Abstract: Described is a modular thermal energy transfer system. The modular thermal energy transfer system includes a plurality of modular thermal units, each modular thermal unit having a thermal retainer with a conditioning pipe and a usable fluid pipe disposed therein. The conditioning pipes are in fluidic communication with one another, and the usable fluid pipes are in fluidic communication with one another. The conditioning pipes are adapted to carry a conditioning fluid therethrough and to allow transfer of thermal energy between the thermal retainers and the conditioning fluid. The usable fluid pipes are adapted to carry a usable fluid therethrough and to allow the transfer of thermal energy between the thermal retainers and the usable fluid. The various thermal retainers of the modular thermal units are configured to be positionable proximate one another such that thermal energy is transferable between substantially adjacent thermal retainers.

Abstract: Cooling of a jacketed autoclave or steam sterilizer is carried out by allowing a film of water to flow down the inner wall of the sterilizer's jacket space. Condensate from the jacket space is drawn into the water ring pump provided for vacuum in the autoclave jacket. The condensate is conducted to the water side of the pump while the normal suction line is connected at the pump to the gas zone. Thus, the water ring pump draws condensate from the lowest point of the jacket to the water side, and gas from the jacket space to the normal suction inlet. During the process of sterilizer cooling, a stream of water and air from the water ring pump is conducted to the upper part of the jacket space of the steam sterilizer and is allowed to flow as a film down the inner wall of the jacket space. Evaporation takes place with cooling of the jacket inner wall. This evaporation is enhanced by the lowering of pressure in the jacket due to the action of the water ring pump.

Abstract: A cooling system for a microchip or other component is described, including, in one embodiment: (1) a cold plate assembly positioned adjacent (e.g., in contact with) the component to be cooled; (2) at least one heat exchanger; (3) a fan for directing gas adjacent (e.g., through) a portion of the heat exchanger; and (4) a pump for circulating cooling fluid through a closed circuit including the cold plate and heat exchanger. The cold plate may include guide fins that define macrochannels and microchannels that serve as conduits for the cooling fluid. The fins and channels in one embodiment are shaped to substantially match the heat map profile of the chip or component to be cooled. The heat exchanger in one embodiment includes a reservoir in its base which may cooperate with a recess or channel in a support plate to form an additional cooling fluid flow passage.

Abstract: A combined heat-exchanger includes a first air-cooled heat-exchanger for cooling coolant for a heat generator other than an internal combustion engine in an automobile and a second air-cooled heat-exchanger for cooling refrigerant for air-conditioning. The first air-cooled heat-exchanger includes an upstream tank into which the coolant flows, a downstream tank form which the refrigerant flows out, flow channel members that communicate the upstream tank with the downstream tank, heat release fins that are alternately stacked with the flow channel members, and a water-cooled heat-exchanger for cooling the refrigerant. The water-cooled heat-exchanger is disposed within the downstream tank, and includes an inlet port to which the refrigerant flows at its upper portion and an outlet port from which the refrigerant flows out at its lower portion. According to the heat-exchanger, staying of oil mixed in the refrigerant can be prevented, heat exchange efficiency can improve and downsizing can be achieved.

Abstract: A cooling device includes a heat receiving unit disposed to contact a surface of a temperature-increasing part the temperature of which increases during an image forming process; a radiation unit transferring heat from a cooling liquid; a tube for circulating the cooling liquid between the heat receiving unit and the radiation unit in a liquid circulation direction; a conveying unit conveying the cooling liquid through the tube; a coupling having an internal flow path and including a first end to which a first part of the tube is connected and a second end to which a second part of the tube is connected; and an outlet for draining the cooling liquid from the tube. At least one of the first part of the tube and the second part of the tube extends to a position lower than the position of the coupling.

Abstract: The present invention relates to a heat exchanger unit (13) for exchanging heat between a first fluid and a second fluid. The unit (13) comprises a flow passage for the first fluid and a flow passage for the second fluid, the flow passages are connected to inlets (9) and outlets (10) of the heat exchanger unit (13) through which the first and the second fluid flow into and out of the heat exchanger unit (13).

