Abstract: Laminates of polymeric films and solvent-based polyurethane adhesive formulations for preparing them are provided. The adhesive formulations include a hydroxyl-terminated polyester that forms crystalline polyester domains after reaction with an appropriate polyisocyanate, but prior to completion of cure. The result is an adhesive layer that substantially enhances the oxygen barrier properties of the adhesive and, therefore, of the laminate as a whole, while offering desirable convenience of application even at relatively low temperatures. The laminates may also exhibit desirable retention of barrier properties following flex-cracking.

Abstract: Methods for bonding a seam using an inductively heated structure are provided. A three-dimensionally conformable structure is placed upon materials at a location of a desired seam for a clothing article. The structure contours to the surface and material as placed. The structure includes a conductive filling that may be inductively heated. The heated structure and conductive filling activate a heat-responsive adhesive at the location and bond the materials to one another to form the desired seam.

Abstract: A method of making a part comprising stacking a plurality of uncured composite sheets to form an uncured composite stack. The method also comprises interposing a resistor wire between an adjacent two of the uncured composite sheets of the uncured composite stack. The method further comprises applying heat to the uncured composite stack externally of the uncured composite stack to at least partially cure the plurality of uncured composite sheets. The method additionally comprises transmitting an electric current through the resistor wire to generate heat, from the resistor wire, internally within the uncured composite stack to at least partially cure the plurality of uncured composite sheets. Applying heat to the uncured composite stack externally and generating heat internally converts the plurality of uncured composite sheets into a plurality of cured composite sheets and converts the uncured composite stack into a cured composite stack.

Abstract: A three-dimensional image forming system according to the present invention includes a conveying unit which conveys a heat-expandable sheet along a conveyance path, a heating unit which heats the heat-expandable sheet by irradiating the heat-expandable sheet with light, and a control unit which preheats the surroundings of the heating unit to a previously determined preheat temperature and then causes the conveying unit to convey the heat-expandable sheet.

Abstract: A manufacturing method for a conveyance seat having a pad structure including a seat pad and a back face member includes integrally molding the seat pad with the back face member in a state where the back face member is arranged so as to cross over at least part of a parting line that is formed by laying a first sub element and a second sub element of a molding die on top of each other, the molding die being formed of at least the first sub element and the second sub element.

Abstract: In an embodiment, a process for producing a functional-substance thin film material for which a required heating temperature for finishing is 100-130° C. is characterized in that a PP film 2 is releasably laminated to a surface of a PET film 1 with a non-silicone adhesive layer 3 so that the strength of adhesion of the PP film 2 by the non-silicone adhesive layer 3 is regulated so as to prevent the PP film 2 from suffering thermal deformation when a functional substance superposed in a thin film form on the other surface of the PP film 2 is heated to 100-130° C. in order to finally convert the functional substance into a functional-substance thin film material 4.

Abstract: A compressible or retractable support (10, 80, 90, 100) is installed inside an air blower cavity (36) of a body support system (30), such as a medical mattress with forced air flow. The support is compressed or retracted within the cavity when the air blower (40) is inserted in the dynamic configuration of the body support system. The support rebounds to an uncompressed state to fill a greater portion of the air blower cavity when the air blower is removed to convert the body support system to a static configuration.

Abstract: The invention discloses an electronic expansion valve. The electronic expansion valve includes: a valve body (10), a first chamber being formed in the valve body (10), a liquid inlet (11) and a liquid outlet (12) being oppositely provided at two ends of the valve body (10); a second chamber, provided in the first chamber, a coil (20) being provided in the second chamber; a third chamber, an inlet end of the third chamber being communicated with the liquid inlet (11), an outlet end of the third chamber being communicated with the liquid outlet (12), the inlet end of the third chamber and the outlet end of the third chamber being coaxially provided, and a valve core (31) being provided in the third chamber; and the first chamber being communicated with the liquid inlet (11) via the first liquid passage hole (33).

Abstract: A method of joining a first bulk composite core and a second bulk composite core by applying an adhesive to a surface network of the first bulk composite core; inserting a plurality of mandrels into a plurality of cell members of the first bulk composite core and a plurality of cell members of the second composite core, thereby aligning the cell members of the first bulk composite core to the cell members of the second bulk composite core; pressing the respective surface networks of the first bulk composite core and the second bulk composite core together with the adhesive located therebetween; and curing the adhesive.

