Abstract: An intercooler is a two-stage water-cooled intercooler having a first core and a second core. A condenser for an air conditioner includes a water-cooled condenser and an air-cooled condenser. A drive system electrical component such as an inverter, the second core, and the water-cooled condenser are cooled by a second cooling water circuit including a sub-radiator. Cooling is carried out by the second cooling water circuit including the sub-radiator. The sub-radiator and the air-cooled condenser are located in front of a main radiator.

Abstract: A data center cooling system, including a support structure having a lower portion and an upper portion, one or more fans supported by the support structure at a height that is equal to or greater than a height of the electronics cabinets, and a heat exchanger having one or more cooling coils supported at the upper portion of the support structure. In some embodiments, the cooling coils can be supported by the upper portion of the support structure so as to be above the top of and/or over one or more of the electronics cabinets. The fans can be configured to draw air from the one or two rows of electronics cabinets and to cause the air to be passed through the heat exchanger to cool the warmer air from the electronics cabinets.

Abstract: The intake air cooling device 100A constitutes a heat exchange device that performs heat exchange of the intake air of the internal combustion engine 6. The intake air cooling device 100A includes the heat exchange part 1A configured to perform heat exchange between the cooling liquid W that is introduced thereto and the intake air that is passing therethrough, and the intake air control valve 2 configured to perform control of the intake air that passes through the heat exchange part 1A. The cooling liquid introduction port 13 of the heat exchange part 1A and the intake air control valve 2 are provided at positions opposing each other with respect to the heat exchange part 1A.

Abstract: A cyclone cooler device includes a housing that defines an interior channel elongated along a center axis. One or more of the fluid passage or configuration of an inlet end of the channel is shaped to induce a swirling flow of a cooling fluid within the channel while the channel is thermally coupled with one or more heat sources. The swirling flow of the cooling fluid removes thermal energy from and cools the one or more heat sources. During the swirling flow, the cooling fluid rotates around the center axis of the channel while also moving along the length of the center axis. The cooling fluid changes phases during the swirling flow to cool the heat source(s).

Abstract: A heat pipe module includes at least one first pipe body and at least one second pipe body. The inner wall of the first pipe body defines a hollow chamber. A part of the second pipe body is disposed in the hollow chamber, and the external wall of the part of the second pipe body directly contacts the first pipe body.

Abstract: Thermal control systems that include variable conductivity metamaterial units are provided. The metamaterial unit a plurality of thermally conductive plates, a plurality of first bonds, each of which connects two adjoining thermally conductive plates, and a plurality of second bonds, each of which connects two adjoining thermally conductive plates. Also included is a load inducer constructed to cause the plurality of thermally conductive plates to move between a non-contact state, in which opposing surfaces of the plurality of thermally conductive plates are not in direct contact, to a contact state, in which the opposing surfaces of the plurality of thermally conductive are in at least partial direct contact, so as to change a thermal conductivity of the metamaterial unit from a first value to a second value.

Abstract: A heat exchanger module includes a condenser unit and an evaporator unit. The evaporator unit includes N pieces of parallel-flow heat exchangers arranged adjacently, and the coolant temperatures reduce gradually from the first to Nth parallel-flow heat exchangers along an air flow direction in the evaporator unit. A counter-current mounting method is adopted in the parallel-flow heat exchangers of the evaporator unit in the heat exchanger module provided by the present invention. The coolant temperature of each parallel-flow heat exchanger is lower than that of the previous one, the temperature difference between air and coolant is relatively uniform by using the counter-current method so as to reach a better heat exchange effect.

Abstract: The disclosure relates to a pulsating heat pipe including channel plate. The channel plate includes first surface, second surface, first channels, second channels, first passages, second passages, at least one chamber, and at least one third passage. The first channels and the chamber are formed on the first surface, the channels are formed on the second surface, and the first passages, the second passages, and the third passage penetrate through the first and second surfaces. The chamber has a closed end located opposite to the third passage and connected to at least one of the second channels via the third passage. The first and second channels are connected via the first and second passages. The chamber has a hydraulic diameter of Dh which satisfies the following condition: D h > 2 ? ? ?? ? ? g , wherein ? is surface tension, ?? is difference in density between liquid and vapor, and g is gravitational acceleration.

