Abstract: Among other things a method including releasing a discrete component from an interim handle and depositing a discrete component on a handle substrate, attaching the handle substrate to the discrete component, and removing the handle substrate from the discrete component.

Abstract: A scrap collection assembly for a tape lamination head that applies a plurality of composite tape segments includes a crack-off assembly with a scrap crack-off redirect roller configured to engage one or more composite tape segments and one or more scrap portions; and a secondary crack-off roller configured to engage one or more composite tape segments and one or more scrap portions; a pivot that connects the crack-off assembly to the tape lamination head, wherein the secondary crack-off roller selectively moves about the pivot to change a direction of composite tape movement.

Abstract: An apparatus and method for debonding a pair of bonded wafers are disclosed herein. In some embodiments, the debonding apparatus, comprises: a wafer chuck having a preset maximum lateral dimension and configured to rotate the pair of bonded wafers attached to a top surface of the wafer chuck, a pair of circular plate separating blades including a first separating blade and a second separating blade arranged diametrically opposite to each other at edges of the pair of bonded wafers, wherein the first and the second separating blades are inserted between a first and a second wafers of the pair of bonded wafers, and at least two pulling heads configured to pull the second wafer upwardly so as to debond the second wafer from the first wafer.

Abstract: A pad removal method includes affixing a first end of a pad guide to a first edge location of a pad. The pad removal method further includes affixing a second end of the pad guide to a second edge location of the pad. The pad removal method further includes moving the first end from a first position, a first distance from the second edge location, to a second position, a second distance from the second edge location, wherein the first distance is greater than a diameter of the pad, and the second distance is less than the diameter of the pad.

Abstract: To reduce residual stress generated on a protective tape at a time of application of the protective tape to a semiconductor wafer, provided is an application apparatus (1) for applying a protective tape (PT) to a semiconductor wafer (W), including: a tape conveyance mechanism (2) configured to convey the protective tape (PT) temporarily applied to a base material (BM) to a peeling position; a tape holding body (30) capable of holding the protective tape (PT); a holding-body moving mechanism (31) configured to move the tape holding body (30) to the peeling position; and a peeling mechanism (4) configured to peel the base material (BM) from the protective tape (PT) held by the tape holding body (30) at the peeling position.

Abstract: A film peeling device includes a chamber, a lower stage disposed on a first wall of the chamber, first to fourth grippers capable of peeling first to fourth sides of a film by gripping the first to fourth sides of the film attached to an object disposed on the lower stage and an upper stage disposed on a second wall of the chamber facing the first wall of the chamber and capable of extending in a first direction in which the object is disposed.

Abstract: A processing method for a tip end of a tape is a method of processing a tip end of a component storage tape before attaching the component storage tape to a component feeding device. The processing method for a tip end of a tape includes a lifting step and a folding step. At the lifting step, a lifting process of lifting the tip end of the cover tape off the carrier tape is carried out such that a part of a tip edge of the cover tape is separated from the carrier tape. At the folding step, the lifted tip end of the cover tape is folded along a fold to form a triangular fold piece.

Abstract: A transfer apparatus for transferring a plurality of light emitting diode chips, comprising a stage on which a first substrate having the plurality of light emitting diode chips mounted on one surface is placed, a work table on which a second substrate to which the plurality of light emitting diode chips are to be transferred is placed, and a push pin module for transferring the plurality of light emitting diode chips to the second substrate by pushing the other surface of the first substrate in a state that one surface of the first substrate and the second substrate are disposed to face each other, wherein the push pin module includes a plurality of push pin units each including a push pin for pushing the other surface of the first substrate, and the push pin module transfers the plurality of light emitting diode chips corresponding to each push pin of the plurality of push pin units to the second substrate at a time.

