Abstract: A bonding apparatus includes a first holder, a second holder, an attracting pressure generator and a lift pin. The first holder is configured to hold a first substrate. The second holder, disposed at a position facing the first holder, has an attraction surface configured to attract a second substrate to be bonded to the first substrate. The attracting pressure generator is configured to generate an attracting pressure in the attraction surface. The lift pin is configured to space the second substrate on the attraction surface apart from the second holder. The second holder is provided with a space including an opening through which the lift pin passes, and the space is controlled to have a pressure lower than an atmospheric pressure.

Abstract: An additive manufacturing system including a housing configured to contain a powder bed of material, and an array of laser emitters having a field of view. The array is configured to melt at least a portion of the powder bed within the field of view as the array translates relative to the powder bed. The system further includes a spatter collection device including a diffuser configured to discharge a stream of gas across the powder bed, and a collector configured to receive the stream of gas and contaminants entrained in the stream of gas. The collector is spaced from the diffuser such that a collection zone is defined therebetween, and the spatter collection device is configured to translate relative to the powder bed such that the collection zone overlaps with the field of view of the array.

Abstract: A pellicle transfer apparatus includes; a base including supporting a target plate, a pellicle and a flexible plate sequentially stacked on the base, and a roller unit laterally movable in a first direction across the base and including a lower roller extending in a second direction intersecting the first direction, and an upper roller above the lower roller and extending in the second direction, wherein the lower roller compresses the flexible plate while the roller unit laterally moves in the first direction across the base to bond the pellicle to the target plate, as the pellicle is separated from the flexible plate, and the flexible plate moves upward to wrap around the lower roller, and the upper roller contacts the flexible plate as it wraps around the lower roller.

Abstract: A food dispensing module for a delaminating food dispensing system includes an outer housing; and a delaminating housing. The delaminating housing has a first portion being located within said outer housing and a second portion located outside said outer housing. The delaminating housing includes delaminating nips, a first film take-up roller, a second film take-up roller, an output opening, and a trap void. The output opening is located in the second portion of the delaminating housing.

Abstract: A laser-based method of removing a coating from a surface comprises directing a laser pulse to a first position on the surface, removing the coating from the first position by rapidly elevating a surface temperature of the first position using the laser pulse and thereby disassociating the coating from the surface and collecting the disassociated coating. In some embodiments, the coating comprises an environmentally harmful substance such as Hexavalent Chromium. In some embodiments, the coating comprises Diamond-Like Carbon (DLC), Vitrified Contaminant Material (CMAS). The disassociated coating is collected by a waste collector.

Abstract: An apparatus and method is provided for controlling a propagation of a bond wave during semiconductor processing. The apparatus has a first chuck to selectively retain a first workpiece. A second chuck selectively retains a second workpiece. The first and second chucks selectively secure at least a periphery of the respective first workpiece and second workpiece. An air vacuum is circumferentially located in a region between the first chuck and second chuck. The air vacuum is configured to induce a vacuum between the first workpiece and second workpiece to selectively bring the first workpiece and second workpiece together from a propagation point. The air vacuum can be localized air vacuum guns, a vacuum disk, or an air curtain positioned about the periphery of the region between the first chuck and second chuck. The air curtain induces a lower pressure within the region between the first and second chucks.

Abstract: A device for removing a portion of cover is provided, which includes a lower platform and an upper platform oppositely disposed, a cover jig between the lower and upper platforms, a feed roller and a receiving roller oppositely disposed, and an adhesive film. The upper platform includes a plurality of protrusions, and each of the protrusions extends toward the lower platform. The cover jig includes a plurality of through holes, and each of the through holes is disposed opposite to each of the protrusions, so that each of the protrusions can be inserted through each of the through holes. One end of the adhesive film is connected to the feed roller, and the other end of the adhesive film is connected to the receiving roller, and a portion of the adhesive film between the two ends is located between the upper platform and the cover jig.

Abstract: Disclosed is an apparatus for manufacturing a display module. An apparatus for manufacturing a display module according to an exemplary embodiment of the present invention, which attaches a polarizing plate, from which a release film is peeled, onto a display panel, includes: a separator configured to peel a release film from a polarizing plate, and formed with a flow path, through which foreign substances dropped from the release film when the release film is peeled are dischargeable; and a suction unit coupled to the separator to suck the foreign substances.