Abstract: OLED display color output may vary substantially as a function of display temperature, which changes over time. Luminance of each of the pixels is defined by the current flowing therethrough, which is a function of the applied voltage and resistivity of the pixels. Temperature affects the resistivity of the pixels and thus the current flowing therethrough if voltage is held constant. The temperature response of red, green, and blue pixels differs, particularly at low applied voltage levels. As a result, the relative luminance of red, green, blue may vary with temperature changes, which may yield an undesirable overall color variance. The presently disclosed systems and methods dynamically adjust driving voltage to maintain color quality within a desired specification, while also reducing (or in some implementations, minimizing) power consumption of the OLED display.

Abstract: An airstream cooling assembly includes an evaporator and a first and second condenser. The evaporator is configured to have a first airstream directed over its outer surface and to change the phase of a primary cooling medium from liquid to gas. The first condenser is configured to have a second airstream directed over its outer surface, transfer heat from the primary cooling medium, and change the phase of the primary cooling medium from gas to liquid. The second condenser is configured to accept a secondary cooling medium, and when accepting the secondary cooling medium, to receive the primary cooling medium from the evaporator, transfer heat from the primary cooling medium, and change the phase of the primary cooling medium from gas to liquid. The evaporator is configured to receive the primary cooling medium in the liquid phase from at least one of the first condenser and the second condenser.

Abstract: An apparatus includes a thermally conductive interface assembly including a first component associated with a first interface surface and a second component associated with a second interface surface. The apparatus also includes a shape memory alloy component coupled to the thermally conductive interface assembly and configured to move one or more components of the thermally conductive interface assembly between a first state and a second state based on a temperature of the shape memory alloy component. In the first state, the first interface surface is in physical contact with the second interface surface, and in the second state, a gap is defined between the first interface surface and the second interface surface.

Abstract: A vehicle includes an internal combustion engine, a cooling loop, an exhaust system, and a thermosiphon. The cooling loop is configured to direct an engine coolant through the engine. The exhaust system is configured to direct exhaust gas away from the engine. The thermosiphon is configured to transfer heat from the exhaust gas to the engine coolant.

Abstract: In order to reduce the dimensions and costs of a heat exchanger, while at the same time increasing its heat effectiveness, it is suggested to configure the heat exchanger such that a condenser side and an evaporator side of the heat exchanger are separated from each other by a barrier.

Abstract: An electronic device includes a heat emitting element disposed on a PCB. The electronic device further includes a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the corresponding optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1° C./W.

Abstract: A heat pipe structure is used for cooling a heat source. The heat pipe structure includes a sleeve tube and a shaft. The sleeve tube includes an inner wall. The sleeve tube has a trench on the inner wall. The trench is at an outlet end of the sleeve tube. The trench extends in a circumferential direction of the sleeve tube. The shaft is connected to the heat source. The shaft is inserted into the sleeve tube from the outlet end such that the shaft is rotatable relative to the sleeve tube. The trench surrounds the shaft.

Abstract: A server rack thermosiphon system includes a plurality of evaporators, each evaporator including a thermal interface for one or more heat-generating server rack devices; at least one condenser mounted to an external structure of a server rack, the condenser including a fluid-cooled heat transfer module; a liquid conduit that fluidly couples each of the evaporators to the condenser to deliver a liquid phase of a working fluid from the condenser to the evaporators; and a vapor conduit that fluidly couples each of the evaporators to the condenser to deliver a mixed phase of the working fluid from the evaporators to the condenser.

Abstract: Immersion cooling enclosures with insulating liners and associated computing facilities are disclosed herein. In one embodiment, an immersion cooling enclosure includes a well formed in a substrate material, a lid in contact with and fastened to the well to enclose an internal space configured to contain a dielectric coolant submerging one or more computing devices in the internal space, and an insulating liner on the internal surfaces of the well. The insulating liner has a first side in contact with the dielectric coolant and a second side in contact with the substrate material of the well. The insulating liner is non-permeable to the dielectric coolant, thereby preventing the dielectric coolant from passing through the insulating liner to the substrate material.

