Punching And Bonding Pressure Application By Punch Patents (Class 156/261)
  • Patent number: 11325732
    Abstract: A packaging machine for making capsules of the type including a container having an inlet opening and a bottom and at least one substantially disc-shaped element associated with the container, including a movement system by which the containers are directed along a predetermined path in a feed direction; a movement means by which a continuous web for defining the disc-shaped elements is moved along a second predetermined path; a cutoff station where the disc-shaped elements are cut from the continuous web and which is positioned along the second predetermined path and an associating station where the disc-shaped elements are associated with the containers and which is positioned along the predetermined path; the associating station is distinct from the cutoff station and the machine includes a transfer system by which the disc-shaped elements are transferred from the cutoff station to the associating station.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: May 10, 2022
    Assignee: AZIONARIA COSTRUZIONI MACCHINE AUTOMATICHE A.C.M.A. S.P.A.
    Inventor: Massimo Scrivani
  • Patent number: 11260644
    Abstract: The invention relates to an applicator for die-cut parts (2), having a die-cut part strip (1) with a longitudinal direction (L) having a carrier layer (3) and an adhesive layer (4), where an outer contour of the die-cut parts (2) is punched through the carrier layer and adhesive layer (3, 4) down to predetertnined breaking points (18) and a die-cut part complement (19) protrudes beyond the die-cut parts (2) continuously laterally to a longitudinal direction (L), and a punch head (8) over which the die-cut part strip (1) runs, where the die-cut parts (2) running over the punch head (8) face away from the punch head (8) by their adhesive layer (4), and the die-cut parts (2) can be pressed by means of the punch head (8) onto a surface (11).
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: March 1, 2022
    Assignee: tesa SE
    Inventors: Hans-Peter Brandt, Matthias Seibert
  • Patent number: 10833569
    Abstract: A rotor core includes laminate steel plates extending in a radial direction with respect to a central axis. The laminate steel plates each include a base portion on a radially outer side of the central axis, and pieces separately disposed on a radially outer side of the base portion with penetrating portions therebetween, and arranged side by side at predetermined intervals in a circumferential direction. The laminate steel plates are laminated in an axial direction. The laminated steel plate at an upper end in the axial direction includes at least one of an outward projection extending radially outward from an outer edge portion of the base portion and an inward projection extending radially inward from an inner edge portion of the piece, and the laminated steel plate at a lower end in the axial direction includes an intervening portion between the base portion and the piece portion.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: November 10, 2020
    Assignee: NIDEC CORPORATION
    Inventors: Takayuki Migita, Takeshi Honda, Hirofumi Muto, Osamu Fujimoto, Hiroshi Kitagaki, Yasuaki Nakahara
  • Patent number: 10759583
    Abstract: The present invention relates to a universal fitment, method of assembling the universal fitment, and method of dispensing liquids using such universal fitment. The universal fitment of the present invention has features to engage a quick-connect-disconnect dispensing connector or a screw-on connector dispensing connector for the dispensing of liquids and semi-liquids from a collapsible bag.
    Type: Grant
    Filed: November 2, 2016
    Date of Patent: September 1, 2020
    Assignee: LIQUI-BOX CORPORATION
    Inventor: James W. Johnson
  • Patent number: 10723499
    Abstract: An automated labeling method and apparatus includes a label web-severing mechanism and a label-applying assembly, the web-severing mechanism configured to synchronously sever a plurality of labels from a self-wound label web, and the label-applying assembly configured to synchronously apply the plurality of severed labels to a corresponding plurality of articles to be labeled.
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: July 28, 2020
    Assignee: NORTH ZION MANAGEMENT LLC
    Inventor: Jamie Allen Kelso
  • Patent number: 10696457
    Abstract: To provide a spout-equipped container that is excellent in hermetical-sealing performance. The spout-equipped container includes a container and a spout. The spout includes a spout base, an opening element accommodated in a cylinder of the spout base, an activating body which moves the opening element, and a heat sealed sheet which covers an inner opening which fronts an accommodating part in the spout base. The opening element is formed so as not to be get out of the spout base, is formed so as to move toward the heat sealed sheet, and has its center where a spout through hole is formed. The heat sealed sheet is formed so as to be partially torn by the opening element to make the accommodating part of the container and an outer opening of the spout base communicate with outside via the spout through hole of the opening element, and is formed so that an accommodated substance is poured outside.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: June 30, 2020
    Assignee: MELODIAN CO., LTD.
