Direct Application Of Vacuum Or Fluid Pressure During Bonding Patents (Class 156/285)
  • Publication number: 20130195605
    Abstract: A turbofan engine has a fan having a circumferential array of fan blades. A fan case encircles the fan. There is at least one compressor section, a combustor, and at least one turbine section. The fan case comprises a composite structural member and a metallic member encircled by the composite structural member. The metallic member is mounted to the composite structural member to permit differential thermal expansion proximate the blades.
    Type: Application
    Filed: January 31, 2012
    Publication date: August 1, 2013
    Applicant: UNITED TECHNOLOGIES CORPORATION
    Inventors: Thomas J. Robertson, Mark W. Costa, Johan R. Santana
  • Patent number: 8496771
    Abstract: A method of filling and sealing a fluorescent layer in a slot space defined by two optical lenses and a partition ring is disclosed, in which a slot space is defined by two optical glasses and a partition frame having a partition ring on the inner wall surface. The partition frame is installed with two slots diametrically opposite to each other, and the slot space is evacuated to allow filling of a fluorescent material, and then the two slots are sealed so that the moisture is prevented from permeating into the fluorescent layer, and thus the optical performance can be maintained over a long period.
    Type: Grant
    Filed: January 26, 2011
    Date of Patent: July 30, 2013
    Assignee: Gem Weltronics TWN Corporation
    Inventors: Jon-Fwu Hwu, Yung-Fu Wu, Kui-Chiang Liu
  • Patent number: 8496206
    Abstract: Structural panels for use in manufacturing aircraft fuselages and other structures are disclosed herein. In one embodiment, a structural panel configured in accordance with the invention includes a skin and at least first and second stiffeners. The first stiffener can have a first flange portion mated to the skin and a first raised portion projecting away from the skin. The second stiffener can have a second flange portion mated to the skin and a second raised portion projecting away from the skin. At least one of the first flange portion of the first stiffener and the second flange portion of the second stiffener can extend toward the other of the first flange portion and the second flange portion to form an at least approximately continuous support surface to which a frame can be attached.
    Type: Grant
    Filed: April 16, 2010
    Date of Patent: July 30, 2013
    Assignee: The Boeing Company
    Inventors: Kent E. Johnson, Mark A. Ulvin
  • Patent number: 8492176
    Abstract: To provide a method of manufacturing a semiconductor device including a step of attaching a surface protective tape onto the surface of a wafer which has completed the wafer process, a step of subjecting the back surface of the wafer to back grinding, and a step of attaching a peeling assist tape onto the surface protective tape while vacuum-adsorbing the back surface of the wafer to apply a tension to the assist tape, thereby separating the surface protective tape from the wafer, wherein a vacuum suction system has a peripheral suction system for the peripheral part of the wafer and an internal suction system for the internal region of the wafer.
    Type: Grant
    Filed: September 11, 2012
    Date of Patent: July 23, 2013
    Assignee: Renesas Electronics Corporation
    Inventor: Haruo Amada
  • Publication number: 20130180760
    Abstract: A laminate body containing at least one resin composition layer and at least one glass substrate layer, wherein the resin composition layer comprises a resin composition containing a thermosetting resin and an inorganic filler. A laminate plate containing at least one cured resin layer and at least one glass substrate layer, wherein the cured resin layer comprises a cured product of a resin composition that contains a thermosetting resin and an inorganic filler. A printed wiring board having the laminate plate and a wiring provided on the surface of the laminate plate. A method for producing a laminate plate containing at least one cured resin layer comprising a cured product of a resin composition containing a thermosetting resin and an inorganic filler, and at least one glass substrate layer, which comprises a cured resin layer forming step of forming a cured resin layer on the surface of a glass substrate.
    Type: Application
    Filed: September 21, 2012
    Publication date: July 18, 2013
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventor: HITACHI CHEMICAL COMPANY, LTD.
  • Publication number: 20130180769
    Abstract: A laminate body containing at least one resin composition layer and at least one glass substrate layer, wherein the resin composition layer comprises a resin composition containing a thermosetting resin and a fibrous base material and wherein the glass substrate layer accounts for from 10 to 70% by volume relative to the entire laminate body. A laminate plate containing at least one cured resin layer of the resin composition and at least one glass substrate layer, wherein the glass substrate layer accounts for from 10 to 70% by volume relative to the entire laminate plate. A printed wiring board having the laminate plate and a wiring provided on the surface thereof. A method for producing the laminate plate, which comprises forming a fiber-containing cured resin layer on the surface of a glass substrate.
    Type: Application
    Filed: September 21, 2012
    Publication date: July 18, 2013
    Applicant: Hitachi Chemical Company, Ltd.
    Inventor: Hitachi Chemical Company, Ltd.
