Abstract: Provided is a lithium secondary battery separator including a laminate of a substrate and a porous heat-resistant polyimide film which covers at least one surface of the substrate. The porous heat-resistant polyimide film has pores which are regularly arrayed three-dimensionally and a film thickness of 5-20 ?m. Penetration damage to the separator by growth of dendrite-shaped lithium is avoided, and it is also possible to meet a request which is demanded of the lithium secondary battery separator.

Abstract: An electroconductive film including a substrate film, and an organic electroconductive layer disposed on the substrate film, wherein the substrate film is formed of a resin containing an alicyclic structure-containing polymer having crystallizability, a thickness of the substrate film is 5 ?m or more and 50 ?m or less, and a crystallization degree of the alicyclic structure-containing polymer having crystallizability is 30% or more. The alicyclic structure-containing polymer having crystallizability is preferably a hydrogenated product of a ring-opening polymer of dicyclopentadiene.

Abstract: Embodiments of the present disclosure describe ambient temperature pressing (“cold pressing”) of a wood-based product using protein/PAE adhesives within industrially suitable set times and press pressures. A method includes preparing an adhesive comprising a protein source and polyamideamine-epichlorohydrin (PAE) resin, applying the adhesive to one or more wood-based components, and cold pressing the one or more wood-based components to form a wood-based structure, the cold pressing being the only pressing operation in the formation of the wood-based structure after applying the adhesive to the one or more wood-based components. Other embodiments may be described and/or claimed.

Abstract: Novel benzoxazine-thiol adducts are described, which may be may be cured to produce compositions useful in coating, sealants, adhesive and many other applications.

Abstract: The invention relates to an improved two component adhesive system, a kit comprising said two adhesive components, its use and a method for production of interior wood products, in particular form-pressed products, parquet floor elements and solid wood panels with very low formaldehyde emission and to the interior wood products obtainable having improved properties. The two-component adhesive system comprises adhesive component I comprising a 50-70 wt % melamine-formaldehyde (MF) type resin in 25-40 wt % water and adhesive component II comprising 25-40 wt % of a water based dispersion adhesive, 15-40 wt % of a formaldehyde scavenger and an acidic compound in an amount such that the pH of adhesive component II is 1.5-6.5, wherein adhesive component I and II are to be applied in a weight ratio I:II of 1:0.5 to 1:1.5 and the adhesive system has a molar ratio of formaldehyde (F) to total amino group (F/NH2) between 0.2 and 0.7.

Abstract: A composition for and method for bonding a substrate. In general, applied to a substrate will be a primer composition that includes an adhesion promoter, which is an adduct prepared by the reaction of at least one aromatic polyisocyanate compound, with an active hydrogen containing moiety of an organofunctional silane, and a prepolymer derived from the reaction of at least one aliphatic polyisocyanate and a polyol, and is at least partially reacted with an active hydrogen containing moiety of an organofunctional silane.

Abstract: Solvent free, moisture curable reactive hot melt adhesives are prepared using an oxazolidine functional prepolymer and a polyfunctional isocyanate.

Abstract: Method for making lignocellulosic composites by adhering lignocellulosic substrates together. A first variant of the method involves using an adhesive composition that comprises a reaction product of (i) first ingredient selected from a soy protein or lignin and (ii) at least one substantially formaldehyde-free curing agent that includes at least one amine, amide, imine, imide, or nitrogen-containing heterocyclic functional group that can react with at least one functional group of the soy protein. A second variant of the method involves using an adhesive composition that comprises a reaction product of (i) a protein or lignin, (ii) a first compound that includes at least one amine, amide, imine, imide or nitrogen-containing heterocyclic functional group that can react with at least one functional group of the protein and (iii) a curing agent.

Abstract: The invention is a composition comprising a) one or more prepolymers having on average three or more aliphatic isocyanate groups and further containing alkoxysilane groups; b) one or more aromatic polyisocyanates; c) one or more compounds having at least one heterocyclic ring which hydrolyzes when exposed to moisture to form at least one isocyanate reactive group; d) one or more solvents; and e) one or more amine and/or organometallic polyurethane catalysts; wherein the ratio of aromatic isocyanate groups to aliphatic isocyanate groups in the composition is from about 0.5:1.0 to about 1.5:1.0, preferably about 0.9:1.0 to about 1.5:1.0, and the equivalent ratio of isocyanate groups to isocyanate reactive groups derivable from the one or more compounds having at least one hydrolyzable heterocylic ring is from about 0.8:1.0 to about 5.3:1.0, and most preferably about 1.5:1.0 to about 1.7:1.0.

Abstract: The present invention provides a laminate comprising an insulating layer having suppressed dusting properties, an insulating film comprising the insulating layer, and an electronic circuit component comprising a pattern of the insulating layer. The laminate has a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer. The insulating layer comprises a laminate of two or more wet etchable insulating unit layers. At the interface between the inorganic material layer and the insulating layer, surface irregularities of the inorganic material layer have been transferred onto the surface of the insulating layer. The average height of the surface irregularities transferred onto the insulating layer is less than the thickness of the outermost insulating unit layer in the insulating layer.

