Abstract: A robotic press assembly configured to apply force to a wheel, may include a selectively moveable arm that is operatively connected to a body portion at a first end thereof; and a press tool operatively connected to a second end of the moveable arm; wherein the press tool includes at least one mounting bracket maintaining a press tool thereon, the mounting bracket arranged on a platform, and a base operatively connected to the second end of the arm, the platform being slidably fixed to the base in order to adjust the lateral displacement of the press tool, and wherein the press tool is configured to apply force at the wheel.

Abstract: A method for joining an optical part made of quartz glass and a supporting part made of ceramic includes forming a metal layer on a surface of the supporting part by electroless plating, polishing the formed metal layer with a polishing pad to form a first smoothed face on the supporting part surface, polishing a surface of the optical part with the polishing pad to form a second smoothed face, cleaning the first smoothed face and the second smoothed face with ultrasonic cleaning water, forming a first metal film on the first smoothed face by vapor deposition and forming a second metal film on the second smoothed face by vapor deposition, and joining the first metal film and the second metal film to each other by interatomic joining by atomic diffusion between the faces at which the first metal film and the second metal film contact with each other.

Abstract: A system for switching between an optical pellicle and an EUV pellicle includes one or more inspection tools configured to perform one or more inspection processes on a mask. The system includes one or more extreme ultraviolet (EUV) lithography tools configured to perform one or more lithographic exposures on the mask. The system includes a dual pellicle handler operatively coupled to the one or more inspection tools and the one or more EUV lithography tools, wherein the dual pellicle handler is configured to attach at least one of an optical pellicle or an EUV pellicle to the mask, wherein the dual pellicle handler is configured to detach at least one of the optical pellicle or the EUV pellicle from the mask.

Abstract: Hybrid microelectronic substrates, and related devices and methods, are disclosed herein. In some embodiments, a hybrid microelectronic substrate may include a low-density microelectronic substrate having a recess at a first surface, and a high-density microelectronic substrate disposed in the recess and coupled to a bottom of the recess via solder.

Abstract: The invention relates to an explosion-proof assembly (22) having an electrically conductive stud (23) made of a material which is not deformable radially. The stud (23) is coaxially surrounded in a central portion (23a) by an electrically insulating, electrically insulating sleeve (30). The sleeve (30) is in turn coaxially surrounded by a connecting portion (41) of a plastically deformable connecting body (40). Plastic deformation of the connecting portion (41) reduces the outer dimension thereof and the connecting portion (41) presses inwardly against the sleeve (30) to form a frictionally engaged form-fitting connection therebetween such that the connecting body (40), the sleeve (30) and the stud (23) form a structural unit with at least one stop surface (26) on the stud (23) resting against a counter stop surface of the sleeve (30).

Abstract: A component carrier includes a core having a recess, at least one electronic component arranged in the recess, wherein a vertical thickness of the at least one electronic component is larger than a vertical thickness of the core, and an electrically insulating sheet covering at least part of a top main surface of the core, covering at least part of the at least one electronic component and filling a gap between a lateral surface of the at least one electronic component and a lateral surface of the core in the recess.

Abstract: A portable enclosure that is configured to be surroundably mounted at least one object to provide protection thereof wherein said portable enclosure is further configured to inhibit moisture within the interior volume thereof. The portable enclosure of the present invention includes a body wherein the body includes at least one body segment having at least one wall. The body is provided in alternate sizes and shapes and includes mateable end cap members. The wall of the body is configured with perimeter seams that are equipped with fasteners operable to provide expansion of the body segment. A pressurization chamber is operably coupled to the wall of the body and configured to provide a pressure within the interior volume of the portable enclosure that is greater than that of its surroundings. The pressurization chamber combines an airflow pattern and a water reducing member to facilitate the reduction of moisture.

Abstract: In an example, a method of determining bonding efficacy of a composite laminate is described.

Abstract: Provided is a semiconductor device formed by performing bonding at room temperature with respect to a wafer in which bonded electrodes and insulating layers and are respectively exposed to front surfaces, including a bonding interlayer which independently exhibits non-conductivity and exhibits conductivity by being bonded to the bonded electrodes, between the front surfaces.

