Abstract: The invention relates to a method for the manufacture of a sensor element and to a sensor element. In the method, both surfaces of a sensor film are provided with metallic electrodes. The sensor element is produced by cutting it from a larger amount of sensor element material. In the manufacture of the sensor element material, the electrodes are produced as a continuous process from roll to roll and the sensor element material is formed by laminating as a continuous process from roll to roll. At least the signal electrode consists of repeated electrode patterns (41) which are at least partially connected to each other via one or more narrow connecting strips (42), and a sensor element of a desired length and/or shape is produced by cutting the material across the region of the connecting strips.

Abstract: A substrate bonding method for mutually bonding substrates, has a first radiation step for irradiating the surfaces of the individual substrates with an oxygen particle beam, a second radiation step for irradiating the surfaces of the individual substrate with a nitrogen particle beam simultaneously with or subsequently to the first radiation step, and a step for stacking the individual substrates and bringing the surfaces thereof into close contact. Particularly, the substrates which have been irradiated first with an oxygen plasma and subsequently with a nitrogen plasma are stacked and bonded.

Abstract: A welding apparatus is provided with a lamp unit having a light source such as a halogen lamp and a multiple reflection surface. The light source applies incoherent electromagnetic waves that belong to a visible region and a near-infrared region in which a wavelength is 500 nm (nanometer) or more. The multiple reflection surface reflects and collects the light from the light source in the shape of a desired dot or line. The housing and the transparent cover are superimposed, and the light from the light source is collected by the multiple-reflection surface on the portion where the housing is superimposed on the transparent cover.

Abstract: A method of manufacture and assembly of multiwell plates employing targeted radiation at an interface in order to achieve bonding is disclosed. The method accommodates glass and polymer attachment as well as polymer to polymer attachment. Resultant plates have unique flatness and optical properties.

Abstract: Disclosed is an optical device which can be formed as a thinner layer by a simplified manufacturing process at a reduced cost. Specifically, the optical device has a multilayer structure wherein a polyvinyl alcohol- or polyvinylene-base polarizing film (b) and protective films (a and c) are directly laminated on top of another without any adhesive layer including a pressure sensitive adhesive layer interposed therebetween. The protective film (c) on one side is composed of a triacetyl cellulose, an alicyclic polyolefin resin, or an alicyclic acrylic resin, and the protective film (a) on the other side is composed of a triacetyl cellulose, a polycarbonate, a polyethylene terephthalate, a polyethylene naphthalate, a (meth)acrylate resin, an alicyclic polyolefin resin, or an alicyclic acrylic resin.

Abstract: Method of coating a web-form carrier material with an aqueously dispersed composition, the composition being applied to the carrier material with a suitable applicator with a coatweight of at least 10 g/m2 (dry) and the subsequent drying of the coated carrier material taking place in a suspension drying unit.

Abstract: One exemplary embodiment includes a fuel cell component having comprising a carbon chain, and a material grafted to the coating/surface, wherein the material includes ionic or polar groups. One embodiment includes composite plates which include carbon that can be activated and treated to make their surface hydrophilic.

Abstract: A suspension board with circuit includes a metal supporting board, a conductive layer laminated on the metal supporting board, and a via layer interposed between the metal supporting board and the conductive layer. The conductive layer includes a conductive pattern, and a reference portion serving as a positioning reference for placing the suspension board with circuit on a load beam.

Abstract: A dicing die-bonding film comprising a dicing film having a pressure-sensitive adhesive layer on a base and a die-bonding film on the pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer comprising an acrylic pressure-sensitive adhesive comprising an acrylic polymer which comprises an acrylic ester, a hydroxyl group-containing monomer where a ratio is in a range of 10-40 mol % to 100 mol % of the acrylic ester, an isocyanate compound having a radical reactive carbon-carbon double bond where a ratio is in a range of 70-90 mol % to 100 mol % of the hydroxyl group-containing monomer, and a compound having two or more radical reactive carbon-carbon double bonds where a ratio is in a range of 10-60 parts by weight to 100 parts by weight of the acrylic polymer, and the die-bonding film is formed from an epoxy resin and is laminated on the pressure-sensitive adhesive layer.