Abstract: The invention is based on the discovery that compositions containing certain maleimide compounds and aromatic diene compounds are useful as thermosetting resins for the electronic packaging industry. The invention compositions described herein can be cured in a variety of ways, with or without a catalyst. In some embodiments, the well-known “ene” reaction can be used to cure the compositions described herein, and therefore no catalyst is required.

Abstract: The invention relates to an improved two component adhesive system, a kit comprising said two adhesive components, its use and a method for production of interior wood products, in particular form-pressed products, parquet floor elements and solid wood panels with very low formaldehyde emission and to the interior wood products obtainable having improved properties. The two-component adhesive system comprises adhesive component I comprising a 50-70 wt % melamine-formaldehyde (MF) type resin in 25-40 wt % water and adhesive component II comprising 25-40 wt % of a water based dispersion adhesive, 15-40 wt % of a formaldehyde scavenger and an acidic compound in an amount such that the pH of adhesive component II is 1.5-6.5, wherein adhesive component I and II are to be applied in a weight ratio I:II of 1:0.5 to 1:1.5 and the adhesive system has a molar ratio of formaldehyde (F) to total amino group (F/NH2) between 0.2 and 0.7.

Abstract: A thermosetting composition comprising (a) (a) at least one phosphorous-free dihydrobenzoxazine component; (b) at least a sulfonium salt and (c) optionally a compound comprising at least an epoxy group is disclosed. Cured products made from these compositions have valuable chemical, physical and mechanical properties.

Abstract: The present invention relates to thermosetting resin compositions that include maleimide-, nadimide- or itaconimide-containing compounds and a metal/carboxylate complex and a peroxide, which is curable at a low temperature at relative short period of time, such as less than about 100° C., for instance 55-70° C., over a period of time of about 30 to 90 minutes. The invention further provides methods of preparing such compositions, methods of applying such compositions to substrate surfaces, and packages and assemblies prepared therewith for connecting microelectronic circuitry.

Abstract: Building panels with a thin and embossed surface layer and a sub layer between a surface layer and a core.

Abstract: A circuit terminal connected structure and a circuit terminal connecting method are provided. Both the structure and the method feature a circuit connecting material formulated with the following components: a curing agent capable of generating free radicals upon heating; an acrylate or methacrylate radical polymerizable substance; and either an acrylic rubber or a maleimide radical polymerizable substance having at least two maleimide groups per molecule. In some embodiments, the curing agent features a 10-hour half life temperature of 40° C. or above and a 1-minute half-life temperature of 180° C. or below. In other embodiments, the circuit connecting material includes conductive particles. In additional embodiments, the circuit connecting material includes a hydroxyl-group-containing resin having a weight average molecular weight of 10,000 or more.

Abstract: The present invention generally relates to anaerobically curable compositions of: (a) a cyanate ester compound having the structure of formula I: R1O—C?N)m??(I) ?wherein m is from 2 to 5 and R1 is an aromatic nucleus-containing residue; (b) a (meth)acrylate monomer; and (c) an anaerobic cure inducing composition comprising peroxide and saccharin, wherein said composition is free of added metallic catalyst.

Abstract: Provided are adhesive compositions comprising a mixture of a maleimide terminated polyimide resin, a thermoplastic resin compatible with the maleimide terminated polyimide resin, a liquid rubber, and a thermally activated free radical curing agent. Various embodiments add one or more of a silane coupling agent, an ethylenically unsaturated compound with acid functionality, electrically conductive particles, and electrically conductive scrim. Methods of using the compositions also are provided.

Abstract: Adhesive polymers are formed when polyvalent azides and alkynes are assembled into crosslinked polymer networks by copper-catalyzed 1,3-dipolar cycloaddition. The condensation polymerization is efficiently promoted by Cu ions either leached from the metal surface or added to the monomer mixture, and strong interactions with metal surfaces are provided by the multiple triazole binding elements produced. The adhesive polymers may be formed either as adhesive polymer coatings or as adhesive polymer cement.

Abstract: The present invention relates to a method of gluing wood based materials by providing an adhesive system onto wood based materials followed by curing, the adhesive system comprises a melaminic amino resin and a phenolic resin composition, wherein the phenolic resin composition comprises an acid and a phenolic resin. The invention also relates to an adhesive system and a stable phenolic resin composition as well as wood based products obtained by the method or through the use of the adhesive system.

Abstract: The invention is based on the discovery that certain well-defined compounds derived from pentacyclopentadecane dimethanol are useful components in adhesive formulations. In particular, the invention compounds described herein provide high Tg values and low shrinkage. Compounds of the invention are useful as adhesives for use in the semiconductor packaging industry.