  • Publication number: 20130180765
    Abstract: A laminate body containing one or more resin composition layers and two or more glass substrate layers, wherein at least one layer of those resin composition layers is between glass substrate layers, and is a fiber-containing resin composition layer of a composition that contains a thermosetting resin and a fibrous base material. A laminate plate containing one or more cured resin layers and two or more glass substrate layers, wherein at least one layer of those cured resin layers is between glass substrate layers, and is a fiber-containing cured resin layer of the fiber-containing resin composition. A printed wiring board having the above-mentioned laminate plate and a wiring provided on the surface thereof. A method for producing the laminate plate.
    Type: Application
    Filed: September 21, 2012
    Publication date: July 18, 2013
    Applicant: Hitachi Chemical Company, Ltd.
    Inventor: Hitachi Chemical Company, Ltd.
  • Publication number: 20130175214
    Abstract: The present invention provides a separation membrane having a plurality of concavoconvex parts which have a height difference of from 100 ?m to 2000 ?m and are formed on at least one surface of the separation membrane, in which an average value d1 of a minimum thickness and an average value d2 of a maximum thickness in the concavoconvex parts satisfy the following relational expression 0.8?d1/d2?1.0.
    Type: Application
    Filed: September 6, 2011
    Publication date: July 11, 2013
    Applicant: Toray Industries Inc.
    Inventors: Kentaro Takagi, Masahiro Kimura, Hiroho Hirozawa
  • Patent number: 8480826
    Abstract: Disclosed herein is a method for bonding dissimilar materials using an elastic adhesive to permit the bond to withstand variations in temperature and pressure. The use of elastic adhesive accommodates previous problems associated with large differences in thermal expansion coefficient between dissimilar materials, and provides a thermally and chemically stable materials combination that withstands large thermal shock loads, such as may be experienced in a space environment. Also disclosed herein is a method for attaching a coating to a structure. In particular applications, the coating may be (1) specular (greater than 98% specularity); or (2) RF reflective for use in applications including but not limited to high frequency satellite communications.
    Type: Grant
    Filed: April 18, 2007
    Date of Patent: July 9, 2013
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics Space Administration
    Inventors: Kenneth N. Segal, James M. Lohr, Russell Rowles, Wanda Peters, Robert Kiwak
  • Patent number: 8480838
    Abstract: Components for the manufacture of polymer electrolyte membrane fuel cells are provided, as well as apparatus and automatable methods for their manufacture by rotary die cutting and by lamination of various layers to form membrane electrode assemblies. A method and apparatus for performing the method are provided comprising die-cutting webs of catalyst decal materials or electrode materials to make first and second workpieces at first and second rotary die stations; holding the die-cut workpieces by action of sub-ambient air pressure to an endless perforated belt of first and second vacuum conveyors, typically before they are fully cut from the first and second webs; transporting first and second workpieces to opposing sides of a membrane in a laminating station; concurrently feeding the first and second workpieces into the laminating nip adjacent to the membrane, and laminating the first and second workpieces to the membrane.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: July 9, 2013
    Assignee: 3M Innovative Properties Company
    Inventors: Scott Alan Ripley, Donald Ivan Hirsch, William Frederic Bader
  • Patent number: 8475620
    Abstract: A holding tool 2 for use in producing of laminated glass includes a frame 3, a bag member 4 and a supporting member 6b for suspending the bag member 4 from the frame 3. The bag member 4 is made of a film with flexibility and airtightness, is provided with a sealable opening and has evacuating ports 7a and 7b in the vicinity of an periphery of a flat shape thereof having the periphery sealed. The frame 3 has a first frame member 3w and a second frame member 3y opposing each other and disposed outside the periphery of the bag member 4, and the bag member 4 is suspended by the supporting member 6b movably against the frame 3 on a holding face formed at least by the first frame member 3w and the second frame member 3y inside an area formed by connecting ends of these frame members.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: July 2, 2013
    Assignee: Asahi Glass Company, Limited
    Inventors: Hiroyuki Matsuoka, Tsutomu Anbo, Shigeru Hirata, Tsutomu Mizukami, Yoshiyuki Sato
  • Publication number: 20130164481
    Abstract: A method for fabricating a repair laminate for a composite part having an exposed surface includes applying a release film to the exposed surface and forming an uncured ply stack assembly on the release film. The uncured ply stack assembly is formed by forming and compacting a series of uncured ply stacks. The release film and ply stack assembly is then removed from the exposed surface. A bonding material is then applied to the exposed surface, and the uncured ply stack assembly is applied to the bonding material. The ply stack assembly and bonding material are then cured.
    Type: Application
    Filed: February 26, 2013
    Publication date: June 27, 2013
    Applicant: BELL HELICOPTER TEXTRON INC.
    Inventors: Denver Ray Whitworth, Vance Newton Cribb, III, Dumitru Radu Jitariu
  • Publication number: 20130165861
    Abstract: Disclosed are composite microneedles arrays including microneedles and a film overlaying the microneedles. The film includes a plurality of nano-sized structures fabricated thereon. Devices may be utilized for interacting with a component of the dermal connective tissue. A random or non-random pattern of structures may be fabricated such as a complex pattern including structures of differing sizes and/or shapes. Devices may be beneficially utilized for delivery of an agent to a cell or tissue. Devices may be utilized to directly or indirectly alter cell behavior through the interaction of a fabricated nanotopography with the plasma membrane of a cell and/or with an extracellular matrix component.