Abstract: In a method for solid body joining of a carrier body (10) and a cover layer (20), in particular by anodic bonding, the cover layer (20) is pressed with a pressing force against a curved carrier body surface (11), wherein the pressing force during the solid body joining is distributed by way of a pressure intermediary device (30) areally and simultaneously over the whole cover layer (20) and is directed perpendicularly to the curvature of the carrier body surface (11). A composite component comprising a carrier body (10) and a cover layer (20) is also disclosed, wherein a curved areal joining region (13) is formed between a cover layer surface (21) and a carrier body surface (11).

Abstract: Provided is a method for joining composite materials including a thermoplastic resin as a matrix resin and carbon fibers, by which the composite materials can be easily joined to each other to attain good bond strength. The method for joining composite materials includes: (i) a step in which a composite material A including a thermoplastic resin and carbon fibers and having a protrusion part on one surface thereof and a composite material B including a thermoplastic resin and carbon fibers are layered and fixed so that the protrusion part of the composite material A faces inward; and (ii) a step in which a current is applied to a joining portion including the protrusion part to generate heat.

Abstract: A display device and method thereof which minimizes introduction of oxygen and moisture from the outside includes an insulating substrate, a display part formed on the insulating substrate, a cover substrate combined with the insulating substrate, a filler provided between the insulating substrate and the cover substrate, the filler includes a first region and a second region spaced from the first region and formed at a circumference of the first region, and a moisture absorbent formed in a space between the first region and the second region.

Abstract: A method for controlling a contact angle between a glue and a surface of a substrate during manufacture of microchip packages is disclosed. The method includes applying a glue to a surface of a substrate, and placing an electrode in electrical connection with the glue. A potential difference is applied between the electrode and the substrate. The potential difference is applied across the glue and causes a contact angle between the glue and the surface of the substrate to be altered.

Abstract: This invention relates seed layers and a process of manufacturing seed layers for casting silicon suitable for use in solar cells or solar modules. The process includes the step of positioning tiles with aligned edges to form seams on a suitable surface, and the step of joining the tiles at the seams to form a seed layer. The step of joining includes heating the tiles to melt at least a portion of the tiles, contacting the tiles at both ends of at least one seam with electrodes, using plasma deposition of amorphous silicon, applying photons to melt a portion of the tiles, and/or layer deposition. Seed layers of this invention include a rectilinear shape of at least about 500 millimeters in width and length.

Abstract: A continuous production process for a polytetrafluoroethylene functional film for electro-mechanical energy conversion is disclosed. The process includes a step of thermal bonding a composite film having a micro-porous structure and electrically charging the composite film. The composite film having a micro-porous structure includes one layer of porous polytetrafluoroethylene film sandwiched between two adjacent layers of polytetrafluoroethylene film thermally bonded by two heated rollers. The process also has a step of electrically charging the composite film to obtain a polytetrafluoroethylene piezoelectric electret film. The electrically charging the composite film can be corona-polarizing the composite film by introducing the composite film between an electrode roller and a corona electrode, or introducing the composite film into an electroplating region and attaching electrodes to the upper and lower surfaces thereof, followed by introducing the film to a charging region by a contacting process.

Abstract: A fill pack assembly and method for assembling a fill pack from individual sheets utilizes integrally bonded sheet pairs. Each sheet pair is a pair of two individual adjacent fill sheets which have been bonded together via any suitable bonding method. A plurality of the thus formed sheet pairs can then be attached together to form an entire fill pack or portion of a fill pack. Such fill packs are useful in heat exchange devices such as industrial cooling towers.

Abstract: A method of obtaining a high-strength bonded body between composite materials, each containing a thermoplastic resin and carbon fibers, with a low current in a short period of time, wherein the bonded body is rarely susceptible to deformation such as warp. The method of manufacturing a bonded body, comprises the steps of: (i) preparing a plurality of composite materials, each containing a thermoplastic resin and discontinuous carbon fibers which are randomly oriented; (ii) overlapping the composite materials each other; (iii) sandwiching at least a part of the overlapped portion between a pair of electrodes; and (iv) applying electricity between the electrodes to weld together the thermoplastic resins with Joule heat.

