Abstract: A flexible window stack structure includes a substrate, a first hard coating layer formed on a surface of the substrate and a second hard coating layer formed on an opposite surface of the substrate. The first hard coating layer has a curing contraction greater than that of the second hard coating layer, and the second hard coating layer is disposed at an elongated side when the window stack structure is folded. Cracks may be prevented by a curl property of the first hard coating layer when being bent.

Abstract: Disclosed is a method for manufacturing a semiconductor device which includes: a semiconductor chip; a substrate and/or another semiconductor chip; and an adhesive layer interposed therebetween. This method comprises the steps of: heating and pressuring a laminate having: the semiconductor chip; the substrate; the another semiconductor chip or a semiconductor wafer; and the adhesive layer by interposing the laminate with pressing members for temporary press-bonding to thereby temporarily press-bond the substrate and the another semiconductor chip or the semiconductor wafer to the semiconductor chip; and heating and pressuring the laminate by interposing the laminate with pressing members for main press-bonding, which are separately prepared from the pressing members for temporary press-bonding, to thereby electrically connect a connection portion of the semiconductor chip and a connection portion of the substrate or the another semiconductor chip.

Abstract: A scrap collection assembly for a tape lamination head that applies a plurality of composite tape segments includes a crack-off assembly with a scrap crack-off redirect roller configured to engage one or more composite tape segments and one or more scrap portions; a secondary crack-off roller configured to engage one or more composite tape segments and one or more scrap portions; a pivot that connects the crack-off assembly to the tape lamination head, wherein the secondary crack-off roller selectively moves about the pivot to change a direction of composite tape movement; and a conveyor that receives the scrap portion(s) from the secondary crack-off roller.

Abstract: A cover, a display panel, and a cover manufacturing method are provided. The cover includes a glass cover, and the glass cover includes a boring area. An encapsulation layer is disposed on a side of the glass cover, and a buffer layer is disposed on the side of the glass cover away from the encapsulation layer. The buffer layer is disposed on the glass cover corresponding to the boring area, and the buffer layer is configured to buffer stress generated in the encapsulation layer when a hole is drilled in the boring area.

Abstract: A reel-to-reel method of creating pads on a layer of metal sheet or circuitry pattern on the fly. The method includes placing a sintering paste in the intended spots for pads followed by irradiation of the sintering paste by a laser.

Abstract: The present invention relates to a semiconductor device including: a first semiconductor element formed on an adherend; and an adhesive film for embedding the first semiconductor element, wherein the adhesive film satisfies a predetermined ratio between a melt viscosity and a weight loss ratio at a high temperature.

Abstract: The present invention relates to a heat-resistant resin and a method of preparing the same. More particularly, the present invention relates to a heat-resistant resin including 100 parts by weight of a styrene based resin and 0.5 to 5 parts by weight of silica having a contact angle of 10 to 60° and an average particle diameter of 0.1 nm or more and 100 nm or less, a method of preparing the same and a heat-resistant resin composition including the same. In accordance with the present invention, provided are a heat-resistant resin having a low moisture content and a small content of fine particles while having heat resistance equal to or higher than conventional resins and, accordingly superior cohesion, a method of preparing the same, and a heat-resistant resin composition including the same.

Abstract: In a method and a device for recycling a thermoplastic fibre-reinforced composite material, which is in at least one deposition layer in a component (1), it is suggested that said fibre-reinforced composite material should be pulled off from the remaining component (1), in the direction of a main fibre direction, in at least one pull-off layer (10) comprising fibres and matrix material.

Abstract: A method for milling flex foil includes providing a web of flex foil including a substrate; a first conductive layer arranged on one surface of the substrate; a second conductive layer arranged on an opposite surface of the substrate; a first insulating layer arranged adjacent to the first conductive layer; and a second insulating layer arranged adjacent to the second conductive layer. The method includes dry milling one side of the web using a first cliché pattern including raised portions and non-raised portions to selectively remove at least one of the first conductive layer and the first insulating layer. The method includes dry milling an opposite side of the web using a second cliché pattern including upper raised portions, lower raised portions and non-raised portions to selectively remove the second insulating layer.

