Abstract: A method is provided for removing a polarizing sheet with a tool that includes a handle including a main body forming therein a channel for receiving adhesive dissolving liquid, a piston device mounted inside the channel, and a guide tube mounted on the main body, and a blade mounted to the handle. The guide tube has an end in communication with the channel and an opposite end positioned on the blade to guide the adhesive dissolving liquid from the channel to the blade. The polarizing sheet is removed by lifting up a portion of the polarizing sheet and placing the blade against bonding adhesive between the polarizing sheet and a substrate to which the polarizing sheet is attached to allow the adhesive dissolving liquid to be guided by the guide tube toward the blade for subsequently flowing toward and dissolving bonding adhesive.

Abstract: A polarizing sheet removing tool includes a handle and a blade mounted on the handle. The handle includes a main body, a piston device mounted on the main body, and a guide tube mounted on the main body. The main body forms therein a channel for containing an adhesive dissolving liquid. The piston device is mounted inside the channel. The guide tube has an end in communication with the channel and an opposite end positioned on the blade to guide the adhesive dissolving liquid contained in the channel to the blade. In removing a polarizing sheet, the adhesive dissolving liquid can be guided by the guide tube the blade for subsequently flowing toward and dissolving bonding adhesive.

Abstract: The present invention provides a polarizing sheet removing tool and removing method. The tool includes a handle and a blade mounted on the handle. The handle includes a main body, a piston device mounted on the main body, and a guide tube mounted on the main body. The main body forms therein a channel for containing an adhesive dissolving liquid. The piston device is mounted inside the channel. The guide tube has an end in communication with the channel and an opposite end positioned on the blade to guide the adhesive dissolving liquid contained in the channel to the blade. The present invention uses a tool on which a piston device and adhesive dissolving liquid are provided so that in removing a polarizing sheet, the adhesive dissolving liquid can be guided by a guide tube toward a blade for subsequently flowing toward and dissolving bonding adhesive.

Abstract: A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.

Abstract: A component supplying apparatus includes a main tape entering port, a component supply port through which components are picked up from a carrier tape, a main tape path extending in a body part from the main tape entering port to the underside of the component supply port, a top tape removing part removing the top tape from the carrier tape on the main tape path upstream of the component supply port, a sub tape entering port, a sub tape path meeting a slope path portion of the main tape path at a meeting point upstream of the top tape removing part, and at least one sprocket wheels engaging with the carrier tape on the main tape path downstream of the meeting point. A length of the sub tape path is shorter than a length of the main tape path from the main tape entering port to the meeting point.

Abstract: A film stripping mechanism, comprising: a base; a platform disposed on the base and having a substrate to be stripped of film placed thereon; a blade disposed above an upper surface of the platform and capable of contacting the substrate to be stripped of film placed on the platform, the platform and the blade being movable relative to each other so as to strip off a film on the substrate to be stripped of film; an automatic alcohol-spraying module contacting the blade for spraying outwards alcohol and allowing the alcohol to flow toward the substrate to be stripped of film along the blade. The film stripping mechanism can improve the yield rate of film stripping and the stripping efficiency, and reduce breakage rate of the substrates.

Abstract: Described methods and apparatus provide a controlled perturbation to an adhesive bond between a device wafer and a carrier wafer. The controlled perturbation, which can be mechanical, chemical, thermal, or radiative, facilitates the separation of the two wafers without damaging the device wafer. The controlled perturbation initiates a crack either within the adhesive joining the two wafers, at an interface within the adhesive layer (such as between a release layer and the adhesive), or at a wafer/adhesive interface. The crack can then be propagated using any of the foregoing methods, or combinations thereof, used to initiate the crack.

Abstract: A tool for harvesting polycrystalline silicon-coated rods from a chemical vapor deposition reactor includes a body including outer walls sized for enclosing the rods within the outer walls. Each outer wall includes a door for allowing access to at least one of the rods.