Abstract: A thermally insulated vessel contains a thermal insulation barrier defining an upper compartment above the barrier and a lower compartment below the barrier. The compartments are interconnected by a passage to allow pressure equalization. High temperature superconductor is mounted within the lower compartment for immersion in the liquid cryogen. A cryogenic refrigerator has a cold head thermally coupled to the high temperature superconductor for maintaining the high temperature superconductor below a superconductive transition temperature. A temperature controller maintains a temperature of the liquid cryogen in the upper compartment at a temperature of at least a boiling point of the liquid cryogen at atmospheric pressure when the lower compartment and at least a portion of the upper compartment are filled with the liquid cryogen.

Abstract: A passive thermal system for use in aerospace vehicles includes a plurality of core-bearing radiator panels having at least one heat pipe embedded therein. The portion of the heat pipe embedded in each panel is fluidically coupled to the portions of the heat pipe in the other core-bearing radiator panels.

Abstract: An electrical equipment cabinet cooling device includes an electrical equipment cabinet having a cabinet outer frame defining an inner perimeter wall. A planar outer cabinet wall is positioned within the inner perimeter wall. A two-phase thermal device includes spaced and opposed first and second transfer walls. An outer perimeter wall connects the first and second transfer walls and defines an interior sealed cavity between the first and second transfer walls. The outer perimeter wall is sized for slidable receipt within the inner perimeter wall. A liquid/vapor retained in the interior sealed cavity acts as a heat transfer medium between the first and second transfer walls. A convective cooling block has a planar end face in direct contact with the second transfer wall. Heat transfers to atmosphere in a path including the outer cabinet wall, the first transfer wall, the liquid/vapor, the second transfer wall, and the cooling block.

Abstract: A pressure cooking apparatus, a method and device for controlling the same are provided. During a heating process of the apparatus, the device detects a pressure value inside the inner liner, a first temperature value when the detected pressure value rises to a first preset pressure threshold, and a second temperature value when the detected pressure value drops from the preset first pressure threshold to a second preset pressure threshold. Next the device acquires a temperature reference value according to a preset setting strategy using the first temperature value and the second temperature value and then compares a current temperature value detected by the temperature sensor with the temperature reference value. Finally, the device starts or stops the heating process based on the comparison result, thus reducing the on/off frequency of the apparatus and controlling the pressure inside the cooking apparatus more precisely and smoothly.

Abstract: A loop type heat pipe includes: an evaporator configured to vaporize a liquid working fluid; a condenser configured to condense the vaporized working fluid into the liquid working fluid; a vapor pipe provided between the evaporator and the condenser; and a liquid pipe provided between the evaporator and the condenser. Each of the vapor pipe and the liquid pipe includes: a lower-side metal layer; an intermediate metal layer that is disposed on the lower-side metal layer; an upper-side metal layer that is disposed on the intermediate metal layer; and a conduit that is formed by the lower-side metal layer, the intermediate metal layer, and the upper-side metal layer, and at least one of the upper-side metal layer and the lower-side metal layer warps outward in a first portion of the vapor pipe.

Abstract: A loop heat pipe includes a first flow path, a second flow path over the first flow path, and a divider provided between the first flow path and the second flow path. Each of the first flow path and the second flow path includes an evaporator configured to vaporize a working fluid, a condenser configured to condense the working fluid, a first transport pipe connecting the evaporator and the condenser, and a second transport pipe connecting the evaporator and the condenser and forming a loop flow path with the transport pipe.

Abstract: A thermal buffering module is used in a combined equipment and cooling unit including a housing defining an interior configured to receive electronic equipment, with the electronic equipment being supported by the housing. The combined equipment and cooling unit further includes a cooling unit supported by the housing. The thermal buffering module includes at least one heat exchanger. The thermal buffering module is configured to selectively receive chilled air from the cooling unit to cool the at least one heat exchanger and to selectively receive warm IT air from the electronic equipment to cool the warm IT air as it travels over the at least one heat exchanger.

Abstract: A cooling recover system and method are disclosed. A fluid, such as water, is chilled and provided to a cooling coil to cool and dehumidify air passing over the cooling coil. The fluid is output from the cooling coil through an outlet, and at least a portion of the fluid from the outlet of the cooling coil is provided to an inlet of a heat transfer coil to reheat air passing over the heat transfer coil. The fluid is warmed as it passes through the cooling coil, which warmer temperature serves to reheat the air passing over the heat transfer coil.

