Before Final Assembly; E.g., To Cure Lamina, Etc. Patents (Class 156/273.3)
  • Patent number: 11926768
    Abstract: A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm2 to about 300 J/cm2.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: March 12, 2024
    Assignee: Henkel AG & Co. KGaA
    Inventors: Brian Deegan, Gavin Haberlin, Brendan Kneafsey, Stephen Fearon
  • Patent number: 11776820
    Abstract: Embodiments of the application provide a vertical interconnection structure and a manufacturing method thereof, a packaged chip, and a chip packaging method. Conductive pillars are formed on a first surface of a substrate. A first insulated support layer wrapping the conductive pillars is formed on the first surface of the substrate. The conductive pillars are located in the first insulated support layer. An upper surface of the conductive pillar that is away from the substrate is not covered by the first insulated support layer. Then the substrate is removed.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: October 3, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Xiaoyun Wei, Yong Yang, Chaojun Deng
  • Patent number: 11439025
    Abstract: In a circuit forming device, a resin laminated body is formed by curing an ultraviolet curable resin ejected by an ejecting device. Then, ultraviolet curable resin is ejected into a cavity of the resin laminated body, and an electronic component is placed on the ultraviolet curable resin. Then, the electronic component is cured and the electronic component is fixed.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: September 6, 2022
    Assignee: FUJI CORPORATION
    Inventors: Yoshitaka Hashimoto, Masatoshi Fujita, Kenji Tsukada, Akihiro Kawajiri, Masato Suzuki, Katsuaki Makihara
  • Patent number: 11424310
    Abstract: A display panel having an adjusting layer and an elastic layer and a method of manufacturing the display panel are disclosed. Structures of stacked layers of a non-display region of the display panel are patterned. The patterned structures and a portion of an encapsulation layer form the adjusting layer. The adjusting layer makes a position of a neutral plane of a pad bending region approach to a position of a layer where a source/drain electrode is disposed.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: August 23, 2022
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventors: Bo Yan, Jun Cao
  • Patent number: 11214441
    Abstract: An endless belt includes a band-shaped belt main body made of a vulcanized rubber, and a coupling part that is made of a thermoplastic resin and is provided between both end parts of the belt main body, wherein the vulcanized rubber of the both end parts of the belt main body and the thermoplastic resin of the coupling part are chemically bonded to each other.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: January 4, 2022
    Assignee: NITTA CORPORATION
    Inventors: Yoshihiro Konishi, Takeshi Kubota, Akito Oi, Akihiko Kuriya
  • Patent number: 11084265
    Abstract: A system for manufacturing a laminated film, in which a first film and a second film are sequentially laminated, and the system includes: a film supplying part which supplies the first film and the second film; a bonding part which includes a first roll and a second roll that rotate in opposite directions, and compresses the first film and the second film supplied from the film supplying part and bonds the first film and the second film as the laminated film; and a bending inducing part which supports and bends the laminated film bonded and output from the bonding part, in which the second roll shifts in a direction along a circumference of a virtual circle having a larger radius than a radius of the first roll to control the bending of the laminated film.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: August 10, 2021
    Assignee: SHANJIN OPTOELECTRONICS (SUZHOU) CO., LTD.
