Abstract: An insulating substrate has a sample holding surface. A support is bonded to the insulating substrate. A first through-hole in the insulating substrate and a second through-hole in the support are continuous with each other to serve as a gas inlet. A porous member is located in the second through-hole. The second through-hole has, at its opening adjacent to the insulating substrate (opening adjacent to the substrate), a larger diameter than the first through-hole. The opening of the second through-hole and an electrostatic attraction electrode are at different positions in a direction parallel to the sample holding surface. The electrostatic attraction electrode and the second through-hole avoid overlapping each other as viewed from above.

Abstract: A component feeding device includes a cover tape lifting portion that carries out a lifting process of lifting a cover tape of a component storage tape, which travels along first guide surface portions, and a cover tape post-processing portion that carries out post-processing. The first guide surface portions are formed into curved shapes. The cover tape lifting portion includes a lifting extent adjusting portion that continuously increases an extent of lifting of the cover tape off a carrier tape. The cover tape post-processing portion includes an upper regulating portion that pushes the cover tape having been subjected to the lifting process outward in a tape width direction. The gap between the first guide surface portions and the upper regulating portion is determined such that the gap becomes narrower as the gap extends from the upstream side to the downstream side in the tape send-off direction.

Abstract: A workpiece-separating device includes a holding member configured to detachably hold one of a workpiece or a supporting body of a laminated body and a light irradiation part configured to perform light irradiation on a separating layer, the holding member including: a stage facing one of the workpiece or the supporting body, a fixed supporting part projecting from the stage toward the laminated body and including a still suction pad immovable in a projection direction, and a movable supporting part projecting from the stage toward the laminated body and including a response suction pad that is movable in a projection direction and elastically deformable, a plurality of the fixed supporting parts and a plurality of the movable supporting parts disposed in a dispersed manner, and the plurality of response suction pads project toward the laminated body further than the plurality of still suction pads.

Abstract: A component supply device supplies components stored in a component storage tape to a component extracting position. The component supply device includes a component exposing unit that performs an exposing process for exposing the components in the component storage tape fed by a tape feeding unit, the component storage tape traveling on a travel path formed from a tape travel path forming unit. The component supply device further includes a cover member that covers at least a part of each component storage part of the component storage tape after the exposing process by the component exposing unit.

Abstract: A tape feeder includes a magnet that rotates as one with a sprocket driven by a motor, two magnetic field detecting elements that detect signals in accordance with a magnetic field from the magnet and that are arranged at positions opposite the rotation region of the magnet, and a rotation angle detecting circuit that detects the rotation angle of the magnet and the rotation angle of the sprocket by processing output signals of the magnetic field detecting elements. A control section of the tape feeder reads the detection information of the rotation angle detecting circuit from immediately after the motor is started, recognizes the rotation angle of the sprocket, detects the position of tooth of the sprocket of the tooth engaged with a feeding hole of component supply tape based on the recognition results of the rotation angle of the sprocket for each pitch feeding operation of the sprocket, and corrects the pitch feeding amount of the motor by a pitch error correcting amount set for the tooth.

Abstract: Multiple tape feeders are installed in one row on a feeder setting base of a component mounting apparatus. The tape feeder is a variable tape feeder that is displaceable in a tape width direction to a predetermined displacement amount with respect to a feeder main body in which a reel holder has a wider width than the feeder main body. A mounting management device is a device that performs management of the component mounting apparatus, and sets an installation position considering an amount of displacement of the tape feeder such that the adjacent tape feeders do not interfere with each other.

Abstract: A one-directional clutch that only allows rotation in the forward direction, that is the cover tape pulling direction, is provided between, of two cover tape pulling gears, the lower side cover tape pulling gear and shaft thereof, such that reverse rotation of cover tape pulling gears is prevented by the one-directional clutch. For the engaging portion of the one-directional clutch and cover tape pulling gear, the friction of the engaging portion of the one-directional clutch and the cover tape pulling gear is adjusted such that the cover tape pulling gear slip rotates in the reverse direction when a specified rotational force or greater in the reverse direction that is greater than the force required to peel the cover tape is applied to the cover tape pulling gear.

