: August 25, 2020
    Assignee: Ikonics Corporation
    Inventor: Troy Bergstedt
  • Patent number: 10755606
    Abstract: A multilayered sheet assembly includes a carrier layer on which a sign layer is arranged on a first side via a first adhesive layer. The sheet assembly further includes a strip layer which is arranged via a second adhesive layer in adhesively separable manner on a second side of the carrier layer. A further includes arranging the multilayered sheet assembly on a cutting device, arranging a peripheral cut in the sheet assembly along an outer periphery of a sign, arranging an inner cut in the sheet assembly along a peripheral line of at least one enclosed surface area not forming part of the sign, separating the strip layer with adhesive retention of the at least one enclosed surface area not forming part of the sign, and separating the sign layer from the carrier layer.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: August 25, 2020
    Assignee: W.R.R. HOLDING LEIDEN B.V.
    Inventor: Willem Klaas Rollfs Of Roelofs
  • Patent number: 10723106
    Abstract: A method for manufacturing decorative surfaces includes, in order, the steps of a) inkjet printing an image on a first thermoplastic foil by jetting and UV curing one or more pigmented free radical UV curable inkjet inks on the first thermoplastic foil; b) applying on the inkjet printed image a second thermoplastic foil carrying a layer containing a vinylchloride-vinylacetate-vinylalcohol copolymer with the layer facing the inkjet printed image on the first thermoplastic foil; and c) heat pressing the first and second thermoplastic foils into a decorative laminate; wherein at least one of the first and second thermoplastic foils is transparent, and the one or more pigmented free radical UV curable inkjet inks contain a polymerizable composition having: 30 to 90 wt % of one or more compounds with one ethylenically unsaturated polymerizable group; 10 to 70 wt % of one or more compounds with two ethylenically unsaturated polymerizable groups; and 0 to 10 wt % of one or more compounds with three or more ethylenic
    Type: Grant
    Filed: February 20, 2020
    Date of Patent: July 28, 2020
    Assignees: AGFA NV, UNILIN BVBA
    Inventors: Jens Lenaerts, Nadine Willems, Hubertus Van Aert
  • Patent number: 10625494
    Abstract: A method for manufacturing decorative surfaces includes, in order, the steps of a) inkjet printing an image on a first thermoplastic foil by jetting and UV curing one or more pigmented free radical UV curable inkjet inks on the first thermoplastic foil; b) applying on the inkjet printed image a second thermoplastic foil carrying a layer containing a vinylchloride-vinylacetate-vinylalcohol copolymer with the layer facing the inkjet printed image on the first thermoplastic foil; and c) heat pressing the first and second thermoplastic foils into a decorative laminate; wherein at least one of the first and second thermoplastic foils is transparent, and the one or more pigmented free radical UV curable inkjet inks contain a polymerizable composition having: 30 to 90 wt % of one or more compounds with one ethylenically unsaturated polymerizable group; 10 to 70 wt % of one or more compounds with two ethylenically unsaturated polymerizable groups; and 0 to 10 wt % of one or more compounds with three or more ethylenic
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: April 21, 2020
    Assignees: AGFA NV, UNILIN BVBA
    Inventors: Jens Lenaerts, Nadine Willems, Hubertus Van Aert
  • Patent number: 10618247
    Abstract: The present disclosure relates to transfer tapes, segmented and non-segmented which include at least one graphics layer. The transfer tapes include a removable template layer, a transfer layer which includes a backfill layer, having at least one first graphics layer, and an adhesive layer. Segmented transfer tapes further at least one transferable segment, at least one non-transferable segment in the segmented transfer tape and include at least one kerf. The present disclosure also provides optical assemblies, e.g. micro-optical assemblies, which may be fabricated from the transfer tapes which include at least one graphics layer. The present disclosure also provides methods of forming the transfer tapes and methods of making the micro optical assemblies.
