Abstract: According to one embodiment, an electronic device includes a panel, a circuit board, a first flexible wiring board, and a first IC chip. The panel includes a curved display surface, a mounting portion curved, and a plurality of first pads disposed at intervals on the mounting portion. The circuit board is a plate-like. The first flexible wiring board has a first end portion mounted on the plurality of first pads and a second end portion connected to the circuit board. The first IC chip is mounted on the mounting portion and electrically connected to the first flexible wiring board. A first center of the first flexible wiring board is closer to a third center of the panel than a second center of the first IC chip in plan view.

Abstract: Method of manufacturing a product comprising fiber reinforced polymer material, the method comprising the steps of: providing 10 carbon fibers being embedded in a thermosetting resin, heating 20 the thermosetting resin up to its cure temperature by a current flowing through at least a part of said carbon fibers, letting convert 30 the thermosetting resin to a thermoset polymer. The invention is further directed to a device for performing the method and to a composite sandwich panel structure manufactured according to the method.

Abstract: A noise attenuation panel comprises a sound absorbing honeycomb layer disposed between a perforated surface layer on an airflow facing side of the panel and a composite support layer on a second opposing side of said panel. The composite material support layer comprises an electrical heat source.

Abstract: The present disclosure relates to a semiconductor device, a solid-state image pickup element, an image pickup device, and an electronic apparatus that are enabled to reduce restrictions on materials and restrictions on device configuration. A CSP imager and a mounting substrate are connected together with a connection portion other than a solder ball. With such a configuration, restrictions on materials and restrictions on device configuration are reduced, which has conventionally occurred because it is limited to a configuration in which solder balls are used for connection. The present disclosure can be applied to image pickup devices.

Abstract: A semiconductor device includes a semiconductor chip, an electrode electrically connected to the semiconductor chip, the electrode including a looped portion, a cylindrical electrode including a main portion having a screw thread formed therein and a narrow portion continuous with the main portion, the narrow portion having a smaller width than the main portion, the cylindrical electrode being electrically connected to the electrode by the narrow portion being inserted into the looped portion, and a case for the semiconductor chip and the electrode, the case contacting the main portion while causing the screw thread and a connecting portion between the looped portion and the cylindrical electrode to be exposed.

Abstract: The present protective barrier is similar to those commonly installed beneath ceilings during construction work being performed on ceilings or roofs of buildings, wherein two or more sections are sewn together to construct the protective barrier. However, the present protective barrier also comprises a dustcover, which covers the seam entirely preventing dust from passing through holes created when the seam is sewn using a thread or similar means.

Abstract: A method for forming a connection between two tubular sections having a polymeric outer surface jacket, using electrofusion to fusion bond a casing of similar, non-crosslinked polymer to the outer surface of the tubular sections.

Abstract: The invention relates to a method for manufacture of a product or in completion of a product. A flexible mat (20) is manufactured from an incompletely cured thermo-setting plastic, wherein the mat comprises an article (10) of electrically conductive material. The incompletely cured mat (20) including the article (10) is then formed as a function of a forming tool or to lie against or for contact with a product, whereafter final curing of the mat (20) is executed by supplying electric power to the article (10) or by external heat application or ultraviolet light. The invention also relates to an arrangement and uses.

Abstract: The present protective barrier is similar to those commonly installed beneath ceilings during construction work being performed on ceilings or roofs of buildings, wherein two or more sections are sewn together to construct the protective barrier. However, the present protective barrier also comprises a dustcover, which covers the seam entirely preventing dust from passing through holes created when the seam is sewn using a thread or similar means.

Abstract: To reduce a time required for repairing a honeycomb core sandwich panel. A repair method according to the present invention is a repair method, in which a repair patch 20 is disposed on a repair target portion that exists on the side of a repair surface 1A of a honeycomb core sandwich panel 1, the honeycomb core sandwich panel 1 being formed by sandwiching a honeycomb structured core 10 with a plurality of cells between skins 11 and 12, the method including: a heating step of heating the repair patch 20; and a cooling step of cooling the honeycomb core sandwich panel 1 from the side of a second surface 1B opposing the repair surface 1A of the honeycomb core sandwich panel 1.