Abstract: Disclosed is a thin subject assisted debonding method for separating temporarily bonded workpiece-carrier pair. The thin subject can be a thin wire, or thin filament, or thin blade. The thin subject can be applied between the workpiece and carrier pair in association with laser debonding or mechanical debonding to provide well controlled and targeted wedging function to the delaminating temporary adhesive and its adjacent substrate to which it is separating from. The workpiece can be a semiconductor wafer that has been thinned and processed, and the carrier can be a semiconductor non-device wafer or any other rigid substrate such as a glass wafer or panel. The application of a thin subject between the workpiece and carrier during debonding provides the advantage of high throughput and low defect rate.

Abstract: A component feeder for feeding components to a component feeding position using a component feeding tape including a carrier tape holding the components at equal intervals and a covering tape attached to the upper surface of the carrier tape. The component feeder includes a driving sprocket and a tape guide. The driving sprocket is configured to feed the component feeding tape to the component feeding portions. The tape guide includes a pressing surface to press an upper surface of the component feeding tape fed to the component feeding position. The tape guide includes a component exposing portion and an adjustment portion. The component exposing portion includes an inserting portion to be inserted between the carrier tape and the covering tape. The adjustment portion is configured to adjust a projection amount of the inserting portion from the pressing surface.

Abstract: A tape processing method of reusing an opened component supplying tape used in a tape feeder which conveys the component supplying tape provided with a carrier tape including a plurality of component storing portions and a cover tape toward a component take out position, the tape feeder being configured to open a cover tape and convey the component supplying tape. The method includes steps of: repairing the component supplying tape by closing an opened portion of the cover tape and fixing by a repair tape to be returned to a state in which the component storing portion is covered by the cover tape; and cutting the component supplying tape at a predetermined cut position far away toward a downstream side in the conveying direction from a position of a head component located at the most downstream side in the conveying direction.

Abstract: A device for attachment of double-sided adhesive and a method for attachment of the double-sided adhesive are provided. The device includes a driver, a platform and a robot arm provided above the platform. The robot arm is connected with the driver and configured to, under the driving of the driver, place the double-sided adhesive onto a preset position of the platform, strip off the first protective film of the double-sided adhesive at the preset position, press the printed circuit board assembly (PCBA) at the preset position against the double-sided adhesive without the first protective film, and unload the PCBA attached with the double-sided adhesive from the preset position. A positioning structure is provided at the preset position and configured to secure the adhesive layer and the second protective film when the robot arm strips off the first protective film, and release the securing of the adhesive layer and the second protective film when the double-sided adhesive is attached to the PCBA.

Abstract: An apparatus, system, and a method of using the apparatus or system that includes a bladder positioned between tape and an adhesive layer configured to selectively connect the tape to a semiconductor device. The bladder includes one or more chambers that may be selectively expanded to move a portion of the bladder and adhesive layer away from the tape, which may enable the removal of the semiconductor device. The flow of fluid into each of the chambers may selectively expand the chambers. The chambers may have a substantially rounded upper profile or a substantially pointed upper profile. A material within the chambers may be heated to expand the chambers. A plurality of conduits may permit the flow of fluid into the chambers. The conduits may be inserted into the bladder. The chambers may be collapsed after expansion to enable the removal of a semiconductor device from the tape.

Abstract: A label peeling device includes a mounting bracket, a power member attached to the mounting bracket, a driving member driven by the power member; and a pressing assembly coupled to a first end of the driving member. A clamping mechanism includes a sliding member coupled to a second end of the driving member, and a clamping assembly configured to clamp a backing paper. A first resisting member is attached to the mounting bracket, and presses against the clamping assembly. The pressing assembly and the clamping mechanism are configured to be urged toward each other by a driving force imparted by the power member, the first resisting member drive the clamping assembly to the sliding member, and thereby cause at least one of the plurality of wafers to be removed from the backing paper.

Abstract: Provided are a substrate separation apparatus and method. The substrate separation apparatus includes: an upper transfer part which fixes the upper substrate and transfers the upper substrate in a positive X-axis direction in an XY coordinate system composed of an X axis and a Y axis intersecting each other; and a lower transfer part which is installed under the upper transfer part with a gap therebetween and fixes and transfers the lower substrate, wherein the lower transfer part includes: a lower holding unit on which the lower substrate is placed; and a lower guide unit which includes path guides for guiding movement of the lower holding unit, wherein the path guides include a first path guide which is parallel to the X axis and a second path guide which is continuous with the first path guide and contacts a straight line having a negative slope in the XY coordinate system.

