Abstract: A method of bonding includes applying a glass composition to at least a first material surface. The glass composition includes a glass powder and a solvent. The first material surface is disposed onto a second material surface. An elevated temperature is applied to the first material surface and the second material surface to form a bond between the first material surface and the second material surface. The first material surface and the second material surface are compressed under an isostatic pressure.

Abstract: Provided is a semiconductor substrate manufacturing device which is capable of uniformly heating the surface of a semiconductor substrate that has a relatively large diameter or major axis. The semiconductor substrate manufacturing device includes a container body for accommodating a semiconductor substrate and a heating furnace that has a heating chamber which accommodates the container body, and the heating furnace has a heating source in a direction intersecting the semiconductor substrate to be disposed inside the heating chamber.

Abstract: A multi-layer ceramic electronic component includes: a ceramic body including a main surface, an end surface, and a side surface respectively perpendicular to a first axis, a second axis, and a third axis orthogonal to one another, a top portion that connects the main surface, the end surface, and the side surface to one another, and a plurality of internal electrodes laminated in a direction of the first axis; and an end external electrode including a corner portion located on the top portion, a base portion that covers the end surface and extends from the end surface to the main surface and the side surface, and a protrusion that protrudes from the base portion in a thickness direction, the protrusion including an L-shaped main surface protrusion located on the main surface and extending in directions of the second axis and the third axis from the corner portion.

Abstract: A multilayer capacitor and a board having the same mounted thereon are provided. The multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, and first to sixth surfaces, the first internal electrode being exposed through the third surface and the fifth surface and the second internal electrode being exposed through the fourth surface and the sixth surface; first and second side portions disposed on the fifth and sixth surfaces, respectively, of the capacitor body; first and second external electrodes; a first step-compensating portion disposed on a margin portion in a width direction on the second dielectric layer on which the second internal electrode is formed on the first internal electrode; and a second step-compensating portion disposed on another margin portion in the width direction on the first dielectric layer on which the first internal electrode is disposed on the second internal electrode.

Abstract: A multilayer ceramic capacitor includes first and second main surfaces opposite to each other in a thickness direction, first and second side surfaces opposite to each other in a width direction, first and second end surfaces opposite to each other in a longitudinal direction, an element body including dielectric layers and internal electrode layers stacked in the thickness direction, and a pair of external electrodes on the first and second end surfaces and electrically connected to the internal electrode layers, in which the dielectric layers include, as a main component, a perovskite oxide including barium and titanium, and the dielectric layers include an inner portion that is in contact with the internal electrode layer and includes an interface layer including a non-perovskite oxide including tin, barium, and titanium.

Abstract: A circuit module includes a first wiring substrate having a first main surface and a plurality of first components mounted on the first main surface. The plurality of first components includes a multilayer component formed as a single chip by being sealed using resin members. The multilayer component includes a second wiring substrate having a second main surface and a third main surface that face each other, a second component mounted on the second main surface, and a third component mounted on the third main surface.

Abstract: A component is provided for a human-powered vehicle. The component includes a component body, a strain gauge provided on the component body, a signal processing unit electrically connected to the strain gauge, a signal output that outputs a signal from the signal processing unit, and an electric power input electrically connected to the signal processing unit and supplied with electric power from a power supply provided on at least one of the human-powered vehicle and the component body. The strain gauge includes a substrate and a resistor provided on the substrate. The resistor is formed by a metal layer having a thickness of 0.01 micrometers or greater and 1 micrometer or less.

Abstract: A multilayer capacitor includes a capacitor body in which a first capacitor portion and a second capacitor portion are disposed to face each other with a connection region disposed therebetween, the connection portion having a predetermined thickness in which an internal electrode is not formed. The first capacitor portion comprises first and second internal electrodes that are alternately disposed with a dielectric layer interposed therebetween, and the second capacitor portion comprises third and fourth internal electrodes that are alternately disposed with a dielectric layer interposed therebetween. First and second external electrodes connected to the internal electrodes respectively comprise first and second internal layers containing copper (Cu), and first and second external layers containing silver (Ag) or nickel (Ni), and palladium (Pd).