Abstract: The present invention sufficiently heats a repairing material while preventing change in quality of a base material provided with the repairing material so as to securely bond the repairing material to a repair target portion. The repair method of the present invention, in order to repair a repair target portion 14 existing in an outer panel 1, includes: a repairing material disposing step of disposing a repairing patch 21 including a resistance heating element 23 and a carbon fiber reinforced resin, and an adhesive 22A including a thermosetting resin before being hardened for bonding the repairing patch 21 on the repair target portion 14; and a heating-hardening step of heating and hardening the thermosetting resin of the adhesive 22A by causing the resistance heating element 23 to generate heat through supply of electricity thereto.

Abstract: A method of resistive implant welding thermoplastic composites. At least two sections of a component formed with weldable thermoplastic material are provided. The two sections of the component each have a welding surface along which the component is welded together. The welding surface includes a first surface adjoining a second surface at an angle exceeding about 30 degrees or another three dimensional shape. A first wire mesh conductor material is positioned between the welding surface of the at least two sections along the first surface. A second wire mesh conductor material is positioned between the welding surface of the at least two sections along the second surface in an overlapping manner at the angled connection. An electric current is applied to the conductors causing the conductors to heat up and melt the at least two sections of the component together.

Abstract: A composite structure cured by the process of: electrically coupling a first lead to a first portion of said composite structure; electrically coupling a second lead to a second portion of said composite structure; and using an electric power source to pass electric current through said composite structure from said first portion to said second portion, wherein passing said electric current through said composite structure causes the temperature of at least a portion of said composite structure increase to a predetermined temperature.

Abstract: The invention provides a method for pre-curing an adhesive layer bonding a first component to a second component. The adhesive layer is heated by treating an adhesive layer component as heating the first component with a pair of electrodes that are in electrical contact with a surface of the first component, the pair of electrodes applying a predetermined electrical current (I1, I2) to the first component. The invention further provides an arrangement for pre-curing a layer of adhesive.

Abstract: A joining process is proposed for connecting a first component to a second component, whereby in a first process the first component and the second component and an adhesive material arranged between the first and the second component are prepared, whereby in a second process the first and the second components are pressed together and whereby in a third process the adhesive material is hardened and further whereby spacing means are added to the adhesive material and these are at least partially resorbed in the third process by the adhesive material.

Abstract: Methods for assembling rotor blades are provided. A method includes receiving a first portion of a rotor blade at an erection site. The method further includes receiving a second portion of the rotor blade at the erection site. The method further includes aligning the first portion and the second portion at the erection site, the first portion and the second portion supported on a fixture system when aligned. The method further includes connecting a blade component of the first portion and a blade component of the second portion together at the erection site.

Abstract: The present invention includes a method for the attachment of a bracket to a panel structure comprising providing an adhesive for attaching the bracket to the panel structure; placing the bracket in a desired location on the panel structure; heating the adhesive; and hardening the adhesive so the bracket is adhered to the panel structure.

Abstract: A method of manufacturing a brake pedal coil printed circuit board is provided. The method comprises preparing a first epoxy layer having first copper foil laminated on both surfaces thereof; laminating each of second epoxy layers on the first copper foil, and laminating second copper foil on each of the second epoxy layers; forming a through hole, performing electroless copper plating on an inside surface of the through hole and the second copper foil, and forming an electrolytic copper-plated layer on each of the electroless copper-plated layer; forming circuits having a predetermined pattern on the electrolytic copper-plated layer and the electroless copper-plated layer and forming a gap between the circuits; applying a PSR ink onto the electrolytic copper-plated layer; applying a marking ink onto the PSR ink; forming a Ni-plated layer around the through hole and the hole land; and forming an Au-plated layer on the Ni-plated layer.