    Inventors: Beom Seok Lee, Hang Suk Choi, Jae Hoon Choi, Eung Jin Jang, Suk Jae Lee, Ju Young Jeoung, Kyu Sung Hwang, Sung Kyum Kim
  • Patent number: 11065815
    Abstract: A powder dispensing assembly for an additive manufacturing machine includes a hopper defining a powder reservoir for receiving additive powder and a plurality of powder distribution modules operably coupled with the hopper. The powder distribution modules include a powder distribution body defining a discharge orifice and a supply gate that fluidly couples the powder reservoir to the discharge orifice. A plunger valve is movably mounted over the discharge orifice and an actuator moves the plunger valve between an open position and a closed position to selectively dispense a flow of additive powder.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: July 20, 2021
    Assignee: General Electric Company
    Inventors: Ryan William Van Deest, Eric Edward Halla
  • Patent number: 10957538
    Abstract: The present invention relates to a method of forming and transferring a thin film. The method of forming and transferring a thin film according to one embodiment may include a step of bonding a carrier wafer coated with a polymer bonding material to the top of a silicon-on-insulator (SOI) wafer formed by sequentially laminating a backside silicon layer, a buried oxide layer, and a silicon layer; a step of etching the backside silicon layer using the buried oxide layer as an etching barrier, and then selectively etching the buried oxide layer; a step of separating the carrier wafer from the polymer bonding material, and bonding a target wafer including an oxide layer to the bottom of the silicon layer through direct bonding; and a step of transferring the silicon layer to the top of the target wafer including the oxide layer by removing the polymer bonding material.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: March 23, 2021
    Assignee: IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
    Inventors: Chang Hwan Choi, Yu Rim Jeon, Hoon Hee Han
  • Patent number: 10930409
    Abstract: Resin composition comprising a) the reaction product of a1) one or more epoxy compounds having at least 2 epoxy groups, and a2) sorbic acid as component A; b) a solvent containing vinyl groups as component B; characterized in that a bisphenol F diglycidyl ether or an epoxy novolac is used as epoxy compound a1) in component A.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: February 23, 2021
    Assignee: ELANTAS GMBH
    Inventors: Majdi Al Masri, Anne-Gönke Huesmann, Klaus-Wilhelm Lienert, Hans-Ulrich Moritz
  • Patent number: 10916486
    Abstract: Various embodiments disclosed relate to semiconductor device and method of making the same using functional silanes. In various embodiments, the present invention provides a semiconductor device including a silicon die component having a first silica surface. The semiconductor device includes a dielectric layer having a second surface generally facing the first silica surface. The semiconductor device includes an interface defined between the first surface and the second surface. The semiconductor device also includes a silane based adhesion promoter layer disposed within the junction and bonded to at least one of the first silica surface and the dielectric layer second surface.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: February 9, 2021
    Assignee: Intel Corporation
    Inventors: Andrew J. Brown, Chi-Mon Chen, Robert Alan May, Amanda E. Schuckman, Wei-Lun Kane Jen
  • Patent number: 10882251
    Abstract: The present disclosure provides a system for printing a three-dimensional object. The system may comprise an open platform configured to hold a film of a viscous liquid comprising a photoactive resin. The open platform may comprise a print window. The system may comprise a deposition head comprising a nozzle in fluid communication with a source of the viscous liquid. The deposition head may be configured to move across the platform and deposit the film over the print window. The system may use multiple viscous liquids. The system may comprise an optical source that provides light through the print window for curing at least a portion of the film of the viscous liquid. The system may comprise a controller operatively coupled to direct movement of the deposition head and projection of the light, thereby printing at least a portion of the 3D object.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: January 5, 2021
    Assignee: Holo, Inc.
    Inventors: Pierre Lin, Jonathan Pomeroy, Arian Aghababaie, Brian Adzima
  • Patent number: 10850450
    Abstract: A printed object includes a modification not present in the original model of the object. The modification is included in a base layer of the object.
    Type: Grant
    Filed: May 31, 2013
    Date of Patent: December 1, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Krzysztof Nauka, Sivapackia Ganapathiappan, Hou T. Ng
  • Patent number: 10773497
    Abstract: The present invention provides a decorative sheet provided with three-dimensional moldability capable of sufficiently following the shape of a decorative resin molded article having a complicated surface shape. There is provided a decorative sheet composed of a layered body in which at least a substrate layer, a primer layer, and a thin metal film layer have been layered in sequence, and the primer layer contains a cured material having a resin in which the glass transition point is ?30° C. to 80° C.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: September 15, 2020
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Chigusa Kuriyama, Toshifumi Fujii
  • Patent number: 10676594
    Abstract: There is provided herein a composition comprising (a) a mercapto-functional silicon compound having the general Formula (I): and a reactive resin containing at least one epoxy and/or (meth)acrylate group. There is also provided a silylated resin resulting from the reaction product of mercapto-functional silicon compound (a) and reactive resin contain at least one epoxy and/or (meth)acrylate groups.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: June 9, 2020
    Assignee: Momentive Performance Materials Inc.