Abstract: A multilayer capacitor includes a body including a dielectric layer and internal electrodes; and an external electrode disposed on the body to be connected to the internal electrode, wherein the dielectric layer includes a plurality of grains having a core-shell structure having a pore in a core, and the dielectric layer includes 20% to 40% of grains having two or less pores, among the plurality of grains.

Abstract: A multi-layer ceramic capacitor includes: a multi-layer unit including ceramic layers laminated in a first direction and electrodes disposed between the ceramic layers, positions of end portions of the electrodes falling within a range of 0.5 ?m in a second direction; and side margins each containing manganese or magnesium and silicon and facing each other in the second direction. When each margin is equally divided into an inner region and an outer region, a total concentration of manganese and magnesium in the outer region is higher than a total concentration of manganese and magnesium in the inner region and higher than a total concentration of manganese and magnesium in the ceramic layers, and a concentration of silicon in the inner region is not less than a concentration of silicon in the outer region and higher than a concentration of silicon in the ceramic layers.

Abstract: The multilayer ceramic electronic component includes a ceramic body including a dielectric layer; and first and second internal electrodes disposed inside the ceramic body, and disposed to oppose each other with the dielectric layer interposed therebetween. When an average thickness of the dielectric layer is referred to as td and a standard deviation of a thickness of the dielectric layer in each position is referred to as ?td, while an average thickness of the first and second internal electrodes is referred to as te and a standard deviation of a thickness of a pre-determined region of any layer of the internal electrodes in each position is referred to as ?te, a ratio (?te/?td) of the standard deviation of the internal electrodes in each position to the standard deviation of the thickness of the dielectric layer in each position satisfies 1.10??te/?td?1.35.

Abstract: A multilayer capacitor includes a capacitor body in which a first capacitor portion and a second capacitor portion are disposed to face each other with a connection region disposed therebetween, the connection portion having a predetermined thickness in which an internal electrode is not formed. The first capacitor portion comprises first and second internal electrodes that are alternately disposed with a dielectric layer interposed therebetween, and the second capacitor portion comprises third and fourth internal electrodes that are alternately disposed with a dielectric layer interposed therebetween. First and second external electrodes connected to the internal electrodes respectively comprise first and second internal layers containing copper (Cu), and first and second external layers containing silver (Ag) or nickel (Ni), and palladium (Pd).

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers laminated alternately on each other, and external electrode layers provided on opposing end surfaces of the multilayer body in a length direction orthogonal or substantially orthogonal to a lamination direction, and each connected with the internal electrode layers, in which the dielectric layers each include at least one of Ca, Zr, or Ti, the internal electrode layers each include Cu, and when a dimension in the lamination direction of the multilayer body is defined as T0, a dimension in the length direction of the multilayer body is defined as L0, and a dimension in a width direction orthogonal or substantially orthogonal to the lamination direction and the length direction is defined as W0, a relationship of L0<W0<T0 is satisfied.

Abstract: A method of manufacturing a wafer mounting table according to an embodiment includes: (a) a step of loading a ceramic slurry containing a ceramic powder and a gelling agent into opening portions of a metal mesh, inducing a chemical reaction of the gelling agent to gelate the ceramic slurry, and then performing degreasing and calcining to prepare a ceramic-loaded mesh; (b) a step of sandwiching the ceramic-loaded mesh between a first ceramic calcined body and a second ceramic calcined body obtained by calcining after mold cast forming so as to prepare a multilayer body; and (c) a step of hot press firing the multilayer body to prepare the wafer-receiving table.