Abstract: An optical compensatory film of a laminated structure comprising a first optically anisotropic layer having an Re(550) of 20 to 100 nm wherein retardation at a wavelength of 550 nm is never 0 nm along any direction and the direction along which the absolute value of retardation at a wavelength of 550 nm reaches minimum does not exist along the normal direction of the layer or on the in-plane of the layer; and a second optically anisotropic layer having an Re(550) of 20 to 150 nm and an Rth(550) of 40 to 110 nm with Re(450) Re(550)<?3 nm and Rth(450)?Rth(550)>3 nm.

Abstract: The invention relates to a solvent-free, reactive composition comprising at least a photoinitiator and a polymer A, capable of reacting under UV-radiation using a photoinitiator and optionally further components, characterised in that the polymer A contains at least one in-chain olefinically unsaturated group and that the polymer A and/or a polymer B contains further a) at least two groups capable of reacting in the presence of moisture, and/or b) at least two olefinically unsaturated groups in terminal position, and/or c) at least one group capable of reacting in the presence of moisture and at least one olefinically unsaturated group in terminal position. The invention relates also to the process making the same, and its use as adhesive and/or as coating composition.

Abstract: A method of fabricating a joined wafer has an exposure process which comprises a device formed-area exposure process of exposing by a stepper such that parts of the photosensitive adhesive layer formed over a surface of the transparent wafer or the device formed wafer are removed, the parts corresponding to the device formed areas when the transparent wafer and the device formed wafer are stuck together; and a wafer periphery exposure process of exposing such that a portion of the photosensitive adhesive layer over the periphery of the transparent wafer is left.

Abstract: A double layer capacitor (DLC) containing at least one double layer capacitor cell is provided. Each double layer capacitor cell contains two current collectors, each containing a metallized carrier film with upper and lower planar surfaces, two thin electrode layers in direct contact with the lower and upper planar surfaces of the metallized carrier films of the first and second current collectors, and a polymer electrolyte layer in direct contact with the first and the second thin electrode layers. The polymer electrolyte is applied as a liquid which impregnates and encases the electrode layers and then solidified to form the electrolyte layer. The resulting DLC is preferably no thicker than about 20 microns, and may be as thin as 5 microns. Methods of producing a DLC and for forming a cross-linked electrolyte are also provided.

Abstract: A multilayer polarizing structure is produced on a temporary support. The structure comprises at least one orienting layer and one polarizing layer comprising dichroic dyes, the dichroic dyes having an angular orientation determined by the orienting layer. The multilayer structure is separated from the temporary substrate before being applied onto a surface of an optical element. Applying the structure onto the optical element may be easily carried out while obtaining a quality compatible with many uses of the optical element, in particular ophthalmic uses.

Abstract: A building element (1) that is suitable for use as a structural element in wet areas or external docking. The building element (1) comprises a rigid substrate (2) having an upper face (3). Over the first face (3) lies a radiation curable resin (4) into which a layer of reinforcing material (5) is at least partially embedded. The reinforcing material (5) and resin (3) can be applied separately or together onto the first face (3) of the rigid substrate (2) or in some cases can be applied to both faces. An apparatus and method for producing the building sheet are also disclosed.

Abstract: A method and apparatus for making adhesive-backed labels. Glassine paper stock is unwound from a roll, coated with photo-cationic silicone and exposed to wavelength-controlled illumination to cure. Hot melt adhesive is applied over the silicone. Simultaneously, label stock is fed with the coated glassine paper to laminating rollers where the two are joined. Illumination is provided by a dichroic reflector.

Abstract: A method for making a polymeric microfluidic structure in which two or more components (layers) of the microfluidic structure are fixedly bonded or laminated with a weak solvent bonding agent, particularly acetonitrile or a mixture of acetonitrile and alcohol. In an aspect, acetonitrile can be used as a weak solvent bonding agent to enclose a microstructure fabricated in or on a non-elastomeric polymer such as polystyrene, polycarbonate, acrylic or other linear polymer to form a three-dimensional microfluidic network. The method involves the steps of wetting at least one of the opposing surfaces of the polymeric substrate components with the weak solvent bonding agent in a given, lower temperature range, adjacently contacting the opposing surfaces, and thermally activating the bonding agent at a higher temperature than the lower temperature range for a given period of time. The contacted polymeric substrates may also be aligned prior to thermal activation and compressed during thermal activation.