    Inventors: Yoshinori Ohkubo, Takayuki Monden
  • Patent number: 10358240
    Abstract: A packaging machine for making capsules of the type including a container having an inlet opening and a bottom and at least one substantially disc-shaped element associated with the container, including a movement system by which the containers are directed along a predetermined path in a feed direction; a movement means by which a continuous web for defining the disc-shaped elements is moved along a second predetermined path; a cutoff station where the disc-shaped elements are cut from the continuous web and which is positioned along the second predetermined path and an associating station where the disc-shaped elements are associated with the containers and which is positioned along the predetermined path; the associating station is distinct from the cutoff station and the machine includes a transfer system by which the disc-shaped elements are transferred from the cutoff station to the associating station.
    Type: Grant
    Filed: July 23, 2014
    Date of Patent: July 23, 2019
    Assignee: AZIONARIA COSTRUZIONI MACCHINE AUTOMATICHE A.C.M.A. S.P.A.
    Inventor: Massimo Scrivani
  • Patent number: 10068693
    Abstract: A multi-layer wiring structure includes a first conductive structure, a second conductive structure and an insulating layer. To manufacturing the multi-layer wiring structure, a first conductive structure and a second conductive structure are provided. The first conductive structure and the second conductive structure include a plurality of wiring patterns. Then, the insulating layer is disposed between the first conductive structure and the second conductive structure. The insulting layer is thinner than the first conductive structure or the second conductive structure. The first conductive structure, the insulating layer and the second conductive structure are laminated to form the multi-layer wiring structure. A planar magnetic element having a compact coil manufactured by the method is also provided.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: September 4, 2018
    Assignee: CYNTEC CO., LTD.
    Inventors: Chun-Chih Lin, Yi-Wei Chen, Yi-Ting Lai, Chu-keng Lin, Cheng-Chang Lee
  • Patent number: 10000308
    Abstract: An automated labeling method and apparatus includes a label web-severing mechanism and a label-applying assembly, the web-severing mechanism configured to synchronously sever a plurality of labels from a self-wound label web, and the label-applying assembly configured to synchronously apply the plurality of severed labels to a corresponding plurality of articles to be labeled.
    Type: Grant
    Filed: December 5, 2014
    Date of Patent: June 19, 2018
    Assignee: North Zion Management, LLC
    Inventor: Jamie Allen Kelso
  • Patent number: 9963256
    Abstract: The present invention provides a method of assembling a filter element (8) with a cup-shaped capsule body (2) using a combined weld-head (70) and former (80), comprising the steps of positioning the filter element (8) at or near a mouth of the cup-shaped capsule body (2), moving the combined weld-head (70) and former (80) so as to contact and drive the filter element (8) into the cup-shaped capsule body (2), wherein, the filter element (8) is deformed by a sprung-loaded former (80) of the combined weld-head (70) and former (80) to form a cup-shaped filter element (56), and using a weld-head (70) of the combined weld-head (70) and former (80) to bond the cup-shaped filter element (56) to the cup-shaped capsule body (2). The present invention further provides a method of making a beverage capsule and a beverage capsule produced using this method.
    Type: Grant
    Filed: October 16, 2013
    Date of Patent: May 8, 2018
    Assignee: Kraft Foods R&D, Inc.
    Inventors: Nicholas Hansen, Mark Norton
  • Patent number: 9824958
    Abstract: Various embodiments provide a chip carrier structure. The chip carrier structure may include a structured metallic chip carrier; encapsulating material at least partially filling the structure; wherein the main surfaces of the metallic chip carrier are free from the encapsulating material.
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: November 21, 2017
    Assignee: INFINEON TECHNOLOGIES AUSTRIA AG
    Inventors: Ralf Otremba, Josef Hoeglauer, Juergen Schredl, Xaver Schloegel, Klaus Schiess
  • Patent number: 9717142
    Abstract: A multilayer wiring substrate, a method of producing and a semiconductor product includes: a trench produced at one surface of an insulation layer, the trench having a depth shallower than a thickness of the insulation layer; and a copper plating applied to the trench.
    Type: Grant
    Filed: July 10, 2014
    Date of Patent: July 25, 2017
    Inventors: Toshiyuki Inaoka, Atsuhiro Uratsuji
  • Patent number: 9713576
    Abstract: A spout pouch, configured to removably couple to a feeding device, for feeding liquid to a child includes a spout having an inner surface that includes at least one feature selected from the group consisting of a ridge, rib, boss, recess, groove and step. The inner surface is configured to engage with a portion of the feeding device when the portion of the feeding device is inserted into the spout. The spout pouch also includes a pouch of flexible material coupled to the spout and configured to hold the liquid. Other systems, methods, and components are also provided.
