Abstract: A lighting device includes a chassis; light sources; and a rectangular substrate formed of a long rectangular plate-shaped member disposed in the chassis, having the light sources attached to a front surface thereof, and having a plurality of first alignments indicating positions of the light sources. The plurality of first alignments are provided at positions facing each other with the light source interposed therebetween a pair of long sides of the rectangular substrate, and are confirmed at least from a back surface side of the rectangular substrate.

Abstract: A component mounting machine includes a feeder device that has a tape feeding mechanism that feeds out a carrier tape that stores components in respective component storage sections, and a tape peeling mechanism that has a tape peeling blade that carries out peeling, and a component transfer device that has a mounting head that holds a suction nozzle, and a head driving mechanism, the component mounting machine further provided with a peeling start determination section of determining whether or not the peeling starts before the suction nozzle starts a suction operation, and a recovery function section of carrying out a recovery operation in which the recovery function section returns the leading end of the carrier tape temporarily to the front of the tape peeling blade and feeds out the carrier tape again in a case where it is determined that peeling is not started.

Abstract: According to the present disclosure, a tape feeder includes a main body that is attached to a component mounter and has a tape traveling path which is a traveling path of a carrier tape; and a sprocket that is provided in the main body, causes an outer peripheral tooth to engage with a feed hole of the carrier tape, and rotates so as to perform pitch feeding of the carrier tape on the tape traveling path. The tape feeder includes a lock mechanism that has a press operation unit operated with pressing force, locks the sprocket in the main body in a state where the press operation unit is not operated, and unlocks the sprocket in a state where the press operation unit is operated.

Abstract: An electronic component supply apparatus that transports a component supply tape which has accommodation sections and sprocket holes and which accommodates an electronic component in each of the accommodation sections and is covered with a cover tape, to a component picking-up position and that supplies the electronic component to a component mounting apparatus, the electronic component supply apparatus includes a sprocket hole detecting unit that detects a sprocket hole on the upstream side on a transport path from the component picking-up position; an electronic component detecting unit that detects an electronic component accommodated in the accommodation section on the transport path on the upstream side from the component picking-up position; and a component presence/absence determining unit that determines presence or absence of an electronic component in the accommodation section based on information from the sprocket hole detecting unit and information from the electronic component detecting unit.

Abstract: There is provided an electronic component mounter configured to include a supplier holder in which a radial lead type electronic component supplier can be mounted, and to cause a mounting head to hold a radial lead type electronic component so as to mount the component on a board positioned by a board holder. The electronic component mounter includes a tape guide passage that guides a tape body after the radial lead type electronic components are picked up from the tape body. The electronic component supplier is configured to further include a posture converter that converts a posture of the tape body from a posture perpendicular to a horizontal plane to a posture parallel to the horizontal plane, after the radial lead type electronic components are picked up from the tape body, and that introduces the tape body to the tape guide passage.

Abstract: A component supplying apparatus comprises an inclined straight path P2 which is for the carrier tape and which extends obliquely upward, a horizontal straight path P3 which is for the carrier tape and which extends in the horizontal direction from a front end of the inclined path P2 and runs through the component supply position Q, a first sprocket wheel engaging with the feed holes of the carrier tape within the inclined path P2, a guide member locating the carrier tape in the width direction within the horizontal path, a top tape removing device disposed above the inclined path P2 between the first sprocket wheel and the horizontal path P3 and partially removing the top tape from the base tape so as to expose the components, and a sprocket wheel drive device rotating the first sprocket wheel.

Abstract: A marking object having at least one object blank (3) and held by an object carrier (2), the object blank (3) being markable by a marking apparatus (7). To configure the marking objects such that the known drawbacks are eliminated, the object carrier (2) has at least one identification means (4a, 4b, 4c, 4d) that contains at least one piece of information relating to the marking object (1) and/or the identification means (4a, 4b, 4c, 4d) can be used to store at least one piece of information relating to the marking object (1).

Abstract: According to an aspect of an exemplary embodiment, there is provided a method of obtaining graphene, the method comprising: preparing a graphene forming structure of which a first graphene is formed on one surface and a second graphene is formed on another surface, and that comprises at least one metal catalyst member; disposing a first carrier and a second carrier on the first graphene and the second graphene, respectively; and removing the metal catalyst member by applying an etchant to a side surface of the graphene forming structure while winding up the first carrier and the second carrier by respectively rotating a pair of rolls formed to face each other.