    Type: Application
    Filed: April 27, 2011
    Publication date: June 27, 2013
    Inventor: Russell Frederick Ross
  • Publication number: 20130157867
    Abstract: A thermal insulation tube has a double-structure including a thermal insulation internal tube and a thermal insulation external tube, an intermediate connecting part has a double-structure including an outer container and an inner container, the internal tube and the external tube penetrate through a wall surface of the outer container and are introduced at least up to a wall surface of the inner container, a region between the internal tube and the external tube is sealed by joining an end to be introduced of the internal tube and an end to be introduced of the external tube, at an introduction portion of the external tube to be positioned on an inner side of a wall surface of the outer container, and a corrugated tubular part has a tube wall thinner than the external tube outside of the wall surface.
    Type: Application
    Filed: January 26, 2012
    Publication date: June 20, 2013
    Applicants: INTERNATIONAL SUPERCONDUCTIVITY TECHNOLOGY CENTER, FURUKAWA ELECTRIC CO., LTD.
    Inventors: Masashi Yagi, Takaharu Mitsuhashi, Tomoya Nomura, Taro Matsuoka
  • Publication number: 20130153330
    Abstract: A dash silencer is constructed by layering a front side layer formed from a porous material, an intermediate layer constructed by a film structure body and a rear side layer. The rear side layer has upper and lower side layer portions which are formed from porous and sound insulation materials respectively and layered on upper and lower side layer portions of the intermediate layer.
    Type: Application
    Filed: July 24, 2012
    Publication date: June 20, 2013
    Applicant: HOWA TEXTILE INDUSTRY CO., LTD.
    Inventor: Shinobu Fushiki
  • Publication number: 20130153029
    Abstract: Methods are generally provided for adhering a support insert within a connection aperture defined in an encapsulating substrate of a photovoltaic device that has a first lead. The connection aperture generally has a perimeter defined by an aperture wall of the encapsulating substrate. The method can, in one particular embodiment, include threading the first lead through the connection aperture; and positioning a support insert within the connection aperture such that the first lead is still able to extend through the connection aperture. The support insert can generally define a channel within its construction that extends from a channel opening in the support insert to an exit port. An adhesive composition can be injected into the channel opening such that a first amount of the adhesive composition flows through the channel and out of the exit port to bond the support insert within the connection aperture.
    Type: Application
    Filed: December 15, 2011
    Publication date: June 20, 2013
    Applicant: PRIMESTAR SOLAR, INC.
    Inventors: Bradley Crume, Max William Reed, Loucas Tsakalakos, Jeffrey Scott Erlbaum, Troy Alan Berens, Jeffrey Todd Knapp, Venkata Sai Rahul Chandra Abbaraju
  • Publication number: 20130153140
    Abstract: It comprises applying a mould release agent on a compaction tool (1), carrying out its curing and applying a layer with adhesive properties (2) on the mould release agent. It is characterized in that it also comprises extending an aerator blanket (4) along the layer (2) with dimensions larger than the adhesive layer (2), extending a membrane with resilient properties (5) on the entire surface of the tool (1) by applying vacuum to the membrane (5) for compacting the adhesive layer. This method reduces the number of stages required to perform the compaction and avoids the generation of waste materials thus reducing the cost of the process.
    Type: Application
    Filed: June 11, 2012
    Publication date: June 20, 2013
    Applicant: AIRBUS OPERATIONS, S.L.
    Inventors: Gerardo GONZÁLEZ FERNÁNDEZ, Victor SÁNCHEZ MONTES
  • Patent number: 8465619
    Abstract: Semiconductor device assembly die attach apparatus and methods are disclosed for improvements in attaching a semiconductor die to a die pad. Preferred methods of the invention include steps for positioning a semiconductor die on a bearing surface of a collet and retaining the die on the bearing surface of the collet using a vacuum force. A pushing force is also exerted on the die adjacent to the applied vacuum force. The pushing force opposes flexion of the die in the direction of the vacuum force. In further steps, the die is placed on a die pad, and die attach adhesive is interposed between the die and the die pad. A preferred method includes applying a pushing force to bow the central region of the die toward the die pad. In a preferred apparatus of the invention, a collet has a body including a bearing surface for receiving a die and a vacuum for holding it. A chamber encompassed by the bearing surface is adapted for applying the force of expelled gas against a die borne on the bearing surface.
    Type: Grant
    Filed: July 28, 2010
    Date of Patent: June 18, 2013
    Assignee: Texas Instruments Incorporated
    Inventors: Dan Okamoto, Seiichi Yamasaki
  • Patent number: 8460502
    Abstract: A method and part forming apparatus configured for forming an aircraft stringer. The part forming apparatus may comprise a forming tool, a rigid plate, and a hollow bladder. The forming tool may comprise a material trough, a bladder extension trough laterally aligned with and open to the material trough, and a recessed pocket extending from either side of the bladder extension trough and adjacent to the material trough. The method comprises placing composite material into the material trough, placing the bladder onto the composite material and through the bladder extension trough, placing the rigid plate into the recessed pocket and over the bladder, and then placing skin laminate over the bladder and the composite material. Once each of these components is in place, the forming tool may be vacuum bagged and the composite material and skin laminate may be co-cured to form the stringer.