Abstract: A peeling device separates a superposed substrate, in which a target substrate and a support substrate are joined to each other with an adhesive, into the target substrate and the support substrate. The peeling device includes a holding unit configured to hold the superposed substrate, and a plurality of position adjustment units movable forward and backward with respect to a side surface of the superposed substrate held in the holding unit, and the position adjustment unit configured to perform a position adjustment of the superposed substrate by contacting the side surface of the superposed substrate.

Abstract: Provided is a cut tape/leaderless feeder finger for use in tape feeders for component mounters. The cut tape/leaderless feeder finger can be attached to existing component tape feeders to allow feeding of component tape without a leader. The cut tape/leaderless feeder finger includes a stripping mechanism that folds and creases the top cover of component carrier tape to expose the component in the tape. The cover tape stays attached to the carrier tape and is folder and creased out of the way of the feeder mechanism and the chip mounter. The component tape passes between guides that retain the component in the tape until it is picked by the component mounter.

Abstract: Provides a method and a terminus processing tool whereby terminus processing for the purpose of connection to another optical fiber may be carried out simply. The terminus processing method entails cutting an optical fiber 20 composed of a glass fiber 21 and a coating 24; and with the optical fiber 20 positioned relative to a terminus processing tool that is disposed contacting the coating at the end surface of the optical fiber 20 and that has a protruded-into space for accommodating inward protrusion of the glass fiber 21, and with the cut end surface of the glass fiber 21 facing the protruded-into space, pushing the optical fiber 20 to thereby strip the coating 24 from the glass fiber 21.

Abstract: A separating apparatus for separating a composite substrate into a first substrate and a second substrate previously bonded to each other. The separating apparatus includes a support base having a supporting surface for supporting the composite substrate, a pair of side surface supporting rollers for supporting the peripheral side surface of the composite substrate placed on the supporting surface, and a separating unit for applying a separating force to the boundary between the first substrate and the second substrate constituting the composite substrate supported to the supporting surface of the support base and the side surface supporting rollers, thereby separating the composite substrate into the first substrate and the second substrate.

Abstract: Provided is a peeling apparatus including a first holding unit, a second holding unit, and a peeling inducing unit. The first holding unit holds a first substrate of a superimposed substrate in which the first substrate and a second substrate are bonded. The second holding unit holds the second substrate of the superimposed substrate and moves the second substrate in a direction of separating the second substrate from a surface of the first substrate. The peeling inducing unit forms an area where the second substrate starts to be peeled off from the first substrate on a side surface of the superimposed substrate. The peeling inducing unit includes a sharp member, and a moving mechanism that moves the sharp member toward a side surface portion of the second substrate adjacent to a bonding portion of the first substrate and the second substrate in the side surface of the superimposed substrate.

Abstract: An adhesive substance removing tool is provided with a cracking tool and a scrapping assembly which are removably coupled to a base. The cracking tool is used to crack the adhesive substance by forming breaking lines on the surface of the adhesive substance, and then the scrapping assembly is used to scrape off the adhesive substance by starting from the breaking lines. The combination of the cracking tool and the scraping assembly allows the user to remove adhesive substance easily and completely. Besides, the cutting assembly of the cracking tool is able to move freely both in straight-line or circular fashion, and the cracking tool can be prevented from rotating or disengaging once it is positioned in place on the base. Hence, convenience and safety of use can both be assured.

Abstract: A film stripping mechanism, comprising: a base; a platform disposed on the base and having a substrate to be stripped of film placed thereon; a blade disposed above an upper surface of the platform and capable of contacting the substrate to be stripped of film placed on the platform, the platform and the blade being movable relative to each other so as to strip off a film on the substrate to be stripped of film; an automatic alcohol-spraying module contacting the blade for spraying outwards alcohol and allowing the alcohol to flow toward the substrate to be stripped of film along the blade. The film stripping mechanism can improve the yield rate of film stripping and the stripping efficiency, and reduce breakage rate of the substrates.

Abstract: A separating apparatus according to the present invention includes a clamp for gripping an outer peripheral end of a supporting plate. The clamp grips the outer peripheral end of the supporting plate and separates the supporting plate from a wafer by gripping the supporting plate. This makes it possible to separate a supporting plate from a wafer without breaking the wafer. With this, a supporting plate can be separated from a wafer to which the supporting plate has been attached, without breaking the wafer.