Abstract: A system for separating semiconductor devices from a wafer having back metal exposed in scribe streets of the wafer positioned on a plastic film by applying a variable radial force to stretch and tension the film while controlling the stretch and tension as a function of a control parameter.

Abstract: A method for detaching a semiconductor chip from a foil uses a die ejector comprising plates having a straight supporting edge and an L-shaped supporting edge comprises: lifting of the plates to a height H1 above the surface of a cover plate; lowering of a first pair of plates with L-shaped supporting edge; optionally, lowering of a second pair of plates with L-shaped supporting edge; lifting of the plates that have not yet been lowered to a height H2>H1; staggered lowering of plates that have not yet been lowered, with at least one or several plates not being lowered; optionally, lowering of the plates that have not yet been lowered to a height H3<H2; lowering of the plates until all plates are lowered, and moving away of the chip gripper, wherein the chip gripper touches the semiconductor chip before lowering the last three plates.

Abstract: Provided is a semiconductor die pick-up apparatus including a stage, a suction opening, a cover that opens and closes a suction opening, and projections and primary holes arranged at a circumferential edge of the suction opening and project from a contact surface. When picking up a semiconductor die, in a state in which at least a portion of a contour of the semiconductor die sticks out from the projections toward the outer circumference of the stage, a retaining sheet at the portion sticking out from the primary holes is suctioned, a tip end of the cover is caused to advance upward, the cover is caused to slide while pushing the retaining sheet and the semiconductor die upward to open the suction opening sequentially, the opened suction opening is caused to suction the retaining sheet sequentially to separate the retaining sheet from the semiconductor die.

Abstract: A film peeling apparatus includes a peeling pin that push-lifts a first end portion of a cut portion of a film toward a second end portion of the cut portion, a peeling roller that push-lifts the second end portion of the cut portion toward the first end portion of the cut portion by closely contacting the second end portion of the cut portion and rotating, and an absorbing unit that absorbs and removes the cut portion of the film push-lifted by the peeling pin and peeling roller.

Abstract: An apparatus for removing a protective film for a flat display panel includes a laser oscillating member configured to be disposed over the protective film, the protective film attached to a surface of the flat display panel, the laser oscillating member configured to cut the protective film into a plurality of division regions by irradiating a laser beam; a separation member configured to peel at least one of the plurality of division regions from the flat display panel; a spacer member configured for insertion between the protective film and the at least one division region to be peeled from the flat display panel; and an adhesive member configured for attachment to a surface of the division region opposite the spacer member on the division region, the spacer member and the adhesive member being configured to move in a same direction.

Abstract: Described methods and apparatus provide a controlled perturbation to an adhesive bond between a device wafer and a carrier wafer. The controlled perturbation, which can be mechanical, chemical, thermal, or radiative, facilitates the separation of the two wafers without damaging the device wafer. The controlled perturbation initiates a crack either within the adhesive joining the two wafers, at an interface within the adhesive layer (such as between a release layer and the adhesive), or at a wafer/adhesive interface. The crack can then be propagated using any of the foregoing methods, or combinations thereof, used to initiate the crack.

Abstract: A substrate separating method includes: holding, in a predetermined position, a substrate sandwiched between a first holder and a second holder opposed to each other; and relatively moving the first holder and the second holder while the substrate is held in the predetermined position. In holding the substrate, the substrate may be held in the predetermined position by effecting a pressurizing force or a suction force onto the substrate. Also in holding the substrate, the substrate may be held in contact with one of the first holder and the second holder.