    Type: Grant
    Filed: June 13, 2016
    Date of Patent: April 14, 2020
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Martin B. Wolk, Thomas J. Metzler, Samuel J. Carpenter, Denis Terzic, Mitchell T. Nommensen, Suman K. Patel, Mikhail L. Pekurovsky, Donald G. Peterson, Terry O. Collier
  • Patent number: 10549521
    Abstract: A pad printing machine is arranged for enabling the transfer and application of multiple layers of ink from an ink source both into and onto an ink receiving member. The pad printing machine comprises a depth enhanced ink well (about 0.0015 to about 0.0035 inches deep) for peripherally enclosing an absorbable pattern of ink, a vertically and horizontally displaceable temperature controlled ink transfer print pad, and a temperature controlled printable item support print fixture for supporting an ink receiving printable item member, to enable multiple layers of ink to be simultaneously transferred after pickup by the print pad as one layer, and inversely and simultaneously applied as multiple layers into and onto the ink receiving printable item member on the support print fixture.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: February 4, 2020
    Inventor: Benjamin S. Adner
  • Patent number: 10500883
    Abstract: A thermal transfer sheet and intermediate transfer medium, and a print forming method, capable of forming a thermal transfer image having good transferability when transferring a transfer layer including a receiving layer onto a transfer receiving article, and capable of improving the durability of a print obtained by transferring the transfer layer including the receiving layer, on which the thermal transfer image has been formed, onto a transfer receiving article. The thermal transfer sheet includes a substrate, primer layer and colorant layer, wherein the primer layer contains one or more selected from the group consisting of particles derived from colloidal inorganic particles, polyvinyl alcohol resins, polyvinyl pyrrolidone resins, and polyurethane resins. The intermediate transfer medium includes another substrate, a protective layer, and a receiving layer, wherein the protective layer and the receiving layer are layered in this order on one surface of the another substrate.
    Type: Grant
    Filed: February 23, 2017
    Date of Patent: December 10, 2019
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Shinya Yoda, Emi Matsuba
  • Patent number: 10471754
    Abstract: Provided is a thermal transfer image receiving sheet that is thin, resistant to curling, has favorable image quality and has opacity. A thermal transfer image receiving sheet of the present invention at least comprises an ink receiving layer, a first support, an adhesive layer and a second support laminated in that order, wherein the first support and the second support are provided with a foamed layer and a non-foamed skin layer laminated on both sides of the foamed layer.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: November 12, 2019
    Assignee: Tomoegawa Co., Ltd.
    Inventors: Hideaki Takahashi, Shigeki Asai
  • Patent number: 10460973
    Abstract: The pressure sensitive adhesive tape for semiconductor processing of the present invention is a pressure sensitive adhesive tape for semiconductor processing, which, in a step of grinding a back face of a semiconductor wafer having a groove formed on a front face thereof or having a modified region formed therein to singulate the semiconductor wafer into semiconductor chips, is stuck on the front face of the semiconductor wafer and used, the pressure sensitive adhesive tape for semiconductor processing including a base, a buffer layer provided on one face of the base, and a pressure sensitive adhesive layer provided on the other face of the base, and having a ratio (D2/D1) of a thickness (D2) of the buffer layer to a thickness (D1) of the base of 0.7 or less and an indentation depth (X) of the front face on the buffer layer side of 2.5 ?m or less.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: October 29, 2019
    Assignee: LINTEC CORPORATION
    Inventors: Tomochika Tominaga, Katsuhiko Horigome
  • Patent number: 10427357
    Abstract: A system for manufacturing a display unit including: a transport unit which transports an optical film comprising a polarizing film, an adhesive layer, and a release film, by a predetermined transport length and stops the transport of the optical film; a cutting unit which cuts the optical film in a width direction at a predetermined cutting position without cutting the release film; a separating unit which separates the release film from the polarizing film at the cutting position; and an attaching unit which attaches the polarizing film, from which the release film is separated, to a panel. The transport unit includes a horizontal roll satisfying the following conditional expression: I*n<H<I*(n+1) in which I is the predetermined transport length, n is an integer equal to or greater than 0, and H is a horizontal distance between a rotation center of the horizontal roll and the cutting position.