Abstract: Disclosed is a method for manufacturing a semiconductor device which includes: a semiconductor chip; a substrate and/or another semiconductor chip; and an adhesive layer interposed therebetween. This method comprises the steps of: heating and pressuring a laminate having: the semiconductor chip; the substrate; the another semiconductor chip or a semiconductor wafer; and the adhesive layer by interposing the laminate with pressing members for temporary press-bonding to thereby temporarily press-bond the substrate and the another semiconductor chip or the semiconductor wafer to the semiconductor chip; and heating and pressuring the laminate by interposing the laminate with pressing members for main press-bonding, which are separately prepared from the pressing members for temporary press-bonding, to thereby electrically connect a connection portion of the semiconductor chip and a connection portion of the substrate or the another semiconductor chip.

Abstract: A signal collection assembly and a power battery module are provided. The signal collection assembly includes: a substrate; a signal collection line including a sheet-like metal conductive element disposed on the substrate; a signal collection member disposed on the substrate and connected with the signal collection line; and a signal collection terminal disposed on the substrate. The signal collection terminal includes a first terminal connected with the signal collection line and a second terminal connected with a power connection member of the power battery module.

Abstract: The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.

Abstract: The invention relates to a method for partially coating a surface of an object, comprising the following steps: (a) optional hydrophobization of the surface of the object; (b) partial application of (b1) a liquid and subsequent application of a powderous or granular substance or (b2) a solution or suspension of said powderous or granular substance in a liquid; (c) drying the surface to form spatially-delimited salt or powder crusts; (d) coating the surface with at least one layer of a metal or a metal compound; and (e) removing the salt or powder crusts that have been produced. The invention also relates to products that have been produced according to the claimed method.

Abstract: An adhesive patch assembly and method for making same. The assembly can include an adhesive patch and a release liner. The patch can include a backing and a skin-contact adhesive. The release liner can further include a first portion and a second portion separated by a hinge. The first portion can be positioned to overlay the backing of the patch when the release liner is folded upon the hinge, and the second portion can be positioned to underlie the skin-contact adhesive of the patch. The method can include positioning the patch on the release liner, such that patch is located on one of the first portion and the second portion of the release liner; and folding the release liner about to locate the patch between the first portion and the second portion of the release liner.

Abstract: A temporary package substrate includes a first copper layer, a second copper layer, a third copper layer, a first plating copper layer, a second plating copper layer, a third plating copper layer, a first dielectric layer, a second dielectric layer and two circuit structures. The second copper layer is located between the first and the third copper layers, and edges of the second copper layer are retracted a distance compared to edges of the first copper layer and edges of the third copper layer. The first and the second dielectric layers completely encapsulate the edges of the second copper layer and the edges of the second plating copper layer. Each of the circuit structures includes at least two patterned circuit layers, an insulation layer located between the patterned circuit layers, and a plurality of conductive through hole structures penetrating the insulation layer and electrically connected with the patterned circuit layers.

Abstract: A process for the production of at least one analytical device is disclosed. The analytical device comprises at least one capillary element. The process comprises providing at least one carrier layer; providing at least one spacer layer; applying the spacer layer on top of the carrier layer; providing at least one cover layer; and applying the cover layer on top of the spacer layer. The process further comprises at least one cutting step. At least one capillary channel of the capillary element is cut out from the spacer layer. The cutting step is performed by using at least two cutting tools. The cutting tools complement one another to form a contour of the capillary channel.

Abstract: A system and method are provided for implementing relatively low temperature joining processes, including displacement/vibration welding techniques and/or heat staking techniques, in a process of building up laminate layers to form and/or manufacture three-dimensional objects, parts and components in additive material (AM) manufacturing systems. A multi-stage 3D object forming scheme is described involving steps of laminate cutting (with lasers or other cutting devices); laminate transport between processing stations (including using one or more of conveyors, robotic pick and place devices and the like); laminate stacking, clamping and adhering through comparatively low temperature welding or other mechanical joining (including displacement/vibration welding or heat staking); and mechanical surface finishing (via CNC machining or other comparable process).

Abstract: A printable magnetic label tape including a magnetic first layer and a printable second layer. The printable magnetic label tape includes spaced apart transverse oriented lines of weakness along the length of the label tape. A printable magnetic label, and methods of making.

Abstract: An adhesive composite dressing useful for applying an active ingredient to a treated skin site, as well as methods of manufacture and use of such dressings. In one embodiment, an adhesive composite dressing comprising an anchor member, a target member, and a folding member, where the anchor member comprises a first skin-contact adhesive, the target member comprises an opening adapted to enable skin treatment, the folding member comprises a drug reservoir, and where the folding member is attached to the anchor portion through a hinge defined by a line of attachment that is not contiguous with an edge of the anchor member.