Abstract: The present invention relates to an apparatus and a method for simultaneously performing delamination and adhesion processes. The apparatus which simultaneously performs delamination and adhesion processes includes: a lower stage configured to suction and fix a carrier substrate on which a first workpiece is adhered; and an upper stage including a curved main body configured to suction and fix a second workpiece and formed in a shape convex toward the first workpiece, and a driving portion configured to rotate the curved main body such that predetermined portions of the second workpiece sequentially come into contact with corresponding predetermined portions of the first workpiece at a predetermined pressure, adhere the second workpiece to the first workpiece, and delaminate the first workpiece from the carrier substrate during an adhesion process.

Abstract: The present invention provides a procedure of processing a workpiece such as backside grinding of a device wafer and an apparatus designed for the procedure. The procedure comprises (1) preparing a bonded stack comprising (e.g. consisting of) a carrier layer, a workpiece layer, and an interposer layer therebetween; (2) processing the workpiece layer; and (3) delivering a gas jet at the junction between two adjacent layers in the stack to separate or debond the two adjacent layers. Technical merits of the invention include enhanced efficiency, higher wafer throughput, reduced stress on workpiece surface, and uniformly distributed stress and avoidance of device wafer breakage and internal device damage, among others.

Abstract: The present invention provides a method of separating a bonded stack utilizing the force generated by a gas jet. The stack includes a carrier and a thinned workpiece such as device wafer that are bonded together through one or more layers therebetween. The gas jet can separate two adjacent layers having peeling strength therebetween in the range of from 0.01 to 50.0 g/cm. The invention can simplify the procedure and provide high throughput in separating thinned wafer from its carrier.

Abstract: An apparatus for removing a ring-shaped reinforcement, edge from a ground semiconductor wafer, which is cohesively connected to an elastic carrier film and is fixed to a circumferential wafer frame via the carrier film, includes a holding device, which has a support having suction openings for holding the semiconductor wafer on the support surface of the support, and a separating device, which includes a device for integrally detaching the reinforcement edge from the carrier film.

Abstract: Apparatuses, fixtures, methods, and computer program products for disassembling devices are provided. A disassembly apparatus may include first and second disassembly fixtures and an actuator configured to provide a separation force therebetween. Suction may be employed to respectively engage first and second separable portions of a device with the first and second fixtures. Channels defined in an engagement member and surrounded by a sealing member may facilitate such engagement. Further heaters may be employed to loosen a pressure sensitive adhesive or other bonding material.

Abstract: The present disclosure provides a system for removing a touch panel from a display panel. The system includes: a carrying device on which the display panel adhered with the touch panel is placed; a heating device configured to heat an adhesive between the touch panel and the display panel; and a cutting device arranged on the carrying device and configured to cut the adhesive so as to remove the touch panel from the display panel.

Abstract: A unloading mechanism for removing workpieces from a transporting film can include a loading assembly and a unloading assembly coupled to the loading assembly. The loading assembly can include a base, a first driving member and an absorbent member. The base can include a base body, a first guiding member slidably extending through the base body, and a plurality of pushing members coupled to the base body. The first driving member can be coupled to the base body. The absorbent member can be coupled to the first guiding member. The absorbent member can define a plurality of receiving holes, and the pushing members can be received in the receiving holes. The unloading assembly can include a second driving member coupled to the first driving member, and a stopping member coupled to the second driving member adjacent to the absorbent member.

Abstract: Disclosed is a peel-off apparatus comprising: a first holding unit configured to hold a first substrate of a superimposed substrate; a second holding unit configured to hold a second substrate of the superimposed substrate; and a moving unit configured to move a part of outer periphery of the first holding unit to be separated from the second holding unit. The first holding unit includes: a plate type elastic member connected to the moving unit; and a plurality of adsorbing units provided in the elastic member to adsorb the first substrate. An outer periphery adsorbing unit which becomes a peel-off beginning point includes: a pad member whose adsorbing surface of the first substrate is open to form a hollow portion; and a support member fitted into the hollow portion of the pad member having a hardness higher than that of the pad member.