    Type: Grant
    Filed: October 16, 2017
    Date of Patent: October 1, 2019
    Assignee: LG CHEM, LTD.
    Inventors: Beom Seok Lee, Suk Jae Lee, San Park, Hang Suk Choi, Eung Jin Jang, Bong Su Jeung, Jea Han Ryoo
  • Patent number: 10405436
    Abstract: A bonding method of a flexible display module is provided. The flexible display module includes a flexible display panel having a first bonding area and an integrated driving circuit having a second bonding area. The bonding method includes: attaching, through a colloid, a transfer plate to a surface of the flexible display panel; solidifying the colloid facing the first bonding area to form a fixed portion; flattening the transfer plate to flatten the first bonding area through the fixed portion; aligning the second bonding area with the first bonding area pre-laminating the first bonding area and the second bonding area at a first temperature; breaking the fixed portion, and separating the flexible display panel and the transfer plate; flattening the flexible display panel; laminating the first bonding area and the second bonding area at a second temperature to form the flexible display module.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: September 3, 2019
    Assignee: SHENZHEN ROYOLE TECHNOLOGIES CO., LTD.
    Inventor: Jianlei Zhu
  • Patent number: 10391518
    Abstract: A method of manufacturing a transparent pattern printed steel plate includes forming a printed paint film layer by jetting transparent ink onto at least one surface of a steel plate, and curing the printed paint film layer with ultraviolet light to form a cured printed paint film layer. Further, a method of manufacturing a transparent pattern printed steel plate includes preparing a steel plate having a color painted film layer formed on at least one surface thereof, forming a printed paint film layer by jetting transparent ink onto the color painted film layer, and curing the printed paint film layer to form a cured printed paint film layer.
    Type: Grant
    Filed: August 19, 2015
    Date of Patent: August 27, 2019
    Assignee: POSCO
    Inventors: Jin-Tae Kim, Jong-Sang Kim, Bong-Woo Ha, Yang-Ho Choi, Jung-Hwan Lee, Ha-Na Choi, Jong-Kook Kim
  • Patent number: 10369811
    Abstract: Disclosed in the present invention is a printing method for apparel fabric, comprising the steps of: (1) thermal compounding: stacking and placing the apparel fabric and thermal adhesive printing paper into a first heating device set to a first preset temperature, wherein a surface of the thermal adhesive printing paper is provided with a thermal adhesive, and the thermal adhesive is heated to compound the apparel fabric and the thermal adhesive printing paper together to form a compounded paper/apparel fabric roll; (2) printing: loading the compounded paper/apparel fabric roll onto a printer, and printing graphics and text on the apparel fabric of the compounded paper/apparel fabric roll to form a printed cloth; (3) thermal fixation: fixing the color of the printed cloth through a second heating device set to a second preset temperature for a preset time.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: August 6, 2019
    Assignee: TSINGHUA (SUZHOU) TECHNICAL RESEARCH CENTER
    Inventor: Shan Chang
  • Patent number: 10361228
    Abstract: A technique comprising: securing a device substrate (8) to a carrier (1) using one or more adhesive elements (6); forming electronic elements (10) on the device substrate with the device substrate thus secured to the carrier; and thereafter reducing the adhesion strength of at least one of the one or more adhesive elements to facilitate the release of the substrate from the carrier.
    Type: Grant
    Filed: October 13, 2015
    Date of Patent: July 23, 2019
    Assignee: FLEXENABLE LIMITED
    Inventor: James Denziel Watts
  • Patent number: 10308056
    Abstract: A method for manufacturing decorative surfaces includes the steps of a) inkjet printing an image on a first thermoplastic foil using a pigmented UV curable inkjet ink; b) applying a second thermoplastic foil on the inkjet printed image; and c) heat pressing the first and second thermoplastic foils into a decorative laminate; wherein the pigmented UV curable inkjet ink contains a polymerizable composition having 30 to 70 wt % of monofunctional polymerizable compounds and 30 to 70 wt % of polyfunctional polymerizable compounds, the weight percentage wt % is based on the total weight of the polymerizable composition; and at least one of the first and second thermoplastic foils is a transparent foil.