Abstract: In a process of welding pieces of tubing into films with a central electrode the central electrode is divided to facilitate the welding in a single process. In the case of tools with or without a central electrode, electrode lamellae lying next to one another have a free visual connection between edges lying towards the insert piece to obtain a tight welded joint.

Abstract: A composite foam product comprising a foam core surrounded by a gas-impermeable film. The gas-impermeable film retains the gas formed from the blowing agent so that the pressure inside the foam core is above ambient pressures.

Abstract: The invention relates to a device comprising a wafer comprising a silicon area and a wafer comprising a glass area fastened to each other, the fastening zone thus formed between the wafers defining a multilayer structure comprising a first layer protecting the silicon from physical changes caused by attack of the surface, which layer covers the silicon area, and a second layer protecting the glass from physical changes caused by attack of the surface, which layer covers the glass area; said multilayer structure furthermore comprising at least one additional layer enabling anodic bonding between the two protective layers; said device containing at least one fluid channel protected by said protective layers and able to contain a solution temporarily.

Abstract: An induction heating inductor and perforated susceptor are formed as an integral unit to provide a low cost, physically stable, efficient, and easily cleaned unit.

Abstract: Providing a method for manufacturing a package capable of suppressing occurrence of a discharge phenomenon during the anodic bonding and achieving stable anodic bonding of the base board and the bonding film. Providing a method for manufacturing a package including: an alignment step where an inner surface of the lid board 50 is superimposed onto an inner surface of the base board 40, and an outer surface of the base board 40 is disposed on an electrode base portion 70 for anodic bonding; and an anodic bonding step where a bonding voltage is applied between the bonding film 35 and the electrode base portion 70 while heating them to a bonding temperature, whereby the bonding film 35 and the base board 40 are anodically bonded, wherein the anodic bonding step involves applying the bonding voltage in a state where the penetration electrodes 32, 33 are exposed to a void portion 73 formed in the electrode base portion 70.

Abstract: Provided are a sealing method and device of a pouch type secondary battery including a pouch and an electrode tab provided for electrical connection with the pouch, in which the electrode tab is heated so that heat may be supplied to a tab sealant bonding between a bonding surface of a sealing part of the pouch and the electrode tab at the time of sealing the pouch type secondary battery.

Abstract: A sandwich of impact resistant material comprising: a first tile comprising a plurality of nano-particles bonded together, wherein the nano-structure of the nano-particles is present in the first tile and the first tile comprises a hardness value; a second tile comprising a plurality of nano-particles bonded together, wherein the nano-structure of the nano-particles is present in the second tile and the second tile comprises a hardness value; and a third tile comprising a plurality of nano-particles bonded together, wherein the nano-structure of the nano-particles is present in the third tile and the third tile comprises a hardness value, wherein the second tile is coupled in between the first tile and the third tile, and the second tile comprises a hardness value greater than the first tile and the second tile.

Abstract: A method of making a tile, the method comprising: providing a plurality of nano-particles, wherein the plurality of nano-particles comprises a plurality of ceramic nano-particles; and performing a spark plasma sintering (SPS) process on the plurality of nano-particles, thereby forming a tile comprising the plurality of nano-particles, wherein the nano-structure of the nano-particles is present in the formed tile. In some embodiments, the tile is bonded to a ductile backing material.

Abstract: A method of making a composite material, the method comprising: providing a tile, wherein the tile comprises an inorganic material; and bonding the tile to a ductile backing material using heat-curable adhering material and catalyzed foamable exothermic material between the tile and the ductile backing material, wherein heat generated from the use of the catalyzed foamable exothermic material cures the heat-curable adhering material. In some embodiments, the exotherm from the foaming of the foamable exothermic material cures the heat-curable adhering material for a time sufficient to unite a solid foam body to the heat-curable adhering material of the tile and the ductile backing material. The method is particularly advantageous in bonding a tile composed of nano-particles to a ductile backing material, as it helps retain the nanoscale properties of the nano-particles in the tile.