Abstract: A membrane switch and a method of manufacturing the same, includes upper and lower membranes printed with upper and lower conductive dots and an isolation layer between them, holes being opened in the isolation layer corresponding to the dots, the isolation layer is bonded with the upper and lower membranes respectively via the glue coated on the upper surface and the lower surface thereof; and the glue may employ hot melt glue. This method of manufacturing the membrane switch includes a coating the upper surface and/or lower surface of the isolation layer exclusive of the positions of the holes with glue; bonding and adhering the sides of the upper membrane and the lower membrane printed with the conductive dots and respectively to the upper surface and the lower surface of the isolation layer via glue, making the positions of the conductive dots and the holes corresponding to each other.

Abstract: A method in the manufacturing of an insulated electric high voltage DC termination or joint includes the steps of providing an insulated electric high voltage DC cable including an inner conductor; a polymer based insulation system, the polymer based insulation system comprising an insulation layer and a semiconducting layer; and an outer grounding layer; removing the grounding layer and the semiconducting layer in at least one end portion of the high voltage DC cable, thereby exposing the insulation layer in the at least one end portion of the high voltage DC cable; covering the insulation layer of the polymer based insulation system in the at least one end portion of the high voltage DC cable by a cover impermeable to at least one substance present in the insulation layer of the polymer based insulation system in the at least one end portion of the high voltage DC cable in a non-homogenous distribution; subjecting the insulation layer of the polymer based insulation system in the at least one end portion of

Abstract: A multilayered heat-recoverable article according to the present invention includes a cylindrical base material layer and an adhesive layer disposed on an inner peripheral surface of the base material layer, in which the base material layer contains a polyethylene and an oxidation inhibitor, the adhesive layer contains an ethylene-vinyl acetate copolymer and an oxidation inhibitor, the oxidation induction temperature of the base material layer is 255° C. to 270° C., and the oxidation induction temperature of the adhesive layer is 255° C. or higher.

Abstract: A method for manufacturing a semiconductor device includes the steps of mounting a Si interposer over a printed wiring substrate, plasma-cleaning an upper surface of the Si interposer, disposing an NCF over the upper surface of the Si interposer, and mounting a semiconductor chip over the upper surface of the Si interposer through the NCF. Also, the method includes the step of electrically coupling each of plural electrodes of a second substrate and each of plural electrode pads of the semiconductor chip with each other through plural bump electrodes by reflow, and the surface of the Si interposer is plasma-cleaned before attaching the NCF to the Si interposer.

Abstract: A multi-layer heat-shrinkable tubular sleeve (100) comprises an outer layer (110) and an inner layer (120). The outer layer (110) is arranged around the inner layer (120). The outer layer (110) comprises a partially crystalline thermoplastic material with a major part of partially crystalline thermoplastic material with a crystallinity of more than 60%. The inner layer (120) comprises a partially crystalline thermoplastic material or an elastomeric material.

Abstract: Methods and apparatus relating to provision and/or utilization of a hidden feature for accessing and/or repairing mobile devices are described. An embodiment includes a wire physically adjacent to an adhesive. The adhesive bonds a first portion of a computing device and a second portion of the computing device. The wire is capable of being heated in response to application of electrical voltage or current. In turn, the heated wire causes cutting of the adhesive to allow for physical separation of the first portion of the computing device and the second portion of the computing device. Another embodiment utilizes a hidden end of an opening in a computing device to hide a fastener. Other embodiments are also disclosed and claimed.

Abstract: There is provided a drainage system of an aircraft which discharges moisture having entered inside horizontal tails, which are structures of an airframe of an aircraft, toward the rear end of a fuselage, the drainage system including: a drainage channel which includes an introduction end and a discharge end, and by a capillary action delivers moisture introduced from the introduction end toward the discharge end; and a heater which heats and dries the moisture delivered through the drainage channel. The drainage channel of the present invention is preferably composed of a paper drainage material. It is also preferable that the introduction end of the drainage channel is provided in a lowermost region in the vertical direction within an area in which moisture can accumulate inside the horizontal tails while the aircraft is parked.

Abstract: Anisotropic conductive film (ACF) structures and manufacturing methods for forming the same are described. The manufacturing methods include preventing clusters of conductive particles from forming between adjacent bonding pads and that are associated with electrical shorting of ACF structures. In some embodiments, the methods involve use of multiple layered ACF materials that include a non-electrically conductive layer that reduces the likelihood of formation of conductive particle clusters between bonding pads. In some embodiment, the methods include the use of ultraviolet sensitive ACF material combined with lithography techniques that eliminate conductive particles from between neighboring bonding pads. In some embodiments, the methods involve the use of insulation spacers that block conductive particles from entering between bonding pads. Any suitable combination of the described methods can be used.