    Type: Grant
    Filed: May 11, 2016
    Date of Patent: June 4, 2019
    Assignees: AGFA NV, UNILIN BVBA
    Inventors: Roel De Mondt, Nadine Willems
  • Patent number: 10252503
    Abstract: A method of transfer lamination involves applying a release coating to a first side of a film, applying an application layer to the first side of the film over the release coating, bonding the first side of the film to a substrate, applying a second coating to a second side of the film while the first side of the film is bonded to the substrate, and removing the film from the substrate leaving the application layer deposited on the substrate and the second coating on the second side of the film.
    Type: Grant
    Filed: July 8, 2016
    Date of Patent: April 9, 2019
    Assignee: HAZEN PAPER COMPANY
    Inventors: John Hazen, Robert Hazen, Larry Hoague
  • Patent number: 10252504
    Abstract: A method for producing a smooth coating on a substrate includes applying a release coating to a first side of a film, applying an application layer to said first side of said film over said release coating, bonding said first side of said film to a first substrate, applying a printable coating to a second side of said film while said first side of said film is bonded to said first substrate, and removing said film from said first substrate leaving said application layer deposited on said first substrate and said printable coating on said second side of said film.
    Type: Grant
    Filed: July 8, 2016
    Date of Patent: April 9, 2019
    Assignee: HAZEN PAPER COMPANY
    Inventors: John Hazen, Robert Hazen, Larry Hoague
  • Patent number: 10225931
    Abstract: According to an embodiment of the present invention, a substrate for a printed circuit board, the substrate including a resin film and a metal layer deposited on at least one surface of the resin film, includes a modified layer on the surface of the resin film on which the metal layer is deposited, the modified layer having a composition different from another portion, in which the modified layer contains a metal, a metal ion, or a metal compound different from a main metal of the metal layer. The content of a metal element of the metal, the metal ion, or the metal compound on a surface of the modified layer is preferably 0.2 atomic % or more and 10 atomic % or less.
    Type: Grant
    Filed: June 1, 2016
    Date of Patent: March 5, 2019
    Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Kayo Hashizume, Yoshio Oka, Takashi Kasuga, Jinjoo Park, Hiroshi Ueda
  • Patent number: 10220600
    Abstract: Transfer films comprising a carrier film, a sacrificial template layer deposed on the carrier film and comprising reentrant forming template features, and a thermally stable backfill layer having a first surface conforming to the reentrant forming template features and forming reentrant features and an opposing planar second surface; and methods of making transfer films are disclosed.
    Type: Grant
    Filed: January 9, 2015
    Date of Patent: March 5, 2019
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Martin B. Wolk, Olester Benson, Jr., Terry O. Collier, Michael Benton Free, Adam J. Meuler, Justin P. Meyer, Evan L. Schwartz
  • Patent number: 10214310
    Abstract: Described is a device (1) for applying self-adhesive labels (101) on moving containers (2), comprising means (28) for feeding a web (103) along a movement path, the labels (101) being arranged on the web (103) to bring one label (101) at a time to a detaching unit (12). The detaching unit (12) is operatively associated with the labels (101) for detaching them from the web (103) in such a way as to apply them to a container (2). The device (1) also comprises a unit for controlling the feed means (28) designed for moving the web (103) along an outward direction (19) to bring a respective label (101) to the detaching unit (12). In addition, after a label (101) has been detached, the control unit is designed to move the web (103) in a return direction (20), opposite to the outward direction, by a predetermined distance in such a way as to increase the movement space between the detaching unit (12) and the next label (101).