Abstract: Consistent with an example embodiment, there is a method for preparing integrated circuit (IC) device die from a wafer substrate having a front-side with active devices and a back-side. The method comprises pre-grinding the backside of a wafer substrate to a thickness. The front-side of the wafer is mounted onto a protective foil. A laser is applied to the backside of the wafer, at first focus depth to define a secondary modification zone in saw lanes. To the backside of the wafer, a second laser process is applied, at a second focus depth shallower than that of the first focus depth, in the saw lanes to define a main modification zone, the secondary modification defined at a pre-determined location within active device boundaries, the active device boundaries defining an active device area. The backside of the wafer is ground down to a depth so as to remove the main modification zone. The IC device die are separated from one another by stretching the protective foil.

Abstract: An image forming apparatus includes: an image forming section configured to form a toner image on a sheet having a paste component; and an end pressing section provided on an upstream side of the image forming section in a sheet conveyance direction, and configured to exert a pressure on an end portion of the sheet while moving from a center toward an end of the sheet in a sheet width direction orthogonal to the sheet conveyance direction.

Abstract: The present invention relates to a film for semiconductor device production, which includes: a separator; and a plurality of adhesive layer-attached dicing tapes each including a dicing tape and an adhesive layer laminated on the dicing tape, which are laminated on the separator at a predetermined interval in such a manner that the adhesive layer attaches to the separator, in which the separator has a cut formed along the outer periphery of the dicing tape, and the depth of the cut is at most ? of the thickness of the separator.

Abstract: A method of manufacturing a package substrate is provided. A first copper layer and a first plating copper layer formed thereon, a first dielectric layer, a second copper layer and a second plating copper layer formed thereon, a second dielectric layer, a third copper layer and a third plating copper layer formed thereon are provided and laminated, so that the first and the second dielectric layers encapsulate edges of the second copper layer and the second plating copper layer to form a temporary carrier. Two circuit structures are formed on two opposite surfaces of the temporary carrier. The temporary carrier and the circuit structures are cut to expose the edges of the second copper layer and the second plating copper layer, and separated along the exposed edges of the second copper layer and the second plating copper layer to form two package substrates independent from each other.

Abstract: A method for continuously manufacturing an optical display panel includes feeding a carrier film 12 on which an optical film 13 is placed with a pressure-sensitive adhesive interposed therebetween, peeling off the optical film 13 from the carrier film 12 by using a folding-back part 40a to inwardly fold back the carrier film 12 being fed, taking up the carrier film 12 from which the optical film 13 is peeled off, feeding an optical cell P and bonding the optical film 13, which is peeled off from the carrier film 12, to the optical cell P with the pressure-sensitive adhesive interposed therebetween, and reducing a difference between a first tension on the carrier film 12 located upstream of the folding-back part 40a and a second tension on the carrier film 12 located downstream of the folding-back part while reducing one of the first and second tensions before the bonding step.

Abstract: The test strip stabilizes skin prior to incision by a lancet tip. The innovative test strip includes a pair of skin contacting tabs that apply pressure linearly to the skin to stretch the skin taut. Beneficially an incision by a lancet tip to an accurate depth can be formed on the taut skin. Moreover, pressure from the tabs is applied linearly to the skin which results in a higher ratio of pressure to surface that can be reached as compared to applying pressure laminarily to skin. Some manufacturing techniques of the skin contacting tabs include cutting or stamping through all of the layers and test area of the test strip to form these tabs. These techniques increase the manufacturing efficiency and cost savings associated with test strips and integrated lancet testing devices. Contamination from other sampling events is eliminated since the test strips are disposed of after each use.

Abstract: An apparatus for removal of the liner of a self-adhesive balancing weight is disclosed. A stripper wheel or stripper belt is rotated in close proximity over the surface of a balancing weight, and interacting with the liner and pulling the liner off from the balancing weight by means of a plurality of teeth. The speed of the stripper wheel or stripper belt is slightly higher than the speed of motion of the balancing weight.

Abstract: A method of making a pad of labels comprises: printing display information on a top surface of a substrate; affixing a first layer of lamination material to a bottom surface of the substrate; affixing a second layer of lamination material to the top surface of the substrate, the second layer of lamination material having a release coating applied to a top surface thereof; applying an adhesive strip to a bottom surface of the first layer of lamination material, the adhesive strip being covered by a liner material; cutting the substrate having first and second layers of lamination material affixed into at least one label; removing the liner material to expose the adhesive strip after cutting the substrate into at least one label; and arranging the labels into a pad of labels.