Abstract: Provided are an electronic component carrier tape feeding device and an electronic component carrier tape feeding method. The electronic component carrier tape feeding device includes: a carrier tape guiding unit configured to guide a carrier tape to which a cover tape is attached; and a transfer unit configured to transfer the carrier tape. The carrier tape guiding unit includes: a guiding unit t configured to guide the carrier tape; and a cover unit surrounding a top surface of the carrier tape and comprising a protrusion portion protruding toward the cover tape.

Abstract: A film peeling apparatus includes: a pair of rollers configured to peel films from a target object having the films adhered on surfaces thereof; a transporter configured to transport the target object toward the rollers; a sensor configured to obtain peeling target information; a calculator configured to calculate roller distance information or peeling condition information based on the peeling target information; and a controller configured to control a movement of the pair of rollers based on the roller distance information or the peeling condition information.

Abstract: A peeling device according to the present disclosure includes a holding unit, a plurality of suction moving units, a state detection unit and a control unit. The holding unit is configured to hold a first substrate of a superposed substrate having the first substrate and a second substrate joined. The suction moving units are configured to suction-hold the second substrate of the superposed substrate and move the second substrate in a direction away from a surface of the first substrate. The state detection unit is configured to detect a peeled-off state of the second substrate from the first substrate. The control unit is configured to control operation timings of the suction moving units so that the second substrate is peeled off from the first substrate gradually from one end of the second substrate toward the other end thereof, based on the peeled-off state detected by the state detection unit.

Abstract: There is provided a substrate warpage removal apparatus and method which can remove warpage of a substrate which has a patterned surface having a film with a pattern, and a non-patterned surface having a film without a pattern. The substrate warpage removal apparatus includes: a holding plate configured to hold a substrate; a processing liquid supply pipe, provided on the side of the non-patterned surface of the substrate, configured to supply an etching liquid to the surface to remove a surface film; and a first laser displacement meter and a second laser displacement meter configured to detect warpage of the substrate. When the controller, based on signals from the first laser displacement meter and the second laser displacement meter, determines that warpage of the substrate has been eliminated, the controller stops the supply of an etching liquid from the processing liquid supply pipe.

Abstract: A first holding table suction-holds an annular projection of a wafer remaining on a rear face thereof for surrounding a back grinding region. A second holding table having an outer peripheral wall adjacent to an inner wall of the annular projection is inserted into a flat portion inside the annular projection for joining a separating adhesive tape to a protective tape on a surface of the wafer while a flat plane of the flat portion is suction-held. Thereafter, the adhesive tape is separated. Accordingly, the adhesive tape is separated from the surface of the wafer together with the protective tape.

Abstract: A peeling apparatus for peeling labels in rows from a tape-shaped release paper comprises a main body, a peeling mechanism, a driving mechanism and a sensing mechanism. The peeling mechanism locates the release paper and peels the labels in a row from the release paper when being rotating. The sensing mechanism located upon the peeling mechanism and parallel with the peeling mechanism. The labels in a row are orderly arranged from a first position to a second position on the release paper. The sensing mechanism comprises at least two detectors which are perpendicular to the peeling mechanism. When the peeled labels facing the sensing mechanism, either of the at least two detectors detects the peeled labels at the first position or the second position to generate a pause signal. The driving mechanism stops driving the peeling mechanism rotating in response to the pause signal.

Abstract: A feeder capable of transferring and separating an adhesive component from a tap, includes a frame, a driven capstan device, a separating device, and a drive device. The driven capstan device is mounted to the frame. The separating device is mounted to the frame to separate the adhesive component from the tap. The drive device drives the tap to unwind from the driven capstan and transfer to the separating device to enable the separating device to separate the adhesive component.

Abstract: Fiberglass batts are installed between the side-by-side studs in the interior walls of a home or building to insulate the walls and minimize sound transfer. Each fiberglass batt has a paper backing that projects from the side edges of the batt to provide for attachment to the spaced, side-by-side wall studs that comprise the internal frame to which the walls are secured. However, a significant percentage of the backing is produced with a noncompliant, reduced width and thus those batts are discarded. In the present invention a stripper mechanism between an input conveyor that receives the inferior batts and an output conveyor strips the backing therefrom so that the fiberglass may be used in other applications.