    Type: Grant
    Filed: February 27, 2015
    Date of Patent: February 26, 2019
    Assignee: MAKRO LABELLING S.R.L.
    Inventor: Simone Marcantoni
  • Patent number: 10212821
    Abstract: A method of fabricating a flexible printed circuit includes providing a carrying support comprised of a rigid support base and a release layer adhered in contact with each other, forming a flexible substrate on the carrying support, the formed flexible substrate being adhered in contact with the release layer, applying one or more processing step on the flexible substrate while the flexible substrate is supported by the carrying support, and peeling the flexible substrate with an electric circuit formed thereon from the release layer while the release layer remains adhered in contact with the support base.
    Type: Grant
    Filed: November 30, 2016
    Date of Patent: February 19, 2019
    Assignee: Taimide Technology Incorporation
    Inventors: Yen-Po Huang, Tsung-Hsien Tsai
  • Patent number: 10191195
    Abstract: There is provided a thin polarizing plate with a pressure-sensitive adhesive layer hardly warping. A polarizing plate with a pressure-sensitive adhesive layer of the present invention includes: first pressure-sensitive adhesive layer, a protective film, and a polarizing film in the stated order, wherein: the polarizing film has a thickness of 13 ?m or less; a thickness ratio between the protective film and the polarizing film (thickness of the protective film/thickness of the polarizing film) is from 1.5 to 9.0; and a creep amount when a load of 500 g is applied to the first pressure-sensitive adhesive layer for 1 hour is from 20 ?m/h to 300 ?m/h.
    Type: Grant
    Filed: September 15, 2015
    Date of Patent: January 29, 2019
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shinsuke Akizuki, Yuusuke Toyama, Takaaki Ishii
  • Patent number: 10173845
    Abstract: Apparatus and methods for fulfillment of patient prescription orders by adapting a standard or stock container pre-filled with medication or the like for use as a patient-specific container through precise application of patient-specific information to the pre-filled container. Precise placement of the patient-specific information to the pre-filled container enables pharmacy management to fully utilize valuable information provided with the pre-filled container, thereby improving the quality of service to the patient while making the process of prescription order fulfillment more efficient. In general, preferred embodiments comprise control apparatus and information-application apparatus. In embodiments, the information-application apparatus is adapted to place a patient-specific label on the container. Preferred forms of the information-application apparatus include a label printer and a positioner. The preferred printer applies patient-specific information on a label.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: January 8, 2019
    Assignee: ARxIUM, Inc.
    Inventors: Jacob A. Dent, Brian Gorman, Mark Bidus
  • Patent number: 10138015
    Abstract: A process for using a first labeling system that is a constituent of a block-form first container-handling includes, before switching between said labeling and non-labeling modes of a labeling unit thereof, providing a control signal to a control unit that controls the labeling machine, the control signal being indicative of a gap in container flow. the control signal occurs before the gap in container flow reaches a container inlet of the first labeling system.
    Type: Grant
    Filed: October 22, 2014
    Date of Patent: November 27, 2018
    Assignee: KHS GmbH
    Inventors: Lutz Deckert, Klaus Krämer
  • Patent number: 10143083
    Abstract: A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a metal layer formed on at least one surface side of the base film. In the substrate for a printed circuit board, a plurality of fine particles are disposed between the base film and the metal layer, and the fine particles are formed of a metal the same as a main metal of the metal layer or formed of a metal compound of the main metal. The fine particles preferably have an average particle size of 0.1 nm or more and 20 nm or less. The fine particles are preferably formed of a metal oxide or a metal hydroxide. The fine particles are preferably present between the base film and the metal layer so as to form a layer. The metal layer preferably includes a metal grain layer formed by firing metal nanoparticles.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: November 27, 2018
    Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Motohiko Sugiura, Takashi Kasuga, Yoshio Oka, Shigeaki Uemura, Jinjoo Park, Hiroshi Ueda, Kousuke Miura
  • Patent number: 10131171
    Abstract: A transfer material is provided that can be more firmly attached to an image substrate without deteriorating printing characteristics concerning image bleeding, printing resolution, and the like. An ink receiving layer is of a gap-absorbing type. An adhesive layer includes discretely disposed adhesive pieces provided on a surface of the ink receiving layer so as to leave exposed portions on the surface of the ink receiving layer.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: November 20, 2018
    Assignee: Canon Finetech Nisca Inc.