Abstract: Methods for forming backside illuminated (BSI) image sensors having metal redistribution layers (RDL) and solder bumps for high performance connection to external circuitry are provided. In one embodiment, a BSI image sensor with RDL and solder bumps may be formed using a temporary carrier during manufacture that is removed prior to completion of the BSI image sensor. In another embodiment, a BSI image sensor with RDL and solder bumps may be formed using a permanent carrier during manufacture that partially remains in the completed BSI image sensor. A BSI image sensor may be formed before formation of a redistribution layer on the front side of the BSI image sensor. A redistribution layer may, alternatively, be formed on the front side of an image wafer before formation of BSI components such as microlenses and color filters on the back side of the image wafer.

Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a flexible substrate divided into first, second, and third regions, a first rigid substrate in the first region of the flexible substrate, and a second rigid substrate in the third region of the flexible substrate. The first and second substrates expose the second region of the flexible substrate.

Abstract: While a transporting unit transports an adhesive sheet attached to a separator larger than the adhesive sheet, a chuck member on a tip of a swing arm of a separating unit holds a portion of the separator protruding from an end of the adhesive sheet. Under such a condition, the chuck member moves in a direction crossing a transportation direction of the adhesive sheet, and the transporting unit moves in the transportation direction in synchronization with the chuck member while folding back the separator at an end of a supporting plate contacting the separator as a starting point. Accordingly, the separator is separated from the adhesive sheet. The transporting unit transports while holding the adhesive sheet with the separator separated therefrom to join the adhesive sheet to a workpiece.

Abstract: The present invention relates to a method of manufacturing a web of a plurality of conductive structures which may be used for example to produce an antenna, electronic circuit, photovoltaic module or the like. The method involved simultaneously patterning at least one pattern in a conductive layer using a plurality of registration marks. The registration marks serve to align and guide the creation of the plurality of conductive structures. Optical brighteners may also be utilized within the adhesive layer and the registration marks of the present invention in order to detect the location where conductive structures are to be placed.

Abstract: A method for processing a workpiece including: a supporting plate preparing step of preparing a supporting plate having, on a top surface side of the supporting plate, a recessed portion configured to house a projecting portion provided in a device region of the workpiece; a positioning step of mounting the workpiece on the supporting plate such that the recessed portion of the supporting plate and the device region of the workpiece correspond to each other; a bonding step of forming a welded region in which the workpiece is welded to the supporting plate by irradiating a peripheral surplus region of the workpiece mounted on the supporting plate with a laser beam, whereby the workpiece is fixed on the supporting plate; and a processing step of processing the workpiece after performing the bonding step.

Abstract: By preparing a polyimide film with a face at the support side and subjected to a surface treatment; subjecting at least one of a face of the support and the face of the polyimide film which are opposite to each other to a patterning treatment using a coupling agent to form a satisfactorily bondable part and an easily releasable part which differ in adhesion/peel strength; subsequently, superposing the support and the polyimide film to be subjected to a pressurizing/heating treatment and to be bonded to each other, subjecting the surface of the polyimide film to an organic alkali treatment; and then, applying a polyamic acid solution free from a slip agent ingredient, drying the coating film and imidizing the film, a layered product having a structure of at least three layers in which at least one layer contains a slip agent material and both surface layers have no slip agent material is produced.

Abstract: Provided is a process for producing an adhesive sheet having a singulated adhesive layer (b) on a carrier film (a), comprising the following steps in the order mentioned: Step A: cutting an adhesive film having a carrier film (a), an adhesive layer (b), and a cover film (c) in the order mentioned locally only at the adhesive layer (b) and the cover film (c) by means of local half-cutting; Step B: peeling only the cover film (c) at unwanted parts of the adhesive film; Step C: applying adhesive tape to the side of the cover film (c) of the adhesive film; and Step D: peeling the adhesive layer (b) at unwanted parts and the cover film (c) at desired parts of the adhesive film together with the adhesive tape. Also provided are a process for producing an adhesive sheet comprising a singulated adhesive disposed at a specific position, and equipment for producing an adhesive sheet.