Abstract: A fastener comprises a threaded surface and an adhesive composition at least partially disposed on the threaded surface. The adhesive composition includes an inorganic compound comprising at least one Group 1 metal and at least one Group 13 element and/or Group 14 element. The inorganic compound is present in an amount of at least about 20 parts by weight based on 100 parts by weight of the adhesive composition. A method of making the (coated) fastener comprises the steps of providing a fastener, providing the adhesive composition, and applying the adhesive composition to at least a portion of the threaded surface of the fastener. A method of joining adjacent elements comprises the steps of providing the adjacent elements, providing the fastener, and disposing the fastener adjacent and/or through the adjacent elements. An adhesive, formed by curing the adhesive composition, has excellent physical properties, including adhesive strength and high temperature resistance.

Abstract: The present invention relates to furniture panels, and more particularly, to a method for preparing functional engineered wood. It includes the following steps: make veneer blanks by rotary cutting or splicing, and cut the veneer blanks into desired dimensions to obtain veneers A. Soak the veneers A in a ternary mixed solution of a biomass nanocellulose solubilizer, a fire retardant and an acid dye for toughening, fire retardation and dyeing to obtain veneers B. Add a formaldehyde decomposing powder into a modified MUF adhesive, mix them up, coat the veneers B with the mixture to obtain veneers C. Assemble and cold-press the veneers C to obtain flitches D, and saw the flitches D into desired patterns and dimensions to obtain finished products.

Abstract: Various embodiments of an implant devices and systems are provided. The implant devices can include a mesh or implant encapsulated or otherwise coated, in whole or in part, with a film or coating. The coating or film can include methylcellulose or ethylcellulose to provide tissue regeneration as a hydrogel, while also providing a stiff polymer film when dry.

Abstract: After CMP and before an epitaxial growth step, the substrate is prepared by an atmospheric plasma which includes not only a reducing chemistry, but also metastable states of a chemically inert carrier gas. This removes residues, oxides, and/or contaminants. Optionally, nitrogen passivation is also performed under atmospheric conditions, to passivate the substrate surface for later epitaxial growth.

Abstract: A carbon nanotube sheet includes a carbon nanotube layer containing numerous vertically aligned carbon nanotubes and a fibrous carbonized layer that retains the proximal end portions of the carbon nanotubes. The carbon nanotube layer is configured such that the proximal end portions and distal end portions of the carbon nanotubes are inclined and the intermediate portions of the carbon nanotubes are entangled with one another.

Abstract: Semiconductor packages and methods of manufacturing semiconductor packages are described herein. In certain embodiments, the semiconductor package includes a substrate, a wall attached to the substrate, a first adhesive layer disposed between a bottom surface of the wall and a top surface of the substrate, and a second adhesive layer disposed around an outer perimeter of the first adhesive layer, the second adhesive layer disposed adjacent and contacting the wall, the second adhesive layer different from the first adhesive layer, wherein at least one of the first adhesive layer and the second adhesive layer connects the wall to electrical ground.

Abstract: A separation apparatus for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive, into the processing target substrate and the supporting substrate includes: a first holding unit that includes a heating mechanism heating the processing target substrate and holds the processing target substrate; a second holding unit that includes a heating mechanism heating the supporting substrate and holds the supporting substrate; a moving mechanism that relatively moves at least the first holding unit or the second holding unit in a horizontal direction; and a porous part that is annularly provided along an outer peripheral portion of the first holding unit and formed with a plurality of pores, and supplies an inert gas to the outer peripheral portion of the first holding unit holding the processing target substrate.

Abstract: The present invention provides a carbon fiber cord having both high bending fatigue resistance and high adhesiveness. The disclosed carbon fiber cord is a carbon fiber cord for reinforcing a rubber product. This carbon fiber cord includes a carbon fiber, a first coating layer formed on the carbon fiber, and a second coating layer formed over the first coating layer. The first coating layer contains a phenolic resin and does not contain a rubber component. The second coating layer contains a rubber component. The mass ratio of the first coating layer to the total mass of the carbon fiber and the first coating layer is in a range of 0.5% to 10%.