Abstract: In an embodiment, a chuck to support a solar cell in hot spot testing is provided. This embodiment of the chuck comprises a base portion and a support portion disposed above the base portion. The support portion is configured to support the solar cell above the base portion and to define a cavity between a bottom surface of the solar cell and the base portion that thermally separates a portion of the bottom surface of the solar cell from the base portion.

Abstract: Provided is a semiconductor die pick-up apparatus including a stage, a suction opening, a cover that opens and closes a suction opening, and projections and primary holes arranged at a circumferential edge of the suction opening and project from a contact surface. When picking up a semiconductor die, in a state in which at least a portion of a contour of the semiconductor die sticks out from the projections toward the outer circumference of the stage, a retaining sheet at the portion sticking out from the primary holes is suctioned, a tip end of the cover is caused to advance upward, the cover is caused to slide while pushing the retaining sheet and the semiconductor die upward to open the suction opening sequentially, the opened suction opening is caused to suction the retaining sheet sequentially to separate the retaining sheet from the semiconductor die.

Abstract: A flexible display panel peeling apparatus for peeling a flexible display panel attached to a top surface of a substrate includes a stage fixed to the substrate and a peeling plate comprising a bottom surface that is convex toward the flexible display panel and a plurality of adsorption units defined in the bottom surface to adsorb the flexible display panel to the bottom surface. Since the flexible display panel is successively peeled through the peeling plate, the flexible display panel may be peeled from the substrate without being damaged.

Abstract: The embodiments described herein provide an apparatus and method for separating dies from adhesive tape. In general, these techniques use applied vacuum and one or more channels in an extractor base surface to progressively peel adhesive tape away from the die. When the adhesive tape has been peeled away from the entire die the die can be removed and packaged. Such a technique can reduce the strain the die and thus may reduce the probability of cracks occurring in the die, and is thus particularly applicable to removing adhesive tape from relatively thin dies.

Abstract: A carrier substrate removing apparatus configured to separate a flexible substrate bonded to a carrier substrate includes a carrier substrate holding unit configured to hold the carrier substrate separated from the flexible substrate; an inclined separation unit configured, with the carrier substrate holding unit, to separate the flexible substrate from the carrier substrate and to transport the flexible substrate at an angle; and a transmittance measuring unit configured to measure a transmittance of the separated carrier substrate.

Abstract: According to an embodiment of the present disclosure, a substrate inverting device for inverting front and rear surfaces of a substrate is provided. The substrate includes a first holding unit configured to hold one surface of the substrate and a second holding unit disposed to face the first holding unit and configured to hold one surface of the substrate. Further, the substrate includes a moving mechanism configured to relatively move at least one of the first holding unit and the second holding unit to approach each other and stay spaced apart from each other, and a transfer mechanism configured to hold the one surface of the substrate. In this case, a support of the substrate in the first holding unit, the second holding unit and the transfer mechanism is performed by a Bernoulli chuck.

Abstract: The present invention provides a polarizing sheet removing tool and removing method. The tool includes a handle and a blade mounted on the handle. The handle includes a main body, a piston device mounted on the main body, and a guide tube mounted on the main body. The main body forms therein a channel for containing an adhesive dissolving liquid. The piston device is mounted inside the channel. The guide tube has an end in communication with the channel and an opposite end positioned on the blade to guide the adhesive dissolving liquid contained in the channel to the blade. The present invention uses a tool on which a piston device and adhesive dissolving liquid are provided so that in removing a polarizing sheet, the adhesive dissolving liquid can be guided by a guide tube toward a blade for subsequently flowing toward and dissolving bonding adhesive.

Abstract: Systems and methods of separating bonded wafers are disclosed. In one embodiment, a system for separating bonded wafers includes a support for the bonded wafers and means for applying a sheer force to the bonded wafers. The system also includes means for applying a vacuum to the bonded wafers.