Abstract: A multi-layer ceramic electronic component includes: a multi-layer unit including ceramic layers laminated in a direction of a first axis, internal electrodes disposed between the ceramic layers, and first and second side surfaces on which end portions of the internal electrodes in a direction of a second axis orthogonal to the first axis are positioned; and first and second side margins that cover the first and second side surfaces, respectively. When the first and second side margins are each divided equally into first and second regions along a plane perpendicular to the direction of the first axis, the first side margin has a larger average thickness in the first region than in the second region, and the second side margin has a larger average thickness in the second region than in the first region.

Abstract: A multilayer capacitor and a board having the same mounted thereon are provided. The multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, and first to sixth surfaces, the first internal electrode being exposed through the third surface and the fifth surface and the second internal electrode being exposed through the fourth surface and the sixth surface; first and second side portions disposed on the fifth and sixth surfaces, respectively, of the capacitor body; first and second external electrodes; a first step-compensating portion disposed on a margin portion in a width direction on the second dielectric layer on which the second internal electrode is formed on the first internal electrode; and a second step-compensating portion disposed on another margin portion in the width direction on the first dielectric layer on which the first internal electrode is disposed on the second internal electrode.

Abstract: A ceramic electronic device includes a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, the plurality of internal electrode layers being alternately exposed to a first end face and a second end face of the multilayer structure. A bent portion, in which the plurality of dielectric layers in a substantially same position along a stacking direction project along the stacking direction, is formed in the multilayer chip. In the bent portion, a through-hole is formed in two or more of the plurality of internal electrode layers. The through-hole is a defect portion in a first direction in which the first end face faces with the second end face and in a second direction that is vertical to the first direction in a plane of the plurality of internal electrode layers.

Abstract: An electronic component includes a laminate in which a plurality of dielectric layers and a plurality of internal electrodes are alternately laminated and external electrodes electrically connected to the internal electrodes. A side margin portion as a region in which the plurality of internal electrodes is not provided when a section of the laminate having the length direction and the width direction is viewed from the laminating direction includes a plurality of side margin layers laminated in the width direction. An outer layer portion as a region in which the plurality of internal electrodes is not provided except for the side margin portion when a section of the laminate including the laminating direction and the width direction is viewed from the length direction includes a plurality of layer-margin layers laminated in the laminating direction.

Abstract: A ceramic electronic device includes a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, the plurality of internal electrode layers being alternately exposed to a first end face and a second end face of the multilayer structure. A bent portion, in which the plurality of dielectric layers in a substantially same position along a stacking direction project along the stacking direction, is formed in the multilayer chip. In the bent portion, a through-hole is formed in two or more of the plurality of internal electrode layers. The through-hole is a defect portion in a first direction in which the first end face faces with the second end face and in a second direction that is vertical to the first direction in a plane of the plurality of internal electrode layers.

Abstract: A ceramic electronic device includes: a multilayer chip having a structure in which each of dielectric layers and each of internal electrode layers are alternately stacked; and external electrodes provided on end faces of the multilayer chip, wherein a main component of the external electrodes is a first metal, wherein the internal electrode layers include the first metal and a second metal of which a melting point is higher than that of the first metal, wherein a diffusion coefficient of the first metal with respect to the second metal is larger than that of the second metal with respect to the first metal, wherein a number of a cavity in a range of 10 numbers of the internal electrode layers that are next to each other and are connected to a same external electrode of the first external electrode and the second external electrode is 1 or less.

Abstract: Methods of coupling inductors in an IC device using interconnecting elements with solder caps and the resulting device are disclosed. Embodiments include forming a top inductor structure, in a top inductor area on a lower surface of a top substrate, the top inductor structure having first and second top terminals at its opposite ends; forming a bottom inductor structure, in a bottom inductor area on an upper surface of a bottom substrate, the bottom inductor structure having first and second bottom terminals at its opposite ends; forming top interconnecting elements on the lower surface of the top substrate around the top inductor area; forming bottom interconnecting elements on the upper surface of the bottom substrate around the bottom inductor area; forming solder bumps on lower and upper surfaces, respectively, of the top and bottom interconnecting elements; and connecting the top and bottom interconnecting elements to each other.