Abstract: The invention relates to a process for bonding by molecular adhesion of two substrates to one another during which the surfaces of the substrates are placed in close contact and bonding occurs by propagation of a bonding front between the substrates. The invention includes, prior to bonding, a step of modifying the surface state of one or both of the surfaces of the substrates so as to regulate the propagation speed of the bonding front. The surface can be modified by locally or uniformly heating or roughening the surface(s) of the substrate(s).

Abstract: The present invention relates to a process for producing a resin composite molded article comprising bonding a molded article (A) of a resin A which contains a polymer containing an alicyclic structure and a molded article (B) of a resin B to produce a resin composite molded article, the bonding including a step 1 of applying at least one activation treatment selected from plasma application, excimer ultraviolet irradiation, and corona discharge to the bonding surface of the molded article (A), followed by a treatment with a silane coupling agent (A), a step 2 of applying at least one activation treatment selected from plasma application, excimer ultraviolet irradiation, and corona discharge to the bonding surface of the molded article (B), and a step 3 of superposing the bonding surface of the molded article (A) on the bonding surface of the molded article (B), and press-bonding the bonding surfaces.

Abstract: Provided is an anisotropic conductive film, containing: an insulating layer formed of an insulating resin composition; and a conductive particle-contained layer containing a photo and thermal curing resin composition and conductive particles, the conductive particles being aligned into a monolayer in a portion adjacent to an interface with the insulating layer, in which the conductive particle-contained layer has a degree of cure which is gradually lowered in a thickness direction of the conductive particle-contained layer, from the side where the conductive particles are present to the side where the conductive particles are not present.

Abstract: An electro-optic display comprises a layer (130) of a solid electro-optic material, at least one electrode disposed adjacent the layer (130) of electro-optic material, and a layer (180) of a lamination adhesive interposed between the layer (130) of electro-optic material and the electrode, the lamination adhesive (180) having a higher electrical conductivity in a direction perpendicular to the layer of lamination adhesive than in the plane of the layer.

Abstract: The present invention relates to a method for bonding two surfaces to one another. The invention particularly pertains to the use of such method in which one of the surfaces is a polymeric plastic (and more preferably a polymeric thermoplastic (especially poly-(methyl methacrylate) (“PMMA”) or cyclic olefin copolymer (“COC”)). More particularly, the invention relates to treating at least one of the contacting surfaces with UV in the presence of oxygen to thereby generate ozone (O3) and atomic oxygen under conditions of temperature below that of the glass transition temperature of the polymeric plastic. The UV/O3-mediated bonding results in high bond strength and zero-deformation method. This bonding method can be applied to micro/nano-scale polymer devices, and particularly to microfluidic devices, for a low cost, high throughput, high yield advantage.

Abstract: A method of bonding an adherent to a substrate, wherein a primer is applied to the substrate by plasma deposition and the adherent is bonded to the primer treated surface of the substrate, and the primer contains functional groups which chemically bond to functional groups in the adherent.

Abstract: A method of forming a bonded body comprised of a first base member, a second base member, and a first bonding film and a second bonding film provided between the first base member and the second base member is provided. The first bonding film and the second bonding film are constituted of copper and an organic component, and an amount of copper contained in each of the first bonding film and the second bonding film is 80 atom % or higher but lower than 90 atom % at an atomic ratio.

Abstract: A method of forming a bonded body comprised of a first base member, a second base member, and a first bonding film and a second bonding film provided between the first base member and the second base member is provided. The first bonding film and the second bonding film are constituted mainly of copper. The method is comprised of: forming the first bonding film on the first base member by using a chemical vapor-film formation method; forming the second bonding film on the second base member by using a chemical vapor-film formation method; bringing the first bonding film formed on the first base member into contact with the second bonding film formed on the second base member so that the first bonding film faces the second bonding film; and applying a compressive force to the first base member and the second base member so that the first bonding film and the second bonding film are bonded together to thereby obtain the bonded body.