Abstract: A substrate separating method includes: holding, in a predetermined position, a substrate sandwiched between a first holder and a second holder opposed to each other; and relatively moving the first holder and the second holder while the substrate is held in the predetermined position. In holding the substrate, the substrate may be held in the predetermined position by effecting a pressurizing force or a suction force onto the substrate. Also in holding the substrate, the substrate may be held in contact with one of the first holder and the second holder.

Abstract: The invention relates generally to a vacuum peeling apparatus and a vacuum peeling method. The vacuum peeling apparatus may include a chamber, a sealing maintain frame disposed inside the chamber, a first air tube disposed along a bottom end of the sealing maintain frame and configured to be expandable, a peeling prevention panel configured so as to be inserted into a center of the sealing maintain frame, and a second air tube disposed along an end of the peeling prevention panel.

Abstract: Disclosed are an apparatus and method for fabricating a flat panel display device to realize easy separation of a substrate from an imprinting mold. The apparatus includes an imprinting mold connected to a substrate to form a thin film pattern on the substrate, a first adsorption pad to vacuum-adsorb the center of the imprinting mold, a second adsorption pad to vacuum-adsorb the periphery of the imprinting mold, and a connector connected to vacuum pins to vertically move in different regions of the first and second adsorption pads.

Abstract: A wafer-related data creation device including a setting stand for setting wafer pallets, a test-use suction nozzle for picking up die on dicing sheet of a wafer pallet set on the setting stand, a test-use pusher pin for pushing up the adhesive section of die from dicing sheet which is being attempted to be picked up by test-use suction nozzle, and a test-use camera for capturing an image of die on dicing sheet is used. The wafer pallet for which wafer-related data is to be created is set on the setting stand of wafer-related device creation device, an image captured by test-use camera is processed, pusher movement of test-use pusher pin and die pickup movement of test-use pickup nozzle is performed, and wafer-related data is created.

Abstract: A film releasing device includes at least one transport member configured to transport a stack of a substrate and a film and to discharge the stack, a negative-pressure-generating unit provided on a discharge side of the transport member and configured to attract the film with a negative pressure generated on a surface of the film, and a communicating portion communicating with atmosphere and provided in a region of the film that is on a side facing the substrate, the region overlapping a part of a negative-pressure-generated area of the film. The film is released from the substrate in such a manner as to be guided in a direction that is different from a direction of discharge while the film is attracted to the negative-pressure-generating unit.

Abstract: Disclosed are systems, devices and methodologies for debonding wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be debonded from the carrier plate. Such a debonding process can be achieved by applying a suction force to the wafer-carrier plate assembly. Various debonding systems, devices and methodologies, and related features, are disclosed.

Abstract: A method of peeling an electronic component. The method includes a step of, when the electronic component is adhered onto a first main surface of a tape member, bringing a bellowphragm into contact with a second main surface, which is the other main surface of the tape member; and a step of, after the bellowphragm is brought into contact with the second main face, deforming the bellowphragm and the tape member by supplying a fluid to the bellowphragm to thereby peel the electronic component from the tape member.

Abstract: Disclosed are systems, devices and methodologies for debonding wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be debonded from the carrier plate. Such a debonding process can be achieved by applying a suction force to the wafer-carrier plate assembly. Various debonding systems, devices and methodologies, and related features, are disclosed.

Abstract: The detachment and removal of a semiconductor chip from a foil occurs in accordance with the invention in three phases. In the first phase there is a partial detachment of the semiconductor chip from the foil with mechanical means, but without the participation of a chip gripper. In the second phase the semiconductor chip is further detached from the foil, with the semiconductor chip being held by the chip gripper. In the third phase the chip gripper is lifted and moved away.

Abstract: A first holding table suction-holds an annular projection of a wafer remaining on a rear face thereof for surrounding a back grinding region. A second holding table having an outer peripheral wall adjacent to an inner wall of the annular projection is inserted into a flat portion inside the annular projection for joining a separating adhesive tape to a protective tape on a surface of the wafer while a flat plane of the flat portion is suction-held. Thereafter, the adhesive tape is separated. Accordingly, the adhesive tape is separated from the surface of the wafer together with the protective tape.