Abstract: A vacuum chuck includes: a vacuum chuck stage having a circular vacuum surface; a vacuum protection pad provided to the vacuum surface; an annular or arc-shaped concave portion dividing the vacuum surface into a central region located closer to a center of the vacuum surface and an outer circumferential region located on an outer circumferential side; and radially-extending concave portions formed in the central region. The vacuum protection pad has through holes in communication with the radially-extending concave portions, and the vacuum protection pad is bonded to the vacuum surface at the central region excluding the radially-extending concave portions.

Abstract: An equipment system for bond-packaging an LED using an organic silicone resin photoconverter by tandem rolling includes a protective film removing apparatus used for removing a protective film on one side of a photoconversion sheet with protective films on both sides and a roll-bonding apparatus for packaging a flip chip LED array by using the photoconversion sheet containing a protective film on a single side, to form LED package elements. The protective film removing apparatus includes a photoconversion sheet freezing part (2-1, 2-2), a traction part for pulling and removing a protective film on a single side of the frozen photoconversion sheet, and a photoconversion sheet rewarming part (4-1, 4-2) that are sequentially connected and disposed. The roll-bonding apparatus includes two single-wheeled rollers (5-1, 5-2) whose rolling surfaces are both smooth surfaces.

Abstract: A system for disassembling a display device includes a supporting part facing a window and supporting at least a portion of the window. A window fixing part is disposed on the supporting part and is configured to fix a position of the window with respect to the supporting part. A display panel stopper is positioned above the supporting part and is spaced apart from the supporting part by a predetermined distance. A window pressurizing part is configured to apply pressure to the second region of the window along a first orthogonal to an upper surface of the supporting part. A separating stick is movable along a second direction which intersects the first direction. The separating stick is configured to be inserted between the window and a display panel adhered to the window.

Abstract: Compositions and designs are described for a sectional porous carrier used in processing microelectronics where thin device substrates are affixed by adhesive to the carrier and form an impervious bonded stack that is resistant to thermal and chemical products during processing and is easily handled by a substrate handling vacuum robot, and subsequently allows rapid removal (debonding) in batch operations by directional penetration into sectional porous regions by selective liquids which release the carrier from the device wafer without harm. The invention carrier with porous regions is used for temporary support of thin and fragile device substrates having capabilities of selective penetration of chemical liquids to pass through the porous regions, access and breakdown the bonding adhesive, and allow it to release without damage to the device substrate.

Abstract: This disclosure relates to manufactured articles containing ethylene interpolymers. Specifically, films, containers and lids comprising at least one layer of an ethylene interpolymer product, or a blend containing an ethylene interpolymer product, where the ethylene interpolymer product has: a Dilution Index (Yd) greater than 0; total catalytic metal ?3.0 ppm; ?0.03 terminal vinyl unsaturations per 100 carbon atoms, and; optionally a Dimensionless Modulus (Xd) greater than 0. The ethylene interpolymer products have a melt index from about 0.4 to about 100 dg/minute, a density from about 0.950 to about 0.970 g/cm3, a polydispersity (Mw/Mn) from about 2 to about 25 and a CDBI50 from about 55% to about 97%. Further, the ethylene interpolymer products are a blend of at least two ethylene interpolymers; where one ethylene interpolymer is produced with a single-site catalyst formulation and at least one ethylene interpolymer is produced with a heterogeneous catalyst formulation.