Abstract: A method of arranging stacked chips by photo-curing adhesive includes the steps of disposing a first chip on a top side of a substrate and electrically connecting the first chip to the substrate by wire bonding; forming a photo-curing adhesive layer on a top side of the first chip; hardening the photo-curing adhesive layer by irradiation to convert it from colloid to solid for 70-80% degree of solidification; softening the photo-curing adhesive layer by heating of 50-80° C. to convert it from solid to semisolid to enable the photo-curing adhesive layer to be adherent; disposing a second chip on a top side of the photo-curing adhesive layer, then converting the photo-curing adhesive layer from semisolid to complete solid by heating of 100-150° C., and finally electrically connecting the second chip to the substrate by wire bonding.

Abstract: A first transport system moves a web comprising a subgasketed CCM layer and an application system applies a crosslinkable resin to at least a subgasketed portion of the subgasketed CCM layer. The crosslinkable resin preferably comprises a photocurable cationic crosslinkable resin. A first curing apparatus subjects an exposed surface of the crosslinkable resin to a photo curing process to initiate curing of the crosslinkable resin. A second transport system moves a GDL into adhering contact with a partially cured exposed surface of the crosslinkable resin of the CCM layer so as to form an MEA layer. A second curing apparatus subjects the GDL, partially cured crosslinkable resin, and CCM layer structure to a thermal curing process to substantially complete curing of the crosslinkable resin. A converting system is configured to receive the MEA layer and produce a plurality of discrete MEAs from the MEA layer.

Abstract: The invention relates to a process that makes it possible to improve the mechanical strength of bonds between substrates when these bonds are produced by means of an adhesive that comprises a resin that can be cured by chain polymerization, and in particular a resin that can be cured under the effect of ionizing or light radiation. This process is characterized in that it comprises the grafting of groups capable of acting as chain transfer agents during the polymerization of said resin to the surface of the substrates, before the latter are brought into contact with the adhesive. Applications: assembling of structural, engine, passenger compartment or bodywork parts in the aeronautical, space, railway, ship-building and automotive industries.

Abstract: A composite green sheet which comprises a green sheet including an inorganic powder and an organic binder, and a conductive layer formed thereon is prepared; the composite green sheet is then placed on a supporting surface of a base member containing a liquid; and the composite green sheet is irradiated with a laser light so as to form a through hole according to need, and thereby to evaporate the liquid contained in the base member so that waste remaining on the inner wall surface of the through hole is cleaned and removed. As a result, the conductive layer is exposed at the inner wall of the through hole penetrating the conductive layer.

Abstract: Fabrication methods for cholesteric liquid crystal display devices are presented. A roll of a first substrate is conveyed from a first direction. A patterned enclosure structure is formed on the roll of the first substrate, wherein the patterned enclosure structure includes a plurality of stripes for dividing liquid crystals. A roll of a second substrate is conveyed from a second direction. An adhesion layer is formed on the roll of the second substrate. The first and the second substrates are assembled by dual rollers, thereby tightly combining the adhesion layer and the patterned enclosure structure.

Abstract: There is provided an underlayer coating that is used as an underlayer of photoresists in lithography process of the manufacture of semiconductor devices and that has a high dry etching rate in comparison to the photoresists, does not intermix with the photoresists, and is capable of flattening the surface of a semiconductor substrate having holes of a high aspect ratio; and an underlayer coating forming composition for forming the underlayer coating. The underlayer coating forming composition for forming by light irradiation an underlayer coating used as an underlayer of a photoresist in a lithography process of the manufacture of semiconductor devices, comprises a polymerizable substance and a photopolymerization initiator.

Abstract: A pressure-sensitive adhesive optical film of the present invention comprises an optical film; and a pressure-sensitive adhesive layer laminated on at least one side of the optical film, wherein the pressure-sensitive adhesive layer is formed from an acrylic pressure-sensitive adhesive comprising a (meth)acrylic polymer comprising 30 to 99.99% by weight of an alkyl (meth)acrylate monomer unit and 0.01 to 15% by weight of a functional group-containing monomer unit, and the (meth)acrylic polymer in the acrylic pressure-sensitive adhesive is crosslinked by electron beam irradiation. The pressure-sensitive adhesive optical film has a high level of reworkability, durability and workability.

Abstract: Disclosed is a laminate comprising, on a support: an insulating resin composition layer configured to produce a reactive active species when provided with energy; and a reactive polymer precursor layer containing a compound configured to react with the insulating resin composition layer and form a polymer compound.