Abstract: A multilayer capacitor includes a capacitor body in which a first capacitor portion and a second capacitor portion are disposed to face each other with a connection region disposed therebetween, the connection portion having a predetermined thickness in which an internal electrode is not formed. The first capacitor portion comprises first and second internal electrodes that are alternately disposed with a dielectric layer interposed therebetween, and the second capacitor portion comprises third and fourth internal electrodes that are alternately disposed with a dielectric layer interposed therebetween. First and second external electrodes connected to the internal electrodes respectively comprise first and second internal layers containing copper (Cu), and first and second external layers containing silver (Ag) or nickel (Ni), and palladium (Pd).

Abstract: A coil-embedded ceramic substrate includes a plurality of ceramic layers including multi-turn coil patterns provided thereon. At least one ceramic layer of the plurality of ceramic layers includes thereon a multi-turn coil pattern and dummy patterns not electrically connected to the multi-turn coil pattern. The multi-turn coil pattern winds around and extends parallel or substantially parallel to sides of the ceramic layer. The dummy patterns are each parallel or substantially parallel to corresponding ones of the sides of the ceramic layer as an extension of portion of the coil pattern in an extending direction.

Abstract: An end surface outer layer Mn/Ti peak intensity ratio, which is a ratio of a peak intensity of Mn found by laser ICP to a peak intensity of Ti found by laser ICP in a dielectric ceramic layer in an end surface outer layer portion, is higher than a central portion Mn/Ti peak intensity ratio, which is a ratio of a peak intensity of Mn found by laser ICP to a peak intensity of Ti found by laser ICP in the dielectric ceramic layer in a central portion in a width direction, a length direction, and a layering direction in an effective portion, and a peak intensity of Ni found by TEM-EDX is in a portion of the dielectric ceramic layers in the end surface outer layer portion.

Abstract: A magnet and a method of forming the magnet are provided. The method includes forming a slurry comprising magnetic powder material and binder material and creating raw layers from the slurry. A magnetic field is applied to the raw layers to orient the magnetic powder material in a desired direction, and each layer is cured to form another layer on the most recent cured layer. The layers are attached together.

Abstract: A multilayer ceramic capacitor includes, in at least one of a region between an end of a first internal electrode layer which is not connected to a second external electrode and the second external electrode, and a region between an end of a second internal electrode layer which is not connected to a first external electrode and the first external electrode, in a length direction, a defect portion provided on a plane including a stacking direction and a width direction, such that the defect portion is located between the first dielectric ceramic layers in the stacking direction and is located between the second dielectric ceramic layer and the third dielectric ceramic layer in the width direction.

Abstract: A device for promoting healing of an injury in a living being is provided. Such device is based upon an injury covering portion, which portion comprises an electroactive polymer, such as poled polyvinylidine difluoride (PVDF) or a copolymer of PVDF. The electroactive polymer has either pyroelectric properties, piezoelectric properties, or both.

Abstract: A ceramic substrate of the present disclosure is a ceramic substrate including a ceramic body having a ceramic layer on a surface thereof and a surface electrode placed on a primary face of the ceramic body. Between the surface electrode and the ceramic layer is an oxide layer made of an insulating oxide having a melting point higher than the firing temperature for the ceramic layer. The oxide layer also extends on the ceramic layer not occupied by the surface electrode. The oxide layer on the ceramic layer not occupied by the surface electrode has a rough surface.

Abstract: A resin multilayer substrate includes a plurality of insulating resin base material layers and a plurality of conductor patterns provided on the plurality of insulating resin base material layers. The plurality of conductor patterns include a plurality of signal lines provided at positions not overlapping each other as viewed from a laminating direction of the insulating resin base material layers, and a ground conductor overlapping the plurality of the signal lines as viewed from the laminating direction. Openings are provided in the ground conductor and, as viewed from the laminating direction, an aperture ratio is higher in an inner zone that is sandwiched between two signal lines than in an outer zone of the two signal lines.