Abstract: A film peeling device preventing deformation or other defect of substrates occurring in the process of conveying films adhered up to the substrate leading ends while peeling from the substrate, protecting the substrate from damage, and avoiding deterioration of the substrate quality. The constitution is composed of a substrate holding mechanism for holding the leading end of a substrate by linear contact, an adhering and peeling mechanism for peeling films by an adhesive force from the substrate held by the substrate holding mechanism, a film holding tool for gripping individually the leading ends of the films adhered to the substrate both sides being wound and lifted by the adhering and peeling mechanism, a film conveying unit drive mechanism for conveying the film holding tool gripping the films in the substrate opposite direction conveying direction, and a recovery container accommodating the films being gripped and conveyed by the film holding tool.

Abstract: A peeling device for peeling off a substrate to be processed and a support substrate from an overlapped substrate, the overlapped substrate being formed by bonding the substrate to be processed and the support substrate by an adhesive, which includes: a first holding unit configured to heat the substrate to be processed and configured to hold the substrate to be processed; a second holding unit configured to heat the support substrate and configured to hold the support substrate; a moving mechanism configured to horizontally move at least one of the first holding unit and the second holding unit relative to each other; and an inert gas supply mechanism configured to supply an inert gas onto a bonding surface of the substrate to be processed or a bonding surface of the support substrate.

Abstract: A method for extracting electronic components comprising the steps of heating an electronic device having one or more electronic components by delivering heat energy to the electronic device directly to a first side surface or a second side surface of the electronic device and disturbing the electronic device to separate the one or more electronic components from the electronic device.

Abstract: A film peeling apparatus that peels off a film from a peeling object having the film and a substrate, the film peeling apparatus including a base; a conveying unit to hold a first side of the peeling object and to turn the peeling object from a parallel orientation with respect to the base to a perpendicular orientation with respect to the base; a first peeling unit to receive the peeling object from the conveying unit and to hold a second side of the peeling object in the perpendicular orientation; a second peeling unit to hold the first side of the peeling object, the second peeling unit facing the first peeling unit; and a knife unit that is reciprocably movable toward and away from an edge of the peeling object and movable along an edge of the peeling object.

Abstract: Embodiments using immersion de-taping are described. A substrate having a substrate tape attached thereto is provided. The substrate includes electrically conductive connectors attached to the substrate tape. A fluid is provided between the substrate and the substrate tape. While the fluid is between the substrate and the substrate tape, the substrate tape is removed from the substrate. Another embodiment is an apparatus comprising an immersion tank, a substrate chuck, first and second fixed rollers, and a moveable roller. The substrate chuck is configured to secure a substrate and to place the substrate into the immersion tank. The first fixed roller is operable to dispense a clamp tape. The second fixed roller is operable to roll the clamp tape. The moveable roller is operable to extend into the immersion tank and to adhere the clamp tape to a substrate tape on the substrate.

Abstract: A separation device includes a mount table, projecting portion, and drawing port. The mount table includes a mount surface on which a pressure sensitive adhesive sheet, on which an electronic component is stuck, is mounted. The electronic component is stuck on one surface of the pressure sensitive adhesive sheet, and the mount surface is in contact with the other surface of the pressure sensitive adhesive sheet. The projecting portion is formed on the mount surface and projects toward the pressure sensitive adhesive sheet mounted on the mount surface. The drawing port is open near the projecting portion on the mount surface, and when a negative pressure is applied, draws the pressure sensitive adhesive sheet.

Abstract: A method for filling a carrier tape (10) with electronic components (12) and for removing and replacing defective electronic components (13) from the carrier tape, comprising the steps of: at a filling station (1), loading an electronic component in a pocket (11) of the carrier tape (10), moving said carrier tape (10) forward, automatically detecting that said electronic component which is defective, moving said carrier tape backward, and unloading the defective electronic component (13) from the carrier tape (10), at said filling station (1), filling said packet with a new electronic component.

