Abstract: A method and an apparatus are provided for bonding a coating to a web of cloth or foam without sacrificing the characteristics of the spandex mesh or foam. The coating and the cloth or foam are bonded and heated and then conveyed to an aspiration device for removing air between the coating and the cloth, thereby providing a thorough bonding therebetween.

Abstract: A method for repairing a damaged area, referred to as the repair area, of a composite structure comprises steps of: making alignment markings on the repair area; fabricating a pair of alignment templates; preparing the repair area for a hot bonded, vacuum bagged repair; assembling a repair patch; consolidating the repair patch; heating the repair patch; transferring and aligning the repair patch to the repair area; vacuum bagging, heating, and cooling the repair patch for a partial cure at the repair area; heating and cooling the repair patch in an oven; and bonding the repair patch to the repair area.

Abstract: An optical disk is manufactured by bonding a resin stamper having, on a principal plane, asperity pits on which a thin film is formed and a second substrate having a thickness of 0.3 mm or less with radiation cured resin such that the asperity pits face to the second substrate. The resin stamper is peeled off after curing the radiation cured resin to form asperity pits on the second substrate. A metal film is formed on the asperity pits on the second substrate to attain an information recording layer on the second substrate. A first substrate having an information recording layer and the second substrate having the formed information recording layer are bonded such that the both information recording layers face each other.

Abstract: A method and apparatus for preparing a perforated panel for reticulation to a film adhesive. The method includes supporting the perforated panel. The method also includes adhering the film adhesive to the perforated panel without initiating a cure of the film adhesive. The method applies a vacuum to the film adhesive. Next the method will move the perforated panel at a predetermined speed through a reticulation unit. Next the method will soften the film adhesive and finally remove the film adhesive from the perforations by an airflow. The method is generally used for creating acoustic sheet panels for use in many industries.

Abstract: An FPD encapsulation apparatus at least comprises a chamber and a pressing mechanism. In this case, the chamber has an airtight space to provide a low-pressure environment, and the low-pressure environment is located inside the airtight space. The pressing mechanism is disposed within the chamber, and the pressing mechanism is operated in the low-pressure environment for pressing a second substrate to bind a first substrate and the second substrate. Furthermore, a method for encapsulating an FPD is disclosed. The method comprises providing a first substrate, forming an adhesive on the first substrate, providing a second substrate to align the first substrate and face to the adhesive, providing a low-pressure environment for the first and second substrates, and binding the first and second substrates to form the FPD.

Abstract: A sash frame is provided having a first mounting surface for a first glazing pane and a second mounting surface for mounting a second glazing pane substantially parallel to the first glazing pane. The first and second mounting surfaces are spaced apart to provide an insulating space between the glazing panes. An evacuation opening is provided in communication with the insulating space. The first glazing pane is adhesively mounted to the first mounting surface and the second glazing pane is adhesively mounted to the second mounting surface. Air is allowed to exhaust through the evacuation opening as the insulating space is formed between the glazing panes. A vacuum is drawn from the evacuation opening to draw the first and second glazing panes closer together after the panes have been mounted on their respective mounting surfaces. Mounting of the glazing panes may also be facilitated using a roll press.

Abstract: The inventive method concerns a process of transferring resin into reinforcing fiber material used in the manufacture of composite articles. A first step in the method involves positioning at least one layer of the reinforcing fiber material on the surface of an open mold. The reinforcing fiber material typically consists of glass, carbon, linear polyethylene, polypropylene, and polyester fibers. Subsequently, a sealant layer is applied in liquid form over the reinforcing fiber material to create an airtight chamber encapsulating the reinforcing fiber material between the sealant layer and the mold. After the sealant layer is allowed to cure, a vacuum pressure is applied to the airtight chamber to draw resin through the reinforcing fiber material. For example, the resin can be an epoxy, polyester or vinyl ester resin.

Abstract: A method of moulding articles from layers of composite material being fibres impregnated with uncured resin, includes draping at least one layer of the composite material over a moulding tool, applying over the composite material layer or layers a membrane, and establishing an at least partial vacuum between the membrane and the moulding tool to consolidate the composite material, and wherein the membrane is made of a resilient material, and the method includes applying a force to the membrane to stretch the membrane over the moulding tool and maintaining the force whilst the at least partial vacuum is established.