Abstract: Producing a printed circuit board, by coating a resin composition comprising an aromatic cyanate compound having two or more cyanato groups in a molecule and a radical-polymerizable resin on a circuit substrate, photo-curing the resin composition, and thermally curing the photo-cured resin composition to thereby form an insulation layer, affords an insulation layer with improved surface smoothness and excellent dielectric properties.

Abstract: The invention is a method for application of a special low viscosity cyanoacrylate adhesive which is used for the manufacture and repair of wooden furniture. The cyanoacrylate adhesive quickly penetrates and bonds wood to wood. The wooden furniture that results from the process of this invention are cohesive in structure and are ready for immediate use. This special wood grade cyanoacrylate adhesive provided by this invention permits those in the furniture repair or furniture manufacture industries with a method of repairing or assembling wooden furniture in an easy and quick manner.

Abstract: The present invention generally relates to curable compositions free of metallic catalysts. The inventive compositions are capable of curing when applied to a metal substrate. The inventive compositions provide improved thermal performance and enhanced cure strength on oily metal surfaces.

Abstract: A pressure sensitive adhesive comprising a mixture of: a radiation-crosslinkable polymer A) composed of at least 40% by weight of C1 to C18 alkyl (meth)acrylates, and a polymer B) composed of at least 20% by weight of vinylpyrrolidone and of less than 40% by weight of C1 to C18 alkyl (meth)acrylates, wherein the fraction of the polymer B) in the mixture is less than 15% by weight, based on the sum of A)+B).

Abstract: Disclosed are internally coordinated organoboranes as 5, 6, or 7-membered rings formed from an unsaturated amine, amidine, or guanidine and dialkylhydroborane under hydroboration conditions, as well as two-part adhesive or coating kits containing radical polymerizable material and the internally coordinated organoborane.

Abstract: The following invention relates to phenyl-linked polybenzoxazoles having terminal, aryl- or heteroaryl-attached cyanate groups which can be used for adhesive bonding and as dielectrics, especially for electronic components, and to a process for preparing them.

Abstract: The present invention describes the use of poly-o-hydroxy amides (PHAs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and/or wafers, chip and/or wafer stacks produced by the process, and adhesive compositions which comprise the poly-o-hydroxy amides of the formula (I).

Abstract: A resin impregnated overlay is applied to a wood veneer, which in turn may be adhered to a substrate.

Abstract: A pressure sensitive adhesive composition is described, comprising the reaction product of a copolymer and a bisamide crosslinking agent, (A) the copolymer comprising the reaction product of (i) a (meth)acrylate ester of a non-tertiary alcohol in which the alkyl group contains between 1 and 4 carbon atoms, inclusive, and (ii) a carboxylic acid-functional, ethylenically unsaturated co-monomer, and (B) a bisamide crosslinking agent having the formula: 1

Abstract: A method of making a surface planarization is provided using a separate pre-cut or precured film laminated onto a metallized surface to form planarized dielectric coating. The method comprises the steps of: (a) providing a thin film interconnect module with a polyimide adhesive laminated with a pre-cut or pre-cured polyimide lamination film on the top of the polyimide adhesive, the polyimide lamination film being covered with a glass plate; (b) applying pressure and heat in a synchronized format to ensure a uniform curing and gap filling in the thin film module metal for the adhesive layer; and (c) releasing the glass plate to expose a smooth lamination film surface.

Abstract: The invention is a method for application of a special low viscosity cyanoacrylate adhesive which is used for the manufacture and repair of wooden furniture. The cyanoacrylate adhesive quickly penetrates and bonds wood to wood. The wooden furniture that results from the process of this invention are cohesive in structure and are ready for immediate use. This special wood grade cyanoacrylate adhesive provided by this invention permits those in the furniture repair or furniture manufacture industries with a method of repairing or assembling wooden furniture in an easy and quick manner.

Abstract: A chip-type circuit component comprising a chip body which is formed by bonding first and second substrates with each other. A polyimide adhesion layer is provided between the first and second substrates and a thin film circuit pattern is formed on at least one of a pair of main surfaces of the first and second substrates which are opposite each other, while an external electrode is formed on an end surface of the chip body to be electrically connected with the thin film circuit pattern.

Abstract: The present invention provides an adhesive film for semiconductor package, which comprises a polycarbodiimide resin, an epoxy resin and an inorganic filler, wherein the polycarbodiimide resin has a polystyrene-reduced number-average molecular weight of 3,000 to 50,000 as measured by gel permeation chromatography, the epoxy resin is contained in an amount of 20 to 150 parts by weight per 100 parts by weight of the polycarbodiimide resin, and the inorganic filler is contained in an amount of 30 to 70% by weight based on the total resin content.

Abstract: A metal film, particularly, a stainless steel film having been not subjected to roughing treatment, and an aromatic polyimide substrate film having a thermoplastic surface can be combined with a high bonding strength to form a metal film/aromatic polyimide film laminate, utilizing an amorphous aromatic polyimide film of 0.05 to 3 &mgr;m thick which has a glass transition temperature in the range of 200 to 300° C.