    Type: Grant
    Filed: April 14, 2011
    Date of Patent: June 11, 2013
    Assignee: Spirit AeroSystems, Inc.
    Inventors: Blaise F. Bergmann, Dwight D. Spaulding, John P. McPherson
  • Publication number: 20130133936
    Abstract: Provided is an integral thermal compression bonded board technology which is high in reliability and low in cost. In a process of bonding printed boards to each other, electrodes are connected with each other by solder connection using a Cu core solder plated ball and the boards are bonded by a three-layer bonding material constituted by a bonding material layer, a ball maintaining core layer, and the bonding layer, and solder of the Cu core solder plated ball inserted into holes of three layers is formed by integral thermal compression. They are connected with each other by flux or welcoming solder.
    Type: Application
    Filed: November 28, 2012
    Publication date: May 30, 2013
    Applicant: HITACHI, LTD.
    Inventor: Hitachi, Ltd.
  • Publication number: 20130133828
    Abstract: A bonding apparatus for bonding a substrate to be processed and a support substrate including, a first holding unit which holds the substrate to be processed, a second holding unit disposed to face the first holding unit and configured to hold the support substrate, a pressurizing mechanism including a vertically-expansible pressure vessel which is installed to cover the substrate to be processed held by the first holding unit and the support substrate held by the second holding unit, the pressurizing mechanism being installed in any one of the first holding unit and the second holding unit and configured to flow air into the pressure vessel and press the second holding unit and the first holding unit towards each other, an internally-sealable processing vessel which receives the first holding unit, the second holding unit and the pressure vessel, and a depressurization mechanism which depressurizes an internal atmosphere of the processing vessel.
    Type: Application
    Filed: November 21, 2012
    Publication date: May 30, 2013
    Applicant: TOKYO ELECTRON LIMITED
    Inventor: TOKYO ELECTRON LIMITED
  • Publication number: 20130133726
    Abstract: Multi-layered protective backsheet for solar modules comprising in this order (i) an optional top layer (layer (i)), (ii) an insulating layer (layer (ii)), (iii) a back layer (layer (iii)), wherein between each layer there may or may not be one or more sublayers, wherein the top layer (i), the insulating layer (ii) and the back layer (iii) contain a polyolefin as the major component, wherein the polyolefin is selected from polyethene homo- and copolymers (PE's) and polypropene homo- and copolymers (PP's) and preferably the insulating layer (ii) has a thickness of at least 210 or at least 310 ?m. Also provided are solar modules containing the backsheets and methods for making the backsheets and for making solar modules containing the backsheets.
    Type: Application
    Filed: August 16, 2011
    Publication date: May 30, 2013
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Andreas H. Graichen, Wolfgang G. Schöppel, Michael Jürgens
  • Patent number: 8445776
    Abstract: A solar cell module comprising a solar cell layer and a sheet comprising at least one layer of a sodium ionomer composition, wherein the sodium ionomer composition consists essentially of a sodium ionomer that is an ionic, neutralized derivative of a precursor ?-olefin carboxylic acid copolymer, wherein about 10% to about 35% of the total content of the carboxylic acid groups present in the precursor ?-olefin carboxylic acid copolymer have been neutralized with sodium ions, and wherein the precursor ?-olefin carboxylic acid copolymer comprises (i) copolymerized units of an ?-olefin having 2 to 10 carbons and (ii) about 20 to about 25 wt %, based on the total weight of the ?-olefin carboxylic acid copolymer, of copolymerized units of an ?,?-ethylenically unsaturated carboxylic acid having 3 to 8.
    Type: Grant
    Filed: June 1, 2009
    Date of Patent: May 21, 2013
    Assignee: E I du Pont de Nemours and Company
    Inventors: Richard Allen Hayes, Rebecca L. Smith, Kristof Proost, Steven C. Pesek, Charles Anthony Smith
  • Publication number: 20130118679
    Abstract: A method of manufacturing an interior component for a vehicle interior. The method involves laminating, in a laminating mold, a foam laminate onto a dimensionally stable substrate with a three-dimensional surface contour. The method includes providing the substrate, applying the foam laminate onto the three-dimensional surface contour of the substrate by way of a vacuum, and bonding the substrate to the foam laminate.
    Type: Application
    Filed: November 16, 2012
    Publication date: May 16, 2013
    Applicant: Lisa Draexlmaier GmbH
    Inventor: Lisa Draexlmaier GmbH
  • Publication number: 20130122236
    Abstract: A composite structure comprises stacked sets of laminated fiber reinforced resin plies and metal sheets. Edges of the resin plies and metal sheets are interleaved to form a composite-to-metal joint connecting the resin plies with the metal sheets.