Abstract: We reduce core crush in honeycomb sandwich structure by using a peripheral tiedown ply, generally in combination with a scrim-reinforced barrier film, between the composite laminate and the core along the panel chamfer to prevent slipping of the barrier film and outer laminates relative to the core during curing. We produce superior panels with lighter weights, improved mechanical properties, and more predictable structural performance.

Abstract: A device for fast, easy and cost-effective de-airing of different shape, size and thickness laminates that comprises a flexible vacuum ring with a built-in longitudinal channel that can be matingly mounted about a periphery of a multi-ply laminate, and a male connector part attached to one end of the flexible vacuum ring, where the male connector is shaped such that the longitudinal channel can slide onto the male connector to form an airtight seal while still providing gas flow through the flexible vacuum ring mounted about the periphery of the laminate. The device can be readily applied to and removed from the assemblies to be laminated, and is constructed to be applicable to any size, shape or thickness laminate, particularly the one with sharp corners.

Abstract: A thermally insulating panel (e.g., vacuum IG window unit) includes first and second opposing substrates spaced apart from one another by a plurality of spacers. A low pressure space is defined between the substrates, and is hermetically sealed off by at least one edge seal. During evacuation of the space, a plasma is ignited within the space in order to reduce the time needed to evacuate the space down to the desired low pressure.

Abstract: The invention relates to vacuum insulating glazing consisting of two glass sheets held apart by spacers and a peripheral seal. The invention also relates to a process for producing such vacuum insulating glazing.

Abstract: A method of and apparatus for evacuating a chamber, for example in vacuum glazing, that is enclosed in part by a glass wall that includes an evacuation port. An evacuating head is employed and is arranged to cover the port and a portion of the glass wall that surrounds the port. The evacuating head has a first cavity that communicates with the port and at least one further cavity that surrounds the first cavity. The first and further cavities are connected by conduits to respective vacuum pumps, which apply differential negative pressure to the first and further cavities, and the chamber is evacuated by way of the first cavity. Evacuation of the chamber may be effected whilst the glazing is subjected to high temperature out-gassing.

Abstract: A tire apparatus (14) having nozzles (32) for directing air steams against layers (34) of uncured tire components applied to a tire building drum (19) for stitching and ejecting air from the layers.

Abstract: A method provides for full or partial infusion of resin into three-dimensional, woven textile preforms. Resin film is placed at selected locations adjacent the preform, and the resin film may be separated from other areas of the preform using separator sheets or other materials. The preform is heated and may be vacuum-bagged to apply pressure, or may be rolled or fed through a die. The heat and pressure cause the resin to infuse into the selected areas of the preform adjacent the resin films. The amount of resin in the partial infusion is the same as is necessary to fully infuse the preform, but the resin remains localized in the selected areas until heated again at cure to cause the resin to flow throughout the preform. The method may also be used to fully infuse the preform with resin by providing sufficient temperature and time at that temperature during the initial infusion.

Abstract: Films are closely conformed to substrates by reducing the air pressure to a subatmospheric level in at least one airflow pathway that is present in the film or the substrate. The reduced air pressure enables the film to tightly contact the substrate in locations where protrusions or depressions on the substrate are present. The method is particularly useful for conforming film containing graphics to a variety of substrates such as the sides of semi-trailers or concrete block walls, even in instances where the semi-trailer sides include rivets and/or grooves and where the concrete block wall is relatively rough.

Abstract: A method of manufacturing a ceramic matrix composite comprises forming a slurry comprising a ceramic sol, filler particles and a solvent and forming laminates of fibers (12). The laminates of fibers (12) are impregnated with the slurry and are stacked (14) on a mold (10). The stack (14) of laminates of fibers (12) is covered by a porous membrane (16), a breather fabric (18) and a vacuum bag (20). The vacuum bag (20) is evacuated and is heated to a temperature of 60° C. for 10 hours to produce a ceramic matrix composite. The ceramic matrix composite is then heated to a temperature of 1200° C. at atmospheric pressure to sinter the ceramic matrix composite.

Abstract: A structure includes holes formed in a layer of tape. The holes are aligned over active areas on chips formed in a wafer. A custom vacuum chuck with a plurality of suction ports is aligned on the tape such that the suction ports contact only the tape and not the hole portions. Flats of the custom vacuum chuck are formed so that a perimeter of the flats contacts, and rests on, the tape. In addition, the flats of the custom vacuum chuck are formed so that the flats cover the entire active area on the first surface of each of the chips. Consequently, the combination of the custom vacuum chuck and the single layer of tape form a protective cavity over the active areas of the chips during singulation from the wafer.