    Type: Grant
    Filed: October 9, 2014
    Date of Patent: July 25, 2017
    Inventors: John M. McBean, Kailas N. Narendran
  • Patent number: 9532591
    Abstract: There is provided a method of manufacturing a combustible heat source having a barrier affixed to an end face thereof, including providing a hollow die having a first opening and an opposed second opening; covering the first opening with a laminar barrier material; punching a barrier from the laminar barrier material by inserting a first punch into the hollow die through the first opening; placing one or more particulate components in the hollow die through the second opening; compressing the one or more particulate components to form a combustible heat source and affixing the barrier to an end face of the combustible heat source by inserting a second punch into the hollow die through the second opening; and ejecting the combustible heat source having the barrier affixed to the end face thereof from the hollow die.
    Type: Grant
    Filed: June 13, 2013
    Date of Patent: January 3, 2017
    Assignee: Philip Morris Products S.A.
    Inventor: Oleg Mironov
  • Patent number: 9084354
    Abstract: A method for designing a printed circuit board to meet a specification is described. A first voltage switchable dielectric material is placed in apposition with a first copper foil. A second voltage switchable dielectric material is placed in apposition with a second copper foil. An arcuate portion of the first copper foil is placed in apposition with a first side of an aluminum member, an adhesive substance being situated between the first copper foil and the first side of the aluminum member. An arcuate portion of the second copper foil in is placed apposition with a second side of the aluminum member, an adhesive substance being situated between the second copper foil and the second side of the aluminum member.
    Type: Grant
    Filed: August 28, 2012
    Date of Patent: July 14, 2015
    Assignee: LITTELFUSE, INC.
    Inventors: Robert Fleming, Lex Kosowsky, Shurui Shang, Bhret Graydon, Xiaofeng Chen, Glen Irvin
  • Patent number: 8986487
    Abstract: The present invention relates to a consolidated composite pre-form for reinforcing a composite structure, said pre-form comprising fibers and a binding agent, said pre-form having a sheet-like structure with an upper major surface and a lower major surface, and said pre-form being provided with recesses on at least a portion of at least one of said major surfaces.
    Type: Grant
    Filed: April 29, 2009
    Date of Patent: March 24, 2015
    Assignee: Vestas Wind Systems A/S
    Inventors: Knud Stenbaek Nielsen, Henning Schroder
  • Patent number: 8882955
    Abstract: An automated labeling method and label supply therefor. The method and label supply are particularly adapted for labeling produce, and more particularly fruit, in high volumes at high speed.
    Type: Grant
    Filed: July 7, 2011
    Date of Patent: November 11, 2014
    Assignee: Superior Tape & Label Incorporated
    Inventors: Dwayne K. Brandon, Robert L. Leighton
  • Publication number: 20140290845
    Abstract: A method for making a friction plate that includes a core plate and a friction facing is disclosed. The method includes cutting a pattern of friction material segments into a friction material sheet such that each friction material segment remains integrally connected to the friction material sheet, locating a predetermined number of the friction material segments adjacent to a surface of a core plate to which a bonding material is present, separating the friction material segments from the friction material sheet, and placing the friction material segments onto the surface of the core plate over the bonding material. An apparatus for practicing this method is also disclosed.
    Type: Application
    Filed: November 30, 2012
    Publication date: October 2, 2014
    Applicant: BorgWarner Inc.
    Inventors: Dean A. Collis, Walter J. Becker
  • Patent number: 8834660
    Abstract: The present disclosure relates to methods and a related systems and tools for dispensing an adhesive piece having damping qualities onto a component of a hard disk drive suspension. The adhesive piece can be commercially available layered strip sold as an adhesive layer having a first and a second liner adhered to each side. An exemplary method can cut an adhesive piece, separate the adhesive piece from a secondary liner, adhere the adhesive piece onto a component of a hard disk drive suspension, separate a primary liner from the adhesive piece, and dispose of the primary liner using a conventional gantry system. The method can be performed using a two-step operation of the gantry system.
    Type: Grant
    Filed: January 7, 2014
    Date of Patent: September 16, 2014
    Assignee: Hutchinson Technology Incorporated
    Inventors: Bryan J. Scheele, Neal T. Eidenschink, John L. Schumann, Trent A. Johnson, Daniel W. Scheele, Cameron T. Hempel, Scott J. Cray, Kenneth L. Bolster
  • Patent number: 8764931
    Abstract: A method for manufacturing a cushioning element may include securing a plurality of pad components to pins that extend outward from a base, each of the pins having a non-circular short-axis cross-sectional shape. The pad components are then compressed between the base and a material layer to bond the pad components to the material layer. In some configurations, the pins may have an elongate short-axis cross-sectional shape. In some configurations, the pins may have an elliptical short-axis cross-sectional shape. Additionally, in some configurations, the pins may have a short-axis cross-sectional shape selected from triangular, square, rectangular, hexagonal, and semi-circular.