    Type: Application
    Filed: December 16, 2012
    Publication date: May 16, 2013
    Applicant: THE BOEING COMPANY
    Inventor: The Boeing Company
  • Patent number: 8440120
    Abstract: A use of a core block for an impregnation process as well as a composite structure comprising such a core block is described. The core block has a first surface and a second surface, and a number of first grooves is formed in the first surface of the core. Furthermore, a number of second grooves is formed in the second surface of the core. The first grooves have a first height (h1) and a bottom, and the first grooves and the second grooves are part of a resin distribution network formed in the core block. The distance (t) between the bottom of the first grooves and the second surface of the core block is of such a size that the core block is flexible along the first grooves. Additionally, the sum of the first height and the second height is larger than the thickness of the core block, and at least one of the first grooves in the first surface of the core block crosses at least one of the second grooves in the second surface of the core block.
    Type: Grant
    Filed: June 27, 2008
    Date of Patent: May 14, 2013
    Assignee: LM Glasfiber A/S
    Inventors: Tommy Mikkelsen, Morten Stage
  • Publication number: 20130115440
    Abstract: Embodiments include methods of forming a composite. The methods can include providing a foam core, wherein the foam core includes a foam having a softening point of 90° C. to 110° C., covering a portion of the foam core with a prepreg, contacting the prepreg that covers the portion of the foam core with a curable composition, and curing the prepreg and the curable composition to form the composite, wherein the prepreg insulates the foam core during the curing so that the foam maintains a temperature that is below the softening point. Embodiments include a composite obtained by curing the prepreg and the curable composition. Embodiments include B-stageable formulation having a resin component and a hardener component.
    Type: Application
    Filed: May 27, 2011
    Publication date: May 9, 2013
    Inventors: Bernd Hoevel, Martine M. Rousse, Alain M. Sagnard, Marvin L. Dettloff, Radhakrishnan Karunakaran
  • Publication number: 20130112459
    Abstract: A laminate body containing at least two glass substrate layers and at least one inner resin composition layer existing between the adjacent two glass substrate layers, wherein the inner resin composition layer comprises an inner resin composition that contains a thermosetting resin and an inorganic filler. A laminate plate containing at least two glass substrate layers and at least one inner cured resin layer existing between the adjacent two glass substrate layers, wherein the inner cured resin layer comprises a cured product of an inner resin composition that contains a thermosetting resin and an inorganic filler. A printed wiring board having the laminate plate and a wiring provided on the surface of the laminate plate. A method for producing the laminate plate, which comprises a cured resin layer forming step of forming a cured resin layer on the surface of a glass substrate.
    Type: Application
    Filed: September 21, 2012
    Publication date: May 9, 2013
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventor: HITACHI CHEMICAL COMPANY, LTD.
  • Publication number: 20130112349
    Abstract: Process for joining a foil or a membrane. The invention relates to a method for joining at least one foil-like or membrane-like part to a structural part (9), wherein the foil-like or membrane-like part is separated by means of a tool (2) from a semi-finished product (3) and is held on the tool (2) by applying a reduced pressure, and wherein the foil-like or membrane-like part is placed on the structural part (9), and is in turn held on this (9) and joined to this (9) by applying a reduced pressure. By means of the method a precise, reliable and readily automatable joining of a foil-like or membrane-like part to a structural part (9) is possible. A device (1) is also proposed, with which the method according to the invention can readily be carried out.
    Type: Application
    Filed: May 2, 2012
    Publication date: May 9, 2013
    Applicant: BOEHRINGER INGELHEIM MICROPARTS GMBH
    Inventors: Markus VOIGT, Thomas WILLMS
  • Patent number: 8434587
    Abstract: A purpose is to provide a tubular body soundproof cover and a covered tubular body, for which elastic deformation of the tubular body is unlikely to be inhibited. The tubular body soundproof cover includes a sound absorbing layer arranged on outside in an axially perpendicular direction of a tubular body having tubular body side curved sections; a skin layer arranged on outside in the axially perpendicular direction of the sound absorbing layer; and cover side curved sections arranged on outside in the axially perpendicular direction of the tubular body side curved sections, including at least a portion of the sound absorbing layer and at least a portion of the skin layer. The cover side curved sections have non-adherent sections in which the sound absorbing layer and the skin layer are not bonded over the entire circumferential length.
    Type: Grant
    Filed: January 26, 2012
    Date of Patent: May 7, 2013
    Assignee: Tokai Rubber Industries, Ltd.
    Inventors: Kazuki Era, Hiroyuki Ochiai
  • Publication number: 20130105077
    Abstract: A method for thermoforming a laminate to a part by controlling the temperature and pressure during the thermoforming. The laminate to be thermoformed may include an adhesive layer and the part may be a metal article. A thermoforming box may be used to control one of the temperature and the pressure.