Abstract: A method for bonding a sensor carrier plate having an adhesive layer to a vehicle window includes heating the adhesive layer by a heating device and pressing the carrier plate against the vehicle window for a predetermined time by a contact-pressure device. To reduce the risk of air inclusions between the adhesive layer and the vehicle window, the contact-pressure device initially brings the carrier plate with its adhesive layer into point or linear contact with the vehicle window and then, immediately after this, into extended-area contact with the vehicle window until full contact is achieved.

Abstract: A process for producing an IC card is provided wherein an interlayer sheet carrying an IC module is contact bonded under reduced pressure to a top sheet and a base sheet using a reactive polyurethane hot melt adhesive.

Abstract: Steered vacuum-assisted laminating apparatus and methods of using the same are disclosed. The apparatus includes a vacuum-assisted laminator for applying large format films to substrates where lamination pressure is generated at least partially by a vacuum drawn in a vacuum cavity. The apparatus also includes a steering system to control the vertical position the laminator and a vehicle to move the laminator along the substrate in a desired direction.

Abstract: A tool and method for applying an insert to the face of a chuck so that holes in the insert register with holes in the chuck, includes a removable vacuum chamber that is brought into sealing engagement with the chuck and that is indexed with respect to the chuck by means of locating pins. The removable vacuum chamber includes a stamp on which the insert is mounted and to which the insert is indexed by locating pins. The stamp is advanced until an adhesive surface of the insert contacts the face of the chuck. Thereafter, the vacuum is relieved and the vacuum chamber is removed from the chuck. The tool insures that the holes in the insert register with those in the face of the chuck, and the absence of air within the vacuum chamber prevents air from being trapped between the insert and the face of the chuck.

Abstract: A method for repairing a damaged area, referred to as the repair area, of a composite structure comprises steps of: making alignment markings on the repair area; fabricating a pair of alignment templates; preparing the repair area for a hot bonded, vacuum bagged repair; assembling a repair patch; consolidating the repair patch; heating the repair patch; transferring and aligning the repair patch to the repair area; vacuum bagging, heating, and cooling the repair patch for a partial cure at the repair area; heating and cooling the repair patch in an oven; and bonding the repair patch to the repair area.

Abstract: A plurality of joined members each made of thermoplastic resin and having a fluid flow path formed of a groove and/or a hole in a junction face are vacuum-packed in a state in which the joined members are joined to each other. After a wrapped body obtained by the vacuum-packing is heated to soften the joined members, the joined members are welded to each other through the junction faces by applying fluid pressure to an entire outer periphery of the wrapping to evenly pressurize the wrapping from a periphery. Then, the pressurization is cancelled to cool the welded joined members.

Abstract: A method for encasing a ceiling tile. The back surface of the ceiling tile is positioned adjacent to a vacuum table and a facing is placed over the front surface of the ceiling tile so that the facing overlaps each edge about the perimeter of the ceiling tile. In one embodiment, the facing is covered with an air-impermeable cover and a support frame can be placed surrounding the perimeter of the ceiling tile. The facing is drawn onto the ceiling tile by a vacuum applied through the vacuum table. The ceiling tile is then reversed so that the front surface of the ceiling tile is positioned adjacent to the vacuum table. An air-impermeable backing is placed over the ceiling tile so that the backing overlaps each edge about the perimeter of the ceiling tile. The backing is drawn onto the ceiling tile by the vacuum applied through the vacuum table.

Abstract: Methods of applying film to substrates are provided wherein the film matingly conforms to the configuration of the substrate, including areas adjacent protrusions or depressions in the substrate. In certain embodiments, the film is punctured by a probe and a vacuum is applied to the probe in order to aspirate air and urge the film toward a position of compliance with the substrate. Optionally, the film is softened by heat in order to facilitate conformance with the shape of the substrate.