    Type: Grant
    Filed: May 19, 2011
    Date of Patent: July 1, 2014
    Assignee: NIKE, Inc.
    Inventor: David Turner
  • Patent number: 8425712
    Abstract: A method for manufacturing the cushioning elements may include utilizing a die with a plurality of die elements positioned in a particular arrangement. A polymer material, which may be a polymer foam material, is located between the die and an extractor. The polymer material is compressed between the die and the extractor, and the die elements cut the polymer material to form a plurality of pad components, which are arranged like the die elements. The die and the extractor are separated, and the pad components are secured to the extractor in the arrangement of the die elements. Additionally, the pad components are bonded to at least one material layer such that the pad components remain in the arrangement of the die elements.
    Type: Grant
    Filed: April 7, 2010
    Date of Patent: April 23, 2013
    Assignee: Nike, Inc.
    Inventor: David Turner
  • Patent number: 8361269
    Abstract: A movable punch punches a plate piece from an original material sheet. The punched plate piece is rotated relative to and laminated onto another plate piece. A plurality of projections are formed on the outer circumference of each plate piece. The movable punch has a plurality of projection forming blades, the number of which is greater than the number of the projections of the plate pieces. Prior to the punching of the plate piece by means of the movable punch, blank holes for nullifying the formation of the projections are formed in the original material sheet at positions that correspond to projection forming blades. Further, as the punching of the plate pieces from the original material sheet progresses, the positions of the blank holes are changed.
    Type: Grant
    Filed: July 26, 2010
    Date of Patent: January 29, 2013
    Assignee: Toyota Boshoku Kabushiki Kaisha
    Inventors: Masami Sakakibara, Shirou Fujimura
  • Patent number: 8337646
    Abstract: A method and apparatus are provided for filling vias in a product greensheet and/or repairing vias in a product greensheet. The method and apparatus utilize a transfer greensheet having filled vias in a fixed array, which vias are punched into the product greensheet to either repair or fill the via of the product greensheet. The method and apparatus employ position determining means such as a camera, a punch head and a corresponding punch die and an activating means to activate the punch head to punch the transfer greensheet via to fill the product greensheet via. The transfer greensheet has a fixed array of filled vias and a transfer greensheet station employs a fixed plate having a plurality of vacuum ports positioned in the non-via areas of the transfer greensheet which secures the transfer greensheet during the method. The product greensheet is held by a vacuum plate.
    Type: Grant
    Filed: August 25, 2008
    Date of Patent: December 25, 2012
    Assignee: International Business Machines Corporation
    Inventors: Mark J. LaPlante, Thomas Weiss
  • Patent number: 8302516
    Abstract: An apparatus for punching at least one hole in a sheet of paper and attaching a reinforcing ring onto the sheet around the hole includes a platform; a hole punch rod mounted to and extending outwardly from the platform positioned to match a desired location for a hole on a sheet, the hole punch rod having a rod cutting end extending away from the platform; a sheet panel having a ring passing hole positioned to register with the longitudinal axis of the punch rod and sized to pass a reinforcing ring; a hole punch plate generally parallel to and spaced forwardly from the sheet panel and having a hole punching port positioned to register with the longitudinal axis of the hole punch rod, the hole punching port being sized to pass the rod cutting end closely enough to cut a hole into a sheet placed between the rod cutting end and the punching port; a sheet panel return spring mechanism.
    Type: Grant
    Filed: July 29, 2010
    Date of Patent: November 6, 2012
    Inventor: Claudia Marlin
  • Patent number: 8241450
    Abstract: A method of manufacturing a fluid-filled chamber may include utilizing one of a blowmolding and a thermoforming process to define a first surface, a second surface, and a sidewall surface of the chamber. An aperture is defined through the first surface in a location where the first surface is spaced from the second surface. A pressurization apparatus is located adjacent to the first surface and around the aperture, and the pressurization apparatus is utilized to inject a fluid into the chamber through the aperture, compress the first surface against the second surface, and form a bond around the aperture and between the first surface and the second surface.
    Type: Grant
    Filed: December 17, 2007
    Date of Patent: August 14, 2012
    Assignee: Nike, Inc.
    Inventors: Shaun J. Hensley, Stuart C. Forstrom, William A. Brunais
  • Patent number: 8205653
    Abstract: A substrate bonding apparatus and method are provided. The substrate bonding apparatus may include a first support member that receives a first substrate, a second support member that receives a second substrate opposite the first support member, and a support pin located at the outside of the first substrate fixed to the first support member. The support pin may be connected to the first support member, and a distance adjustment device may move the support pin upward or downward to adjust the distance between the first support member and the second support member.