Abstract: A multi-tiered approach to combating reverse engineering of electronics is disclosed herein. The encapsulant utilized with the optical sensor may be selected based on being substantially being opaque to X-ray inspection. In this way, visible public inspection to gain competitive intelligence may be reduced and operation of the electronics may remain unaffected. Additionally, a thin filament of wire embedded just below the surface of the encapsulant could be used as an electronic tripwire in response to being severed and/or dissolved by the reverse engineering strong solvents and acids.

Abstract: Embodiments of a gas turbine engine actuation system are provided, as are embodiments of a high temperature actuator and methods for the manufacture thereof. In one embodiment, the gas turbine engine actuation system includes an actuated gas turbine engine component and a high temperature actuator, which has a rotor mechanically linked to the actuated gas turbine engine component and a stator surrounding at least a portion of the rotor. The stator includes, in turn, a coil support structure having a plurality of spokes extending radially therefrom. A plurality of pre-formed electromagnetic coils is circumferentially distributed about the coil support structure. Each of the plurality of pre-formed electromagnetic coils is inserted over at least one of the plurality of spokes in a radial direction. The stator further includes an inorganic dielectric material in which each of the plurality of pre-formed electromagnetic coils is at least partially embedded.

Abstract: Prismatic polymer monolithic capacitor structure operating at temperatures exceeding 140° C. and including multiple interleaving radiation-cured polymer dielectric layers and metal layers. Method for fabrication of same. The geometry of structure is judiciously chosen to increase sheet resistance of metal electrodes while reducing the capacitor's equivalent series resistance. Metal electrode layers are provided with a thickened peripheral portion to increase strength of terminating connections and are passivated to increase corrosion resistance. Materials for polymer dielectric layers are devised to ensure that the capacitor's dissipation factor remains substantially unchanged across the whole range of operating temperatures, to procure glass transition temperature that is no less than the desired operating temperature, and to optimize the absorption of ambient moisture by the polymeric layers.

Abstract: A passive volatile dispensing device includes a housing having first and second curved walls and sidewalls between the curved walls. A volatile-bearing substrate is disposed within an internal cavity of the housing. The first and second curved walls each include at least one aperture and at least two opposing sidewalls include a vent therein.

Abstract: A composition for preparing a graphene and a method for preparing a graphene using the same are disclosed.

Abstract: Disclosed is a sandwich type steel sheet having low specific gravity and high stiffness which may be applied to an exterior plate of a vehicle and the like, which require excellent strength, dent resistance and the like. Further, a method of manufacturing the sandwich type steel sheet having a low specific gravity and high stiffness is also disclosed. Particularly, the sandwich type steel sheet includes an upper steel sheet positioned at an upper portion; a lower steel sheet positioned at a lower portion; a polymer layer containing an amount of about 50 to 60 wt % of a polyamide 6 resin, an amount of about 25 to 45 wt % of a polyolefin resin, based on a total weight of the polymer layer. Therefore, the thickness of the steel sheets may be reduced by about 20 % from the conventional steep sheet, and strength, dent resistance and the like may be enhanced.

Abstract: The invention discloses a shock-absorbing flooring which is comprised of: a base layer based on a polymer foam; and an top layer based on an elastomeric material, the top layer being bonded to the base layer by an intermediate bonding layer, wherein the flooring possesses a shock absorbance of 20 to 40% (as measured according to EN 14808) and a residual indentation of less than 0.3 mm (as measured according to EN 433) and a density of 400 to 500 kg/m3). It further describes a process for its manufacture and a use thereof as a ready-to-use single floorcovering.

Abstract: Banks, as well as a plurality of substantially recess-shaped cells defined by the banks, are provided in an image section formed in a gravure printing plate. Each of edge cells located along an outer edge of the image section is provided with a projecting portion that projects from a part of a base surface of that edge cell, and each projecting portion is distanced from the banks and located closer to the outer edge than the center of the corresponding edge cell. Preferably, the projecting portions and the banks that face the outer edge are positioned at a predetermined interval from the outer edge, and substantially frame-shaped recess portions that extend continuously along the outer edge are provided in the image section.