Abstract: A method for thermally welding an adhesive tape to a polymeric substrate wherein the backing of the adhesive tape enters into a cured physical connection with the polymeric substrate is disclosed. The adhesive tape is comprises a spunbonded backing that is coated, at least partially, on one side with a pressure sensitive adhesive, preferably natural rubber or acrylate. The spunbonded backing can comprise polyester or polypropylene fibers that do not melt during the welding process, and may optionally include additives such as pigments, UV stabilizers and flame retardants.

Abstract: An anodic bonding method of anodically bonding a base wafer 10 and a lid wafer 11 includes:(1) superimposing the base wafer 10 and the lid wafer 11 onto each other in a direction where a bonding film 9 faces a cavity C; (2) subsequent to the superimposition step, pressurizing and holding the base wafer 10 and the lid wafer 11 in a vacuum state in the superimposition direction; and (3) subsequent to the pressurizing step, partitioning and setting a plurality of intended bonding areas A1, A2, A3 and A4 in a concentric form on a contacting surface where the base wafer 10 and the lid wafer 11 are in contact with each other and applying a DC voltage to each of the plurality of intended bonding areas A1, A2, A3 and A4.

Abstract: A microfluidic device for use with a microfluidic delivery system, such as an organic vapor jet printing device, includes a glass layer that is directly bonded to a microfabricated die and a metal plate via a double anodic bond. The double anodic bond is formed by forming a first anodic bond at an interface of the microfabricated die and the glass layer, and forming a second anodic bond at an interface of the metal plate and the glass layer, where the second anodic bond is formed using a voltage that is lower than the voltage used to form the first anodic bond. The second anodic bond is formed with the polarity of the voltage reversed with respect to the glass layer and the formation of the first anodic bond. The metal plate includes attachment features that allow removal of the microfluidic device from a fixture.

Abstract: Provided is an anode bonding method by which a silicon substrate and a glass substrate are well anodically bonded without generating positional shift, even when an electrode cannot be arranged on a surface on the opposite side to a bonding surface of a glass substrate and the bonding surface is large. The method for anodically bonding the glass substrate and the silicon substrate is provided with a step of placing on the glass substrate the silicon substrate whereupon a through hole is arranged; a step of bringing the anode electrode into contact with the surface of the overlapped silicon substrate opposite to the surface facing the glass substrate, and bringing an cathode electrode into contact with the glass substrate through the through hole arranged on the silicon substrate; and a step of applying a direct current voltage to the anode electrode and the cathode electrode in a state where the glass substrate and the silicon substrate are heated.

Abstract: The invention provides a method of fastening lamellae of a lamellar material that is at least partially conductive onto an insulating substrate (2) containing oxides that are suitable for dissociating into mobile ions of given charge and stationary ions of opposite charge, the method comprising the steps of: placing a sample (1) of the lamellar material against a surface of the substrate; causing the oxides of the substrate to dissociate; and subjecting the substrate and the sample to an electric field by means of an electrode in contact with the substrate and an electrode in contact with the sample.

Abstract: The invention relates to a method for the production of at least one layer (1) of a shoe upper or of a part of a shoe upper, wherein a nonwoven fabric (2) made of thermoplastic elastomere (TPE) is used as the basic material for at least a section of the layer (1) of the shoe upper. To influence the local properties of the material selectively in a cost efficient manner the invention suggests that at least partitions (3) of the surface of the nonwoven fabric (2) are exposed to a welding beam (4) in such a manner, that in those partitions (3) at least a partial melting of the nonwoven fabric (2) takes place, so that the density of the material is increased in the molten partitions (3).

Abstract: A method for joining at least two members of a lithographic apparatus is disclosed. The method includes providing a first member, providing a second member, direct-bonding the first member and the second member to form a direct-bond, and anodically bonding the first member and the second member. At least one of the members includes ultra low expansion glass and/or ultra low expansion glass ceramics.