Abstract: A heat exchanger (15) comprising a plurality of generally parallel passages through which air is to pass in a first direction through a first set of passages (16) and in an opposite direction to said first direction through a second set of said passages (22), the passages of said first set (16) being located adjacent the passages of said second set (22). The heat exchanger (15) further comprising sheet material that separates the first set (16) from the second set (22), and provides for the transfer of heat between said first set (16) and said second set of passages (22).

Abstract: A phase change device for controlling temperature within a confined environment, comprising a foam material, a phase change material, the phase change material being absorbed into the foam, and a protective covering encasing the foam material/phase change material. A method for making a phase change device for controlling temperature within a confined environment, comprising providing a phase change material, providing a foam material, absorbing the phase change material into the foam material, and sealing the foam material/phase change material within a protective covering.

Abstract: Systems and methods for operating a hydraulically actuated device/system are described herein. For example, systems and methods for the compression and/or expansion of gas can include at least one pressure vessel defining an interior region for retaining at least one of a volume of liquid or a volume of gas and an actuator coupled to and in fluid communication with the pressure vessel. The actuator can have a first mode of operation in which a volume of liquid disposed within the pressure vessel is moved to compress and move gas out of the pressure vessel. The actuator can have a second mode of operation in which a volume of liquid disposed within the pressure vessel is moved by an expanding gas entering the pressure vessel. The system can further include a heat transfer device configured to transfer heat to or from the at least one of a volume of liquid or a volume of gas retained by the pressure vessel.

Abstract: A cooling system includes a buried heat exchange unit (301), a first air-liquid heat exchanger (302), a second air-liquid heat exchanger (303), a control device (304), a fluid conveying device (305), and connecting pipes (307). A control method applicable to the cooling system includes: acquiring environment information, where the environment information includes at least one of the following temperatures: an outdoor temperature of the equipment room and a temperature of the soil surrounding buried pipes; and controlling at least one of the at least two circulation pipelines to be in an open state according to a control policy and the acquired environment information, where a circulation fluid is driven by the fluid conveying device to flow in the open circulation pipeline. An equipment room using the cooling system is also provided.

Abstract: A two-phase heat transfer system includes an evaporator unit configured to receive heat from a source, a liquid line fluidly connected to the evaporator unit, a vapor line fluidly connected to the evaporator unit, and a condenser. The evaporation unit includes a thermal capacitance device and an evaporator integrated with the thermal capacitance device.

Abstract: A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting chips (12, 112, 212, 312, 412) and a support (13, 14, 114, 214, 314, 414) on which the light emitting chips are disposed. The support includes a first side on which the light emitting chips are attached and a second side opposite the first side. A thermally superconducting heat transfer medium (22, 122, 222, 322, 422) is disposed in an interior volume of the support and thermally connects the first and second sides of the support. The thermally superconducting heat transfer medium has a thermal conductivity at least 1500 times greater than the thermal conductivity of copper.

Abstract: A cooling unit, which is configured to contain and cool air between two rows of equipment racks defining a hot aisle, includes a housing configured to be secured mounted on the two rows of equipment racks such that the housing spans the hot aisle, a heat exchanger supported by the housing and coupled to and in fluid communication with a coolant supply and a coolant return, and an air movement assembly supported by the housing and configured to move air over the heat exchanger. Other embodiments of the cooling unit and methods of cooling are further disclosed.

Abstract: A modular capillary pump loop (CPL) cooling system and associated components. The modular CPL cooling system transfers heat from high-power circuit components, such as microprocessors disposed within computer chassis, to other locations within or external to the chassis, where the heat can be more easily removed. In various embodiments, the CPL cooling system includes one or more evaporators connected to one or more condensers via flexible liquid transport and vapor transport lines. A wicking structure, such as a volume of sintered copper, is disposed within each condenser. The wicking structure draws working fluid (e.g., water) in a liquid state into the evaporator based on a capillary mechanism and a pressure differential across a meniscus/vapor interface on an upper surface of the wicking structure. As the liquid meniscus is evaporated, additional fluid is drawn into the evaporator. The working fluid is then condensed back into a liquid in the condenser.