    Inventors: Constantine Kondos, Vikram Kumar, Martin Wusik
  • Patent number: 10654225
    Abstract: A method of fabricating a blade. The blade comprises subassemblies made of thermoplastic composite materials, each subassembly comprising an internal arrangement and at least one external arrangement, each internal arrangement comprising a stack of intermediate layers comprising reinforcing fibers impregnated with a semicrystalline thermoplastic matrix, each external arrangement comprising at least one surface layer comprising reinforcing fibers impregnated with an alloy of a semicrystalline thermoplastic polymer and of an amorphous thermoplastic polymer. An assembly film comprising an amorphous thermoplastic material and a ferromagnetic member is interposed between two surface layers of two distinct subassemblies that are to be assembled together by a method of local heating by induction.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: May 19, 2020
    Assignee: AIRBUS HELICOPTERS
    Inventor: Patrick Boschet
  • Patent number: 10620446
    Abstract: A multi-fiber endcap array can include an endcap that includes a stem surface and an exit surface, wherein the exit surface opposes the stem surface. The multi-fiber endcap array can also include a plurality of stems extending from the stem surface of the endcap and a plurality of optical fibers. Each of the plurality of optical fibers is optically coupled and mechanically coupled to a corresponding stem of the plurality of stems.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: April 14, 2020
    Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: James G. Ho, Gregory D. Goodno
  • Patent number: 10612153
    Abstract: The present invention relates to surface roughening methods and more particularly to a method for electrochemical roughening of thin film macro- and micro-electrodes. In one embodiment, an electrochemical etch template is formed comprising polymer particles adsorbed on a surface of a substrate to be roughened, followed by electrochemically etching of exposed regions of the substrate between the polymer particles in the electrochemical etch template so as to selectively roughen the surface of the substrate. In another embodiment, a surface of the electrode is immersed in either a adsorbing acidic solution, such as sulfuric acid, or a non-adsorbing acidic solution, such as perchloric acid, followed by electrochemically pulse etching the surface of the substrate at a narrow frequency range for adsorbing acidic solutions, or at a wide frequency range for non-adsorbing acidic solutions.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: April 7, 2020
    Assignee: Lawrence Livermore National Security, LLC
    Inventors: Anna Nikolaevna Ivanovskaya, Vanessa Tolosa, Dylan Dahlquist, Satinderpall S. Pannu, Kedar G. Shah, Angela C. Tooker, Fang Qian
  • Patent number: 10538071
    Abstract: Provided is a flooring tile manufacturing apparatus includes: a lower sheet supply unit configured to form and supply a lower sheet; a middle sheet supply unit configured to supply a middle sheet joined to an upper side of the lower sheet; a raw material supply unit configured to supply materials having different contents of a filler to the lower sheet supply unit and the middle sheet supply unit; a main roller configured to join the lower sheet and the middle sheet that have been received; a first sheet supply unit configured to supply a print sheet having a color or a pattern to the main roller; a second sheet supply unit configured to supply a transparent sheet to the main roller; and an ultraviolet (UV) coating unit configured to form a UV coating layer on a surface of the transparent sheet.
    Type: Grant
    Filed: June 27, 2017
    Date of Patent: January 21, 2020
    Inventor: Jung Soo Seo
  • Patent number: 10487183
    Abstract: The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip.
    Type: Grant
    Filed: June 27, 2017
    Date of Patent: November 26, 2019
    Assignee: Ushio Denki Kabushiki Kaisha
    Inventors: Fumitoshi Takemoto, Shinji Suzuki, Motohiro Sakai, Kenichi Hirose
  • Patent number: 10464263
    Abstract: Disclosed is a heat welding apparatus for combining a plastic fuel tank and plastic parts, and a method of combining the plastic fuel tank and the plastic parts using the apparatus. When a plastic part is heat-welded onto an inner surface of the plastic fuel tank, a melting unit simultaneously heats and melts a welding portion of the inner surface of the plastic fuel tank, to which the plastic part is joined, and a welding surface of the plastic part inside the plastic fuel tank, and then the welding surface of the plastic part is heat-welded to the welding portion of the plastic fuel tank after melting without delay.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: November 5, 2019
    Assignee: Dong Hee Industrial Co., Ltd.