Abstract: There is provided a substrate warpage removal apparatus and method which can remove warpage of a substrate which has a patterned surface having a film with a pattern, and a non-patterned surface having a film without a pattern. The substrate warpage removal apparatus includes: a holding plate configured to hold a substrate; a processing liquid supply pipe, provided on the side of the non-patterned surface of the substrate, configured to supply an etching liquid to the surface to remove a surface film; and a first laser displacement meter and a second laser displacement meter configured to detect warpage of the substrate. When the controller, based on signals from the first laser displacement meter and the second laser displacement meter, determines that warpage of the substrate has been eliminated, the controller stops the supply of an etching liquid from the processing liquid supply pipe.

Abstract: Device for separating a substrate from a carrier substrate which is connected to the substrate by an interconnect layer. The device includes a carrier substrate holder with a holding surface for holding the carrier substrate, and a substrate holder which is located opposite the carrier substrate holder with a substrate holding surface which can be located parallel to the holding surface for accommodating the substrate. There are separating means for parallel displacement of the substrate relative to the carrier substrate in the interconnected state of the substrate and carrier substrate.

Abstract: Apparatus and a method for operating the apparatus to remove at least one chip-type semiconductor component from an adhesive film. The method comprises: arranging a lifting device with respect to the film, wherein a contact region of the lifting device bears against a second main surface of the film, opposite a chip-type semiconductor component that is arranged on a first main surface and is to be lifted off. Then, applying either a constant vacuum to a plurality of suction cutouts of the lifting device, by means of an assigned vacuum regulating device, or applying different values of the vacuum for different suction cutouts or groups of suction cutouts. Next, partially deforming the film in the contact region by using lifting means arranged in assigned cutouts of the lifting device to lift the film. Finally, using a removal device to remove the at least one semiconductor component from the film.

Abstract: The present invention relates to a striping apparatus and a striping method. The apparatus for stripping a film from a product comprising a transfer device for transferring the product; a film stripping device disposed above a stripping operation area of the transfer device for stripping the film from the product; and a plurality of guiding devices disposed on both sides of the transfer device in the stripping operation area for guiding the transfer direction of the product.

Abstract: Objects are to reduce the number of steps in a process for separating a substrate and a semiconductor element, to provide a separation apparatus capable of reducing the number of steps, to suppress manufacturing cost by reducing the number of steps in a separation process, and to improve productivity in manufacturing semiconductor elements. A separation apparatus including a frame body, a porous body having a chamfered, rounded corner portion, a suction unit configured to create suction in the porous body and the frame body, and a jig which includes a unit adopted to press down part of an object to be separated and a unit adopted to lift another part of the object to be separated, and also a separation method and a method for manufacturing a semiconductor element by using the separation apparatus, are provided.

Abstract: An exemplary film-removing device for removing a protecting film from a workpiece includes a main body and a film-removing mechanism. The film-removing mechanism includes a suspending arm and a roller. The suspending arm has a first end rotatably connected to the main body. The roller is rotatably connected to a second end, opposite to the first end, of the suspending arm. The roller is driven to rotate by movement of the workpiece.

Abstract: A surface height of a protective tape joined to a wafer mounted and held on a separation table is detected, a lowering operation distance of a needle is calculated based on such detected information, and a lowering operation amount for approaching a joining member to the protective tape until the separation tape winded around the joining member contacts the protective tape is calculated. A separating site is formed in the protective tape and the protective tape is separated while controlling a height of each member based on the calculated lowering operation amount.

Abstract: A sheet peeling apparatus 10 includes: a supporting means 11 for supporting a semiconductor wafer W stuck with an adhesive sheet S; a tape sticking means 14 for sticking a peeling tape T to the adhesive sheet S; a pulling means 13 for pulling the peeling tape T; a peeling assisting means 15 including an endless member 45 which is positioned on the adhesive sheet S, and wound on a guide member 41; and a sandwiching means 16 for sandwiching the adhesive sheet S between the endless member 45 and the sandwiching means 16. In the sheet peeling apparatus 10, the adhesive sheet S is peeled off due to the relative movement of the pulling means 13 and the supporting means 11 in a state that the adhesive sheet S is sandwiched between the peeling assisting means 15 and the sandwiching means 16.

Abstract: The watch case of this invention includes a caseband-back of plastic material, a metallic bezel and a packing to assure impermeability between the caseband-back and the bezel. A first annular seat extending radially into the bezel receives an annular protuberance integrally formed with the caseband in a manner such that the caseband-back and bezel become inseparable. At the same time a packing is compressed into a second seat to render impermeable the discontinuity between the caseband-back and the bezel. Assembly of the caseband-back to the bezel is effected by ultrasonic vibrations.