Abstract: A vapor-liquid phase fluid heat transfer module includes: at least one evaporator having a first chamber inside, which containing a first working medium; at least one evaporator tube body having a first end, a second end and a condensation section positioned, the first and second ends communicating with the first chamber of the at least one evaporator to form a loop of the first working medium; at least one heat exchanger having a heat exchange chamber, a first face and a second face for the condensation section of the evaporator tube body to attach to; and at least one heat sink tube body, which communicating with the heat exchange chamber of the at least one heat exchanger and the at least one heat sink to form a loop of the second working medium.

Abstract: A pulsating vapor chamber has an inner board, a first outer board, a second outer board, an asymmetric loop, and a working fluid. The inner board has a first surface and a second surface. The first and second outer boards are mounted on the first surface and the second surface of the inner board respectively. The asymmetric loop is located between the first and second outer boards and has multiple channels communicating with each other in sequence. A part of the channels are formed between the first outer board and the inner board, and the remaining channels are formed between the second outer board and the inner board. With the asymmetric loop, even if the vapor chamber is disposed horizontally, pressure may be changed by different amount in the channels so that the working fluid is still able to oscillate or circulate.

Abstract: The invention refers to a component carrier comprising at least one heat pipe, wherein the at least one heat pipe has at least a largely cylindrical heat pipe section with a largely cylindrical profile with an outer diameter. The at least one heat pipe is embedded within a recess of at least one inner layer or is surface-mounted on an outer layer of said component carrier, wherein at least the largely cylindrical heat pipe section of the heat pipe is thermoconductively coupled by means of at least one adapter means that directly contacts the heat pipe with at least one layer of the component carrier. Furthermore the invention refers to several methods for producing said component carrier.

Abstract: An electrical winding topology having a core and a plurality of windings is provided. The plurality of windings is operatively coupled to the core, where at least one of the plurality of windings includes an evaporator section and a condenser section. Further, at least a portion of one or more of the plurality of windings includes heat pipes.

Abstract: A passive thermal system for use in a satellite and other aerospace applications includes a container having a heat-pipe working fluid disposed in a first chamber and a Phase Change Material (PCM) disposed in a second chamber that substantially surrounds the first chamber. The first chamber contains a wick for transporting the heat-pipe working fluid. The exterior of the first chamber has fins, etc., that extend into the PCM for heat spreading and increased interface area.

Abstract: A three-dimensional pulsating heat pipe includes a pipe member and a connecting member. The pipe member is coiled around an axis to form a plurality of loop portions, and the loop portions are arranged in order along the axis so as to form a three-dimensional coiled structure. The three-dimensional coiled structure has a heat receiving section, and the pipe member has different effective pipe cross-sectional areas on two opposite sides adjacent to the heat receiving section. The connecting member is connected to two ends of the pipe member, such that the connecting member and the pipe member together form a closed loop.

Abstract: A vehicle body may have an internal skeleton forming a wing shape and a fuselage shape, and a skin fabricated in-situ over the internal skeleton. The skin may include a matrix material, and a plurality of continuous fibers at least partially coated with the matrix material. The plurality of continuous fibers may extend from the wing shape over the fuselage shape.

Abstract: A vehicle body may have an internal skeleton, and a skin fabricated in-situ over the internal skeleton. The skin may include a matrix material, and a plurality of continuous fibers encased within the matrix material. The plurality of continuous fibers may include at least one electrically conductive wire interwoven with others of the plurality of continuous fibers. The at least one electrically conductive wire may be configured to function as at least one of a heater and a strain gauge.

Abstract: A reactor, which includes a reactor body and two reactor ends sealing the ends of the reactor body, a plurality of reactor tubes extending inside the reactor body at least partially between the reactor ends, and at least one heat pipe disposed inside at least one of the reactor tubes.

Abstract: An apparatus includes a thermally conductive interface assembly including a first component associated with a first interface surface and a second component associated with a second interface surface. The apparatus also includes a shape memory alloy component coupled to the thermally conductive interface assembly and configured to move one or more components of the thermally conductive interface assembly between a first state and a second state based on a temperature of the shape memory alloy component. In the first state, the first interface surface is in physical contact with the second interface surface, and in the second state, a gap is defined between the first interface surface and the second interface surface.