Abstract: A fusion-bonded body which includes a fusion-bonded part obtained by fusion-bonding to each other a first part to be fusion-bonded which comprises a first thermoplastic resin and first carbon fibers and a second part to be fusion-bonded which comprises a second thermoplastic resin and second carbon fibers. Also provided is a method for producing the fusion-bonded body which comprises a fusion-bonding step in which the first part to be fusion-bonded is brought into close contact with the second part to be fusion-bonded, an electric current is caused to flow through the two parts to generate heat and melt the first thermoplastic resin and second thermoplastic resin, and the molten resins are solidified to form a fusion-bonded part.

Abstract: A composite tank that can suppress electrification, corrosion and strength degradation, a wing comprising the composite tank, and a method for manufacturing the composite tank.

Abstract: An apparatus for welding a first plastic sheet to a second plastic sheet is provided. The apparatus includes an elongate die including a channel extending longitudinally along the die's welding face. In combination with a plate and a high frequency alternating current generator, the die and the plate are operable to compress the first and second plastic sheets in an overlapping arrangement and generate a high frequency alternating electromagnetic field between the die and the plate and weld the first and second plastic sheets to one another. The depth of the die channel prevents the formation of an electromagnetic field that is strong enough to weld the first and second plastic sheets in an area between the die channel and the plate. A die for use in such an apparatus and a method of use thereof are further provided.

Abstract: The present subject matter relates to a method which includes positioning a bottom and top polymeric separator sheet on a working surface, with a substantially planar battery anode disposed therebetween; applying a pressure and an electrical current to a cutting and welding tool such that top and bottom polymeric separator sheets are welded into a bag and such that the bag is excised from the top and bottom separator sheets, with the battery anode disposed in the bag; stacking the battery anode and at least one cathode into a battery stack; and disposing the battery stack into a battery case having at least one feedthrough, with a first terminal connected to the battery stack through the at least one feedthrough, and with the battery case filled with an electrolyte, wherein the protrusion is defined by laser cutting the cutting and welding tool, machining the cutting and welding tool, or photochemical etching the cutting and welding tool.

Abstract: Providing an anodic bonding method capable of suppressing uneven quality between the central and outer sides of a bonding surface being anodically bonded.

Abstract: The present invention provides for safe and reliable electronic circuitry that can be employed in ingestible compositions. The ingestible circuitry of the invention includes a solid support; a conductive element; and an electronic component. Each of the support, conductive element and electronic component are fabricated from an ingestible material. The ingestible circuitry finds use in a variety of different applications, including as components of ingestible identifiers, such as may be found in ingestible event markers, e.g., pharma-informatics enabled pharmaceutical compositions.

Abstract: An apparatus that comprises an electronic device package 102. The package includes an electronic device 105 on a first planar substrate 110, and, a second planar substrate 112 bonded to the first planar substrate so as to form an interior chamber 115 housing the electronic device. The package includes a plurality of electrically conductive pins 120, each of the pins passing through a hole 125 in one of the first and second planar substrates. A first end 130 of each pin is located in the interior chamber and is electrically coupled to the electronic device. A second end 132 of each pin is located on an exterior side 135 of the one of the first and second substrates. An inorganic sealant 140 surrounds at least one of the first end or the second end for each of the pins.

Abstract: A method is provided for welding a laminated metal sheet to a workpiece. The laminated metal sheet includes an outer metal sheet and an inner metal sheet bonded together by a polymer material that impedes the flow of weld current. A punch is applied against the outer metal sheet and driven through the laminated metal sheet to create a hole and also create an annular metallic burr that bridges across the polymer material layer between the outer metal sheet and the inner metal sheet. A weld electrode is positioned against the outer metal sheet at the punched hole and weld current is conducted through the first annular metallic burr to create an electric resistance weld between the laminated metal and the workpiece.

Abstract: The invention provides a method of fastening lamellae of a lamellar material that is at least partially conductive onto an insulating substrate (2) containing oxides that are suitable for dissociating into mobile ions of given charge and stationary ions of opposite charge, the method comprising the steps of: placing a sample (1) of the lamellar material against a surface of the substrate; causing the oxides of the substrate to dissociate; and subjecting the substrate and the sample to an electric field by means of an electrode in contact with the substrate and an electrode in contact with the sample.