Abstract: A flexible ferromagnetic strip is used to induction-weld seams in polymer pipes. The strip is a blend of strontium ferrite, a surfactant, and an LDPE binder. A process to produce the profile is to mix the ingredients together followed by granulation and extrusion or calendering. The strip is used in conjunction with an induction coil sized to fit over a polymer pipe coupling containing the strip and separate segments of polymer pipe. The strip is heated by induction current induced by an electromagnetic field generated by the coil. The heated strip causes the polymer pipe segments to be thermoplastically welded together.

Abstract: A sandwich laminate for wind turbine blades includes a sandwich core material and an upper laminate part and a lower laminate part, wherein the upper laminate part and the lower laminate part have a thermoplastic matrix material and heating elements. The heating elements are electrically conductive fibers constituting electric circuits in the interior part of the thermoplastic matrix. Further, a wind turbine blade including such a sandwich laminate as well as a method of manufacturing such a sandwich laminate are provided.

Abstract: A method comprises laying up a fiber ply of reinforcing fibers and a metal foil layer in a full face-to-face relation. The fibers in the fiber ply are oriented in a single direction. The metal foil layer includes a plurality of metal foil strips separated by gaps. The metal foil layer has substantially the same length and width as the fiber ply. The method further comprises infusing resin into the layup, wherein the resin flows through the gaps and infuses into the fibers.

Abstract: An apparatus for temporarily bonding a substrate on a carrier includes an electrically conductive adhesion layer disposed between the carrier and the substrate, and a current supply source configured to apply a current to the electrically conductive adhesion layer.

Abstract: A method for manufacturing a fiber-reinforced composite material of the present invention includes: the step (a) of placing a non-woven fabric N made of a reinforcement fiber in a movable mold 12; and the step (b) of moving the movable mold 12 toward a fixed mold 11 to close the mold and then injecting a thermoplastic resin into the mold to obtain a molded article formed of the non-woven fabric N and the thermoplastic resin. The mechanical strength of the obtained fiber-reinforced composite material can be enhanced by applying an injection compression molding process as the injection molding process in the step (b).

Abstract: An electronic component includes a wiring substrate having a first surface and a second surface, an electronic component body mounted on a first surface side of the wiring substrate, an external electrode formed on a second surface side of the wiring substrate which is opposite to the first surface side, the external electrode being electrically connected to the electronic component body, a heat generating member having a conductive property and having a higher resistivity than the external electrode, and a heat insulating layer disposed between the electronic component body and the heat generating member, the heat insulating layer having an insulating property and being formed of a material different from an other material of the wiring substrate.

Abstract: The present invention comprises a jointing head 1, a robot with this jointing head 1, and a fastening method for affixing fastening elements 9 to a component surface B. The jointing head 1 comprises a gripper 30 that removes fastening elements 9 from a removal position E of a cartridge 70 by means of a pivoting movement. In addition, the jointing head 1 comprises a compensation mechanism 40 of the gripper 30 so that, when the fastening element 9 is mounted on a component surface B, the fastening element 9 is optimally arranged adjacent to a hardening source 60 such as a light source.

Abstract: Embodiments of a high-permittivity, low-leakage energy storage device, such as a capacitor, and methods of making the energy storage device are disclosed. The disclosed device includes electrically conductive first and second electrodes, and a sterically constrained dielectric film disposed between the first and second electrodes. The sterically constrained dielectric film comprises a plurality of polymeric molecules, and at least some of the polymeric molecules are bound to the first electrode. The disclosed device may include an insulative layer between the first electrode and the dielectric film and/or between the second electrode and the dielectric film.