Abstract: The pool heating system includes a pool containing a large volume of pool water and an associated building. The building having an attic space over a living space. A heat-exchanger is positioned outside of the living space of the building. The heat exchanger exchanges heat from the attic into pool water that is circulated through the heat exchanger. Any pool water that leaks from the heat-exchanger does not leak into or onto the living space.

Abstract: A thermal energy transfer system utilizes a composition containing one or more polyols, such as 1,3-propanediol, and one or more ionic liquids as a thermal energy transfer composition. There is also provided a method of transferring thermal energy and a process for temperature adjustment, either cooling or heating, using such a composition.

Abstract: A system (1) for recirculation of air in a component of a wind turbine, such as a converter cabinet (2), a nacelle, a generator, etc. The system (1) comprises a housing (5) enclosing the system (1), a fan (4) arranged inside the housing (5) for recirculating the air, an opening (6) arranged in a wall part of the housing (5) and having a filter (7) arranged across it, and means for drawing air from outside the housing (5) to inside the housing (5) via the opening (6) and the filter (7). The air may be drawn through the opening (6) due to a low pressure created when the fan (4) draws air through a heat exchanger (3) arranged in the system (1). Drawing air through the opening (6) creates an overpressure inside the housing (5), and thereby air from outside is prevented from entering the system (1) via possible holes or crevices in the housing (5). Since air entering the system (1) flows via the filter (7), dirt and impurities are therefore prevented from entering the system. Thereby the wind turbine is protected.

Abstract: A reverse flow heat exchanger is combined with a thermal energy sink to generate a temperature ladder. This system is used to cool a fluid more efficiently and/or to a lower temperature than would be possible without the reverse flow heat exchanger. The cooled fluid is optionally used to cool a sensor, a superconductor, a circuit, a cooling surface, or the like. The cooled fluid is optionally combined with a catalyst to remove unwanted constituents.

Abstract: A thermal conductor for a heat-generating liquid pump system of a pool containing liquid and including a pipe. The conductor is adapted for conducting heat from the pump system to liquid circulated by the pump system. The conductor includes a body in thermal communication with a heat generating portion of the pump system and in thermal communication with only an outside surface of the pipe and not in direct contact with the liquid.

Abstract: A water over air intercooler for use in a reciprocating air compressor includes a central core unit having an interior which contains a plurality of air passage tubes, a cooling water inlet and at least one cooling water outlet. A first manifold has at least one air inlet and is in communication with the plurality of air passage tubes so as to receive air from the at least one air inlet and direct the air to the plurality of air passage tubes. A second manifold has an air outlet and is in communication with the plurality of air passage tubes so as to receive air from the plurality of finned air passage tubes and direct the air to the at least one air outlet. The central core unit, the first manifold and the second manifold are integrally connected by welding to form a single piece.

Abstract: Cooling device and method for cooling a working fluid of a high-pressure pump with a pressure booster. The cooling device includes a conveyor system comprising at least one pump, at least two heat exchangers arranged in series along the conveyor system, and at least two switches coupled to the at least two heat exchangers. At least one controller is structured and arranged to selectively activate and deactivate the at least two heat exchangers via the at least two switches at an adjustably preset temperature of the working fluid.

Abstract: A sensor housing system maintains a sensor—which is used in monitoring an extreme temperature environment such as a combustion unit—at a desired ambient temperature. The system comprises one or more sensors housed within an internal chamber and cooled by air or an inert gas. Gas within the chamber cools the sensor and then exhausts to a second internal chamber which, in turn, exhausts to atmosphere. Both chambers are housed in a directional ball pivot that provides access to the extreme temperature environment and adjusts the angle of the sensor. An air tube having a cobra sweep is directed toward the external surface of the glass wafer and directs a hot gas stream across the surface of the wafer. A failsafe device retracts the chambers from tie extreme temperature environment in case of power failure or if for some reason the sensor becomes too hot.