Abstract: A pressure-sensitive adhesive for an optical film of the present invention comprises a (meth)acrylic polymer comprising 50 to 99.99% by weight of alkyl (meth)acrylate monomer unit and 0.01 to 30% by weight of a photocrosslinkable monomer unit having an unsaturated double bond-containing polymerizable functional group and a photocrosslinkable moiety different from the functional group. A pressure-sensitive adhesive layer is formed from the pressure-sensitive adhesive on at least one side of an optical film, wherein the photocrosslinkable moiety of the (meth)acrylic polymer in the pressure-sensitive adhesive is crosslinked by active energy ray irradiation. The pressure-sensitive adhesive can form the pressure-sensitive adhesive layer with a high level of durability and preferable workability.

Abstract: The present invention provides a magnetic recording medium having superior startup operation and durability as well as satisfactory surface lubricity. The present invention relates to a method of manufacturing a magnetic recording medium in which at least a magnetic layer, a protective film layer and a lubricant layer are sequentially laminated on a non-magnetic substrate, wherein the lubricant layer is surface treated using a gas activated by plasma generated at a pressure in the vicinity of atmospheric pressure. The present invention also relates to a magnetic recording medium produced according to the aforementioned manufacturing method.

Abstract: The present invention relates to a flame retardant resin composition for a printed circuit board and a printed circuit board using the same, in more detail, to a flame retardant resin composition which includes a complex epoxy resin, photo acid generator, a curing agent, a curing accelerator, and an inorganic filler, so that UV curable and property-maintainable insulating material can be manufactured, and to a printed circuit board using the same. The flame retardant resin composition according to the present invention contains a photo acid generator instead of an acrylate reactive diluent which is included UV curable insulating material so that fine patterned printed circuit board can be manufactured through UV curing and post thermal curing.

Abstract: Methods and systems for manufacturing environmentally-safe cardstock for cards are provided. An environmentally safe core material may be printed with content using environmentally safe ink. Further, a layer of environmentally safe laminate material and annotation material may be applied to the core material. The layer is adhered to the core material by activating an environmentally safe adhesive associated with the laminate material through application of pressure without requiring application of heat.

Abstract: A base member with a bonding film that can be firmly bonded to an object with high dimensional accuracy and efficiently bonded to the object at a low temperature, a bonding method which is capable of efficiently bonding such a base member and the object at a low temperature, and a bonded body formed by firmly bonding the base member and the object with high dimensional accuracy and therefore being capable of providing high reliability are provided. The base member is adapted to be bonded to an object through the bonding film thereof.

Abstract: Methods and apparatuses for making improved carpet are disclosed comprising the use of plasma discharge units to treat carpet backing surfaces to improve the adhesion of carpet backing layers, the adhesion of carpet backing to the carpet segments and to improve the adhesion of the exterior of the carpet backing to surfaces to which the carpet is applied.

Abstract: A fluidic structure and a method for production of a fluidic structure are provided. The method may comprise, in order, introducing at least one externally accessible opening into at least one base substrate of the fluidic structure, partially introducing at least one section of a fluidic conductor, which has at least one inner lumen and at least one conductor wall, in particular of a tube or flexible tube, into the at least one opening, introducing at least one curable fluid sealing material into the at least one opening, entirely or partially curing the at least one fluid sealing material, and producing at least one connecting channel between at least one inner lumen in the at least one fluidic conductor and at least one fluid channel in the fluidic structure, the at least one connecting channel passing through at least one conductor wall.

Abstract: The direct deposit of photoelectric materials onto low-cost prefabricated patterned flexible electrodes provided by the present invention introduces a new design approach that permits the development of innovative lightweight, durable and non-planar sensing systems. By extending single and multi-spectral bioelectronic sensing technology to flexible plastic substrates, the invention offers a number of potential advantages over structurally rigid silicon-based microelectronics (e.g. CMOS) including a reduction in spatial requirements, weight, electrical power consumption, heat loss, system complexity, and fabrication cost.

Abstract: An object of the present invention is to provide a curable composition excellent in on-site formability, excellent in heat resistance, chemical resistance and oil resistance, and low in compression set. The invention relates to a curable composition comprising (a) a vinyl-based polymer containing at least one (meth)acryloyl group in a molecule thereof and having a number average molecular weight of 500 to 1,000,000, (b) an ethylenic unsaturated group-containing compound, (c) a thixotropic property-imparting agent, (d) fumed silica surface-treated with a (meth)acryloyl group-containing silane and (e) a photopolymerization initiator.