    Inventors: Nan Woong Choi, Se Jun Kim, Seung Ho Lee, Myeong Hoon Baek
  • Patent number: 10406749
    Abstract: The disclosure relates in particular to a machine for additive manufacturing by sintering or melting powder using an energy beam acting on a powder layer in a working zone, said machine comprising a device for layering said powder. The device is configured to distribute the powder that are able to travel over the working zone in order to distribute the powder in a layer having a final thickness suitable for additive manufacturing; transfer the powder to a distribution structure by gravity, and control the quantity of powder transferred to the distribution structure.
    Type: Grant
    Filed: December 5, 2014
    Date of Patent: September 10, 2019
    Assignees: Compagnie Generale Des Etablissements Michelin, Michelin Recherche Et Technique, S.A.
    Inventors: Christophe De Lajudie, Ludovic Angele
  • Patent number: 10370137
    Abstract: A method for monitoring a labeling process, characterized in that parameters of the adhesive used for labeling and/or of the objects (306) to be labeled and/or of the environmental conditions of the environment of the labeling process are recorded, wherein the recorded parameters are processed by a control device (100) comprising a data processing system (101) in a given time interval or continuously and are matched with corresponding desired values, wherein said corresponding desired values can be changed via an input interface (104, 109) and wherein deviations between the recorded parameters and the desired values detected by the data processing system are output via an output interface (103) to an external device (200).
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: August 6, 2019
    Assignee: HENKEL AG & CO. KGAA
    Inventors: Goran Plazonic, Dejan Odadzic
  • Patent number: 10311175
    Abstract: Computer-implemented method for defining, on a three-dimensional model of an object (1), the points of development (6) of supporting elements (7) of the object (1) during its production through a stereolithography process. The method includes the steps of defining the surfaces or portions of surfaces (2) of the object (1) whose points are oriented towards a reference plane (?); of tracing a predefined grid of points (3) on each one of the surfaces or portions of surfaces (2); of identifying, for each one of the surfaces or portions of surfaces (2), the presence of at least one local minimum point (5) with respect to the reference plane (?); of adapting, for each one of said surfaces or portions of surfaces (2), the grid of points (3) so that one of the points of the grid (3) substantially coincides with the local minimum point (5); and of identifying the points of the adapted grid (3) as points of development (6) of the supporting elements (7) for each one of said surfaces or portions of surfaces (2).
    Type: Grant
    Filed: March 20, 2015
    Date of Patent: June 4, 2019
    Assignee: DWS S.R.L.
    Inventor: Alessandro Marozin
  • Patent number: 10299896
    Abstract: This invention designs and builds multiple layers (two layers or more) of various dental devices, specifically denture base or denture, where printed multiple layered denture base with teeth cavities to receive artificial denture tooth materials to form final dental devices, such as partial and full dentures. It can also print denture teeth. This invention also designs and prints multiple layers (two layers or more) of denture base with artificial denture teeth to form final dental devices, such as partial and full dentures. A method for manufacturing a layered denture is provided. The invention provides a multiple layered denture base materials for printing a denture base. The invention also provides a multiple layered denture tooth materials for printing artificial denture teeth. Highly shape adjustable or shape memory polymer layer(s) may be used in these multiple layered denture base forms.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: May 28, 2019
    Assignee: DENTSPLY SIRONA Inc.
    Inventors: Benjamin J Sun, Dan Ammon
  • Patent number: 10279546
    Abstract: In structural body formation, influence of misalignment between an in-process structural body layer and a support member layer on the shape accuracy is reduced. A method for manufacturing a structural body includes: forming a model forming layer from a liquid model forming material on an existing surface formed of at least one of prepared model forming layer and support member; while a defining surface of a defining member defining the upper surface of the model forming layer is in contact therewith; supplying a support material to fill between the existing surface and the defining surface and solidifying the support material into a support member to form a layer of the model forming layer and the support member; removing the defining member; and providing a layer of a model forming layer and a support member on the surface of the layer exposed by removal of the defining member.