Abstract: Apparatus is disclosed for repairing a flaw in a surface, partcularly in the field of vehicle glass repair. The apparatus has a housing adapted to engage the surface to be repaired, a repair seal for sealing between the housing and around the flaw to be repaired to define a repair space over the flaw. A reservoir communicates with the repair space and, in use, contains liquid repair material. A vacuum pump communicates with the repair space and the reservoir to apply a partial vacuum to the repair space and to the reservoir without repair liquid from the reservoir being drawn into the repair space in order to degas separately the flaw and repair liquid in the reservoir. After appropriate degassing, repair liquid from the reservoir is caused to flow into the repair space to fill the repair space with repair liquid.

Abstract: An improved method of and apparatus that is continuously automatically operative in an in-line system is described for applying under vacuum, heat and mechanical pressure a dry film photoresist-forming layer to printed circuit boards (200) that already have been prelaminated by the loose application thereto of the dry film resist as discrete cut sheets within the confines of the surface of the boards whereby a laminate without entrapped air bubbles and closely conforming to the raised circuit traces and irregular surface contours of the printed circuit board is obtained. Featured is a conveyorized vacuum applicator (12) comprising two independent vacuum lamination chambers (18,20) in end-to-end relation. The first vacuum chamber operates at ambient temperature to draw off all of the air entrapped between the dry film resist and the surface of the printed circuit board at conditions that do not result in premature tacking of the dry film to the surface of the board.

Abstract: A plurality of covers each of which has a light transmitting section are attached to a substrate on which is formed a plurality of optical elements each of which has an optical section, and each of the optical sections is sealed by each of the covers. Then, the substrate is cut into individual ones of the optical elements.

Abstract: An improved method of and apparatus that is continuously automatically operative in an in-line system is described for applying under heat, vacuum and mechanical pressure a dry film photoresist-forming layer to printed circuit boards (136) that already have been prelaminated by the loose application thereto of the dry film resist as discrete cut sheets within the confines of the surface of the boards whereby a laminate without entrapped air bubbles and closely conforming to the raised circuit traces and irregular surface contours of the printed circuit board is obtained.

Abstract: Method for forming a cover layer on a disk. The method includes a coating step, in which an uncured cover layer is coated on the surface of the disk, and the average thickness of the cover layer is enough to support to the requirement of a predetermined laminating thickness, a laminating step, where a transparent capping board of amorphous olefin polymer is laminated on the uncured cover layer whose thickness is maintained at a predetermined thickness to obtain a smooth surface, an illuminating step, where a UV light source is shined onto the cover layer to harden and cure the cover layer, and a stripping step, where the capping board is stripped from the cured cover layer.

Abstract: An elastomerized phenolic resin ablative insulation particularly suitable for use in connection with the thermal insulation of selected components of rocket motors. A composition for making the elastomerized ablative insulation is disclosed. Furthermore, an associated method of forming calendered sheets of material formed of the composition is disclosed. The preferred ingredients of the disclosed composition include acrylonitryle butadiene rubber, zinc borate, and phenol formaldehyde resin which can be cured and bonded to structures such as domes of open-ended rocket motors and other rocket motor components. The subject elastomerized ablative insulation is well suited for use independently or in connection with other insulative materials to form a thermal barrier which is highly resistant to the heat and the erosive nature associated with the combustion of propellant fuels, for example.

Abstract: An article made up of (1) a composite having a polyurethane matrix including fibrous or particulate reinforcement, the polyurethane matrix being formed in situ about the reinforcement by reaction of polyurethane forming components at a temperature below the melting point of the reinforcement and (2) a polymeric film bound to at least one surface of the composite, the film being bound to the composite by adhesion to the polyurethane matrix which emerges or is enhanced as the matrix is formed in situ.

Abstract: A vacuum wrapping process and apparatus for adhering a flexible material to a rigid substrate. The temperature of the flexible material is monitored, processed, and controlled by a control unit. The material is supported over the substrate in a mold. Spring-loaded rotatable bars are supported within the mold and compress the marginal portion of the material against the mold. A vacuum draws the material toward the substrate, and the bars control the release of the material at a desired rate. The vacuum drawn on the material is monitored, processed and controlled by the control unit. The amount of vacuum applied to the material is inversely related to the temperature of the material. The control unit alters parameters of the vacuum molding process, such as the material temperature and the vacuum to reduce tearing, stretching, and/or wrinkling of the material.