Abstract: A film peeling apparatus includes a peeling pin that push-lifts a first end portion of a cut portion of a film toward a second end portion of the cut portion, a peeling roller that push-lifts the second end portion of the cut portion toward the first end portion of the cut portion by closely contacting the second end portion of the cut portion and rotating, and an absorbing unit that absorbs and removes the cut portion of the film push-lifted by the peeling pin and peeling roller.

Abstract: A die bonding apparatus includes a work supply/transfer portion for transferring a substrate; a bonding portion for conducting bonding of a die on the substrate; a wafer supply portion for supplying a wafer having the die thereon; and a controller portion for controlling equipment, wherein the wafer supply portion has a push-up unit for pushing up a dicing tape from a lower part, for separating the die from the dicing tape, and the push-up unit has a suction opening portion, which is configured to suck the dicing tape with vacuum, a push-up portion, which is made of an elastic body, sealing a fluid or a power therein, and is configured to push up the dicing tape, a cylinder, which is configured to apply pressure to the push-up portion, and an air supply means for supplying an air for changing the pressure within the cylinder through control of the controller portion.

Abstract: Systems and methods of separating bonded wafers are disclosed. In one embodiment, a system for separating bonded wafers includes a support for the bonded wafers and means for applying a sheer force to the bonded wafers. The system also includes means for applying a vacuum to the bonded wafers.

Abstract: An object of the present invention is to provide a pickup device that can securely peel a die or to provide a reliable die bonder or a pickup method using the pickup device. To achieve the object, the present invention is provided with a characteristic that when a die to be peeled out of plural dies (semiconductor chips) applied to a dicing film is thrust up and is peeled from the dicing film, the dicing film in a predetermined part in a circumference of the die is thrust up and a peeling starting point is formed, the dicing film in a part except the predetermined part is thrust up, and the die is peeled from the dicing film.

Abstract: A debonder apparatus for debonding a temporary bonded wafer pair. The clam shell reactor includes first and second isolated chambers. An upper chuck is contained within the first chamber and has a lower surface protruding into the second chamber. A lower chuck is contained within the second chamber and has an upper surface oriented parallel and opposite to the lower surface of the upper chuck. The debonder includes means for holding an unbounded surface of the first wafer onto the lower surface of the upper chuck. The first chamber pressurizing means applies pressure onto an upper surface of the upper chuck and thereby causes the lower surface of the upper chuck and the attached wafer pair to bow downward. The debonder apparatus also includes means for initiating a separation front at a point of the bonding interface of the temporary bonded wafer pair.

Abstract: A system is disclosed for ejecting a semiconductor die from a tape to which the die is affixed during the wafer dicing process. In embodiments, the system includes an ejector tool including a support table, ejector pins and a pick-up arm. The support table is connected to a vacuum source for creating a negative pressure at an interface between the tape and support table. The support table further includes an aperture with one or more chamfered sidewalls. The vacuum source is connected to the aperture so that, upon placement of the tape on the support table with a die centered over the aperture, the vacuum source pulls a portion of the tape around the edges of the semiconductor die away from the die and into the space created by the chamfered edges.

Abstract: The fiber batt reclaiming method and apparatus separates the fiber batt portion of surplus or defective fiberglass insulation from the paper backing material attached to the fiber batt. As the insulation is fed to a perforated roller, a vacuum means draws the backing material to the roller so that the backing material adheres to the roller. As the roller rotates the fiber batt portion of the insulation is separated from the backing material by a separation tool. In accordance with various embodiments of the apparatus, the separation tool may be an elongated knife, a pressurized air bar, a circular saw bar, or an elongated wire brush.

Abstract: A die detachment apparatus for partially delaminating a die from an adhesive tape on which it is mounted comprises a cover having a support surface that is operative to support the adhesive tape, the support surface including a set of cover holes. A movable pin chuck is positioned below the support surface and includes a set of pin holes that are arranged coaxially with the cover holes. The movable pin chuck is configured for detachably inserting a set of pins in a first desired configuration on some of the pin holes, and the pins are also operable to be relocated on the pin chuck to form another desired configuration. The pins are operative to protrude from the cover by passing through the cover holes to contact and lift the die.