Abstract: Resin films, all of which are formed of the same resin material, are laminated to form a laminate. Heat and pressure are applied to the laminate to integrate the resin films into one piece; then the pressure applied to the laminate is released and the laminate is cooled. In a predetermined region of the laminate which is to constitute a bent part, one or more of the resin films are arranged on each of one side and the other side in a lamination direction of the resin films with respect to one conductor pattern; and the total thickness of the one or more resin films arranged on the one side is larger than the total thickness of the one or more resin films arranged on the other side. Consequently, the predetermined region can be bent by utilizing the difference between contraction force generated in the one or more resin films arranged on the one side and contraction force generated in the one or more resin films arranged on the other side during the cooling after the application of heat and pressure.

Abstract: A multilayer ceramic capacitor includes a ceramic body including an active portion that includes a dielectric layer and a plurality of internal electrodes overlapping each other across the dielectric layer, and cover portions formed above and below the active portion, and including first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other, and first and second side margin portions disposed on the first and second surfaces. In a cross-section of the ceramic body in a length-thickness (L-T) direction, a ratio Sd/Sc of an area Sd of a region except for the active portion to an overall area Sc of the cross-section is greater than 27%.

Abstract: An electronic component includes a main body made from a metal magnetic powder and an insulating resin, a coating film covering the surface of the main body, a conductor disposed inside the main body, inorganic particles adhering to the surface of the coating film, and outer electrodes which are electrically connected to the conductor and which cover portions of the surface of the coating film while inorganic particles adhere to the portions, wherein the coating film contains a resin and metal cations.

Abstract: A multi-layered structural element and a method for producing a multi-layered structural element are disclosed. In an embodiment dielectric green sheets, at least one ply containing an auxiliary material which contains at least one copper oxide and layers containing electrode material are provided and arranged alternately one above another. These materials are debindered and sintered. The copper oxide is reduced to form the copper metal and the at least one ply is degraded during debindering and sintering.

Abstract: A manufacturing method for a sensor element includes a forming step. The forming step includes: a step (a) of forming an unfired electrode on one of plural green sheets; a step (b) of forming an unfired electrode lead and an unfired lead insulating layer on the same green sheet as in the step (a), the unfired electrode lead and to be connected to the unfired electrode, the unfired lead insulating layer surrounding at least part of the unfired electrode lead; and a step (c) of forming an unfired bonding layer so as to fill at least part of a region without the unfired lead insulating layer on the green sheet subjected to the step (b) and so as to overlap at least part of an edge portion of the unfired lead insulating layer.

Abstract: A method of manufacturing a multilayer ceramic electronic component which includes preparing first and second ceramic green sheets; forming an internal electrode pattern on the first ceramic green sheet using a conductive metal paste; forming a ceramic member on first and second end portions of a first surface of the second ceramic green sheet to form a step portion absorption layer; stacking two or more of the first ceramic green sheets on each other in a stacking direction to form a first group; stacking two or more of the first ceramic green sheets on each other in the stacking direction to form a second group; and placing the second ceramic green sheet between the first group and the second group in the stacking direction to form a ceramic body, wherein the first and second end portions oppose each other in a first direction perpendicular to the stacking direction.

Abstract: A coil component includes a magnetic body part and a coil part. The magnetic body part has first and second magnetic layers stacked together alternately in one axis direction, and cover parts covering the first and second magnetic layers from the one axis direction. The coil part has conductor patterns provided on the second magnetic layers. The magnetic body part includes: oblate soft magnetic grain-containing layers extending over the entire range of the magnetic body part in the direction perpendicular to the one axis direction, exposed in the direction perpendicular to the one axis direction, and formed by oblate soft magnetic grains whose thickness direction is oriented in the one axis direction; and spherical grain-containing layers adjoining the oblate soft magnetic grain-containing layers in the one axis direction, and formed by insulative spherical grains.