Abstract: According to the invention, a heat exchanger is disclosed. The heat exchanger may include a first tube sheet, a second tube sheet, a heat exchange tube, a header, and a coupling. The heat exchange tube may be disposed at least partially between the first tube sheet and the second tube sheet, and may also be made of a first material. The header may be made of a second material. The coupling may include a first end and a second end. The first end may be made of the first material, and the second end may be made of the second material. The first end may be operably coupled with the heat exchange tube, and the second end may be operably coupled with the header.

Abstract: A cooling structure for an electric device includes an inverter, a plurality of cooling medium paths (724) through which a cooling medium for the inverter flows, and an inlet (722) into which the cooling medium to be supplied to the plurality of cooling medium paths (724) flows. The plurality of cooling medium paths (724) extend in a direction crossing the aligning direction of the inlet (722) and the plurality of cooling medium paths (724). The cooling structure for an electric device further includes a cooling medium distribution mechanism for promoting distribution of the cooling medium to each of cooling medium paths (724) by suppressing the flow of the cooling medium. The cooling medium distribution mechanism has a flow rate suppression function suppressing the flow rate of the cooling medium flowing through at least one cooling medium path (724). This flow rate suppression function is realized by a wall (726A, 726B, 726C) provided at a cooling medium path (724).

Abstract: The invention relates to a housing that houses a coiled conduit for a first heat transfer fluid with the housing open at two front sides and surrounding the coil. A wall of the housing that extends in the longitudinal direction of the coil is provided with passages.

Abstract: Methods, systems and apparatus for combining a thermal power plant with at least one data center.

Abstract: A thermal device for heat exchange between a substance in solid state and a substance in liquid state comprising a housing formed by two heat conducting plates disposed in parallel wherein wire-made grid-like 3-dimensional bracing is disposed between said plates and adapted to provide turbulent flow of said substance in liquid state; wires of said bracing are mechanically connected together and to said plates. A thermal device for heat exchange between a substance in solid state and a substance in gaseous state. A heat pipe container having a working fluid enclosed therein, said container formed by two heat conducting plates disposed in parallel against each other and sealed along their perimeter; said container having a capillary microchannel system for reversible fluid-gas circulation, wherein said capillary microchannel system is formed by wire-made grid-like 3-dimensional bracing disposed between said plates; wires of said bracing are mechanically connected together and to said plates.

Abstract: The invention relates to a heat exchanger comprising at least one pipe (1) and at least one lamella (2), for exchanging heat between a first coolant that flows through the pipe (1) and a second coolant that wets the heat exchanger under the influence of centrifugal forces in order to be cooled and to be available to further cool a rotating machine element (3) that is situated in a housing (4), where the heat exchanger is of approximately ring-shaped design, essentially surrounds the rotating machine element (3) and is integrated into the housing (4).

Abstract: A refrigeration system includes a first circuit configured to circulate a first refrigerant. The first circuit includes an evaporator. The refrigeration system also includes a second circuit configured to circulate a second refrigerant. The second circuit includes a receiver associated with the evaporator such that the second refrigerant within the receiver is in a heat exchange relationship with the first refrigerant within the evaporator.

Abstract: A heat dissipation device includes a plurality of first fins and second fins, a flattened heat pipe and a base plate. The first fins include a first face at a bottom thereof. The second fins are sandwiched between the first fins and have a second face at a bottom thereof. The heat pipe includes a first section, a second section and a connecting section connecting the first section with the second section. The first section and the second section thermally contact the second face of the second fins. The connecting section thermally contacts the first face of the first fins. The base plate has a bottom surface adapted for contacting a heat-generating electronic component, and a top surface contacting the second face of the second fins and the first section and the second section of the heat pipe.