Abstract: A method for fabricating a fiber-resin composite body for providing electromagnetic shielding. The body has a resin-impregnated fiber fabric and an electrically conductive fiber fabric, wholly or partially impregnated with resin material, one surface of the conductive fiber fabric having an uninsulated area wholly or partly covered with an electrical contact strip made of a wire mesh, which provides an electrical connection with the electrically conductive fiber fabric. The method includes placing the electrically conductive fiber fabric and the resin-impregnated fiber fabric in a mold, placing the wire mesh of the contact strip directly on the electrically conductive fiber fabric, covering the wire mesh of the contact strip with a sealing tape, and filling up the wire mesh of the contact strip completely with uncured resin material from the resin-impregnated fiber fabric so that only a front side thereof forms a contact surface free of resin.

Abstract: A method for forming complexly shaped composite laminate assemblies. A pair of dry fiber preforms are placed on a tool with a thin film adhesive layer therebetween. A vacuum bag encloses the preforms and the adhesive layer. The preforms are heated to a temperature sufficient to cause the adhesive to become viscous and to wet several plys of each of the preforms. The preforms are then allowed to cool slightly before resin is infused via a vacuum source through each of the preforms to thoroughly wet each of the preforms. The resulting joint formed at the bond line of the two preforms is stronger than what would be formed simply by adhering two otherwise completely formed preforms together because the dry fiber preforms, in connection with the heating of the preforms, allow wetting of several plys of each of the preforms at the joint area, rather than just the surface ply of each preform.

Abstract: Voids (26) at the interface of a printed circuit board (10) bonded to a heat sink (24) which impede heat transfer from a heat generating electronic component (12) mounted on the printed circuit board (10) to the heat sink (24), and thus limit the density of electronic components (12) that may be mounted to a given printed circuit board (10) are avoided by a method wherein the adhesive securing the printed circuit board (10) to the heat sink (24) is formed of a pressure sensitive adhesive layer (22) and a thermosetting adhesive layer (28). The latter fills the voids and thus provides for greater thermal conductivity from a heat generating component (12) to the heat sink (24) with the result in increase in heat rejection (30).

Abstract: An apparatus and a method for adhering a flexible film to a ventilated platen without air entrapment problems are described. In the apparatus, a tool body and a tool lid are connected together by a hinge means in a clam-shell configuration. The tool body has a cavity formed such that a ventilated platen can be tightly positioned therein with a top surface of the platen exposed. A flexible film is mounted to an inner surface of the tool lid facing the tool body and pushed down onto the ventilated platen while air is being withdrawn from the ventilated platen. The adhesion process for the flexible film to the platen can be completed without any air entrapment problem existing between the film and the platen.

Abstract: A method of manufacturing a ceramic matrix composite comprises forming a slurry comprising a ceramic sol, filler particles and a solvent and forming laminates of fibres (12). The laminates of fibres (12) are impregnated with the slurry and are stacked (14) on a mould (10). The stack (14) of laminates of fibres (12) is covered by a porous membrane (16), a breather fabric (18) and a vacuum bag (20). The vacuum bag (20) is evacuated and is heated to a temperature of 60° C. for 10 hours to produce a ceramic matrix composite. The ceramic matrix composite is then heated to a temperature of 1200° C. at atmospheric pressure to sinter the ceramic matrix composite.

Abstract: A method for aligning a plurality of thin film transistor tiles for constructing a flat panel display. A coverplate is arranged on a coverplate support. A first layer of a bonding material is applied to at least one of a first side of each of the tiles and a surface of the coverplate on which the tiles are to be secured. The tiles are arranged on the coverplate, such that the first layer of bonding material is arranged between the tiles and the coverplate. The tiles are connected to an alignment apparatus. The tiles are aligned relative to each other and the coverplate. The tiles are at least partially secured to the coverplate.

Abstract: The present invention is directed to cost-effectively provide a high-strength large vacuum heat-insulating panel with a honeycomb core of non-permeable independent cells by means of simplified instruments and method. One goal of the invention is that the core retains an original shape at its lateral ends from the beginning of a procedure of evacuating air into a vacuum condition till the end of panel bonding, and another is ensuring a long lasting air-tight sealing in the honeycomb core. The vacuum heat-insulating panel 100 according to the invention includes a vacuum core element (50) of non-permeable honeycomb structure and a surface element (60) bonded thereto by fusing an air-permeable bonding element (woven cloth made of fibrous adhesive of thermoplastic resin or unwoven cloth of the fibrous adhesive) 70. The surface element 60 has its edges bent to provide protection covers 65.

