Abstract: A thickness of material may be detached from a substrate along a cleave plane, utilizing a cleaving process controlled by a releasable constraint plate. In some embodiments this constraint plate may comprise a plate that can couple side forces (the “P-plate”) and a thin, softer compliant layer (the “S-layer”) situated between the P-plate and the substrate. In certain embodiments a porous surface within the releasable constraint plate and in contact to the substrate, allows the constraint plate to be secured to the substrate via a first pressure differential. Application of a combination of a second pressure differential within a pre-existing cleaved portion, and a linear force to a side of the releasable constraint plate bound to the substrate, generates loading that results in controlled cleaving along the cleave plane.

Abstract: A manufacturing apparatus for an organic light emitting diode (OLED) display includes a stage mounted with an organic light emitting display panel and a supporting substrate of the organic light emitting display panel, a porous sheet attachable to and detachable from a thin film encapsulation layer of the organic light emitting display panel, and a porous sheet attaching/detaching apparatus configured to be separable from the organic light emitting display panel and to attach and detach the porous sheet to and from the thin film encapsulation layer of the organic light emitting display panel. The porous sheet attaching/detaching apparatus is configured to remove an attaching/detaching gas from between the porous sheet and the thin film encapsulation layer to attach the porous sheet to the thin film encapsulation layer.

Abstract: A debonder apparatus for debonding a temporary bonded wafer pair. The clam shell reactor includes first and second isolated chambers. An upper chuck is contained within the first chamber and has a lower surface protruding into the second chamber. A lower chuck is contained within the second chamber and has an upper surface oriented parallel and opposite to the lower surface of the upper chuck. The debonder includes means for holding an unbounded surface of the first wafer onto the lower surface of the upper chuck. The first chamber pressurizing means applies pressure onto an upper surface of the upper chuck and thereby causes the lower surface of the upper chuck and the attached wafer pair to bow downward. The debonder apparatus also includes means for initiating a separation front at a point of the bonding interface of the temporary bonded wafer pair.

Abstract: Methods and apparatus provide for imparting a controlled supply of gas to at least one Bernoulli chuck to provide a balanced draw and repellant gas flow to a material sheet; and at least one of: elevating a temperature of the supply of gas to the at least one Bernoulli chuck such that the gas flow to the material sheet is provided at the elevated temperature, providing a stream of gas to an insulator substrate to promote separation of an exfoliation layer from a donor semiconductor wafer, and providing a stream of gas to a junction of the insulator substrate and any support structure to promote separation of the insulator substrate and the supporting structure.

Abstract: Methods and apparatus provide for imparting a controlled supply of gas to at least one Bernoulli chuck to provide a balanced draw and repellant gas flow to a material sheet; and at least one of: elevating a temperature of the supply of gas to the at least one Bernoulli chuck such that the gas flow to the material sheet is provided at the elevated temperature providing a stream of gas to an insulator substrate to promote separation of an exfoliation layer from a donor semiconductor wafer, and providing a stream of gas to a junction of the insulator substrate and any support structure to promote separation of the insulator substrate and the supporting structure.

Abstract: Systems and methods for the ultrasonic cleaving of bonded wafer pairs are described. The system includes a tank for containing a volume of liquid, a wafer boat having a recess formed therein for receiving the bonded wafer pair. The recess has a pair of opposing, spaced-apart sidewalls disposed at an angle from a vertical axis. An ultrasonic agitator is configured to ultrasonically agitate the volume of liquid. The ultrasonic agitation of the volume of liquid results in the cleaving of the bonded wafer pair.

Abstract: A composite laminar tape (1) for mass-sealing bottles (15) or similar containers consists, according to the invention, of at least one extensible laminar tape (16), made of an extensible plastomeric film, which is possibly provided with closed lines for a predetermined separation of areas being meant to act as sealing membranes. The invention also relates to an apparatus for mass-sealing containers with said tape, and to an apparatus for mass-unsealing the containers sealed with said tape.

Abstract: In a method for releasing a work having an adhesive tape from a holding member which sucks and holds the work having the adhesive tape, the work having the adhesive tape is released from the holding member while supplying a gas which reduces a holding force of the holding member between the holding member and the work having the adhesive tape.