Abstract: An adhesive fastening element (802) for holding a workpiece (808), the adhesive fastening element (802) comprising: an outer member (804); and a consumable inner member (806) disposed inside the outer member (804) and releasably movable relative to the outer member (804) along a longitudinal axis of the adhesive fastening element (802); wherein the consumable inner member (806) comprises a bonding surface which, in use, is bonded by an adhesive (810) to the workpiece (808) and is removed and replaced to detach the workpiece (808) from the adhesive fastening element (802).

Abstract: A delamination apparatus includes a stage, a first roll unit, a gripper, and a second roll unit. The stage includes a peripheral area and a substrate area. An edge of a donor film is attached at the peripheral area. An acceptor substrate, laminated at on the donor film, is disposed at the substrate area. The first roll unit is disposed on the donor film, moves in a lengthwise direction of the acceptor substrate. The gripper is disposed on the donor film, and is configured to separate the edge of the donor film from the stage so as to cause the donor film to contact the first roll unit. The second roll unit is disposed on the stage, contacts the donor film which contacts the first roll unit, and delaminates the donor film from the acceptor substrate by moving in the lengthwise direction with the first roll unit.

Abstract: A paper stripping member is removably supported by a supporting member disposed facing a circumferential surface of a photoreceptor drum, and strips a paper sheet off the circumferential surface. The paper stripping member includes an acute-shaped stripping nail, a holding member and a cover member. The holding member is configured removably from the supporting member, and holds the stripping nail in such a manner that the stripping nail extends toward the circumferential surface. The cover member is configured removably from the holding member, and covers at least part of the stripping nail in the extending direction of the stripping nail in a state where the cover member is attached to the holding member.

Abstract: An adhesive fastening element includes a first member and a second member adjacent to the first member and movable relative to the first member along a longitudinal axis of the adhesive fastening element, wherein a bond is formed by an adhesive between the workpiece and the first and second members of the adhesive fastening element. A method for de- bonding a workpiece from an adhesive fastening element includes moving the second member away from the workpiece and breaks the bond between the second member and the workpiece and moving the first and second members such that the second member moves towards the workpiece and applies a force to the workpiece so as to break the bond between the first member and the workpiece, and lo de-bond the workpiece from the adhesive fastening element.

Abstract: A method of peeling a protective tape, includes the steps of mounting a wafer on a stage, the wafer having the protective tape adhered thereto so that the protective tape overlaps only a portion of a notch of the wafer, attaching a peeling adhesive tape to the protective tape, projecting a lift pin from the stage so that the portion of the protective tape which overlaps the notch is raised by a top surface of the lift pin, and with the protective tape raised by the lift pin, pulling the peeling adhesive tape so as to peel the protective tape from the wafer. The top surface of the lift pin has a shape that allows the top surface to raise the portion of the protective tape which overlaps the notch.

Abstract: Label application devices and methods of printing and applying labels are described herein. One label application device can comprise a feed component configured to deliver a sheet of label material to a position, a product identification component configured to identify a type of a product that is approaching the position, a printing component configured to print data onto the sheet of label material, the data based on the identified type of product, a stripping component configured to remove a liner portion of the sheet of label material from a label portion of the sheet, and an applicator component configured to apply the label portion to the product.

Abstract: The detachment and removal of a semiconductor chip from a foil occurs in accordance with the invention in three phases. In the first phase there is a partial detachment of the semiconductor chip from the foil with mechanical means, but without the participation of a chip gripper. In the second phase the semiconductor chip is further detached from the foil, with the semiconductor chip being held by the chip gripper. In the third phase the chip gripper is lifted and moved away.

Abstract: A chip sorting apparatus comprising a chip holder comprising a first surface and an second surface opposite to the first surface; a wafer comprising a first chip disposed on a first position of the first surface; a first chip receiver comprising a third surface and an fourth surface opposite to the third surface, wherein the third surface is opposite to the first surface; a pressurization device making the first chip and the third surface of the first chip receiver adhered to each other through pressuring the second surface at where corresponding to the first position; and a separator decreasing the adhesion between the first chip and the first surface.