Abstract: The present invention is used for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive into the processing target substrate and the supporting substrate, and includes: a separation processing station performing predetermined processing on the processing target substrate, the supporting substrate, and the superposed substrate; a transfer-in/out station transferring the substrates into/from the separation processing station; and a transfer unit transferring the substrates between the separation processing station and the transfer-in/out station, wherein the separation processing station includes: a separation unit separating the superposed substrate into the processing target substrate and the supporting substrate; a first cleaning unit cleaning the processing target substrate separated in the separation unit; and a second cleaning unit cleaning the supporting substrate separated in the separation unit.

Abstract: A method for removing impurities from shredded plastic uses a device having a first and second cleaning disc with a first and second cleaning surface respectively. The cleaning surfaces lie opposite each other and border a cleaning gap between each other. The cleaning discs are rotated and liquid is fed into the cleaning gap. Shredded plastic is fed between the cleaning discs and conveyed through the cleaning gap, and the shredded plastic is processed abrasively by the cleaning surfaces. The temperature difference of the liquid guided through the cleaning gap during entry into the cleaning gap and the temperature of the liquid as it exits the cleaning gap and/or at least one parameter characterizing this temperature difference is measured. The distance between the cleaning surfaces is set such that the measured temperature difference and/or the at least one parameter characterizing this temperature difference achieve a setpoint value.

Abstract: Apparatus and methods for mechanically cleaving a bonded wafer structure are disclosed. The apparatus and methods involve clamps that grip the bonded wafer structure and are actuated to cause the bonded structure to cleave.

Abstract: The invention relates to a method for pre-cleaning parts made of plastic as part of a recycling process, wherein foreign bodies to be removed adhere to the parts, in particular for removing foreign bodies on parts made of plastic, preferably for removing labels, dirt, etc. on used plastic bottles, said method being characterized in that the foreign bodies are removed from the parts by mechanically loading the parts. A device for applying the method is characterized by a housing (2) having a chamber for accommodating the parts, means (3, 4, 11) for mechanically acting upon the parts and means for separating the foreign bodies released from the parts and for discharging the foreign bodies and parts onto separate paths being provided in the chamber.

Abstract: Disclosed is a peeling system which includes a peeling device, a plurality of first cleaning devices, an inversion device, a second cleaning device, and first to third conveyance devices. The peeling device is configured to separate a superimposed substrate into a first substrate and a second substrate. The plurality of first cleaning devices is configured to clean a bonded surface of the first substrate. The inversion device configured to invert front and rear surfaces of the first substrate. The second cleaning device is configured to clean a non-bonded surface of the first substrate. Delivery positions of the first substrate in the plurality of first cleaning devices are arranged in a region where an operation range of the first conveyance device and an operation range of the second conveyance device overlap each other.

Abstract: Methods and apparatuses for releasably attaching support members to microfeature workpieces to support members are disclosed herein. In one embodiment, for example, a method for processing a microfeature workpiece including a plurality of microelectronic dies comprises forming discrete blocks of material at a first side of a support member. The blocks are arranged on the support member in a predetermined pattern. The method also includes depositing an adhesive material into gaps between the individual blocks of material and placing a first side of the workpiece in contact with the adhesive material and/or the blocks. The method further includes cutting through a second side of the workpiece to singulate the dies and to expose at least a portion of the adhesive material in the gaps. The method then includes removing at least approximately all the adhesive material from the support member and/or the workpiece with a solvent.

Abstract: A delamination system delaminates a laminated substrate, in which a first substrate and a second substrate are bonded together, into the first substrate and the second substrate. The delamination system has a first processing block processing the laminated substrate or the delaminated first substrate and a second processing block processing the delaminated second substrate. The first processing block has a delamination station having a delamination device that delaminates the laminated substrate transferred by a first transfer device into the first substrate and the second substrate. The second processing block has a second cleaning station and a delivery station. The second cleaning station has a second cleaning device cleaning the delaminated second substrate. The delivery station is disposed between the second cleaning station and the delamination station. The delivery station receives the delaminated second substrate from the delamination station and delivers it to the second cleaning station.