    Type: Grant
    Filed: June 16, 2014
    Date of Patent: May 7, 2019
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Hiroshi Taniuchi, Kazuhiro Nakajima
  • Patent number: 10234846
    Abstract: A method and device for determining an optimum manufacturing variant for manufacturing a product from currently available manufacturing alternatives of one or more manufacturing plants, and for creating the associated manufacturing documents based on the following steps: creating a product-specific, manufacturing plant-independent CAD manufacturing specification of the product to be manufactured; determining different possible manufacturing alternatives for manufacturing the product based on the created product-specific, manufacturing plant independent CAD-manufacturing specification and the available manufacturing machines; generating a specific CAD-model for each determined manufacturing alternative, wherein a feedback report is created by an associated CAM-engine for each generated specific CAD-model; evaluating the created feedback reports of the different manufacturing alternatives in order to determine the manufacturing alternatives that are suitable for manufacturing the product and to evaluate whether
    Type: Grant
    Filed: July 7, 2014
    Date of Patent: March 19, 2019
    Assignee: Siemens Aktiengesellschaft
    Inventors: Tobias Jäger, Rupert Maier
  • Patent number: 10232555
    Abstract: The plastic welding device comprises first and second tools arranged respectively at a first support and a second support. The first tool is further movable by a first drive with respect to the first support in a first direction linearly between a first position and a second position. The movement along the first direction is defined by a first imaginary spherical coordinate system, the origin of which is arranged in the first position of the first tool. The z-axis as a first z-axis extends in the direction of the second support. For a first inclination angle between the first z-axis which is positive in the direction of the second support and the first direction it applies 0??1??/2, whereby a first component in the first tool can be brought into engagement with a second component in the second tool.
    Type: Grant
    Filed: November 10, 2015
    Date of Patent: March 19, 2019
    Assignee: BRANSON ULTRASCHALL Niederlassung der Emerson Technologies GmbH & Co. OHG
    Inventor: Silvio Fuchs
  • Patent number: 10195693
    Abstract: The present disclosure provides three-dimensional (3D) objects, 3D printing processes, as well as methods, apparatuses and systems for the production of a 3D object. Methods, apparatuses and systems of the present disclosure may reduce or eliminate the need for auxiliary supports. The present disclosure provides three dimensional (3D) objects printed utilizing the printing processes, methods, apparatuses and systems described herein.
    Type: Grant
    Filed: January 5, 2017
    Date of Patent: February 5, 2019
    Assignee: VEL03D, INC.
    Inventors: Benyamin Buller, Erel Milshtein, Sherman Seelinger
  • Patent number: 10167409
    Abstract: The current three-dimensional object manufacturing technique relies on the deposition of a pseudoplastic material in gel aggregate state. The gel flows through a deposition nozzle because the applied agitation and pressure shears the bonds and induces a breakdown in the material elasticity. The elasticity recovers immediately after leaving the nozzle, and the gel solidifies to maintain its shape and strength.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: January 1, 2019
    Assignee: MASSIVIT 3D PRINTING TECHNOLOGIES LTD
    Inventors: Nataly Lisitsin, Yoav Miller, Igor Yakubov, Moshe Uzan, Victoria Gordon
  • Patent number: 10105903
    Abstract: The method comprises sequentially forming a plurality of layers in a configured pattern corresponding to the shape of the object, thereby forming the object. The formation of each layer comprises dispensing at least one uncured building material, and at least partially curing the uncured building material, wherein for at least one layer, the curing is initiated at least t seconds after commencement of curing of a layer immediately preceding that layer. The t parameter is longer than the number of seconds required for the formation of the layer.
    Type: Grant
    Filed: November 28, 2011
    Date of Patent: October 23, 2018
    Assignee: Stratasys Ltd.
    Inventors: Avraham Levy, Keren Regev, Claudio Rottman, Shai Hirsch
  • Patent number: 10052812
    Abstract: A printed target model is formed by 3D printing by inputting target model data, and based on target model data, identifying surface portions requiring support. The surface portions are projected onto a virtual printer table, and one or more virtual support structures having a V-shaped cap portion and optionally a generally planar web are created therefore. The virtual model is then used to control a 3D printer to integrally print-form the target model and support structures.
    Type: Grant
    Filed: January 12, 2016
    Date of Patent: August 21, 2018
    Assignee: UNIVERSITY OF WINDSOR
    Inventor: Jill Urbanic
  • Patent number: 10022913
    Abstract: A cartridge (1) for a stereolithography machine, comprising: a container (2) provided with an access opening (3) and with a transparent bottom (4) opposite the access opening (3); a reservoir (5) suited to contain a liquid or pasty base material, unremovably associated with the container (2); valve means (6) suited to allow the passage of the base material from the reservoir (5) to the container (2), configured to open when the difference between the pressure present in the reservoir (5) and the pressure present in the container (2) is at least equal to a predefined value and to close spontaneously when the pressure difference is lower than the predefined value, the reservoir (5) comprising tight connection means (7) for connection to an external air feeding device (8).