    Type: Grant
    Filed: October 29, 2008
    Date of Patent: June 26, 2012
    Assignee: Advanced Display Process Engineering, Co., Ltd.
    Inventors: Dong Gun Kim, Bong Hwan Choi
  • Patent number: 8157947
    Abstract: The present invention is directed to a method and apparatus for manufacturing a composite, foam/fabric material for use as protective material in products, and utilizes an apparatus which includes a punch press with punches arranged in rows and correspondingly aligned dies for receiving the punches therethrough. The system operates by punching a sheet of foam material into a plurality of discrete foam elements which are transferred onto a heated fabric substrate, and retained thereon by heat bonding. The apparatus consists, in one preferred embodiment, of a clamp plate which clamps a sheet of foam material onto a die plate, and after a punching sequence, the sheet of foam material, along with the sheet of fabric material, are indexed downstream, and the process repeats.
    Type: Grant
    Filed: April 27, 2007
    Date of Patent: April 17, 2012
    Assignee: Applied FT Composite Solutions Inc.
    Inventor: Daniel Kim
  • Patent number: 8080143
    Abstract: A method for manufacturing a gas sensor element (300), which includes a plate-like second solid electrolyte member (109), a fourth electrode (110) formed on the second solid electrolyte member (109), and a protection layer (111) including a reinforcement member (112) having an insertion hole (112a), and a porous electrode protection member (113a) provided in the insertion hole (112) and adapted to protect the fourth electrode (110) from becoming poisoned.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: December 20, 2011
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Shigeki Mori, Masaki Mizutani, Akinori Kojima, Shigeo Kondo
  • Patent number: 8066840
    Abstract: A method of forming metallic connector patterns for solar cells, whereby an embosser having raised features shaped in the form of a metallic connector pattern is used to attach a portion of a metallic foil to a transparent conductive layer formed on a top transparent surface of a solar cell structure. The raised surfaces of the embosser press the metallic foil portion against the transparent conductive layer. Heat and pressure directed to the metallic foil portion attach the metallic foil portion to the underlying transparent conductive layer, and then the rest of the metallic foil, which is not attached to the transparent conductive layer, is removed.
    Type: Grant
    Filed: January 22, 2008
    Date of Patent: November 29, 2011
    Assignee: SoloPower, Inc.
    Inventors: Mukundan Narasimhan, Todd Johnson, Bulent M. Basol
  • Patent number: 7981237
    Abstract: A micro- or nano-fluidic chip fabricated with a Norland Optical Adhesive (NOA), an acrylated polyurethane-based UV-polymerizable optical adhesive. The micro- or nano-fluidic chip has sequentially an inlet, a channel, and an outlet. The channel has a pillar in the region of the outlet to prevent beads from flowing out, and the surface of the channels in the micro- or nano-fluidic chip is hydrophilic, which generates spontaneous flow in the channels by a capillary force without any extra external pumping.
    Type: Grant
    Filed: October 12, 2007
    Date of Patent: July 19, 2011
    Assignee: Ewha University-Industry Collaboration Foundation
    Inventors: Sung Su Park, So Hyun Kim, Youn Sang Kim, Seong Won Nam, Kang Mu Lee
  • Publication number: 20110155316
    Abstract: A tool and method applies a cover to an item receiving face. A base plate has an item receiving surface. A moveable lower plate has a die bore corresponding to the cover receiving surface of the item and a receiving surface for a laminate cover material having an adhesive layer and a decorative base layer. An upper plate includes a channel corresponding with the lower plate die and a punch secured within the upper plate channel and slideably engageable within the die. The punch has a centrally located bore and cutting edge. A compressible member disposed within the punch bore has a curvolinear free end. The upper plate is displaced towards the lower plate in a closed state to slidingly engage the punch within the die and the punch cutting edge punches out the cover while the compressible member presses the cut cover onto the item receiving face.
    Type: Application
    Filed: May 12, 2009
    Publication date: June 30, 2011
    Inventors: Dan R. Byme, JR., David J. Otto, Clayton Raybourn, Mark Jurcak
  • Patent number: 7955459
    Abstract: One side of a metal sheet is joined to a polymer layer by applying heat to a joining area on the opposite side of the metal. The heat flows through the thin metal to activate a thermoplastic material or heat setting polymer into a bond with the metal. The method can be used to bond the metal sheet to a plastic body or another metal member. It is preferred to use a friction or friction stir tool to heat the metal surface.