Abstract: According to an embodiment of the present disclosure, a substrate inverting device for inverting front and rear surfaces of a substrate is provided. The substrate includes a first holding unit configured to hold one surface of the substrate and a second holding unit disposed to face the first holding unit and configured to hold one surface of the substrate. Further, the substrate includes a moving mechanism configured to relatively move at least one of the first holding unit and the second holding unit to approach each other and stay spaced apart from each other, and a transfer mechanism configured to hold the one surface of the substrate. In this case, a support of the substrate in the first holding unit, the second holding unit and the transfer mechanism is performed by a Bernoulli chuck.

Abstract: Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.

Abstract: A wafer debonding and cleaning apparatus comprises a wafer debonding module configured to separate a semiconductor wafer from a carrier wafer. The wafer debonding and cleaning apparatus also comprises a first wafer cleaning module configured perform a first cleaning process to clean a surface of the semiconductor wafer. The wafer debonding and cleaning apparatus further comprises an automatic wafer handling module configured to transfer the semiconductor wafer from one of the wafer debonding module or the first wafer cleaning module to the other of the wafer debonding module or the first wafer cleaning module. The semiconductor wafer has a thickness ranging from about 0.20 ?m to about 3 mm.

Abstract: A container or array of containers that is are sealed with a peelable seal is transported via a conveyor along a processing path toward a desealing station at which an adhesive surface having a width substantially the same as or greater than the width of the seal is pressed against the upper surface of the peelable seal. A collection rod applies a downward pressure on the adhesive surface, pressing it against the seal and keeping the container or container array in position on the conveyor as the plate moves with the conveyor. As the leading edge of the seal passes the collection rod, the adhesive surface is rolled upward, away from the plane of the seal, pulling up on the leading edge of the seal to separate it from the container or container array while the container or container array is held down by the roller. The removed seal is then discarded.

Abstract: A device for releasing an interconnect layer that provides a connection between a carrier and a wafer which forms a carrier-wafer combination. The device includes rotation means for rotation of the carrier-wafer combination in a release position, and a connection release means for providing an immersion bath that receives the carrier-wafer combination.

Abstract: Provided are a substrate separation apparatus and method. The substrate separation apparatus includes: an upper transfer part which fixes the upper substrate and transfers the upper substrate in a positive X-axis direction in an XY coordinate system composed of an X axis and a Y axis intersecting each other; and a lower transfer part which is installed under the upper transfer part with a gap therebetween and fixes and transfers the lower substrate, wherein the lower transfer part includes: a lower holding unit on which the lower substrate is placed; and a lower guide unit which includes path guides for guiding movement of the lower holding unit, wherein the path guides include a first path guide which is parallel to the X axis and a second path guide which is continuous with the first path guide and contacts a straight line having a negative slope in the XY coordinate system.

Abstract: A peeling device separates a superposed substrate, in which a target substrate and a support substrate are joined to each other with an adhesive, into the target substrate and the support substrate. The peeling device includes a holding unit configured to hold the superposed substrate, and a plurality of position adjustment units movable forward and backward with respect to a side surface of the superposed substrate held in the holding unit, and the position adjustment unit configured to perform a position adjustment of the superposed substrate by contacting the side surface of the superposed substrate.

Abstract: Provided is a cut tape/leaderless feeder finger for use in tape feeders for component mounters. The cut tape/leaderless feeder finger can be attached to existing component tape feeders to allow feeding of component tape without a leader. The cut tape/leaderless feeder finger includes a stripping mechanism that folds and creases the top cover of component carrier tape to expose the component in the tape. The cover tape stays attached to the carrier tape and is folder and creased out of the way of the feeder mechanism and the chip mounter. The component tape passes between guides that retain the component in the tape until it is picked by the component mounter.