    Type: Grant
    Filed: December 17, 2014
    Date of Patent: July 17, 2018
    Inventor: Ettore Maurizio Costabeber
  • Patent number: 9974191
    Abstract: Manufacturing quality of a semiconductor device can be improved, and manufacturing throughput can be improved. A method of manufacturing a semiconductor device includes (a) placing a substrate on a substrate supporting unit installed in a processing chamber, the substrate having thereon a solder with an oxygen-containing film on a surface thereof, (b) reducing the oxygen-containing film by supplying a reducing gas into the processing chamber while maintaining a thermal conductivity of an inner atmosphere of the processing chamber at a first thermal conductivity, and (c) melting the solder by supplying a thermally conductive gas into the processing chamber while maintaining the thermal conductivity of the inner atmosphere of the processing chamber at a second thermal conductivity higher than the first thermal conductivity.
    Type: Grant
    Filed: July 22, 2015
    Date of Patent: May 15, 2018
    Assignee: HITACHI KOKUSAI ELECTRIC INC.
    Inventor: Yasutoshi Tsubota
  • Patent number: 9937557
    Abstract: A method and apparatus for forming objects. Layers of precursor material may be placed on top of each other. The layers of precursor material may be selectively cured as the layers of precursor material are placed on top of each other to form an object and a frame associated with the object.
    Type: Grant
    Filed: December 4, 2016
    Date of Patent: April 10, 2018
    Assignee: THE BOEING COMPANY
    Inventor: Brett Ian Lyons
  • Patent number: 9908315
    Abstract: A composite panel configured for use with a sidewall of a trailer includes an outer metal sheet, an inner metal sheet, and a core member positioned between the inner and outer metal sheets. The core member includes a plurality of apertures formed therethrough such that each aperture extends from an inner surface of the core member to an outer surface of the core member. Illustratively, the plurality of apertures is covered by the inner and outer metal sheets.
    Type: Grant
    Filed: August 7, 2014
    Date of Patent: March 6, 2018
    Assignee: Wabash National, L.P.
    Inventor: Dwaine D. Speer
  • Patent number: 9905811
    Abstract: A method of manufacturing a joined body, including: covering a first area and a second area of a first substrate with a sheet of resin in uncured state; separating a part of the sheet covering the second area from the first substrate, the separating performed after the covering; and joining the first substrate with a second substrate by arranging the second substrate to face the first substrate with a part of the sheet covering the first area between the first substrate and the second substrate, and curing the resin in the part of the sheet covering the first area, the joining performed after the separating. In the method, during the separating, a phase difference ? between stress and strain in the part of the sheet covering the second area is no greater than 48 degrees.
    Type: Grant
    Filed: August 6, 2013
    Date of Patent: February 27, 2018
    Assignee: JOLED INC.
    Inventor: Hiroko Okumura
  • Patent number: 9844912
    Abstract: A hollow conduit is provided. In another aspect, a quick connector, suitable to carry fluid therethrough, is made of layers of material, a light curable material and/or multiple built-up materials. Another aspect uses a three-dimensional printing machine to emit material from an ink jet printing head to build up a conduit.
    Type: Grant
    Filed: November 27, 2013
    Date of Patent: December 19, 2017
    Assignee: A. Raymond et Cie
    Inventors: Todd L. Hemingway, Nicholas Jackson
  • Patent number: 9770869
    Abstract: A method and system for printing a three-dimensional part, which includes printing a plurality of successive layers of the three-dimensional part with the additive manufacturing system based on bitslices in a bitslice stack, measuring surface heights of the successive layers after each of the successive layers are printed, determining differences between the measured surface heights and predicted stack heights of the bitslices, identifying one or more topographical error regions based on the determined differences, and modifying the bitslice stack to compensate for the one or more topographical error regions.
    Type: Grant
    Filed: March 18, 2014
    Date of Patent: September 26, 2017
    Assignee: Stratasys, Inc.
