Abstract: A flooring board having a plurality of layers may have a sufficiently high modified Janka hardness rating for use in general flooring applications. The flooring board may comprise a fiberboard core layer having a thin veneer layer of a natural wood species adhered to a surface of the core layer. The veneer layer may be a gymnosperm (softwood) or angiosperm (hardwood) having a low Janka hardness rating. Surprisingly, the flooring board has a high modified Janka hardness rating significantly higher than the Janka hardness rating of the natural wood species and sufficient for use in general flooring applications when the veneer layer is sufficiently thin.

Abstract: The invention relates to moisture-curing compositions which comprise at least one aromatic isocyanate group-bearing polyisocyanate and at least one dialdimine of formula (I). The compositions according to the invention have a longer open time and at the same time a shorter curing time, they are storage-stable and cure without forming bubbles. They are especially suitable as adhesives, sealing agents, potting compounds or coating materials, the use as sealing agents being especially advantageous.

Abstract: Anaerobic adhesive and sealant compositions in film form, film spool assemblies containing such compositions in film form and preapplied versions thereof on matable parts are provided.

Abstract: A laminate includes a backing material coated with an adhesive composition. The adhesive composition includes a cured silylated polyurethane composition derived from polyester based polyurethane prepolymer. The silylated polyurethane composition when partially silylated is especially useful for pressure sensitive adhesives where it imparts superior adhesive and cohesive performance thereto.

Abstract: Macrocyclic compounds, e.g., ketones, crown ethers, methicones etc., have been found to be effective co-solvents in solvent based adhesives for pipe joining applications. Because of their enhanced solubility with VOC exempt solvents (40 C.F.R. 51.100), the calculated VOC content of the adhesive can be lowered to at least 75% of those established by SCAQMD Rule 116A.

Abstract: The reaction of diner acids, C10-C20 dicarboxylic acids, and alkylene diamines having from 2 to 8 carbon atoms provides polyamides having good oil and solvent resistance, high heat resistance, flexibility, and relatively low melt viscosities.

Abstract: The present invention relates to a polyimide-metal laminate that ensures a high adhesion of a metal layer and suitable for use as a material of a high density circuit board. In particular, it provides a polyimide film characterized by having undergone a surface treatment with an alkaline aqueous solution containing a permanganate. The alkaline aqueous solution preferably contains a hydroxide. It also provides a polyimide-metal laminate characterized in that on a surface of the polyimide film a thermoplastic polyimide layer and a metal layer are formed, and a method of producing the polyimide-metal laminate.

Abstract: The invention is an adhesive composition comprising a) i) a trialkoxysilane functional polyether or polyurethane wherein the polyether or polyurethane has a weight average molecular weight of 6000 or greater and a dialkyltin carboxylate or dialkyltin alcoholate; or ii) a dialkoxysilane functional polyether or polyurethane and a dialkyltin alcoholate; and b) a primary or secondary amino straight chain alkyl trialkoxysilane; wherein the dialkyltin carboxylate or dialkyltin alcoholate is present in an effective amount to facilitate bonding of the adhesive to a substrate of from about 0.1 to about 1.0 percent by weight based on the weight of the adhesive and the primary or secondary amino straight chained alkyl trialkoxysilane is present in an amount which is effective to facilitate bonding of the adhesive to a substrate wherein the amount is from about 0.5 to about 1.2 percent by weight. In another embodiment, the invention is a method of bonding a window in a vehicle.

Abstract: A method of producing formaldehyde laden layered products, the products having reduced emission of formaldehyde, of at least 2 layers, at least one of the layers being a board or veneer, comprising a step of treating at least one of the surfaces of said board or veneer, prior to bonding the layers together, with a solution comprising an inorganic sulphur containing salt. The invention also relates to a flooring material obtained by the method.