Abstract: A film peeling method for a film-coated flat wire that is performed by a film peeling device including: a rotational holder that can rotationally convey in a perpendicular direction to a rotational axis; a positioning mechanism that positions a film-coated flat wire in a longitudinal direction; and a working section that is provided in plural, aligned at specified intervals, and works an end portion of the film-coated flat wire, the method includes: holding the film-coated flat wire that is cut in a specified length in advance by the rotational holder; rotationally conveying the film-coated flat wire that is held by the rotational holder in the perpendicular direction to the rotational axis; positioning the conveyed film-coated flat wire by the positioning mechanism; and working the end portion of the film-coated flat wire by the working section.

Abstract: The apparatus and method disclosed is for removing labels from surfaces, especially from pharmaceutical vials. Each vial is brought into a travel path where it is moved forward by a linear driver. The vial is first pushed through a circular array of slitter blades to create a series of longitudinal slits in the label. The vial is next pushed through a circular array of scraper blades that remove the label segments between each pair of slits. The label segment residue is discarded through a vacuum system.

Abstract: A sheet peeling machine includes a movable table for moving a substrate in a moving direction, a planar member, a holder for holding the planar member; an elevating unit for supporting the holder and moving the holder in an elevating direction, a forwarding unit for contacting an end of the planar member with an edge of a sheet member on the substrate, a tape roller for affixing a peeling tape from the planar member and the sheet member, and a tape wind-up unit for peeling off the sheet member together with the peeling tape. According to the sheet peeling machine, the peeling tape is affixed onto the sheet member and then the sheet member is peeled off together with the peeling tape with a support by the planar member.

Abstract: A paper stripping member is removably supported by a supporting member disposed facing a circumferential surface of a photoreceptor drum, and strips a paper sheet off the circumferential surface. The paper stripping member includes an acute-shaped stripping nail, a holding member and a cover member. The holding member is configured removably from the supporting member, and holds the stripping nail in such a manner that the stripping nail extends toward the circumferential surface. The cover member is configured removably from the holding member, and covers at least part of the stripping nail in the extending direction of the stripping nail in a state where the cover member is attached to the holding member.

Abstract: A method for reworking a bonded display (e.g., a bonded LCD) having a substrate (e.g., plate or film) adhesively bonded to a face (e.g., front face) of the display. The method provides for efficient and clean removal of the substrate from the bonded display when necessary (e.g., when defect(s) are present) to afford a de-bonded display that is undamaged such that the resulting de-bonded display (e.g., de-bonded LCD) can subsequently be re-bonded as a component in a device being manufactured.

Abstract: Described methods and apparatus provide a controlled perturbation to an adhesive bond between a device wafer and a carrier wafer. The controlled perturbation, which can be mechanical, chemical, thermal, or radiative, facilitates the separation of the two wafers without damaging the device wafer. The controlled perturbation initiates a crack either within the adhesive joining the two wafers, at an interface within the adhesive layer (such as between a release layer and the adhesive), or at a wafer/adhesive interface. The crack can then be propagated using any of the foregoing methods, or combinations thereof, used to initiate the crack.

Abstract: A workpiece composed of a glass plate and a display panel joined to each other via an adhesive sheet is suction-held on both surfaces thereof by a pair of upper and lower holding members. The glass plate is detached from the display panel through swinging downward one end of the lower holding member around a support shaft provided on the other end side thereof with an entire surface of the glass plate being held in a planar state with a suction surface of the lower holding member.

Abstract: The present invention provides a debonding apparatus, a system comprising such apparatus, and methods for using such apparatus or system for the removal of flexible substrates (14) post-processing without damage to fabricated devices.