Abstract: An electrical heating bonding device 1 bonds a member M1 to be bonded, which is made of a metal, and a member M2 to be bonded, which is made of a resin. The electrical heating bonding device 1 includes: an upper electrode 11 and a lower electrode 12 which sandwich the member M1 to be bonded, and are electrically conductive with the member M1 to be bonded; a pressurizing unit 20 which applies pressure to a bonding surface between the member M1 to be bonded and the member M2 to be bonded; a temperature sensor 30 which detects a temperature of the member M1 to be bonded; and a control unit 40 which controls the pressurizing unit 20 to apply the pressure to the bonding surface, after the temperature detected by the temperature sensor 30 reaches a predetermined set temperature Ts.

Abstract: Provided is a glass cell in which the thickness of the interior space has high uniformity. A glass cell (1) includes first and second glass sheets (11, 12) and an intermediate sheet (13). The first and second glass sheets (11, 12) are disposed to face each other at a distance. The intermediate sheet (13) is disposed between the first glass sheet (11) and the second glass sheet (12). The intermediate sheet (13) includes an opening (13a). A surface of the intermediate sheet (13) next to the first glass sheet (11) or a surface of the first glass sheet (11) next to the intermediate sheet (13) is made of metal and a surface of the intermediate sheet (13) next to the second glass sheet (12) or a surface of the second glass sheet (12) next to the intermediate sheet (13) is made of metal.

Abstract: Methods are disclosed for creating extremely high permittivity dielectric materials for use in capacitors and energy storage devices. High permittivity materials suspended in an organic non-conductive media matrix with enhanced properties and methods for making the same are disclosed. Organic polymers, shellac, silicone oil, and/or zein formulations are utilized to produce thin film low conductivity dielectric coatings. Transition metal salts as salt or oxide matrices are formed at low temperatures utilizing mild reducing agents.

Abstract: The present invention provides a radio frequency identification electronic tag with diversion-proof function and a process for making the same. The radio frequency identification electronic tag with diversion-proof function is formed of a supporting layer, a release liner, an antenna and a chip, wherein the release liner is bonded to one side of the supporting layer to form an entity, the antenna is bonded to the other side of the release liner, or, the antenna is bonded to the two sides of the entity formed by the supporting layer and the release liner, and is connected via overbridge points on the antenna, the overbridge points run through the supporting layer and the release liner so that antennas at the two sides are switched into conduction; the chip is bonded to the antenna. Once the RFID tag with diversion-proof function is peeled off or transferred, its physical structure will be destroyed and the information contained therein cannot be read, achieving the object of incapable of being reused.

Abstract: Disclosed is a method for manufacturing a flexible device comprising: forming an adhesive layer on a support substrate; adhering a flexible substrate onto the adhesive layer; forming a device layer on the flexible substrate; and separating the support substrate from the flexible substrate, wherein the adhesive layer comprises a self-assembled monolayer (SAM).

Abstract: A method of making an electronic device includes forming a circuit layer on a liquid crystal polymer (LCP) substrate and having at least one solder pad. The method also includes forming an LCP solder mask having at least one aperture therein alignable with the at least one solder pad. The method further includes aligning and laminating the LCP solder mask and the LCP substrate together, then positioning solder paste in the at least one aperture. At least one circuit component may then be attached to the at least one solder pad using the solder paste.

Abstract: A printed circuit board and method of manufacturing same, the printed circuit board comprising a stack of layers. The stack of layers being comprised of alternating circuit layers and insulating layers that are laminated together. The stack of layers includes an area with resin cured to a degree. The area has a coefficient of thermal expansion that is dependent, at least in part, on the degree of curing of the resin.

Abstract: New stretchable electrically conductive composite materials comprising at least one polymer and a plurality of nanoparticles are provided, which exhibit high conductivity even at high strain levels. The composite may comprise polyurethane as the polymer and spherical gold nanoparticles. Such materials have conductivity levels as high as 11,000 Scm?1 at 0% strain and 2,400 Scm?1 at 110% strain. Furthermore, certain embodiments of the composite have a maximum tensile strain of 480% while still exhibiting conductivity of 35 Scm?1. The inventive materials are highly flexible, highly conductive and suitable for a variety of applications, especially for advanced medical devices, implants, and flexible electronics. The disclosure also provides methods of making such stretchable electrically conductive nanocomposites, including formation by layer-by-layer and vacuum assisted flocculation.