Abstract: The invention relates to a piezoceramic material with reduced lead content, based on potassium sodium niobate (PSN) and having a defined parent composition. According to the invention the manner of addition of a mixture of Pb, Nb and optionally Ag and optionally Mn gives a wide sintering range together with reproducible electrical and mechanical properties of the material.

Abstract: A method of manufacturing a multilayer ceramic electronic component includes preparing a green mother laminate in which ceramic layers and inner electrode layers are stacked; cutting the mother laminate perpendicularly or substantially perpendicularly to a main surface of the mother laminate and in a first direction when the mother laminate is viewed in plan such that first sectional surfaces are formed, and pressing the mother laminate to obtain a bonded laminate in which the first sectional surfaces are bonded to each other; and separating the bonded laminate between the first sectional surfaces to obtain laminates. Then, the bonded laminate is cut perpendicularly or substantially perpendicularly to the main surface and in a second direction that intersects the first sectional surfaces such that second sectional surfaces are formed.

Abstract: An integrated, quantized inductor, comprising a plurality of identical inductor sections, is provided for multiple applications on the chip. The inductor section represents one turn and includes two stacked metal layers with identical area and configuration, separated by dielectric layers, winding around the insulated ferromagnetic core, and interconnected by via. Power transformer, having a primary winding and multiple secondary windings comprised of a plurality of identical inductor sections and a shielded common ferromagnetic core ring, placed outside of the active chip area between the seal ring and pad-ring enhanced area. Inside of active chip area, in proximity to the related linear RF components are placed sensitive inductors, balun-transformers, resonator, separately protected by EM guard rings, wherein one node is open, and the second one is tied to the ground. The fabrication is compatible with integrated circuits manufacturing.

Abstract: A method of interconnecting a conductor and a hermetic feedthrough of an implantable medical device includes welding a lead to a pad on a feedthrough. The feedthrough includes a ceramic insulator and a via hermetically bonded to the insulator. The via includes platinum. The pad is bonded to the insulator and electrically connected to the via, includes platinum, and has a thickness of at least 50 ?m. The lead includes at least one of niobium, platinum, titanium, tantalum, palladium, gold, nickel, tungsten, and oxides and alloys thereof.

Abstract: A method for manufacturing a multilayer ceramic capacitor includes preparing a green multilayer body including a stack of dielectric sheets printed with inner electrodes, coating the green multilayer body with a conductive paste that is connected to the inner electrodes, and firing the conductive paste and the green multilayer body at the same time, wherein a rate of temperature increase from about 800° C. to about 1,100° C. during the firing is about 15° C. per minute or more.

Abstract: A multilayer ceramic electronic component includes a laminated body, a first external electrode, a pair of second external electrodes, and a pair of insulating coating portions. The pair of insulating coating portions extends in a laminating direction between each of the pair of second external electrodes and the first external electrode on a second principal surface, from the second principal surface to respective portions of a first side surface and a second side surface. As viewed from at least one direction in the laminating direction, an end of the pair of insulating coating portions, which is located closest to a first principal surface, is located closer to the first principal surface than an end of the first external electrode and pair of second external electrodes, which is located closest to the first principal surface.

Abstract: A multilayer ceramic electronic component includes a laminated body, a first external electrode, a pair of second external electrodes, and a pair of insulating coating portions. The pair of insulating coating portions extends in a laminating direction between each of the pair of second external electrodes and the first external electrode on a second principal surface, from the second principal surface to respective portions of a first side surface and a second side surface. As viewed from at least one direction in the laminating direction, an end of the first external electrode and pair of second external electrodes, which is located closest to a first principal surface, is located closer to the first principal surface than an end of the pair of insulating coating portions, which is located closest to the first principal surface.