Abstract: The present invention provides a method and machine for separating a liquid crystal panel and a liner pad. The method includes (1) providing a separation machine and a combination of the liquid crystal panel and liner pad to be separated, the separation machine including a separation device that includes a suction device, air blasting devices and shaking devices; (2) the suction device moving toward the combination; (3) a central suction nozzle first engaging and sucking a liner pad of the combination and later the first suction nozzles engaging the sucking the liner pad of the combination; (4) the shaking devices being operated to subject the combination to vibration and the air blasting devices being operated to eject air streams to side edges of the combination; and (5) the combination, after being subjected to vibration and air streams, being separated so as to realize separation of the liquid crystal panel and liner pad.

Abstract: Apparatus and a method for operating the apparatus to remove at least one chip-type semiconductor component from an adhesive film. The method comprises: arranging a lifting device with respect to the film, wherein a contact region of the lifting device bears against a second main surface of the film, opposite a chip-type semiconductor component that is arranged on a first main surface and is to be lifted off. Then, applying either a constant vacuum to a plurality of suction cutouts of the lifting device, by means of an assigned vacuum regulating device, or applying different values of the vacuum for different suction cutouts or groups of suction cutouts. Next, partially deforming the film in the contact region by using lifting means arranged in assigned cutouts of the lifting device to lift the film. Finally, using a removal device to remove the at least one semiconductor component from the film.

Abstract: A fixing jig is made up of a plate-like jig main body (2) and a close contact layer (3) which detachably holds a work (W) in close contact therewith. The jig main body has: on one surface thereof a plurality of supporting projections (4) to support the close contact layer; and also has, along an outer peripheral portion of said one surface, a side wall (5) which is of substantially the same height as the supporting projections. The close contact layer is adhered to an end surface of the side wall to thereby define a partitioned space (6) between the close contact layer and the jig main body. By sucking the air within the partitioned space via a ventilation hole (7) formed in the jig main body, the close contact layer is deformed. The work is thus surely supported and fixed also in performing a processing in which a force is applied to the work.

Abstract: An apparatus and method is provided for removing a selected portion of tape material from backing paper. One embodiment of an apparatus may include a supply reel, at least one cutting member, at least one bending member, and first and second vacuum rollers. The apparatus may further include pinch rollers, scraping members, and scrap bins. The apparatus may allow for the removal of scrap tape material from the backing paper.

Abstract: The invention relates generally to a vacuum peeling apparatus and a vacuum peeling method. The vacuum peeling apparatus may include a chamber, a sealing maintain frame disposed inside the chamber, a first air tube disposed along a bottom end of the sealing maintain frame and configured to be expandable, a peeling prevention panel configured so as to be inserted into a center of the sealing maintain frame, and a second air tube disposed along an end of the peeling prevention panel.

Abstract: Methods and apparatus provide for imparting a controlled supply of gas to at least one Bernoulli chuck to provide a balanced draw and repellant gas flow to a material sheet; and at least one of: elevating a temperature of the supply of gas to the at least one Bernoulli chuck such that the gas flow to the material sheet is provided at the elevated temperature providing a stream of gas to an insulator substrate to promote separation of an exfoliation layer from a donor semiconductor wafer, and providing a stream of gas to a junction of the insulator substrate and any support structure to promote separation of the insulator substrate and the supporting structure.

Abstract: A system, apparatus, and method for removing pressure adhesive indicia, such as labels or stamps, from their backing and affixing the same to a target substrate is provided. The automated process affixes stamps, for example, to the target substrate with both speed and precision of placement. Desired stamps can be selectively removed from a backing, for example, can be placed on variable locations upon the target substrate, and can be affixed in the desired orientation with precise spacing between stamps. The precision of affixation afforded by this system is commensurate with philatelic standards and is suitable for all pressure adhesive indicia where rapid and precise placement is desired for aesthetic or other reasons.

Abstract: A substrate separating method includes: holding, in a predetermined position, a substrate sandwiched between a first holder and a second holder opposed to each other; and relatively moving the first holder and the second holder while the substrate is held in the predetermined position. In holding the substrate, the substrate may be held in the predetermined position by effecting a pressurizing force or a suction force onto the substrate. Also in holding the substrate, the substrate may be held in contact with one of the first holder and the second holder.