Abstract: A method and an apparatus for the efficient transfer of heat utilizing micro heat pipes that include a cellular foam or interconnected cellular/truss network having hollow ligaments. A predetermined fraction of the internal volume of the hollow ligaments is filled with a carefully chosen working fluid, and the ends of the hollow ligaments are sealed. In operation, the working fluid evaporates in the region of high heat flux and condenses in regions of lower temperature, resulting in the transfer or redistribution of the fluid's latent heat of vaporization. For open cell foams and interconnected networks, a second fluid flowing through the open cells, separate from the working fluid but also in thermal contact with the hollow ligaments, assists in the transfer of heat from the foam and networks.

Abstract: The inventive method includes the utilization of different phase change materials with different melting temperature ranges in each of the headliner (3), the seats (7), and the instrument panel (12) of an automobile in order to save energy while improving thermal comfort for the passengers. When used in the seats (7), the phase change material can be included in the seat heater system. Preferable phase change materials are alkyl hydrocarbons and mixtures thereof, salt-hydrates, metals, alloys, poly-alcohols, and eutectics with phase changes within the desired temperature ranges and with appropriate heat storage capacities. Preferably, the phase change materials are directly incorporated in a polymeric compound structure, in an elastomeric compound structure, or in a foam structure in order to enhance the overall thermal capacity.

Abstract: The application of carboxylate salts for storing thermal energy is disclosed. The invention is directed to methods for the storage and use of thermal energy comprising contacting mixtures of alkali metal salts or alkali earth metal salts of carboxylic acids, storing the thermal energy in the mixture, containing the mixture in a suitable heat exchange system and using the stored thermal energy in the heat exchange system.

Abstract: A heat management system include including application of phase change materials (PCM). A heat or cold storage multistage tower has a housing with a multistage system of flat rigid container. A significant fraction of internal space of each container is filled with PCM; these containers are fabricated from ceramics, glass, glass ceramics or sulfur concrete. Another version of the heat or cold storage tower is based on application of multi-channel blocks from ceramics, glass, glass ceramics or sulfur concrete; the parallel internal vertical channels of the blocks are open and sealed at their bottoms alternatively, and the channels with the sealed bottoms are filled partially with PCM. The tower achieves effective heat transfer between a heat transfer fluid (HTF) and PCM in the processes of charging and discharging of the containers with heat or cold.

Abstract: A heat transport device includes a container having a hollow structure including a fluid channel, at least one thermal-receiver heat exchanger and one thermal-radiator heat exchanger arranged side-by-side on an outer wall of the container along the fluid channel, and driving heat exchangers at respective terminal portions of the container. In this heat transport device, both ends of the fluid channel are closed to prevent intrusion of external air, and a liquid and a gas are sealed in the fluid channel. The driving heat exchangers cause the liquid to oscillate in the container along the internal fluid channel. The heat transport device provides low acoustic noise performance, improved temperature controllability, high heat transportation and heat radiating capacities, and improved heat transfer and fluid flow characteristics.

Abstract: A modular capillary pump loop (CPL) cooling system and associated components. The modular CPL cooling system transfers heat from high-power circuit components, such as microprocessors disposed within computer chassis, to other locations within or external to the chassis, where the heat can be more easily removed. In various embodiments, the CPL cooling system includes one or more evaporators connected to one or more condensers via flexible liquid transport and vapor transport lines. A wicking structure, such as a volume of sintered copper, is disposed within each condenser. The wicking structure draws working fluid (e.g., water) in a liquid state into the evaporator based on a capillary mechanism and a pressure differential across a meniscus/vapor interface on an upper surface of the wicking structure. As the liquid meniscus is evaporated, additional fluid is drawn into the evaporator. The working fluid is then condensed back into a liquid in the condenser.