Abstract: A pipe repair apparatus includes an outer carrier tube, an inner bladder tube within the carrier tube, and a repair sleeve within the bladder tube. The bladder tube and the carrier tube are formed by one unitary tube which is folded back upon itself. A wick extends from the repair sleeve to the rear end of the bladder tube and permits evacuation of gases from the bladder tube when the bladder tube is flattened by a vacuum during insertion of a curable resin into the bladder tube at its forward end. The bladder tube can be inverted out of the carrier tube so as to place the repair sleeve in contact with an area to be repaired within a sewer pipe. This method may also be used to repair the damaged joint between a lateral sewer line and a main sewer line.

Abstract: A method of adhesively joining two elements by an adhesive layer without gas inclusion in the adhesive layer, wherein an adhesive layer is applied over an area of a surface of a first of the two elements and channels are provided in the adhesive layer for passage of gases therein. An opening around the area of the adhesive layer is in communication with the channels to form a gas escape system so that when the elements are joined together the gases can escape from the adhesive layer via the channels and the opening.

Abstract: The present invention is directed to improved methods and apparatuses for manufacturing microfabricated devices, and particularly, microfluidic devices. In general the methods and apparatuses of the invention provide improved methods of bonding substrates together by applying a vacuum to the space between the substrates during the bonding process.

Abstract: A composite cord assembly is used to fabricate high performance structures. In one form the cord assembly is composed of an inner composition of structural fibrous material and an external cladding. Resin is impregnated into the fibrous material. The external cladding functions as a containment device for liquid resin material during the fabrication of structural parts. The cured resin surrounds the fibrous material, and provides support to the fibers, as well as load transfers between the fibers. In addition, the cord assembly may contain an inner core and other enhancements to promote resin flow through the assembly during the resin infusion/injection process used for part fabrication. Applications for composite cord assemblies of this type include composite coil springs, structural fencing, golf club shafts, fishing rods, and other products composed of structural rods and tubes of simple or complex shapes.

Abstract: A method and system for securing a small spherical shaped semiconductor substrate for processing operations, such as lithography, is disclosed. The substrate is secured by attaching it to a member and applying an adhering substance, such as photo resist, to the substrate and a portion of the member. The application may be by electroplating or other means. The electroplated substance securely attaches the substrate to the member so that one or more processing operations may be performed on the substrate. After processing, the substrate can be removed from the member.

Abstract: A process for laminating multi-layer pre-forms into laminated glazing assemblies is provided. The pre-forms are first subjected to a vacuum in an inlet lock. Then, the pre-forms are heated to an assembly or bonding temperature in a heating chamber, while still being subjected to vacuum. Next, the pre-forms are pressed using pressing pieces in a pressing chamber, which is also subjected to vacuum. A greater pressure is exerted along the edges of the laminated glazing assemblies so as to bond the edges, preferably by using membranes. In an outlet lock which follows the pressing chamber, the laminated glazing assemblies are again vented to atmospheric pressure. An apparatus suitable for carrying out the process is also provided. The apparatus has chambers which are connected together by conveyors so as to achieve a quasi-continuous flow of material.

Abstract: The present invention is directed to improved methods and apparatuses for manufacturing microfabricated devices, and particularly, microfluidic devices. In general the methods and apparatuses of the invention provide improved methods of bonding substrates together by applying a vacuum to the space between the substrates during the bonding process.

Abstract: A semiconductor chip pickup jig which separates semiconductor chips affixed to an adhesive sheet from the adhesive sheet includes first and second thrust pin groups and a pin holder on which base portions of the first and second thrust pin groups are mounted. The thrust pins of the first thrust pin group are arranged in positions corresponding to corner portions of the semiconductor chip and thrust up the semiconductor chip by use of first front end portions thereof with the adhesive sheet disposed therebetween. The thrust pins of the second thrust pin group are arranged in positions corresponding to a nearby portion of a central portion of the semiconductor chip with second front end portions thereof being set lower than the first front end portions and thrust up the semiconductor chip by use of the second front end portions thereof with the adhesive sheet disposed therebetween.

Abstract: A molded composite structure and a method of manufacturing a molded composite structure are disclosed. In one embodiment, an aircraft wing panel and a method for manufacturing an aircraft wing panel are disclosed. In another embodiment, the method of manufacturing a molded composite structure uses a resin transfer molding process.