Abstract: The invention relates to a process for the manufacture of a polypropylene-paper laminate, comprising providing a film of biaxially-orientated polypropylene which does not carry any PVdC coating, and laminating said film to a paper substrate using a UV-curable adhesive; characterised in that said film is substantially free from fatty acid amides. The invention also relates to polypropylene-paper laminates and food packages containing the film. The invention also relates to a film of biaxially-orientated polypropylene substantially free from fatty acid amides, which carries an anti-mist coating on one of its faces.

Abstract: A fluid treatment arrangement may include a fluid treatment unit having a multilayer structure. The multilayer structure may include at least one feed layer, at least one permeate layer, and at least one layer of a permeable fluid treatment medium between the feed layer and the permeate layer. The fluid treatment unit may further include a thermoset which holds the layers together and forms at least a portion of a first end surface of the fluid treatment unit. The fluid treatment arrangement may also include a thermoplastic sheet which overlies the first end surface of the fluid treatment unit. The thermoset directly bonds to the thermoplastic sheet.

Abstract: Disclosed is an ink palette for use in artistic fields that require pigments to be readily available to an artist. Individual reservoirs are conjoined to form a matrix of reservoirs which may be cut to accommodate the artist's desire for color capacity. The ink palette is specifically adapted to the art of tattooing in that the palette may be secured to a work surface by the use of an ointment, like petroleum jelly, and each reservoir may have indentations on their bottoms in order to facilitate securement by the use of such compounds.

Abstract: Diamine is used to enhance adhesion between polyurethane and polyolefinic material or ionomeric material.

Abstract: A hygiene or wiping product includes at least one ply of a fibrous web containing cellulose fibers and having a graphical pattern of at least first and second areas. The ply contains a coloring compound providing a coloration of the ply in the first area. The coloring compound is at least partly chemically destroyed in the second area so that the ply is less colored in the second area than in the first area. A method for producing such a ply includes the steps of providing a fibrous web containing a coloring compound, which provides a uniform coloration in at least a portion of the web, and applying a bleaching agent to a part of the colored portion of the web to at least partly decolor the web in the part generating a pattern of at least first colored and second less colored areas.

Abstract: An elastomer bearing, includes a cylindrical inner metal part, a metallic outer sleeve arranged at a radial distance around the inner metal part; and an elastomer part arranged between the inner metal part and the metallic outer sleeve. The elastomer part has an outer sheath provided with a plastic layer. The outer sleeve is constructed as a one-piece extruded part made of lightweight metal, and the outer sleeve has an inner sheath surface provided with a profiling which form fittingly engages in the plastic layer.

Abstract: The disclosure provides in one embodiment a method of applying a high temperature hybridized molecular functional group adhesion barrier coating to a surface of a structure. The method includes providing a structure having at least one surface to be bonded, preparing the at least one surface to expose active reactive surface sites, providing one or more liquid or solid phase chemical derivatization compounds, applying heat to the one or more liquid or solid phase chemical derivatization compounds to vaporize the one or more liquid or solid chemical derivatization compounds, depositing the one or more vaporized chemical derivatization compounds on the prepared surface to form a derivatized composite surface having hybridized molecular functional groups, and heat curing the derivatized composite surface to form a high temperature hybridized molecular functional group adhesion barrier coating.

Abstract: A solar cell assembly including a first solar cell component, a second solar cell component, an adhesive layer positioned between the first solar cell component and the second solar cell component, and a contact extending through the adhesive layer to electrically couple the first solar cell component to the second solar cell component.

Abstract: The invention provides an assembly comprising at least one substrate being bonded to a structural adhesive wherein the structural adhesive is obtained by curing a precursor comprising a cross-linkable polymer, wherein a surface area of the substrate bonded to the structural adhesive comprises at least one metal, said surface area being treated with a liquid activator.