Abstract: The invention refers to a component carrier comprising at least one heat pipe, wherein the at least one heat pipe has at least a largely cylindrical heat pipe section with a largely cylindrical profile with an outer diameter. The at least one heat pipe is embedded within a recess of at least one inner layer or is surface-mounted on an outer layer of said component carrier, wherein at least the largely cylindrical heat pipe section of the heat pipe is thermoconductively coupled by means of at least one adapter means that directly contacts the heat pipe with at least one layer of the component carrier. Furthermore the invention refers to several methods for producing said component carrier.

Abstract: The system and method spatially predict the condensation of water and acid from the flue gas in the condensing heat exchanger installed in fossil power plant flue gas treatment system or similar environment. By modifying the operational conditions, the heat exchanger can control rates and areas of condensations. The system and method adjust either the cooling water temperature or the flowrate ratio of flue gas to cooling water to control the condensation rates of water or acids. The system and method also estimate actual coverage areas to apply for anti-corrosive coating onto the tube or duct surfaces to resist corrosion due to acid condensation. The system and method also optimize or customize condensation rates of water and acids in boiler flue gas under operating conditions given at a power plant.

Abstract: A cooling device including: a base block having a first length and a first thickness and having a mounting side on which a heat-generating body is installed along a first vertical direction. The cooling device further includes a pipe unit, including a tank buried at an opposite side to the mounting side of the base block for storing a coolant, and pipes which are connected to the tank and are parallel to one another. Heat radiation fins are disposed on the pipes in a state in which the pipes penetrate the heat radiation fins. The cooling device in which the tank is formed has a flattened shape and a smaller dimension along a first thickness direction of the base block than a height dimension along the first length of the block. Each of the pipes are connected to an upper position of the tank with respect to the height dimension.

Abstract: A heat dissipation device includes etched or other grooves for adhesive surrounding etched or other recesses for heat-dissipating fluid, these being created in a first copper sheet and a second copper sheet brought together. The first copper sheet includes first recesses and the second copper sheet includes corresponding second recesses. The second copper sheet is adhesively fixed on the first copper sheet and an airtight receiving cavity is formed by the first and second recesses being brought together. The heat-dissipating fluid in the airtight receiving cavity carries away heat generated by a heat-producing device to which the heat-dissipating device is fixed.

Abstract: A thermally managed electrical supply unit is provided. The unit contains an energy unit comprising a battery or a battery pack; a casing of a porous thermally conductive framework comprising a phase change material on at least one surface of the energy unit; at least one heat flux rectifier unit on the thermally conductive framework casing; wherein a surface of the heat flux rectifier opposite to the PF/PCM casing is subject to cooling. Also provided is a method for thermal management of an energy unit comprising absorption of heat from the energy unit within a phase change material, transfer of the heat energy from the phase change material through a heat flux rectifier and removal of the heat transferred across the heat flux rectifier. The flow of heat across the heat flux rectifier is irreversible and the heat flux rectifier acts as an on/off switch to control the heat flow.

Abstract: A heat exchanger is disclosed which includes a plurality of heat exchanger plates. Each plate has a plurality of hollowed out pins arranged in a pin fin pattern. Each plate also includes an inlet aperture and an outlet aperture in fluid communication with one another. A plurality of heat pipes are defined by several of the plurality of hollowed out pins. A wicking material is arranged within the several hollowed out pins. A heat transfer fluid at least partially fills each heat pipe.

Abstract: Disclosed are thermal management for electronic devices and, more particularly, to a thermodynamic system with bi-phase fluid circuits which self-organize internal fluid movement to transfer heat from heat absorption zones to heat dissipation zones. A thermodynamic system may include a plurality of thermal energy absorption (TEA) nodes disposed adjacent to one or more heat sources which are interconnected with one another and also a plurality of thermal energy dissipation (TED) nodes through a capillary system that encloses a bi-phase fluid. As TE is absorbed into the bi-phase fluid at individual TEA nodes local condition changes such as, for example, pressure and/or volume increases induce convection of the absorbed TE away from the individual TEA nodes. As TE dissipates from the bi-phase fluid at individual TED nodes local condition changes such as, for example, pressure and/or volume decreases further induce convection of additional absorbed TE toward the individual TED nodes.