    Inventors: James W. Comb, Zeiter S. Farah, J. Samuel Batchelder
  • Patent number: 9767224
    Abstract: Systems and methods are provided for designing and fabricating contact-free support structures for overhang geometries of parts fabricated using electron beam additive manufacturing. One or more layers of un-melted metallic powder are disposed in an elongate gap between an upper horizontal surface of the support structure and a lower surface of the overhang geometry. The powder conducts heat from the overhang geometry to the support structure. The support structure acts as a heat sink to enhance heat transfer and reduce the temperature and severe thermal gradients due to poor thermal conductivity of metallic powders underneath the overhang. Because the support structure is not connected to the part, the support structure can be removed freely without any post-processing step.
    Type: Grant
    Filed: May 13, 2014
    Date of Patent: September 19, 2017
    Assignees: The Board of Trustees of The University of Alabama, The United States of America as Represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Yuag-Shan Chou, Kenneth Cooper
  • Patent number: 9738075
    Abstract: A liquid discharge head provided with a member having discharge ports formed configured to discharge liquid thereon, wherein a discharge port surface of the member having discharge ports arrayed thereon includes fumed silica.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: August 22, 2017
    Assignee: Canon Kabushiki Kaisha
    Inventors: Masaki Ohsumi, Kenji Fujii, Junichi Kobayashi, Ken Ikegame, Nobuhisa Tanahashi
  • Patent number: 9726799
    Abstract: A method of manufacturing a double-sided polarizing plate and a double-cited polarizing plate manufactured using the same are disclosed. The method of manufacturing a double-sided polarizing plate including attaching transparent films to both surfaces of a polarizer via adhesive layers; irradiating the adhesive layers with active energy rays in an amount of light of 200 mJ/cm2 or more through an energy source located in a single direction, based on the polarizer; and thermally treating a surface of the transparent film provided to oppose the energy source at a temperature of from 10° C. to 25° C.
    Type: Grant
    Filed: March 28, 2014
    Date of Patent: August 8, 2017
    Assignee: LG CHEM, LTD.
    Inventors: Eun-Soo Huh, Eun-Mi Seo, Kwang-Seung Park, Mi-Rin Lee, Yong-Il Cho
  • Patent number: 9714858
    Abstract: A consumption meter is provided with a conductive feed through for external communication equipment. The meter comprises a housing (104) which forms a closed compartment when an opening of the housing is closed with a cover (106). The compartment includes a communication module (204) and the conductive feed through comprises at least one conductive path (202, 408) from the communication module (204) to an outside part of the meter (102), which outside part is subject to ambient conditions. The path is provided via the opening of the housing and a sealing means (210) in the opening of the housing is used to seal against a first surface (308) of the conductive path when the cover is attached to the housing.
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: July 25, 2017
    Assignee: KAMSTRUP A/S
    Inventors: Peter Schmidt Laursen, Søren Tønnes Nielsen, Jens Lykke Sørensen
  • Patent number: 9708518
    Abstract: The present invention relates to an optical transparent dual cure adhesive, and process for preparing this dual cure adhesive, and uses thereof. More particularly, the present invention relates to optical transparent adhesive, which is both capable of being UV-light cured and thermal cured, for example, it can be used for the bonding of touch screen of an electronic device and substrate.
    Type: Grant
    Filed: October 5, 2015
    Date of Patent: July 18, 2017
    Assignees: Henkel AG & Co. KGaA, Henkel IP & Holding GmbH
    Inventors: Rui Zhang, Daoqiang Lu
  • Patent number: 9688014
    Abstract: A transfer system (1) for transferring a fine transfer pattern (M1) formed in a mold (M) to a to-be-molded material (D) provided on a substrate (W) includes a positioning device (3) configured to position the substrate (W) relative to the mold (M) and to bond the mold (M) and the substrate (W) together after the positioning, and a transfer device (5) provided separately from the positioning device (3) and configured to receive the mold (M) and the substrate (W) positioned and bonded together by the positioning device (3), and to cure the to-be-molded material (D) while pressing the mold (M) and the substrate (W) thereby to perform transfer.