Abstract: An adhesive film or films are applied to a surface of an object by providing a tape with an adhesive on the rear surface and a release characteristic on the front surface. The tape has two or three parallel spaced filaments in the adhesive which are used to tear through the film or film to form butting edges of the films and to form a strip of one of the films which is attached to the object as a visible stripe thereon either as a stand-alone stripe or as a protective cover for the butting edges.

Abstract: A nasal dilator comprises a laminate of vertically stacked layers each comprising at least one member or component. The layers form a unitary, or single body, truss. The truss features horizontal regions adapted to engage outer wall tissues of first and second nasal passages and to traverse the bridge of a nose therebetween. The dilator acts to stabilize and/or expand the nasal outer wall tissues and prevent said tissues from drawing inward during breathing. Dilator members, including components thereof, are configured to dimensional criteria suitable to engage and provide effective dilation to nasal passages, that create lateral and longitudinal registration of dilator members or components during manufacture, and that facilitate manufacture with minimal material waste. Methods of manufacture further include progressive steps that fabricate and assemble components into finished devices, including user assembly thereof.

Abstract: Multi-layer printed wiring boards may be produced by: (1) conveying an adhesive sheet from an adhesive sheet roll wherein an adhesive sheet having a prepreg formed on a support film is wound in a roll and placing the adhesive sheet such that a prepreg surface contacts one or both of the surfaces of a circuit board, (2) partially adhering the adhesive sheet to the circuit board by heating and pressing a part of the adhesive sheet from the support film side, and cutting the adhesive sheet according to the size of the circuit board with a cutter, (3) heating and pressing the temporarily fitted adhesive sheet under reduced pressure to laminate the adhesive sheet on the circuit board, (4) forming an insulating layer by thermally curing the prepreg, and (5) detaching the support film after the thermal curing step.

Abstract: In some embodiments, a method of manufacturing electronic devices including providing a carrier substrate having a first side, a second side, and a first adhesive at the first side; providing a first flexible substrate; and bonding the first flexible substrate to the first side of the carrier substrate. The first adhesive bonds the first flexible substrate to the first side of the carrier substrate. The carrier substrate comprises a mechanism configured to compensate for a deformation of the carrier substrate. Other embodiments are disclosed.

Abstract: A method produces adhesive tapes which are adhesive at least on one side, wherein an adhesive tape web, in which the at least one adhesive side is covered by a first liner, is guided into a cutting device in which a total of N individual adhesive tape strips located next to one another are produced in the machine direction from the adhesive tape web. Every other adhesive tape strip is removed from the first liner and is applied to a second liner in each case having a spacing a between the individual adhesive tape strips. The liners are cut between the adhesive tape strips located on the first liner and on the second liner, and the individual adhesive tapes, together with the liner strips, are wound up in a total of X rolls in a form of an Archimedean spiral.

Abstract: A substrate bonding and debonding method includes the steps of: providing a substrate; forming a first silicone glue layer on a peel-off region of the substrate and a second silicone glue layer on a peripheral region of the substrate, in which the first and second silicone glue layers contain the same silicone main agent and silicone curing agent in a different ratio; adhering an opposite substrate to the first and second silicone glue layers; curing the first and second silicone glue layers to bond the substrate to the opposite substrate; and separating a portion of the substrate from the opposite substrate.

Abstract: The present invention relates to a film for semiconductor device production, which includes: a separator; and a plurality of adhesive layer-attached dicing tapes each including a dicing tape and an adhesive layer laminated on the dicing tape, which are laminated on the separator at a predetermined interval in such a manner that the adhesive layer attaches to the separator, in which the separator has a cut formed along the outer periphery of the dicing tape, and the depth of the cut is at most ? of the thickness of the separator.

Abstract: A manufacturing method of an organic light emitting diode (“OLED”) display includes: forming a contact pattern on a panel region of a surface of a board glass, where the board glass includes the panel region, and a peripheral area which surrounds the panel region; contacting the paper glass with a surface of the contact pattern corresponding to the panel region and the surface of the board glass corresponding to the peripheral area; adhering the surface of the board glass corresponding to the peripheral area to a surface of the paper glass; forming an organic light emitting element on the paper glass corresponding to the panel region; and separating the paper glass from the board glass by cutting the paper glass at a position corresponding to an end portion of the panel region adjacent to the peripheral area.