Abstract: Embodiments of the present disclosure relate to the field of electronics and, in particular, to a multi-layer printed circuit board and a method for fabricating the same. The circuit board is able to avoid the problem that signal transmission performance is affected by a plated hole. The multi-layer printed circuit board includes at least two layers of core plates that are adhered, where a circuit mechanical part is disposed on the core plates, a via is also provided on the core plates, and a metal column is embedded in the via, where one end of the metal column is connected to a corresponding position on an antenna feeder circuit mechanical part disposed on the core plate, and the other end is connected to a corresponding position on an antenna feeder circuit mechanical part disposed on an adjacent layer of the core plate. The method is used for fabricating a multi-layer printed circuit board.

Abstract: A method for forming an ink jet printhead comprises processing an epoxy adhesive such that negative effects from physical contact with particular inks are reduced or eliminated. Conventional adhesives processed using conventional techniques are known to gain weight and squeeze out when exposed to certain inks such as ultraviolet inks and pigmented inks. An embodiment of the present teachings can include processing of a particular adhesive such that the resulting epoxy adhesive is suitable for printhead applications.

Abstract: Method and system for bonding two or more CVD SiC articles together without the use of interface materials using applied forces from about 0.0035 MPa to about 0.035 MPa. The articles are pretreated for bonding. Graphite or other fixtures are used to apply forces in a vacuum or inert gas environment. Temperatures from about 1900° C. to about 2200° C. are used to initiate a ??? transition in the SiC to create bonded CVS SiC articles.

Abstract: A method for covering an inanimate object with a botanical article includes the following steps: taking a dried botanical article having at least one surface, applying an adhesive to the surface of the botanical article, affixing the botanical item to the inanimate object by applying the surface covered with the adhesive to the inanimate object, whereby a natural veining and coloring of the botanical article are preserved, and optionally, applying a sealant over the botanical articles covering the inanimate object. The inanimate object may include sculptures, vessels, carvings, and frames. The botanical article may include flower petals, leaves, skeleton leaves, plant skins, and combinations thereof.

Abstract: Forming a ferrite thin film laminate includes heating a layered assembly to form a laminate. The layered assembly includes a first coated substrate having a first ferrite layer opposite a first thermoplastic surface and a second coated substrate having a second ferrite layer opposite a second thermoplastic surface to form a laminate. Each coated substrate is formed by forming a ferrite layer on a surface of a thermoplastic substrate. The coated substrates are arranged such that the first ferrite layer contacts the second thermoplastic surface. Heating the layered assembly includes bonding the first coated substrate to the second coated substrate such that the first ferrite layer is sandwiched between a first thermoplastic substrate and a second thermoplastic substrate. The ferrite thin film laminate may include a multiplicity of coated substrates.

Abstract: The present invention relates generally to a metallic alloy composed of Titanium and Tungsten that together form an alloy having a Coefficient of Thermal Expansion (CTE), wherein the content of the respective constituents can be adjusted so that the alloy material can be nearly perfectly matched to that of a commonly used semiconductor and ceramic materials. Moreover, alloys of Titanium-Tungsten have excellent electrical and thermal conductivities making them ideal material choices for many electrical, photonic, thermoelectric, MMIC, NEMS, nanotechnology, power electronics, MEMS, and packaging applications. The present invention describes a method for designing the TiW alloy so as to nearly perfectly match the coefficient of thermal expansion of a large number of different types of commonly used semiconductor and ceramic materials.

Abstract: A carbonization catalyst for forming graphene may be exfoliated from a graphene sheet by etching. A binder layer may be formed on the graphene sheet on which a carbonization catalyst is formed, to support and fix all or part of the graphene sheet. Further, the graphene sheet from which the carbonization catalyst is exfoliated may be transferred to a device. When exfoliating the carbonization catalyst from the graphene sheet, an acid may be used together with a wetting agent.

Abstract: A method for bonding PEBA plastic composition with dissimilar materials. Also, composite articles made in accordance with the method. The method uses only water-borne adhesive compositions.