    Type: Grant
    Filed: August 22, 2008
    Date of Patent: June 7, 2011
    Assignee: GM Global Technology Operations LLC
    Inventors: Yen-Lung Chen, Peter H. Foss, Mark W. Verbrugge, Xiaohong Q. Gayden
  • Patent number: 7955466
    Abstract: When a polarization plate is manufactured by laminating and laminating at least two types of retarder films onto a polarizer film by a laminating apparatus, with the two films of at least the two types of retarder films and at least the polarizer films being laminated such that the difference in the angle between the feeding directions of the two films is within the range of 40° to 80°. With this arrangement, a good handling property can be obtained, improvement in yield ratio can be expected, and the installation area of the laminating apparatus can be reduced due to a reduction in size of the laminating apparatus.
    Type: Grant
    Filed: March 25, 2005
    Date of Patent: June 7, 2011
    Assignees: JRS Corporation, Sumitomo Chemical Co., Ltd., Dai Nippon Printing Co., Ltd., Toppan Printing Co., Ltd., NEC Corporation, Hitachi Chemical Co., Ltd.
    Inventor: Atsuo Nozaki
  • Patent number: 7861388
    Abstract: A piezoelectric actuator capable of being driven with a high electric field intensity, obtaining a larger displacement and being high in electric conducting reliability of electrodes, and comprising: at least one cell defined by two side walls, a substrate and a ceiling wall; the two side walls being disposed on the substrate and being covered with the ceiling wall to define one cell, at least the two side walls comprising piezoelectric/electrostrictive devices, and the piezoelectric/electrostrictive devices being capable of changing a volume of the cell by displacement of the walls. Each of the piezoelectric/electrostrictive devices comprises a plurality of layered piezoelectric/electrostrictive bodies and electrodes which are alternately stacked, and end portions of the electrodes are embedded in the piezoelectric/electrostrictive bodies in at least the internal side of the cell.
    Type: Grant
    Filed: June 1, 2007
    Date of Patent: January 4, 2011
    Assignee: NGK Insulators, Ltd.
    Inventors: Yukihisa Takeuchi, Koji Kimura, Koichi Iwata
  • Patent number: 7849905
    Abstract: A stripping apparatus has a simplified structure for stripping a supporting plate from a layered structure, occupies less space, and strips a supporting plate in a shorter period of time. The stripping apparatus comprises a transfer robot, a cassette, a stripping device and a cleaning device which surround the transfer robot. The stripping device comprises a chucking plate for attracting and retaining a layered structure, and a stripping plate for stripping the supporting plate from the layered structure. The chucking plate is constructed so as to be rotated by 180° within a vertical plane, elevated and lowered in a vertical direction in a state of retaining the layered structure.
    Type: Grant
    Filed: December 4, 2006
    Date of Patent: December 14, 2010
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Akihiko Nakamura, Atsushi Miyanari, Yoshihiro Inao
  • Patent number: 7815766
    Abstract: An apparatus for applying adhesive sheets includes a sheet applying base which is placed on a placement base so as to be withdrawable from the placement base and which has a sheet applying region to which adhesive sheets positioned closely before and after a junction portion are to be applied. In the sheet applying base, an upstream-side end portion of the sheet applying region in the adhesive sheet feed direction is placed so as to confront an end portion of the sheet applying head, and moreover a sheet escaping space opened downward is set in place.
    Type: Grant
    Filed: September 20, 2007
    Date of Patent: October 19, 2010
    Assignee: Panasonic Corporation
    Inventors: Kozo Odawara, Atsushi Katayama
  • Patent number: 7811404
    Abstract: A web (36) of paper or the like has labels (42) defined therein by printing the web (36) followed by skip cutting (40) the web to define the label boundaries. The skip cutting (40) leaves the labels (42) connected to the remainder of the web (36) by breakable catch points (44). The labels (42) are rendered capable of being applied to product containers (16) by the web (36) having adhesive applied to the side opposite the printing, and the web (36) is rendered capable of being wound up by having an adhesive release coating, such as silicone, applied over the printing.
    Type: Grant
    Filed: May 21, 2003
    Date of Patent: October 12, 2010
    Assignee: Catchpoint Limited
    Inventor: Richard Wade
  • Patent number: 7780811
    Abstract: The dicing die-bonding film of this invention comprises a pressure-sensitive adhesive layer (2) on a supporting base material (1) and a die-bonding adhesive layer (3) on the pressure-sensitive adhesive layer (2), wherein a releasability in an interface between the pressure-sensitive adhesive layer (2) and the die-bonding adhesive layer (3) is different between an interface (A) corresponding to a work-attaching region (3a) in the die-bonding adhesive layer (3) and an interface (B) corresponding to a part or the whole of the other region (3b), and the releasability of the interface (A) is higher than the releasability of the interface (B). According to this invention, there can be provided a dicing die-bonding film excellent in balance between retention in dicing a work and releasability in releasing its diced chipped work together with the die-bonding adhesive layer.