Abstract: A separating apparatus according to the present invention includes a clamp for gripping an outer peripheral end of a supporting plate. The clamp grips the outer peripheral end of the supporting plate and separates the supporting plate from a wafer by gripping the supporting plate. This makes it possible to separate a supporting plate from a wafer without breaking the wafer. With this, a supporting plate can be separated from a wafer to which the supporting plate has been attached, without breaking the wafer.

Abstract: A system and method for refurbishing or recycling a layered article such as a golf ball is disclosed that includes removing a cover from the article. The system can include a golf ball guide, a golf ball scorer-driver that can score the outer shell of the golf ball while simultaneously advancing it along the golf ball guide, a cover peeler having an orifice with an inner diameter that is less than an outer diameter of the golf ball cover, and a press that can drive the golf ball core through the cover peeler orifice. The method includes inducing at least one weakened region in the outer shell of the golf ball, rupturing the weakened region to create at least one opening in the golf ball outer shell, and forcing a core portion of the golf ball through the opening in the golf ball outer shell.

Abstract: An apparatus for stripping metal from a cathode plate, the apparatus comprising stripping means adapted for positioning between the metal and the cathode plate in order to separate the metal from the cathode plate, and wherein movement of the stripping means is achieved through movement of a robotic arm.

Abstract: An object of the present invention is to provide a pickup device that can securely peel a die or to provide a reliable die bonder or a pickup method using the pickup device. To achieve the object, the present invention is provided with a characteristic that when a die to be peeled out of plural dies (semiconductor chips) applied to a dicing film is thrust up and is peeled from the dicing film, the dicing film in a predetermined part in a circumference of the die is thrust up and a peeling starting point is formed, the dicing film in a part except the predetermined part is thrust up, and the die is peeled from the dicing film.

Abstract: A system is disclosed for ejecting a semiconductor die from a tape to which the die is affixed during the wafer dicing process. In embodiments, the system includes an ejector tool including a support table, ejector pins and a pick-up arm. The support table is connected to a vacuum source for creating a negative pressure at an interface between the tape and support table. The support table further includes an aperture with one or more chamfered sidewalls. The vacuum source is connected to the aperture so that, upon placement of the tape on the support table with a die centered over the aperture, the vacuum source pulls a portion of the tape around the edges of the semiconductor die away from the die and into the space created by the chamfered edges.

Abstract: A multifunction device for prefabricating marking labels, having a top side configured to be printed on and a bottom side opposite the top side with a profiling, includes a printing device and at least one of a separating device and a perforation device. A feeder unit is configured to feed blank marking labels of a finite-length or endless material. A holder element including a recess is configured to receive the marking labels, including the profiling, so as to fix the marking labels in position during a passing over of the printing device and the at least one of the separating device and perforation device.

Abstract: Apparatus and a method for operating the apparatus to remove at least one chip-type semiconductor component from an adhesive film. The method comprises: arranging a lifting device with respect to the film, wherein a contact region of the lifting device bears against a second main surface of the film, opposite a chip-type semiconductor component that is arranged on a first main surface and is to be lifted off. Then, applying either a constant vacuum to a plurality of suction cutouts of the lifting device, by means of an assigned vacuum regulating device, or applying different values of the vacuum for different suction cutouts or groups of suction cutouts. Next, partially deforming the film in the contact region by using lifting means arranged in assigned cutouts of the lifting device to lift the film. Finally, using a removal device to remove the at least one semiconductor component from the film.

Abstract: A die detachment apparatus for partially delaminating a die from an adhesive tape on which it is mounted comprises a cover having a support surface that is operative to support the adhesive tape, the support surface including a set of cover holes. A movable pin chuck is positioned below the support surface and includes a set of pin holes that are arranged coaxially with the cover holes. The movable pin chuck is configured for detachably inserting a set of pins in a first desired configuration on some of the pin holes, and the pins are also operable to be relocated on the pin chuck to form another desired configuration. The pins are operative to protrude from the cover by passing through the cover holes to contact and lift the die.