Abstract: A method for fabricating a rigid lamination. The method includes providing a first rigid substrate, disposing an adhesive on a surface of the first rigid substrate and disposing a second rigid substrate on at least a portion of the adhesive. The second rigid substrate has a first end and a second end. The second rigid substrate is heated to a substantially uniform temperature, where the temperature is sufficient to melt the adhesive. A non-uniform pressure is applied to a surface of the second rigid substrate. The non-uniform pressure includes a lesser pressure and a greater pressure, where the greater pressure is applied at the first end of the second rigid substrate and is sufficient to impart adhesive flow in a direction toward the second end.

Abstract: An organic light emitting diode (OLED) display device and a method of fabricating the same are disclosed. In one embodiment, the method includes: i) preparing a support and a flexible layer, ii) forming a first metal layers on one side of a support and a second metal layer on one side of a flexible layer, iii) performing a cleaning process to the first metal layer and the second metal layer, iv) forming a first radical layer on the first metal layer and a second radical layer on the second metal layer and v) joining the first and second radial layers to each other. At least one embodiment of the invention enhances process convenience and manufacturing yield, and reduces manufacturing costs and time for a flat panel display device having a flexible substrate.

Abstract: The recording medium comprises at least a first (L1) and a second (L2) micro-structured stage assembled by an adhesive layer (4) and arranged between micro-structured bottom (2) and top substrates. A polymerizable layer forming the adhesive layer (4) is deposited on the first stage (L1). Then a micro-structured transparent matrix (5) is provisionally placed on the adhesive layer (4) so as to micro-structure the adhesive layer (4). Polymerization of the adhesive (4) is performed by exposure, through the matrix (5), with a polymerization light. Then the matrix (5) is removed and the second stage (L2) is deposited on the micro-structured adhesive layer (4). Then an additional adhesive layer (9) is deposited on the second stage (L2) and the micro-structured matrix (5) is definitively placed on the additional adhesive layer (9) so as to form the top substrate.

Abstract: An apparatus and a method for the separation of a material layer (4) hardened on a flat plane (2) serving as a reference by means of a flexible, elastic separating layer (1) arranged between plane and material layer and designed in the form of a film or a gel-like material, are provided.

Abstract: Method for producing a laser-printable film which comprises printing an engraving layer comprising a UV-curable coating onto a support film, applying an electron-beam curable coating on top of the engraving layer, and then curing the film by electron irradiation.

Abstract: An organic EL device of top emission type having a structure of a transparent conductive layer on a metal reflecting layer, and particularly an organic EL device having a high luminance with the stability capable of maintaining the high luminance over the long period of time is provided. The organic EL device includes a metal electrode layer serving as a metal reflecting film, a transparent conductive layer, an organic functional layer having an organic EL layer, and a transparent electrode layer which are successively laminated on a substrate, and a formation area of the metal electrode layer resides inside a protection area where the transparent conductive layer is formed on the substrate.

Abstract: Medical devices, and particularly intracorporeal devices for therapeutic or diagnostic uses, having a component chemically modified by plasma polymerization. The medical device comprises a substrate with a plasma polymerized functionality bonded to a surface of at least a section thereof. The plasma polymerized film on a first component of the medical device allows for bonding an agent or a second component to the first component. In one embodiment, the plasma polymerized film facilitates fusion or adhesive bonding of a first component to a second component formed of a material which is dissimilar to, incompatible with, or otherwise not readily bondable to the substrate material of the first component. In another embodiment, a bioactive agent is bonded to the plasma polymerized film on the component, for presenting or delivering the bioactive agent within a body lumen of the patient.

Abstract: A heat-shrinkable multilayer material for packaging, in particular food packaging, comprises a first layer made of heat-shrinkable material, a microwave susceptible material covering at least a part of the first layer, at least one second layer made of shrinkable or non-shrinkable material, the first and second layer can be connected to each other by embedding the microwave susceptible material, wherein the microwave susceptible material is arranged in a pattern between the first and second layer, the pattern creating areas of increased stiffness within the multilayer material when microwave energy is applied onto.