    Type: Grant
    Filed: February 6, 2007
    Date of Patent: August 24, 2010
    Assignee: Nitto Denko Corporation
    Inventors: Takeshi Matsumura, Masaki Mizutani, Sadahito Misumi
  • Patent number: 7754311
    Abstract: The invention relates to a multilayer card of thermoplastic material comprising first and second layers (7, 2) secured to each other, together with least one reinforced bonding zone (9) between the first layer and the second layer. The invention also provides a method of making a multilayer card secure.
    Type: Grant
    Filed: June 2, 2004
    Date of Patent: July 13, 2010
    Assignee: Sagem Securite
    Inventor: Gilles Monteilliet
  • Patent number: 7691218
    Abstract: A label with top, bottom and edge surfaces is attached to a thermoplastic substrate by a method comprising the steps of: A. Placing the bottom surface of the label in contact with a surface of the substrate; B. Melting a portion of the substrate beneath the label or adjacent to an edge of the label; C. Drawing a portion of the melted substrate over an edge of and onto the top surface of the label such that the portion of the melted substrate on the top surface of the label is continuous with the substrate; and D. Solidifying the melted substrate. The attachment does not require adhesive or mechanical fasteners, and the label and thermoplastic substrate can be made of any material that will withstand the conditions of the environment to which they will be exposed.
    Type: Grant
    Filed: September 6, 2006
    Date of Patent: April 6, 2010
    Assignee: Brady Worldwide, Inc.
    Inventor: Richard L. Seiders
  • Patent number: 7669630
    Abstract: Hole punch apparatus which automatically places a reinforcement ring precisely around each punched hole concurrently with the creation of each hole and using the same motion that punches the holes. In a preferred embodiment, the punch shaft has a ring compression disk affixed around it at a location above the punch face. The compression disk has a ring cushion and a stack of reinforcement rings extending along the punch shaft toward the punch face, but spaced therefrom to permit the punch face to puncture a sheet before the lowermost reinforcement ring is then compressed against the sheet in precise axial alignment with the punched hole. The rings each have sufficient adhesive to adhere to the sheet, one and only one ring at each hole, while disengaging from the remaining rings in the stack.
    Type: Grant
    Filed: June 22, 2007
    Date of Patent: March 2, 2010
    Inventor: Lap Shun Hui
  • Patent number: 7641754
    Abstract: A reinforcing ring loading and confining apparatus is provide for a hole punching and sheet material reinforcing device and includes a reinforcer loader receptacle that accommodates a plurality of annular reinforcing rings. The reinforcer loader has a body portion with a floor and a cylindrical reinforcer guide, open at the top and bottom, projecting up from the floor. A removable bottom panel is mounted to the body portion beneath the floor in alignment with the cylindrical guide. The reinforcer loader is inserted into the reinforcer loader receptacle support so that the loaded stack of reinforcing rings are positioned upon the removable bottom panel directly beneath the punching ram. The punching ram is forced downwardly through the stack of reinforcing rings and has an enlarged punching tip that passes through the central apertures in the reinforcing rings. When retracted, the punching tip lifts the stack of reinforcing rings back upwardly, thereby transferring them onto the punching ram shank.
    Type: Grant
    Filed: July 19, 2006
    Date of Patent: January 5, 2010
    Inventor: John Hui
  • Patent number: 7631679
    Abstract: A hole puncher and reinforcer for punching holes in sheets of material and for concurrently applying reinforcement to the sheets of material about the holes punched employs a removable cartridge containing a punch rod upon which a supply of reinforcement rings is mounted. The cartridge fits into a tubular socket located on the stanchion of the puncher and reinforcer frame. The reinforcing rings are mounted on the lower end of a cylindrical punch rod and a pressure plate attached to the punch rod forcefully presses each reinforcing ring in turn against a sheet of material as the cutting edge of the punch rod concurrently punches a hole in the sheet of material. When the supply of reinforcing rings is depleted, the entire cartridge is removed by rotating the punch lever arm away from alignment with the punch rod. A hook on the underside of the punch lever arm engages a lug on the cartridge, and lifts the cartridge out of the socket stanchion to facilitate removal and replacement of the cartridge.
    Type: Grant
    Filed: November 13, 2006
    Date of Patent: December 15, 2009
    Inventor: John Hui
  • Patent number: 7563339
    Abstract: A cutting device (10) for cutting a material (12) and providing a cut portion of the material (12). The device comprises a heating assembly comprising an electrical induction arrangement (32) for heating the cut portion of the material by induction heating.