Abstract: A method for manufacturing a joined body composed of a first substrate and a second substrate joined together by sealing resin material attached to a predetermined area of the first substrate includes: attaching a sheet material to the first substrate so as to cover the predetermined area, the sheet material including a sheet base material and the resin material provided on one main surface of the sheet base material; forming, after the attaching, in the sheet material, a slit by reducing a thickness of the resin material along an outline of the predetermined area; and separating, after the forming, part of the resin material inside the slit from the sheet base material to keep the part of the resin material inside the slit on the predetermined area of the first substrate and not to keep the rest of the resin material outside the slit on the first substrate.

Abstract: A method of manufacturing a touch panel is disclosed. The method includes providing a plurality of substrates, each having a size, providing a carrier including a plurality of grooves each having a size corresponding with the size of the substrates. The method also includes placing the plurality of substrates into the grooves, simultaneously forming a touch structure layer on each of the substrates, and separating substrates from the carrier.

Abstract: A method for manufacturing a TEM-lamella is disclosed. The method includes: disposing a self-supporting protective structure on a surface of a substrate; bonding the protective structure to the substrate; cutting out a lamella from the substrate using a particle beam so that the lamella remains bonded to at least a portion of the protective structure; fastening a first tool to the lamella; and moving away the lamella from a residual portion of the substrate by moving the first tool relative to the substrate.

Abstract: Disclosed herein are a copper clad laminate, a printed circuit board, and a method of manufacturing the same. The copper clad laminate includes: an insulating layer having one surface and the other surface; and first and second copper foil layers having one surface, which is a smooth surface, and the other surface, which is a rough surface having a roughness larger than that of the smooth surface, respectively, wherein one surface of the insulating layer contacts the rough surface of the first copper foil layer and the other surface of the insulating layer contacts the smooth surface of the second copper foil layer.

Abstract: Provided is a label production method capable of significantly reducing production costs by producing many single labels using one member. A label substrate that an adhesive and a release agent are applied to is passed through a laminating device twice, first label substrate passed for the first time and second label substrate passed for the second time are pseudo-adhered by joining the release agent of the first label substrate passed for the first time to the adhesive of the second label substrate passed for the second time, and single labels are punched out from the second label substrate by a cutting tooth of a punching device at a position on the downstream side after the label substrate is passed through the laminating device for the second time. The first label substrate passed for the first time is used as a seat for the cutting tooth of the punching device.

Abstract: Provided is an optical functional film in which air bubbles can be effectively prevented from forming during lamination, and preferably in which a carrier film does not tear readily. Also provided is a method for manufacturing a liquid crystal display device using this optical functional film. A belt-shaped optical functional film is used in order to cut away the optical functional film at predetermined intervals from the belt-shaped optical functional film to which a carrier film is bonded, with the carrier film remaining uncut; to subsequently turn over the carrier film by an edge-shaped member and peel away the optical functional film; and to laminate the exposed surface of the optical functional film to a sheet member while the optical functional film is being peeled away, wherein the optical functional film is characterized in that the flexural rigidity of the carrier film per unit length in the longitudinal direction is from 5.0×10?5 N·mm2 to 8.

Abstract: A method of manufacturing a flexible composite panel having a plurality of reservoirs connected by at least one capillary includes forming a capillary assembly by winding a flexible, deformable capillary base web partially around a rotating cylinder that has a plurality of recessed features formed therein; drawing the capillary base web into the recessed features to form the capillaries in the capillary base web; filling the capillaries; and laminating a capillary barrier web over the capillary base web. A flexible reservoir assembly is formed by cutting the perimeter of the at least two reservoirs and associated catchments into a flexible reservoir web; removing the waste cut interiors of the reservoirs and the catchments from the reservoir web; securing the reservoir web to a base layer; overfilling each reservoir; and laminating the capillary assembly over the reservoir assembly, driving excess filler from the reservoirs into the catchments.

Abstract: A pressure sensitive adhesive film attached to a surface is cut by pulling a filament from an adhesive tape applied on to the surface through that part of the film over the tape so as to cut the film and to form a cut edge of the film. The filament is a polyester multi-fiber filament of the order of 16 tex which provides a strength to break of the order of 2 pounds force and an extension of the order of 15% under a load of 1.0 pounds force. The tape comprises a polyethylene substrate of 0.125 inch in width. The filament is extendible so that, when the tape is stretched the filament stretches with the tape and does not pull out or separate. The filament can be broken by hand and has an ability to bend to a radius of curvature of less than 0.5 inches without any stiffness in the filament.