    Type: Grant
    Filed: August 31, 2011
    Date of Patent: June 27, 2017
    Assignee: TOSHIBA KIKAI KABUSHIKI KAISHA
    Inventors: Tatsuya Shimoda, Mitsunori Kokubo, Yuki Sugiura
  • Patent number: 9658363
    Abstract: The present application generally relates to EAA films including at least one triazine-based ultraviolet absorber. The present application also generally related to retroreflective sheeting including an EAA film including a triazine-based ultraviolet absorber. One embodiments of the present application relates to a film, comprising poly(ethylene-co-acrylic acid) and a triazine-based UVA. Another embodiment of the present application relates to retroreflective sheeting, comprising: a plurality of cube corner elements; and a body layer adjacent to the cube corner elements, the body layer including poly(ethylene-co-acrylic acid) and a triazine-based UVA.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: May 23, 2017
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: David W. Meitz, Bimal V. Thakkar, David M. Burns, David B. Olson, Lee A. Pavelka
  • Patent number: 9582615
    Abstract: A method of modeling may include obtaining an input file defining a first geometry, establishing a control related to the first geometry, adjusting the control, and using a thin plate spline transform to adjust the first geometry to a second geometry based on the control.
    Type: Grant
    Filed: January 16, 2014
    Date of Patent: February 28, 2017
    Assignee: Jostens, Inc.
    Inventor: Carlos D. Carbonera
  • Patent number: 9550326
    Abstract: Stereolithography machine (1) comprising: a container (2) for a fluid substance (14); a source (3) of predefined radiation (3a) suited to solidify the fluid substance (14); an optical unit (4) suited to direct the radiation (3a) towards a reference surface (5) in the fluid substance (14); a logic control unit (6) configured to control the optical unit (4) and/or the source (3) so as to expose a predefined portion of the reference surface (5). The optical unit (4) comprises a micro-opto-electro-mechanical system (MOEMS) (7) provided with a mirror (8) associated with actuator means (7a) for the rotation around at least two rotation axes (X, Y) incident on and independent of each other, arranged so that it can direct the radiation (3a) towards each point of the reference surface (5) through a corresponding combination of the rotations around the two axes (X, Y).
    Type: Grant
    Filed: December 24, 2012
    Date of Patent: January 24, 2017
    Inventor: Ettore Maurizio Costabeber
  • Patent number: 9284212
    Abstract: A method for bending a sheet of material into a shaped article includes providing the sheet of material. A reformable area and a non-reformable area of the sheet of material are heated to a first temperature range corresponding to a first viscosity range. The reformable area of the sheet of material is subsequently heated to a second temperature range corresponding to a second viscosity range. The reformable area of the sheet of material is reformed into a selected shape by at least one of sagging the reformable area of the sheet of material and applying a force to the sheet of material outside of or near a boundary of the reformable area.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: March 15, 2016
    Assignee: CORNING INCORPORATED
    Inventors: Thierry Luc Alain Dannoux, Arnaud Dejean, Allan Mark Fredholm, Patrick Jean Pierre Herve, Laurent Joubaud, Sophie Peschiera, Stephane Poissy
  • Patent number: 9080084
    Abstract: Photolytically induced redox curable compositions, which show a delayed onset of cure resulting in controllable “open times” for the end user consumer, are provided. These compositions are activated by exposure to electromagnetic radiation, such as UV/VIS radiation with a wavelength in the range of 254-470 nm, but show a commercially meaningful “open time” prior to cure. This property is particularly attractive when opaque substrates and/or substrates with low transmissivity are to be assembled.
    Type: Grant
    Filed: January 9, 2014
    Date of Patent: July 14, 2015
    Assignee: Henkel IP & Holding GmbH
    Inventor: Mark M. Konarski
  • Patent number: RE46489
    Abstract: A mounting apparatus for a cooling device is disclosed. The mounting apparatus includes a plurality of connectors extending outwardly from the cooling device. The mounting apparatus also includes at least one mounting post coupled to the plurality of connectors and configured to mount the cooling device on a substrate.
    Type: Grant
    Filed: November 11, 2014
    Date of Patent: July 25, 2017
    Assignee: General Electric Company
    Inventors: Mehmet Arik, Charles Erklin Seeley, Yogen Vishwas Utturkar, William Edward Burdick, Jr., Kunal Ravindra Goray, Stanton Earl Weaver