    Type: Application
    Filed: May 7, 2012
    Publication date: May 2, 2013
    Applicant: WHIRLPOOL CORPORATION
    Inventors: PATRICK J. KESSLER, HEATHER L. RITTENHOUSE, JAMES ALONGI, PAUL ALONGI
  • Patent number: 8431267
    Abstract: A nonaqueous secondary battery comprising a pair of electrodes consisting of a positive electrode and a negative electrode, and a separator interposed between the pair of electrodes, wherein the separator is a laminate formed by stacking in sequence a metal layer, a first resin layer and a second resin layer having a thermal shrinkage percentage smaller than a thermal shrinkage percentage of the first resin layer, and the metal layer is opposed to one of the pair of electrodes.
    Type: Grant
    Filed: February 1, 2011
    Date of Patent: April 30, 2013
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Naoto Torata, Naoto Nishimura
  • Publication number: 20130101430
    Abstract: A wind turbine blade includes at least one mandrel and a sock that covers the at least one mandrel. The sock includes a plurality of braided fibers within a matrix material. The fibers can be made of different materials. Also, stiffness of the sock can vary across the wind turbine blade. A method of manufacturing the wind turbine blade is also disclosed.
    Type: Application
    Filed: October 24, 2012
    Publication date: April 25, 2013
    Applicant: THE REGENTS OF THE UNIVERSITY OF MICHIGAN
    Inventor: The Regents of the University of Michigan
  • Patent number: 8425715
    Abstract: An industrial-scale high throughput wafer bonding apparatus includes a wafer bonder chamber extending along a main axis and comprising a plurality of chamber zones, a plurality of heater/isolator plates, a guide rod system extending along the main axis, a pair of parallel track rods extending along the main axis, and first pressure means. The chamber zones are separated from each other and thermally isolated from each other by the heater/isolator plates. The heater/isolator plates are oriented perpendicular to the main axis, are movably supported and guided by the guide rod system and are configured to move along the direction of the main axis. Each of the chamber zones is dimensioned to accommodate an aligned wafer pair and the wafer pairs are configured to be supported by the parallel track rods. The first pressure means is configured to apply a first force perpendicular to a first end heater/isolator plate.
    Type: Grant
    Filed: April 4, 2011
    Date of Patent: April 23, 2013
    Assignee: Suss Microtec Lithography, GmbH
    Inventor: Gregory George
  • Patent number: 8425711
    Abstract: To provide a glass substrate with protective glass which suppresses formation of microscopic scratches on the back surface of the glass substrate in the production process for a display device, and which prevents a strength decrease in the process or formation of etch pits after a chemical etching treatment; a process for producing a display device by using the glass substrate with protective glass; and a double-sided removable resin sheet for the glass substrate with protective glass. A glass substrate with protective glass, which comprises a glass substrate and a protective glass plate laminated on each other, and which is characterized in that the glass substrate and the protective glass plate are laminated by a double-sided removal resin sheet.
    Type: Grant
    Filed: September 1, 2009
    Date of Patent: April 23, 2013
    Assignee: Asahi Glass Company, Limited
    Inventors: Toshihiko Higuchi, Satoru Takaki
  • Publication number: 20130092521
    Abstract: The present disclosure relates to an electronic device, and more particularly, to an electronic device with laminated structure and a manufacturing method thereof. The electronic device comprises: a first substrate; a second substrate; and a solid-state adhesive layer, wherein the adhesive layer is disposed between the first substrate and the second substrate. The solid-state adhesive layer reacts with the first substrate and the second substrate to form a chemically linked chain for bonding the first substrate and the second substrate. The present disclosure further selects a solid-state adhesive with both physical and chemical cohesiveness to laminate the two substrates: thereby making an electronic device more firm with higher shock resistance.
    Type: Application
    Filed: July 12, 2012
    Publication date: April 18, 2013
    Inventors: Yuezhan LIN, Xu Zhang, Wei Huang
  • Publication number: 20130093297
    Abstract: A device housing includes a main body and a first decorative layer formed on the main body. The main body defines a planar region and at least a concave region connected with the planar region. The first decorative layer includes a first pattern and a second pattern. The first pattern is formed on the planar region. The second pattern is formed on the concave region. The first pattern and the second pattern are an integral structure. A method for making the device housing is also provided.
    Type: Application
    Filed: August 9, 2012
    Publication date: April 18, 2013
    Applicants: FIH (HONG KONG) LIMITED, SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.
    Inventors: XIN-WU GUAN, CHAO-SHENG HUANG, XIAO-MEI CHEN
  • Patent number: 8418740
    Abstract: Composite sections for aircraft fuselages and other structures, and methods and systems for manufacturing such sections, are disclosed herein. A method for manufacturing a shell structure in accordance with one embodiment of the invention includes applying composite material to an interior mold surface of a tool to form a skin extending 360 degrees around an axis. The method can further include positioning a plurality of stiffeners on an inner surface of the skin. After the stiffeners have been positioned, a vacuum bag can be installed over the stiffeners and evacuated to press the stiffeners and the skin outwardly against the interior mold surface of the tool. Next, the skin/stiffener combination can be cocured to bond the stiffeners to the skin and harden the shell structure.