Abstract: An IC layers separator includes a bed; two sets of two opposite seats secured onto the bed; two guide bars each interconnecting the two opposite seats of either set; a carrier assembly secured onto the bed and including a lower vacuum device and an upper vacuum device including a ramp at one end; an IC layer assembly including an upper layer and a lower layer; and a blade assembly moveably mounted on the guide bars and including a pressing roller pressing the IC layer assembly on the ramp, a spring biased blade for separating the upper layer from the lower layer, and two opposite rolls for conveying the separated upper layer and the lower layer.

Abstract: Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.

Abstract: A device is provided for removal of a layer, such as a label, from a cylindrical surface of an object. The device includes a guide, a cutting instrument, and a base connecting the guide and the cutting instrument. The guide and the cutting instrument are separated by a distance defined by the base, and the cutting instrument is positioned to shave along the object's surface to remove the layer, when the surface of the object is rotated against the cutting instrument and against the guide.

Abstract: Disclosed are systems, devices and methodologies for separating wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be separated or unbonded from the carrier plate. Such a separation process can be achieved by applying a mechanical shear force to the wafer-carrier plate assembly. Various devices and methodologies, and related features, are disclosed.

Abstract: A separation apparatus for separating two planar devices bonded together by an adhesive layer is provided. The separation apparatus includes a base, a sliding module, a cutting member, and a positioning stage. The sliding module is mounted on the base. The cutting member is connected to the sliding module and is moveable in a two-dimensional plane with respect to the base by the sliding module for cutting the adhesive layer. The positioning stage is mounted on the base for positioning the planar devices and the adhesive layer therebetween on the base.

Abstract: An apparatus for separating a laminated substrate assembly comprises at least a substantially planar assembly, a cutting member housing assembly positioned on a first side of the substantially planar assembly, a cutting member receiving assembly positioned on a second side of the substantially planar assembly, substantially opposite from the first side of the planar assembly suitable for receiving an amount of the elongated cutting member. At least one of the cutting member housing assembly or the cutting member receiving assembly is configured to provide an amount of tension to the elongated cutting member as the elongated cutting member is released by the cutting member housing assembly or received by the cutting member receiving assembly, and the elongated cutting member is configured to remove an amount of adhesive from an adhesive layer of the laminated substrate assembly.

Abstract: An object of the present invention is to provide a pickup device that can securely peel a die or to provide a reliable die bonder or a pickup method using the pickup device. To achieve the object, the present invention is provided with a characteristic that when a die to be peeled out of plural dies (semiconductor chips) applied to a dicing film is thrust up and is peeled from the dicing film, the dicing film in a predetermined part in a circumference of the die is thrust up and a peeling starting point is formed, the dicing film in a part except the predetermined part is thrust up, and the die is peeled from the dicing film.

Abstract: Disclosed are systems, devices and methodologies for debonding wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be debonded from the carrier plate. Such a debonding process can be achieved by applying a suction force to the wafer-carrier plate assembly. Various debonding systems, devices and methodologies, and related features, are disclosed.

Abstract: Laser-based methods of stripping different types of fiber optic cables (100) are disclosed. The method includes directing a focused laser beam (202) onto the cable's protective cover (114). The method also includes moving the fiber optic cable relative to the focused laser beam in a direction substantially along a central axis (AC) to form a substantially axially oriented groove (250) in the protective cover, wherein the groove does not reach one or more optical fibers (110) carried by the cable. The method can further include opening the protective cover at the groove to form a split protective cover portion (114S), and removing the split protective cover portion from the fiber optic cable. Methods of stripping a cable by forming two grooves in the protective cover using two focused laser beams are also disclosed.

Abstract: Embodiments of the invention are used to provide ways of tire tread molding and retreading with a double tread rubber body having a unitary structure that comprises two treads in order to remove the need for buffing an oxide layer typically associated with tread molding and curing. Embodiments of the double tread molding and retreading methods also remove the need for cementing the cured tread to prevent future oxidation buildup. Once the double tread is cured and cooled, it is cut along the centerline with a double tread separation apparatus to expose a soft non-oxidized inner rubber. The cutting is much less energy intensive when compared to buffing with an expendable wire brush. There is no risk of spots of oxidized rubber being missed as is the case with buffing. There is little or no dust created.