Abstract: A heat transfer regulating mixture having a metallic component A with a melting point TA and a particulate ceramic component B which is non-wettable by the metallic component A, non-reactive therewith and which has a melting temperature TB which is higher than both the temperature TA and a desired operating temperature TD which is also higher than TA. The metallic component A and the particulate ceramic component B and the respective amounts will typically be selected to have a higher thermal resistivity below TA than above TA. The heat transfer regulating mixture may be incorporated in a thermal flux regulator having the mixture within an enclosure surrounding a heat generating reactor structure.

Abstract: A cooler for an electrical component, including a pressure-tight vessel enclosing the electrical component and including a support plate above the electrical component, a bath of electrically insulating and evaporating liquid surrounding the electrical component within the vessel, a flow channel for cooling liquid on the support plate, and a heat exchange element. The heat exchange element includes a serpentine plate having generally horizontally extending and aligned flanks alternately connected along horizontally extending upper and lower edges, with the lower edges being connected by connectors spaced along the horizontally extending edges and the upper edges being connected by horizontally extending crests secured to the flow channel for heat conduction therebetween. The flow channel may define a U-shaped path with two channel legs connected at one end, with a cooling liquid inlet connected to one of the channel legs and a cooling liquid outlet connected to the other of the channel legs.

Abstract: An air conditioning system comprising a plurality of heat pipes. Each of the heat pipes includes an input coil at the input end of a chiller for the passage of input air there through and an output coil at the output end of a chiller for the passage of output air there through. Each of the heat pipes also having an inlet leg and an outlet leg coupling an associated input coil and output coil for the flow of a working fluid there through. At least one valve for controlling the flow of the coolant within each heat pipes exists. A tube and shell heat exchanger transfers heat from a chiller fluid to an intermediate portion of the heat pipes.

Abstract: Apparatus and systems for cooling heat sinks, integrated circuit boards, and electronic components by providing internal passageways in the heat sinks, circuit boards, and electronic components that connect to a fluid manifold. The internal passageways connect to the surface of the heat sinks, circuit boards and electronic components. A cooling fluid capable of phase change is supplied to the internal passageways to conductively cool the interior of the heat sink, circuit board, and component and to cool the surface of the heat sink, circuit board, and/or component at least partially by evaporative cooling. A plurality of circuit boards, components, and/or heat sinks may be placed back to back with the fluid manifold therebetween. The heat sinks, circuit boards, and/or components are in an enclosed space so that cooling fluid can be contained, condensed and recycled to the fluid manifold.

Abstract: A cooling system for cooling electronic/computer equipment in an equipment room in a station. A fan device causes heat exchanging air circulation between a battery and the equipment, where the air is guided by an air guiding device. The air guiding device is in a first chamber with an inlet which communicates with a battery and a second chamber with an outlet which communicates with the equipment. The first and second chambers are separated by a low impulse device preferably in the form of a perforated partition wall equipped with filter cloth. Turbulent flow which leaves the fan changes the laminar flow when the flow is towards the equipment so that warm surrounding air is not mixed in the air flow.

Abstract: A device for the external cooling of the electrical drive motor of a centrifugal pump unit, which with the motor is advantageously to be assembled above the centrifugal pump, comprises a hermetically closed hollow body of heat-conducting material which circumferentially at least partly surrounds the motor and which with its wall surface on the motor side and on the pump side is in heat-conducting surface contact with the motor and the centrifugal pump, wherein the hollow body is essentially filled with a fluid which transfers the motor heat and which, with a heated motor, is subject to a natural circular convection flow.

Abstract: A highly flexible composite material having a flexible matrix containing a phase change thermal storage material. The composite material can be made to heat or cool the body or to act as a thermal buffer to protect the wearer from changing environmental conditions. The composite may also include an external thermal insulation layer and/or an internal thermal control layer to regulate the rate of heat exchange between the composite and the skin of the wearer. Other embodiments of the PCM composite also provide 1) a path for evaporation or direct absorption of perspiration from the skin of the wearer for improved comfort and thermal control, 2) heat conductive pathways within the material for thermal equalization, 3) surface treatments for improved absorption or rejection of heat by the material, and 4) means for quickly regenerating the thermal storage capacity for reuse of the material.