    Inventors: Yusuke Sumikawa, Takahiro Tsutsui, Hiromitsu Hirabayashi
  • Patent number: 10121935
    Abstract: A method for fabrication of three-dimensional nanostructures on top of the surface of a first solid state material is disclosed, which includes steps of (i) deposition of a layer of a second solid state material forming a stable layer-like coverage of the surface, (ii) the subsequent deposition of a third solid state material, having a stronger binding energy with the first solid state material than the second solid state material, (iii) wherein the third solid state material replaces the second solid state material forming an interface with the first material and thus reduces the energy of the system, and (iv) where the resulting excess second solid state material forms three-dimensional nanostructures. The structure can be covered with another (fourth) solid state material, which eventually can be the same as the first material or a different one, and the three dimensional nanostructures form capped quantum dots or quantum wires.
    Type: Grant
    Filed: January 30, 2013
    Date of Patent: November 6, 2018
    Assignee: VI SYSTEMS GMBH
    Inventors: Nikolay Ledentsov, Vitaly Shchukin
  • Patent number: 10099448
    Abstract: A slide fastener reinforcement tape is provided that exhibits high performance launderability and peel strength between a reinforcement tape and a fastener tape, in environments harsher than those set forth in the prior art. Specifically, provided is a slide fastener reinforcement tape formed by laminating an adhesive layer on the back surface of a transparent elastomer film, wherein the slide fastener reinforcement tape is characterized in that the adhesive layer is a polyester-based hot-melt adhesive, a two-part type curable adhesive or a polyamide-based hot-melt adhesive, and the melting point of the adhesive layer is higher than 120° C. and no more than 160° C. and the melt viscosity at 200° C. is higher than 2000 poise and no more than 5500 poise.
    Type: Grant
    Filed: June 17, 2013
    Date of Patent: October 16, 2018
    Assignee: YKK Corporation
    Inventors: Takayuki Ogyu, Shintaro Ohsugi, Kumiko Oyama
  • Patent number: 10059461
    Abstract: An aircraft marking system for an external surface of an aircraft comprises at least one of a photoluminescent material that provides visibility in darkness, a reflective material that provides visibility when illuminated by a light source, and color that provides visibility in daylight. The marking system is applied to the wings, especially wing tips and other areas of the aircraft to reduce the risk of damage from impacts when the aircraft is on the ground and/or to indicate areas for accessing the interior of the aircraft in an emergency.
    Type: Grant
    Filed: October 13, 2015
    Date of Patent: August 28, 2018
    Assignee: SAF-T-GLO LIMITED
    Inventors: Sean Patrick O'Kell, Andrew Jon Hallett
  • Patent number: 10035721
    Abstract: Provided are: a production method for a patterned phosphorescent body capable of producing a patterned phosphorescent body with excellent light emission (phosphorescent) performance through simple and easy production processes; a patterned phosphorescent body, and an evacuation guide sign. A mixture obtained by mixing at least a phosphorescent material and a glass material is filled in a mold and the mixture is press-molded so as to provide a planar part (10), thereby to create a molded body. The molded body is baked and slowly cooled, and then transfer paper of a water transfer type is attached to a surface of the planar part (10) of the baked molded body (4) and re-baking is performed at a temperature lower than a baking temperature of the molded body to impress a pattern (11) on the transfer paper.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: July 31, 2018
    Assignee: CODOMO ENERGY CO., LTD.
    Inventor: Yasunori Iwamoto