Abstract: There is provided a component supply device for supplying a component to a component mounter, including: a transporter that transports a carrier tape in which the component is stored and of which an upper surface is sealed with a cover tape, along a transport path; a peeler that is disposed above the transport path and peels off the cover tape from the carrier tape; and an ejector that ejects a gas for capturing the cover tape by the peeler.

Abstract: A film separation apparatus and a film separation method are disclosed. The film separation apparatus includes a mechanical arm, a needle and a stopping member; the needle has one end connected to the mechanical arm and the other end including a needle tip; the stopping member includes a connecting rod and a stopper, the connecting rod has one end connected to the mechanical arm and the other end connected to the stopper, the needle tip is configured to be inserted into a film to be separated, the stopper and the needle tip are configured to move with respect to each other in an extension direction of the needle so as to separate the film to be separated from the needle tip.

Abstract: An apparatus for extracting a medical implant from bone includes: a housing; a coupler carried by the housing and configured to be mechanically connected to a medical implant; and a forcing mechanism carried by the housing and operable to apply a cyclic excitation force with a specified amplitude, frequency, and vector to the coupler. Methods are described for using the apparatus to remove and/or implant medical implants.

Abstract: Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.

Abstract: Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.

Abstract: Disks stuck together in a stack are separated by placing the disks on a shaft of a vibratory apparatus and vibrating the shaft to vibrate the disks by contact of the disks with the vibrating shaft to separate them and also constrain the disks with the shaft as the disks are vibrated.

Abstract: Improved semiconductor wafer debonding system, method, and apparatus, including a stress-free means for multi-axis debonding utilizing a specialized tool or fixture having at least one ultrasonic transducer.

Abstract: A method of separating an atomically thin material, such as graphene, from a substrate, such as copper, is disclosed. The method provides a composite sheet, such as a graphene-copper sheet, and then applies hypersonic waves to the composite sheet so as to break the bonds therebetween and separate a graphene sheet from the copper substrate. A system to implement the separation is also disclosed.

Abstract: A system includes a first drive unit used for driving at least one of a release device, a gripper device, and a second drive unit used for driving a support device. The release device is a vacuum device. The vacuum device is coupled to a vacuum source and applies a suction force against an edge portion of one layer among a first layer disposed on a second layer. Another layer among the first layer and the second layer is held by a support surface of the support device. The vacuum device and/or the support device are movable upwards and downwards for peeling the edge portion of the one layer from the other layer. The gripper device holds the peeled edge portion of the one layer and the support device or the gripper device is movable along at least one axis for removing the one layer from the other layer.

Abstract: Parts stuck together in a stack are separated by placing the parts in a vibratory apparatus and vibrating the stack of parts with a vibratory head of the vibratory apparatus to separate them and also constrain the parts with the vibratory head as the parts are vibrated.

Abstract: The systems and methods of the present disclosure relate to safely coupling and decoupling various solid objects with the use of pressure-sensitive adhesive. In particular, the disclosure relates to methods and systems for delivering vibrational energy to a pressure-sensitive coupled structure, sufficient to decrease coupling strength of the pressure-sensitive adhesive as well as to de couple or reposition the coupled objects.

Abstract: The present invention provides a method and machine for separating a liquid crystal panel and a liner pad. The method includes (1) providing a separation machine and a combination of the liquid crystal panel and liner pad to be separated, the separation machine including a separation device that includes a suction device, air blasting devices and shaking devices; (2) the suction device moving toward the combination; (3) a central suction nozzle first engaging and sucking a liner pad of the combination and later the first suction nozzles engaging the sucking the liner pad of the combination; (4) the shaking devices being operated to subject the combination to vibration and the air blasting devices being operated to eject air streams to side edges of the combination; and (5) the combination, after being subjected to vibration and air streams, being separated so as to realize separation of the liquid crystal panel and liner pad.

Abstract: Improved semiconductor wafer debonding system, method, and apparatus, including a stress-free means for multi-axis debonding utilizing a specialized tool or fixture having at least one ultrasonic transducer.

Abstract: The invention can firmly and easily remove a finely divided weft piece without leaving the weft piece by constituting a method and an apparatus of removing weft from a cord fabric for a topping sheet in a calender line for topping rubber on a number of pieces of aligned cords by a calender roll. In the midst of transferring a cord fabric transferred to a calender apparatus, weft is finely divided by passing the cord fabric through weft dividing means, thereafter, a plurality of blades arranged movably in a width direction on an upper face side of the cord fabric are reciprocally moved in the width direction over an entire width thereof to be brought into contact with the cord fabric, and the divided weft piece is wiped off to remove by respectively striking respective cords of the cord fabric by the respective blades.

Abstract: A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate.

Abstract: Parts stuck together in a stack are separated by placing the parts in a vibratory apparatus and vibrating the stack of parts with a vibratory head of the vibratory apparatus to separate them and also constrain the parts with the vibratory head as the parts are vibrated.

Abstract: Device for stripping a product substrate off a carrier substrate connected to the product substrate by an bonding layer by means of a film frame, a flexible film which is connected to the film frame and which has an adhesive layer for holding the product substrate in a contacting surface section of the film, the film being connected to the film frame in an attachment section of the film which surrounds the contacting surface section, as well as a solvent reservoir formed by the film frame and the film, especially of variable volume, for holding the solvent for detaching the bonding layer, and the product substrate and the bonding layer can be accommodated in the solvent reservoir, and by delivery means for delivering the solvent into the solvent reservoir and by stripping means for stripping the product substrate off the carrier substrate.

Abstract: A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes the step of supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate.

Abstract: The invention can firmly and easily remove a finely divided weft piece without leaving the weft piece by constituting a method and an apparatus of removing weft from a cord fabric for a topping sheet in a calender line for topping rubber on a number of pieces of aligned cords by a calender roll. In the midst of transferring a cord fabric (F) transferred to a calender apparatus, weft is finely divided by passing the cord fabric (F) through weft dividing means, thereafter, a plurality of blades (45) arranged movably in a width direction on an upper face side of the cord fabric (F) are reciprocally moved in the width direction over an entire width thereof to be brought into contact with the cord fabric (F), and the divided weft piece (W1) is wiped off to remove by respectively striking respective cords (C) of the cord fabric (F) by the respective blades (45).

Abstract: There are provided an interlayer film separation solution and an interlayer film separation method capable of separating an interlayer film and a glass for a short period of time and collecting the separated interlayer film in a recyclable condition. An interlayer film separation solution 21 having etching ability for a glass is introduced into a container 22, and the introduced interlayer film separation solution 21 was controlled to a temperature of 30 to 60° C., and a laminated glass 10 with glass plates 11, 12 crushed is introduced into a barrel 23 from a lid portion 23a, and simultaneously, 50 to 60 metal pieces 25 are, introduced into the barrel 23 from the lid portion 23a in order to easily separate the laminated glass 10 into the glass plates 11, 12 and an interlayer film 13. The barrel 23 containing the laminated glass 10 and the metal pieces 25 introduced thereinto is rotated at a predetermined rotational speed.

Abstract: A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes the step of supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate.

Abstract: A device is disclosed for use with a method for reworking a bonded display (e.g., a LCD) having a substrate (e.g., plate or film) adhesively bonded to a face (e.g., front face) of the LCD. Use of the device provides for efficient and clean removal of the substrate from the display when necessary (e.g., when defect(s) are present) without damage to the display such that the display can subsequently be re-bonded as a component in a device being manufactured.