    Type: Grant
    Filed: September 21, 2012
    Date of Patent: April 16, 2013
    Assignee: The Boeing Company
    Inventors: Michael R. Chapman, Robert M. Watson, Donald A. Anderson, Marc J. Piehl, Joseph L. Sweetin, Douglas L. Grose
  • Patent number: 8414721
    Abstract: Described is a method and a device for applying a coating film (63) on a face (108) of an optical element (100), including placing the coating on the face of the lens with an adhesive interface (46) placed between the coating and the lens, and inflating a membrane (62) towards the lens in order to press the coating against the lens. Provision is made to adjust the position of the lens relative to the membrane, the adjustment being distinct from the inflation of the membrane.
    Type: Grant
    Filed: June 26, 2007
    Date of Patent: April 9, 2013
    Assignee: Essilor International (Compagnie Generale d'Optique)
    Inventors: Konogan Baranton, Herve Jouffroy, Ahmed Haddadi
  • Publication number: 20130082292
    Abstract: A method of fabricating alight emitting diode packaging structure provides a metallized ceramic heat dissipation substrate and a reflector layer, and the metallized ceramic heat dissipation substrate is bonded with the reflector layer through an adhesive. The reflector layer has an opening for a surface of the metallized ceramic heat dissipation substrate to be exposed therefrom. The reflector layer may be formed with ceramic or polymer plastic material, to enhance the refractory property and the reliability of the package structure. In addition, the packaging structure of the present invention may make use of existing packaging machine for subsequent electronic component packaging, without increasing the fabrication cost.
    Type: Application
    Filed: December 8, 2011
    Publication date: April 4, 2013
    Applicant: VIKING TECH CORPORATION
    Inventors: Shih-Long Wei, Shen-Li Hsiao, Chien-Hung Ho
  • Patent number: 8409394
    Abstract: A lamination apparatus has opposed plenums that project pressurized fluids toward a fluid pressure lamination zone. Material sheets to be laminated are advanced through the lamination zone and laminated together due to the pressure exerted by the pressurized fluid.
    Type: Grant
    Filed: May 26, 2006
    Date of Patent: April 2, 2013
    Assignee: First Step Partners, LLC
    Inventor: James McLaughlin
  • Patent number: 8408271
    Abstract: A system, apparatus, and method for removing pressure adhesive indicia, such as labels or stamps, from their backing and affixing the same to a target substrate is provided. The automated process affixes stamps, for example, to the target substrate with both speed and precision of placement. Desired stamps can be selectively removed from a backing, for example, can be placed on variable locations upon the target substrate, and can be affixed in the desired orientation with precise spacing between stamps. The precision of affixation afforded by this system is commensurate with philatelic standards and is suitable for all pressure adhesive indicia where rapid and precise placement is desired for aesthetic or other reasons.
    Type: Grant
    Filed: February 2, 2007
    Date of Patent: April 2, 2013
    Assignee: The United States Postal Service
    Inventors: Khalid X. Hussain, David C. Faulkner
  • Patent number: 8409385
    Abstract: A transparent laminate is produced by preparing a pair of transparent substrates, forming a sealing portion along the periphery on one of the transparent substrates for sealing a curable resin composition, supplying the curable resin composition in a region on the transparent substrate surrounded by the sealing portion, overlaying the other transparent substrate on the supplied curable resin composition in a reduced pressure atmosphere so that the curable resin composition is sealed as it is sandwiched between the pair of transparent substrates, and subsequently curing the curable resin composition in an atmosphere having a higher pressure than the pressure of the atmosphere in which the composition is sandwiched, to produce the transparent laminate.
    Type: Grant
    Filed: June 24, 2009
    Date of Patent: April 2, 2013
    Assignee: Asahi Glass Company, Limited
    Inventors: Hiroshige Ito, Satoshi Niiyama, Satoshi Kikuchi
  • Patent number: 8410218
    Abstract: The present invention is directed to providing a pressure-sensitive adhesive with good initial tack and good adhesion at low temperature. Generally, the pressure-sensitive adhesive composition comprises (1) a carboxylic group-containing (meth)acrylic tacky polymer having a weight average molecular weight of less than 800,000 and a glass transition temperature of ?100° C. to ?30° C., and (2) an amino group-containing (meth)acrylic non-tacky polymer having a weight average molecular weight of from 30,000 to 100,000 and a glass transition temperature of 20° C. to 90° C. The amino group-containing (meth)acrylic non-tacky polymer (2) is present in an amount of no less than 1 parts by mass and less than 20 parts by mass on a basis of 100 parts by mass of said carboxylic group-containing (meth)acrylic tacky polymer (1).