Abstract: The non-contact information recording medium is made by forming the antenna circuit and connecting it to the IC module through connection terminals at the same time. This provides a high degree of freedom of patterning of the antenna circuit. The antenna circuit is formed on a recording substrate, in which an IC module has been embedded. A foil-bonding resin layer is formed on the connection terminals of the recording substrate, with a toner containing a binder resin by an electrophotographic method. Then a conductive foil is brought into contact with the foil-bonding resin layer to bond the foil to the resin layer, to connect the antenna circuit to the connection terminals and form the antenna circuit composed of the conductive foil.

Abstract: A method for forming nanostructures includes bonding a flexible substrate to a crystalline semiconductor layer having a two-dimensional material formed on a side opposite the flexible substrate. The crystalline semiconductor layer is stressed in a first direction to initiate first cracks in the crystalline semiconductor layer. The first cracks are propagated through the crystalline semiconductor layer and through the two-dimensional material. The stress of the crystalline semiconductor layer is released to provide parallel structures including the two-dimensional material on the crystalline semiconductor layer.

Abstract: A water-repellent film is formed on a first joint surface of a first member that contains any one of a macromolecular material, a metallic material, and an inorganic material. The water-repellent film is subjected to an activation treatment, and is thereby converted into a film having a high hydrophilicity and a nylon 6 contact angle of less than 25°. A second joint surface of a second member that contains at least a thermoplastic resin, which differs from the macromolecular material, is placed on the first joint surface having the film, whereupon the second member is heated and melted. Then, the molten second member is cooled and solidified in order to bond the first joint surface and the second joint surface.

Abstract: An object of the present invention is to provide a collet cleaning method and a die bonder using the same in which a collet can be cleaned without adding a new unit, and foreign substances with high adhesive power can be reliably removed without scattering the foreign substances. A die bonder includes a pickup device, a bonding head unit having a collet that absorbs dies from a wafer at the timing of lifting of the pickup device, and a control unit that controls the pickup device and the bonding head unit. The collet is moved to a position of a dicing tape at which no dies of the wafer held by a wafer ring exist to be brought into contact with the adhesive surface of the dicing tape, so that foreign substances attached to the tip end of the collet are removed.

Abstract: Some embodiments include a method of providing an electronic device structure. Other embodiments for related methods and electronic device structures are also disclosed.

Abstract: A sealing device which comprises a slinger fixedly fitted to the rotary side member, a core member fixedly fitted to the stationary side member, and an elastic sealing member fixed to the core member and having a seal lip which elastically and slidably contacts the slinger. The slinger comprises a fitting cylindrical portion to be fitted into the rotary side member, a brim portion extending its radial direction at one end of its outside relative to a sealed portion of the fitting cylindrical portion, and a rotary side fixing member fixed to the brim portion. Further, the slinger is made in such a manner that an adhesive layer is formed on its whole surface including a contacting side surface where the seal lip contacts by applying adhesive agent thereon, then the fixing member is integrally fixed thereto, thereafter the adhesive layer is partially removed only in the contacting side surface.

Abstract: A method and apparatus comprising a sol-gel solution. Zirconium n-propoxide is aged in a solvent to form a first part for the sol-gel solution. The first part is combined with deionized water to form a second part for the sol-gel solution. Aminoaryltrialkoxysilane is combined with an alcohol to form a third part for the sol-gel solution. The third part is combined with the second part to form a mixture for the sol-gel solution. The deionized water, or the alcohol, or a combination thereof is combined with the mixture to form a solution. The solution is aged to form the sol-gel solution comprising a mole balance ratio of approximately 1:5 between the zirconium n-propoxide and the aminoaryltrialkoxysilane.

Abstract: An object of the present invention is to provide a copper surface treatment method capable of keeping certainly a bonding strength between a copper surface and a resist, or between a copper surface and an insulating resin without forming irregularities having sizes of more than 1 ?m on the copper surface, and a copper treated with the method. The surface treatment method, comprising: a first step of forming, on a copper surface, a nobler metal than the copper discretely; a second step, subsequent to the first step, of forming copper oxide on the copper surface by oxidation with an alkaline solution containing an oxidizing agent; and third step of dissolving the copper oxide so as to be removed, thereby forming irregularities on the copper surface.