Abstract: Provided is a latent heat transfer material that is micro-encapsulated, said material exhibiting superior mechanical strength and heat resistance. A production method for the latent heat transfer material that is micro-encapsulated in a hard shell comprises: 1) a step in which a perforate hollow silica particle is manufactured; 2) a step in which the phase change material is sealed inside the perforate hollow silica particle by inserting the perforate hollow silica particle in a molten solution of the phase change material and repeatedly subjecting the same to vibrations such as ultrasound oscillations; 3) a step in which the perforate hollow silica particle having the phase change material sealed within is washed in a saturated aqueous solution of the phase change material; and 4) a step in which perhydropolysilazane is used to coat the outer shell of the perforate hollow silica particle with silica.

Abstract: A passive thermal system for use in satellites includes a solid radiator panel with a plurality of heat pipes attached to a surface thereof. In addition to their heat transporting capability, the heat pipes strengthen the radiator panel to which they are coupled. In some embodiments, the heat pipes are structurally modified to increase their area moment of inertia.

Abstract: A connector assembly includes a socket connector and a plug connector. The socket connector includes a main body having a tongue; multiple mating terminals having multiple first contact portions; a shell surrounding the tongue to form an accommodating cavity; and a first thermal conduction member. The first contact portions are exposed from at least one first surface of the tongue and are arranged in a left-right direction. The first thermal conduction member has a first mating portion accommodated in the accommodating cavity, and the first mating portion and the tongue are provided at intervals in the left-right direction. The plug connector includes a circuit board; a chip, provided on the circuit board; a mating joint having an insulating body and multiple conductive terminals provided on the insulating body; and a second thermal conduction member having a second mating portion and a conducting portion thermally conducted with the chip.

Abstract: A thermal module includes a first heat transfer member and a second heat transfer member. The first heat transfer member has a first chamber in which a first capillary structure is disposed. The second heat transfer member has a second chamber and a conduction section. A second capillary structure is disposed in the second chamber. The conduction section is received in the first chamber. A third capillary structure is disposed on outer surface of the conduction section. A working fluid is respectively filled in the first and second chambers. The third capillary structure is disposed on the outer surface of the conduction section to enhance the heat transfer effect of the second heat transfer member so as to enhance the heat transfer efficiency of the entire thermal module.

Abstract: A motor vehicle heat exchanger system includes a closed circuit for a working medium and an evaporator for evaporation of the working medium. The evaporator includes at least two evaporator cassettes having an exhaust gas channel formed between the evaporator cassettes. Each evaporator cassette includes a capillary structure and a liquid side and a vapor side. A medium feed is provided on the liquid side for liquid working medium. Each evaporator cassette includes a vapor collector.

Abstract: A method of producing a complex product includes designing a three dimensional preform of the complex product, creating a three dimensional preform of the complex product using the model, depositing a material on the preform, and removing the preform to complete the complex product. In one embodiment the system provides a complex heat sink that can be used in heat dissipation in power electronics, light emitting diodes, and microchips.

Abstract: A system and method are provided for passively cooling an inverter subsystem within an enclosure. The method and system absorb heat generated by an inverter subsystem within an enclosure through a first heat spreader. The first heat spreader is thermally coupled to in the inverter subsystem and a first interior surface of the enclosure. The system and method transfer a portion of the heat from the first heat spreader to a second heat spreader through a plurality of heat pipes. The plurality of heat pipes are thermally coupled to the first heat spreader and the second heat spreader. The system and method further thermally couple the second heat spreader to a second interior surface of the enclosure.

Abstract: The present invention relates to a module for cooling heat generating components, in particular for cooling electronic components of a computer device, such as processors, memory modules, storage modules, that may be arranged on a motherboard. The method according to the invention, comprises at least one heat generating component, a gastight chamber having an interior volume having arranged therein a heat-transfer fluid in liquid phase that is in heat transfer contact with at least part of the heat generating component and a heat exchanging surface for transferring heat from the heat-transfer fluid out of the gastight chamber, wherein the gastight chamber comprises a displaceable wall by means of which the interior volume of the gastight chamber is variable, and wherein the interior volume of the gastight chamber is in pressure equilibrating connection with the ambient pressure outside the gastight chamber via the displaceable wall of the gastight chamber.