Abstract: Provided is an anode bonding method by which a silicon substrate and a glass substrate are well anodically bonded without generating positional shift, even when an electrode cannot be arranged on a surface on the opposite side to a bonding surface of a glass substrate and the bonding surface is large. The method for anodically bonding the glass substrate and the silicon substrate is provided with a step of placing on the glass substrate the silicon substrate whereupon a through hole is arranged; a step of bringing the anode electrode into contact with the surface of the overlapped silicon substrate opposite to the surface facing the glass substrate, and bringing an cathode electrode into contact with the glass substrate through the through hole arranged on the silicon substrate; and a step of applying a direct current voltage to the anode electrode and the cathode electrode in a state where the glass substrate and the silicon substrate are heated.

Abstract: This invention relates seed layers and a process of manufacturing seed layers for casting silicon suitable for use in solar cells or solar modules. The process includes the step of positioning tiles with aligned edges to form seams on a suitable surface, and the step of joining the tiles at the seams to form a seed layer. The step of joining includes heating the tiles to melt at least a portion of the tiles, contacting the tiles at both ends of at least one seam with electrodes, using plasma deposition of amorphous silicon, applying photons to melt a portion of the tiles, and/or layer deposition. Seed layers of this invention include a rectilinear shape of at least about 500 millimeters in width and length.

Abstract: The present subject matter relates to a method which includes positioning a bottom and top polymeric separator sheet on a working surface, with a substantially planar battery anode disposed therebetween; applying a pressure and an electrical current to a cutting and welding tool such that top and bottom polymeric separator sheets are welded into a bag and such that the bag is excised from the top and bottom separator sheets, with the battery anode disposed in the bag; stacking the battery anode and at least one cathode into a battery stack; and disposing the battery stack into a battery case having at least one feedthrough, with a first terminal connected to the battery stack through the at least one feedthrough, and with the battery case filled with an electrolyte, wherein the protrusion is defined by laser cutting the cutting and welding tool, machining the cutting and welding tool, or photochemical etching the cutting and welding tool.

Abstract: The invention relates to novel methods of incorporating nanotubes for use in micro- or nano-devices. The invention further relates to incorporating nanotubes in micro or nano-devices and particularly synthesizing or growing nanotubes directly in or on components of a micro- or nano-device. In a particular embodiment, the invention relates to methods of synthesizing or growing nanotubes in a gas chromatography column and their use in portable gas chromatography devices.

Abstract: Techniques for bonding substrates are disclosed. According to one aspect of the techniques, an index bonding is provided to ensure that non-flatness of substrates is compensated when two substrates are bonded together so as to minimize possible dynamic imbalance of a disc. According to another aspect of the techniques, a dynamic alternating electric field bonding is provided to eliminate bubbles from a type of glue used to bond two substrates, wherein a power source is used to generate a dynamic alternating electromagnetic field in accordance with the substrates and/or the characteristics of the glue.

Abstract: An RF welder, and a method of operation thereof, is disclosed that has circuitry that automatically affects system impedance so that, throughout the welding or embossing cycle, a generator is capable of delivering the same power to a die and fabric, and cabling is capable of dissipating a load that is less than a preselected amount.

Abstract: Provided is a MgO single crystal for obtaining a magnesium oxide (MgO) single crystal deposition material which is prevented from splashing during the vapor deposition in, e.g., an electron beam deposition method without reducing the deposition rate, and for obtaining a MgO single crystal substrate which can form thereon, e.g., a superconductor thin film having excellent superconducting properties. A MgO single crystal having a calcium content of 150×10?6 to 1,000×10?6 kg/kg and a silicon content of 10×10?6 kg/kg or less, wherein the MgO single crystal has a variation of 30% or less in terms of a CV value in detected amounts of calcium fragment ions, as analyzed by TOF-SIMS with respect to the polished surface of the MgO single crystal. A MgO single crystal deposition material and a MgO single crystal substrate for forming a thin film obtained from the MgO single crystal.

Abstract: Disclosed is a mandrel for use in Radio Frequency welding, wherein the mandrel comprises first and second conductive portions separated by an insulating material, such that different potentials may be applied to the first and second conductive portions. Also disclosed is a method of RF welding and a method of manufacturing a mandrel.