Abstract: A measuring device for measuring adhesive strength of two-sided adhesive pieces includes a frame, a supporting apparatus fixed to the frame, and a positioning apparatus installed on the supporting apparatus. The frame includes a pull member slidably installed on the frame along a first direction. The supporting apparatus includes a base secured on the frame, and a supporting assembly slidably installed on the base along a second direction perpendicular to the first direction. The positioning apparatus includes a supporting plate slidably installed on the supporting assembly along a third direction perpendicular to the first and second directions, and a number of pulling blocks. Each adhesive piece is adhered between the supporting plate and a corresponding pulling block. Each pulling block is connected to the pull member to be pulled up to disengage from the supporting plate, thereby measuring the adhesive strength of the adhesive piece.

Abstract: A wafer transfer assembly and method of using the assembly to transfer device wafers between processing tools in a manufacturing process are described herein. The assembly comprises a wafer transfer disk, an end effector configured to receive and support the wafer transfer disk, and an elongated handle extending from the end effector. The wafer transfer disk comprises a wafer-engaging surface configured to support a debonded device wafer placed on the wafer transfer assembly with the device surface adjacent the wafer-engaging surface. The wafer-engaging surface has non-stick properties, and yields a low bonding strength interface between the wafer-engaging surface and device surface. The resulting transfer stack can be transported to other processing tools for additional processing of the debonded device wafer, followed by separating the debonded device wafer and the wafer transfer disk without damaging the device wafer.

Abstract: Provides a method and a terminus processing tool whereby terminus processing for the purpose of connection to another optical fiber may be carried out simply. The terminus processing method entails cutting an optical fiber 20 composed of a glass fiber 21 and a coating 24; and with the optical fiber 20 positioned relative to a terminus processing tool that is disposed contacting the coating at the end surface of the optical fiber 20 and that has a protruded-into space for accommodating inward protrusion of the glass fiber 21, and with the cut end surface of the glass fiber 21 facing the protruded-into space, pushing the optical fiber 20 to thereby strip the coating 24 from the glass fiber 21.

Abstract: A pick-and-place machine and method includes use of a passive component feeder cartridge including a feeder gear. Rotation of the feeder gear causes a component-bearing tape to be fed through the feeder cartridge. A pickup head includes a vacuum nozzle to pick up the components from the tape and a rack gear to engage and drive the feeder gear of the feeder cartridge via translational motion of the pickup head when operatively disposed with respect to a selected feeder cartridge.

Abstract: A system includes a first drive unit used for driving at least one of a release device, a gripper device, and a second drive unit used for driving a support device. The release device is a vacuum device. The vacuum device is coupled to a vacuum source and applies a suction force against an edge portion of one layer among a first layer disposed on a second layer. Another layer among the first layer and the second layer is held by a support surface of the support device. The vacuum device and/or the support device are movable upwards and downwards for peeling the edge portion of the one layer from the other layer. The gripper device holds the peeled edge portion of the one layer and the support device or the gripper device is movable along at least one axis for removing the one layer from the other layer.

Abstract: A die ejector includes a supporting unit configured to support a bottom surface of a film on which a die may be attached. The supporting unit may have a hole formed at a center thereof. The die ejector may further include a ring-shaped elevating unit in the hole and configured to move along a vertical direction, a driving unit connected to the elevating unit and configured to move the elevating unit along the vertical direction, and a pressure controlling unit connected to the hole and configured to control a pressure of the hole.

Abstract: A system and method for removing steel beads from large diameter tires by lifting a tire into a position adjacent an extraction hook and a pair of stripping dyes. The hook is positioned adjacent the tire bead and is then withdrawn through a narrow opening in the stripping dyes, which removes the bead from the tire. The machine is capable of removing both rubber-encased inner beads from the tire without repositioning the tire within the system. A plurality of lifting platforms position the tire and the stripping mechanisms with respect to one another throughout the extraction process.

Abstract: Label application devices and methods of printing and applying labels are described herein. One label application device can comprise a feed component configured to deliver a sheet of label material to a position, a product identification component configured to identify a type of a product that is approaching the position, a printing component configured to print data onto the sheet of label material, the data based on the identified type of product, a stripping component configured to remove a liner portion of the sheet of label material from a label portion of the sheet, and an applicator component configured to apply the label portion to the product.