Abstract: The present invention provides a method and a system for manufacturing a circuit board for use during fabrication of LEDs. The method includes individual processes (in no particular order) like continuous contacting of various layers of the circuit board, B-staging of an adhesive used in the circuit board, pre-heating of the various layers when the various layers are arranged in an adjacent manner to each other, applying pressure to the circuit board when the various layers are arranged in an adjacent manner to each other, thermal curing of the adhesive and singulating the circuit board.

Abstract: A method of fabricating a crystal unit fills an adhesive from a first opening in a front surface of a mask of each of penetration holes in the mask in a state in which the mask is set on a base, into each penetration hole, and heats, by a heating element, a sidewall region defining a second opening in a back surface of the mask, in order to cure a sidewall part of the adhesive in the sidewall region defining each penetration hole in contact with the adhesive filling each penetration hole. A crystal blank is bonded on the base using the adhesive in order to form the crystal unit, after removing the mask from the base.

Abstract: A microcircuit deposition system incorporates a first printing engine for depositing a dielectric on a substrate. A microwire spooling machine houses a microwire spool and incorporates a tension guide to position a microwire trace onto the dielectric layer. A second printing engine trails the microwire spooling machine to deposit a covering dielectric layer over the microwire trace.

Abstract: Fluid flow conduits (14a, 14b) and apparatus (40) and methods for joining the conduits (14a, 14b), preferably in a sterile manner, are disclosed. Each conduit (14, 14b) has a polymeric open end that is sealed by a sealing member (26a, 26b) that may include a heating element (28). The polymeric end material is melted, the sealing members (26a, 26b) are moved to expose the melted open ends of the conduits (14a, 14b) and the ends are brought together to form a fused or welded connection (12) between the conduits (14a, 14b).

Abstract: A manufacturing method provides an airtight container having a first plate structure, a second plate structure having a wiring formed on a surface facing the first plate structure, a frame arranged between the first plate structure and the second plate structure, a first bonding material arranged between the first plate structure and the frame, and a second bonding material arranged between the second plate structure and the frame. The method includes the steps of bonding the first plate structure and the frame by irradiating a first energy beam to the first bonding material by transmitting the first energy beam through the first plate structure, and bonding the second plate structure and the frame by irradiating a second energy beam to the second bonding material by transmitting the second energy beam through the first plate structure and the frame. The first energy beam and the second energy beam are scanned in close proximity to each other and at the same speed.

Abstract: According to one embodiment of the present invention, a sandwich structure welded by high-frequency induction heating comprises: a honeycomb core; a first skin sheet and a second skin sheet formed at either side of the honeycomb core, respectively; and conductors to be heated, which are arranged at one side of each of the first skin sheet and second skin sheet, and which melt the interfaces of the first skin sheet and second skin sheet by high-frequency induction heating so as to enable the first skin sheet and second skin sheet to be adhered to either side of the honeycomb core, respectively.

Abstract: An apparatus and a method for manufacturing a camera module. The method for manufacturing a camera module includes: picking up an image sensor by the bonding head and mounting the image sensor on a PCB; compensating for a tilt deviation between the PCB and the image sensor by the gyro unit of the PCB support unit simultaneously when the image sensor is mounted on the PCB; applying heat by the heating unit of the bonding head to cure an adhesive applied between the image sensor and the PCB; and after the image sensor is mounted and the adhesive is cured, picking up a lens housing module by a lens housing module pickup unit and mounting the lens housing module on the PCB and attaching contact portions of the PCB to the lens housing module to complete the manufacture of a camera module.

Abstract: The invention relates to a method for making a semiconductor. In one embodiment the method includes applying an adhesive layer to ground-thin or thinned semiconductor chips of a semiconductor wafer. In this embodiment, the adhesive layer composed of curable adhesive is introduced relatively early into a method for the thinning by grinding, separation and singulation of a semiconductor wafer to form thinned semiconductor chips, and is used further in a semiconductor device into which the thinned semiconductor chip is to be incorporated.