Abstract: In a thin-film capacitor, an electrode terminal layer is divided into a plurality of parts by a penetration portion, and includes a frame portion as one divided part. The frame portion is disposed along an outer edge of the electrode terminal layer when viewed from the bottom surface side of the electrode terminal layer, and the frame portion can hinder deformation of the electrode terminal layer stretching or warping in a thickness direction or an in-plane direction, whereby such deformation can be prevented. Accordingly, in the thin-film capacitor, the electrode terminal layer is not likely to be deformed and an improvement in strength thereof is achieved.

Abstract: The present invention provides a high thermal conductive silicon nitride sintered body having a thermal conductivity of 50 W/m·K or more and a three-point bending strength of 600 MPa or more, wherein when an arbitrary cross section of the silicon nitride sintered body is subjected to XRD analysis and highest peak intensities detected at diffraction angles of 29.3±0.2°, 29.7±0.2°, 27.0±0.2°, and 36.1±0.2° are expressed as I29.3°, I29.7°, I27.0°, and I36.1°, a peak ratio (I29.3°)/(I27.0°+I36.1°) satisfies a range of 0.01 to 0.08, and a peak ratio (I29.7°)/(I27.0°+I36.1°) satisfies a range of 0.02 to 0.16. Due to above configuration, there can be provided a silicon nitride sintered body having a high thermal conductivity of 50 W/m·K or more, and excellence in insulating properties and strength.

Abstract: In an example, a fluid ejection apparatus includes a printhead die embedded in a printed circuit board. Fluid may flow to the printhead die through a plunge-cut fluid feed slot in the printed circuit board and into the printhead die.

Abstract: A multilayer capacitor includes a body including dielectric layers and first and second internal electrodes alternately disposed with dielectric layers interposed therebetween. First and second external electrodes are on the body and connected to the first and second internal electrodes, respectively. The first and second internal electrodes are plating layers. A manufacturing method of a multilayer capacitor includes preparing a plurality of laminated sheets including internal electrodes, dummy electrodes, and dielectric layers. The plurality of laminated sheets, and covers on and below the laminated sheets, are simultaneously stacked and then cured to prepare a cured product. The cured product is then diced depending on the size of the capacitor to prepare a body where the internal electrodes and the dummy electrodes are partially exposed. External electrodes are formed on external surfaces of the body using the dummy electrodes as seeds in a plating method.

Abstract: A multilayer ceramic electronic component includes a ceramic body contributing to capacitance formation and including an active region formed by alternately stacking dielectric layers and first and second internal electrodes and, and a protective layer provided on at least one of upper and lower surfaces of the active region; and first and second external electrodes formed on respective ends of the ceramic body, wherein a step portion absorption layer is disposed in at least one of: both end portions of the ceramic body in a length direction or both end portions of the ceramic body in a width direction, and a total thickness of dielectric layers disposed on the same plane as the step portion absorption layer is greater than a thickness of a dielectric layer disposed in another region.

Abstract: An ESD protective device includes an element assembly with a hollow portion that includes inner surfaces including a first inner surface, a second inner surface, and a third inner surface inclined to a Z direction in a cross section including the Z direction. Accordingly, a surface area of the inner surfaces of the hollow portion is increased, the heat load on an auxiliary discharge electrode is reduced, and the deterioration of the auxiliary discharge electrode is significantly reduced or prevented.

Abstract: In at least one embodiment, a single sintered magnet is provided having a concentration profile of heavy rare-earth (HRE) elements within a continuously sintered rare-earth (RE) magnet bulk. The concentration profile may include at least one local maximum of HRE element concentration within the bulk such that a coercivity profile of the magnet has at least one local maximum within the bulk. The magnet may be formed by introducing alternating layers of an HRE containing material and a magnetic powder into a mold, pressing the layers into a green compact, and sintering the green compact to form a single, unitary magnet.