Abstract: Provided is a peeling apparatus includes a first holding unit, a second holding unit, and a peeling inducing unit. The first holding unit holds a first substrate of a superimposed substrate in which the first substrate and a second substrate are bonded. The second holding unit holds the second substrate of the superimposed substrate and moves the second substrate in a direction of separating the second substrate from a surface of the first substrate. The peeling inducing unit forms an area where the second substrate starts to be peeled off from the first substrate on a side surface of the superimposed substrate. The second holding unit includes a first suction and moving unit and a second suction and moving unit. The first suction moving unit sucks and moves a circumferential edge portion of the second corresponding to the area formed by the peeling inducing unit, in a direction of separating the circumferential edge portion from the surface of the first substrate.

Abstract: A carrier substrate removing apparatus configured to separate a flexible substrate bonded to a carrier substrate includes a carrier substrate holding unit configured to hold the carrier substrate separated from the flexible substrate; an inclined separation unit configured, with the carrier substrate holding unit, to separate the flexible substrate from the carrier substrate and to transport the flexible substrate at an angle; and a transmittance measuring unit configured to measure a transmittance of the separated carrier substrate.

Abstract: A collaborative robotized system comprises: a mobile platform furnished with running device, with an electric motor propulsion assembly, and with a longitudinal mechanical linkage assembly comprising an articulation; an electrical power source; manual control device of the system; remote control device of the system; a computer assembly of at least one computer; hardware-incorporating device suitable for integrating sensors and effectors, and software-incorporating device suitable for integrating software elements; and management device for managing integrated sensorimotor behaviors, suitable for arbitrating implementations of several sensorimotor behaviors in parallel.

Abstract: A film peeling device for peeling a film from a substrate including a transfer module configured to transfer the substrate that is arranged in a vertical direction with respect to a bottom surface of the substrate, and a peeling module configured to peel the film from the substrate transferred by the transfer module.

Abstract: Provided is a delamination device of delaminating a laminated substrate obtained by bonding a first substrate and a second substrate, the laminated substrate being disposed in an opening of a frame, the opening having a diameter larger than that of the laminated substrate, and the laminated substrate being held by the frame with a non-bonding surface of the first substrate attached to a tape provided in the opening. The delamination device includes: a first holding unit configured to hold the second substrate of the laminated substrate from above; a second holding unit configured to hold the first substrate of the laminated substrate from below through the tape; and a moving mechanism configured to move the first holding unit in a direction away from the second holding unit.

Abstract: A delamination system delaminates a laminated substrate, in which a first substrate and a second substrate are bonded together, into the first substrate and the second substrate. The delamination system has a first processing block processing the laminated substrate or the delaminated first substrate and a second processing block processing the delaminated second substrate. The first processing block has a delamination station having a delamination device that delaminates the laminated substrate transferred by a first transfer device into the first substrate and the second substrate. The second processing block has a second cleaning station and a delivery station. The second cleaning station has a second cleaning device cleaning the delaminated second substrate. The delivery station is disposed between the second cleaning station and the delamination station. The delivery station receives the delaminated second substrate from the delamination station and delivers it to the second cleaning station.

Abstract: A method and a device for recycling labeled plastic articles are described. Accordingly, the labels are detached from the plastic articles and the plastic articles treated in this way are sorted in particular automatically. During sorting, plastic articles from which the labels have not been properly detached are sorted out and again subjected to the treatment for detaching the labels.

Abstract: A position control method for controlling a position of a movable portion, includes: performing control of allowing the movable portion to approach a predetermined position by moving the movable portion; and performing control of moving the movable portion to the predetermined position by moving the movable portion and detecting a relative position of the movable portion with respect to the predetermined position by using an imaging unit.