    Type: Grant
    Filed: July 29, 2008
    Date of Patent: April 2, 2013
    Assignee: 3M Innovative Properties Company
    Inventors: Hidetoshi Abe, Masaaki Furusawa, Yorinobu Takamatsu
  • Publication number: 20130075034
    Abstract: The invention relates to an oven (10) for the production of stratified sheets (12) from pre-assembled sheets (14). The pre-assembled sheets (14) comprise at least two sheets (16, 18) and at least one sheet of polymer material (20). The oven (10) comprises a hot chamber (22) which in turn comprises heating means (26) and an inlet opening (28) provided with first closing means (30). The oven also comprises a cold chamber (24) communicating with the hot chamber (22) and able to be separated from the hot chamber (22 via separation means (23). The cold chamber comprises cooling means (36) and an outlet opening (42) provided with second closing means (44). The invention also relates to a method for the production of stratified sheets.
    Type: Application
    Filed: May 25, 2011
    Publication date: March 28, 2013
    Applicant: LISEC COSTRUZIONE MACCHINE ITALIA SRL
    Inventor: Loris Grando
  • Publication number: 20130079434
    Abstract: A method for manufacturing a part in composite material with a hollow core is provided that includes applying at least one adhesive layer on an open surface of the hollow core. The adhesive layer is a blocking polymerizable adhesive layer having, after polymerization, sealing properties relatively to a resin and capable of preventing its diffusion towards an inside of the hollow core. Subsequently, the blocking adhesive layer is polymerized so as to achieve sealing of the hollow core. Additionally, various parts manufactured according to the methods of the present disclosure are also provided.
    Type: Application
    Filed: November 12, 2012
    Publication date: March 28, 2013
    Applicants: Societe Lorraine de Construction Aeronautique, Pole de Plasturgie de L'EST, Ateliers Cini, Arts & Metiers Paris Tech
    Inventors: Societe Lorraine de Construction Aeronautique, Arts & Metiers Paris Tech, Ateliers Cini, Pole de Plasturgie de L'EST
  • Publication number: 20130068375
    Abstract: The use of a heat idler moveable along a path provides speed and flexibility in the heat labeling of containers.
    Type: Application
    Filed: November 12, 2012
    Publication date: March 21, 2013
    Applicant: The Procter & Gamble Company
    Inventor: The Procter & Gamble Company
  • Patent number: 8388789
    Abstract: For an arcuate structural member (10) of a fuselage frame, tapes of resin pre-impregnated unidirectional fibers are used. The member (10) includes a web (11) lying in a radial plane and a radially outer cylindrical flange (12). An elongate, arcuate forming mandrel (M1) having a flat radial surface (F) forming an angular edge (D) with a radially outer, convex cylindrical surface (S) is used and a series of promontories (P) radiating outwardly with respect to the cylindrical surface (S) are provided. Layers of pre-impregnated composite material are laid on the mandrel (M1) to form a first flat arcuate laminate (20?), with a part (20?) of the laminate projecting radially outwardly beyond the angular edge (D). The mandrel (M1), the laminate (20?) and the promontories (P) are covered with a membrane (E). A vacuum is then applied to urge the projecting part (20?) of the laminate against the cylindrical surface (S) and against the promontories (P).
    Type: Grant
    Filed: September 14, 2010
    Date of Patent: March 5, 2013
    Assignee: Alenia Aeronautica S.p.A.
    Inventors: Sabato Inserra Imparato, Luigi Avagliano, Diego De Luca
  • Publication number: 20130050113
    Abstract: The invention relates to a method for the production of an at least partially electrically conductive or semi-conductive element on a structure, wherein the element comprises one or more layers, the method comprising the steps of a) forming a formable element comprising one or more layers, wherein at least one layer comprises a network of high aspect ratio molecular structures (HARM-structures), wherein the HARM-structures are electrically conductive or semi-conductive, and b) arranging the formable element in a conformal manner onto a structure by pressing and/or vacuum sealing the formable element on a three-dimensional surface of the structure, for producing a conformal and at least partially electrically conductive or semi-conductive element comprising one or more layers, wherein at least one layer comprises a network of HARM-structures, on the three dimensional surface of the structure. Further, the invention relates to a conformal element and uses thereof.
    Type: Application
    Filed: March 7, 2011
    Publication date: February 28, 2013
    Applicant: CANATU OY
    Inventor: David P. Brown
  • Patent number: 8377248
    Abstract: A system and method for forming a hollow, complex, monolithic composite part. Composite material may be placed around the mandrel, then an internal impermeable membrane may be placed into and/or through tunnels formed in the mandrel. Next, an external impermeable membrane may be placed around the composite material and sealed against itself and the internal impermeable membrane such that the mandrel and the composite material are both contained in an airtight manner between the internal and external impermeable membranes. Air may then be removed from within the sealed impermeable membranes, compressing the impermeable membranes against the mandrel and/or the composite material. The consolidated composite material may be hardened to form the composite part. Finally, the impermeable membrane may be removed from around the hollow composite part and from within the mandrel, followed by removal of the mandrel from within the composite part by breaking it up into smaller pieces.
    Type: Grant
    Filed: June 16, 2010
    Date of Patent: February 19, 2013
    Assignee: Spirit AeroSystems, Inc.
    Inventors: Robert Alexander Coleman, Timothy Dean King, Steven Fillmore Hanson, Leonard Lloyd Baca