Abstract: An apparatus and method is provided for removing a selected portion of tape material from backing paper. One embodiment of an apparatus may include a supply reel, at least one cutting member, at least one bending member, and first and second vacuum rollers. The apparatus may further include pinch rollers, scraping members, and scrap bins. The apparatus may allow for the removal of scrap tape material from the backing paper.

Abstract: The invention comprises separating the strippings of a strip of paper and of a precut prepreg into strippings to be discarded and blanks to be kept using a suction roller that is tangent to the strip along an action line. In a downstream position, a device collects the blanks on said rectilinear path, and a device closer to the roller discharges the strippings. The paper runs through the device along said rectilinear path while maintaining the blanks thereon, and a strip temporary diversion device, capable of orthogonal movement relative to the strip, temporarily diverts the strip and brings it closer to the roller in order to facilitate the initial peeling of the strippings.

Abstract: A semiconductor system for peeling semiconductor chips from tape, comprising: providing an outer housing having an aperture on a top thereof; providing a magnet with a needle base extension; providing needles magnetically held to the magnet; applying a vacuum through the aperture to hold an adhesive material to the outer housing; and extending the needles through the aperture in the outer housing.

Abstract: A manufacturing method of a semiconductor device comprising the steps of: affixing a die attach film and a dicing film to a back surface of a semiconductor wafer: thereafter dicing the semiconductor wafer and the die attach film to divide the semiconductor wafer into a plurality of semiconductor chips: thereafter pulling the dicing film from the center toward the outer periphery of the dicing film with a first tensile force to cut the die attach film chip by chip; and thereafter picking up the semiconductor chips together with the die attach film while pulling the dicing film from the center toward the outer periphery of the dicing film with a second tensile force smaller than the first tensile force.

Abstract: In the pickup apparatus wherein a chip adhered on a sheet is sucked and held by a picking nozzle and then picked up by the nozzle, a sheet push-up member configured by forming flexible elastic material such as rubber in a spherical shape is attached on the abutment supporting surface of the upper surface of a tool, then the push-up surface of the sheet push-up member is followed in a flat surface state along the lower surface of the sheet and abutted thereto in the moving down state of the picking nozzle, and then the push-up surface pushes up the lower surface of the sheet while being deformed in a upwardly protruded curved surface shape in the moving up operation where the picking nozzle moves up together with the chip. Thus, the chip can be released from the sheet from the outer peripheral side of the chip.

Abstract: A semiconductor-chip exfoliating device for exfoliating a semiconductor chip 1 from an adhesive sheet 6 is provided. The device includes a backup holder 28 for holding the adhesive sheet 6 so that semiconductor chips 1 turn upward, a pair of needle pins arranged on a backside of the holder 28 to lift off the adhesive sheet 6 from the holder 28 through through-holes 31a, 31b in the holder 28 and a sliding unit 33 arranged on the backside of the holder 28 to slide one needle pin 30b in a direction to depart from the other needle pin 30a. By the sliding unit 33, the interval between the needle pins 30a, 30b can be changed so as to cope with a variation of semiconductor chips 1, 1A.

Abstract: Apparatus are provided for attaching to a composite tape lamination machine in order to remove composite scrap tape material from a backing paper. When a moveable member is in one position composite non-scrap tape material on a backing paper is directed along a path to avoid a removing member and keep composite non-scrap tape material on a backing paper. When the moveable member is in another position composite scrap tape material on a backing paper is directed along a different path to contact the removing member and remove composite scrap tape material from a backing paper. Composite scrap tape material may be disposed in a scrap disposal member. Backing paper having attached composite non-scrap tape material and not having attached composite scrap tape material may be spooled using a spool roller.

Abstract: An apparatus and method for removing a temporary substrate from an optical disk is disclosed. A holding fixture (102) provides an optical disk supporting surface. A force imparting tool (118) imparts a force against an optical disk wherein a reaction force to the force imparting tool is provided by the supporting surface. The optical disk is flexed to break away and remove a temporary substrate of the optical disk.