    Type: Grant
    Filed: May 30, 2007
    Date of Patent: July 21, 2009
    Assignee: Relco U.K. Limited
    Inventors: David Gill, Mark Gill
  • Publication number: 20090151154
    Abstract: The invention relates to a system for transferring a nanostructure from a die to a flat side of a large-area substrate with a substrate holder that receives the substrate on a substrate receiving surface, and an actuator device that can be oriented parallel to the substrate receiving surface and opposite to this movable structural surface of the die and that acts orthogonally to the substrate receiving surface. To be able to use reasonably priced dies and in this case to achieve the highest possible throughput, a good edge yield, and a homogeneous structure with the substrate as much as possible without scrapping, a system is proposed with which the resultant force that acts through the die on the substrate surface can be shifted along the die surface.
    Type: Application
    Filed: November 7, 2008
    Publication date: June 18, 2009
    Inventors: Friedrich Paul Lindner, Thomas Glinsner, Markus Wimplinger
  • Patent number: 7533793
    Abstract: A solder preform for use to attach an electronic component to a substrate. The preform is for placement by a pick-and-place machine using a vacuum nozzle which picks the preform from a preform holder. Each of the sides of the preform configured to function as a vacuum side pick up surface has an enlarged planar surface area. Methods for forming such solder preforms are also disclosed.
    Type: Grant
    Filed: December 15, 2004
    Date of Patent: May 19, 2009
    Assignee: Fry's Metals, Inc.
    Inventors: Paul Godijn, Wim Veldhuizen, Patrick Lusse, Mitchell T. Holtzer, Rob van Ekeren, Martin de Haan
  • Patent number: 7531057
    Abstract: A continuous substrate and a continuous absorptive sheet are fed to a press station, and pressed continuously or intermittently. Part of the continuous absorptive sheet is charged in plural holes formed in the continuous substrate to form a biochemical analysis sheet. The biochemical analysis sheet is cut into predetermined tips to obtain a biochemical analysis unit.
    Type: Grant
    Filed: January 31, 2003
    Date of Patent: May 12, 2009
    Assignee: FUJIFILM Corporation
    Inventors: Akifumi Kato, Kenji Nakajima
  • Patent number: 7510619
    Abstract: A method and apparatus are provided for filling vias in a product greensheet and/or repairing vias in a product greensheet. The method and apparatus utilize a transfer greensheet having filled vias in a fixed array, which vias are punched into the product greensheet to either repair or fill the via of the product greensheet. The method and apparatus employ position determining means such as a camera, a punch head and a corresponding punch die and an activating means to activate the punch head to punch the transfer greensheet via to fill the product greensheet via. The transfer greensheet has a fixed array of filled vias and a transfer greensheet station employs a fixed plate having a plurality of vacuum ports positioned in the non-via areas of the transfer greensheet which secures the transfer greensheet during the method. The product greensheet is held by a vacuum plate.
    Type: Grant
    Filed: July 8, 2005
    Date of Patent: March 31, 2009
    Assignee: International Business Machines Corporation
    Inventors: Mark J. LaPlante, Thomas Weiss
  • Publication number: 20080302474
    Abstract: One side of a metal sheet is joined to a polymer layer by applying heat to a joining area on the opposite side of the metal. The heat flows through the thin metal to activate a thermoplastic material or heat setting polymer into a bond with the metal. The method can be used to bond the metal sheet to a plastic body or another metal member. It is preferred to use a friction or friction stir tool to heat the metal surface.
    Type: Application
    Filed: August 22, 2008
    Publication date: December 11, 2008
    Applicant: GM Global Technology Operations, Inc.
    Inventors: Yen-Lung Chen, Peter H. Foss, Mark W. Verbrugge, Xiaohong Q. Gayden
  • Patent number: 7416008
    Abstract: An apparatus and laminate allow removal of at least one sub-area of a face layer sheet from a laminate composed of a backing layer with the face layer sheet adhering thereto to leave at least one product area of the face layer sheet in place on the backing layer. The apparatus may comprise a work surface for receiving the laminate thereon; at least one adhesive applicator mounted adjacent to the work surface; an actuator associated with the applicator(s); an actuator controller to cause application of an adhesive to predetermined portions of the waste area(s); a laminator beside the work surface including a supply of carrier web oriented for temporary lamination with the laminate using the applied adhesive; and a delaminator positioned to receive the carrier lamination and delaminate the laminate therefrom with the waste area(s) adhering to the carrier web.
    Type: Grant
    Filed: August 23, 2004
    Date of Patent: August 26, 2008
    Assignee: Mikkelsen Graphic Engineering, Inc.
    Inventors: Steen B. Mikkelsen, Sergey Potebnya