Always Out Of Direct Contact With Each Other Patents (Class 165/104.14)
  • Patent number: 10184731
    Abstract: A domestic boiler preheater includes a flue box having a combustion gas inlet to receive hot combustion gas from a boiler, and a combustion air inlet to receive air for combustion in a boiler. The preheater further includes a condenser having a mains cold water inlet and a mains water outlet arranged such that mains water flows through the condenser prior to being supplied to a boiler combustion chamber. The condenser further includes a central heating water return and a central heating water flow outlet arranged such that central heating water flows through the condenser prior to being supplied to the boiler combustion chamber. The condenser further includes connections that enable the condenser to be connected to preheated fluid supply pipework from a source of preheated fluid, the preheated fluid having fluid heated by heat from at least one of the combustion gas and a renewable energy source.
    Type: Grant
    Filed: August 7, 2013
    Date of Patent: January 22, 2019
    Inventor: Luke Chamberlain
  • Patent number: 10162382
    Abstract: Methods, apparatus, systems are disclosed for using a movable heat sink to cool an electrical device during an ejection cycle of the electrical device from a dock. In accord with these concepts, the heat sink is moved from a first position, not in contact with the electrical device, to a second position in physical contact with the electrical device to conduct heat from the electronic device prior to an ejection of an electronic device from the dock.
    Type: Grant
    Filed: September 19, 2016
    Date of Patent: December 25, 2018
    Assignee: Intel Corporation
    Inventor: Nishi Yoshi Yoshifumi
  • Patent number: 10154748
    Abstract: The invention concerns a regeneration household machine (10) for regenerating packaged cooked and subsequently cooled to chilled, ambient or frozen temperatures portions of food. The machine (10) comprises at least one compartment (16, 18) adapted to receive, preferably when it is empty, at least one packaged cooked and subsequently cooled to chilled, ambient or frozen temperatures portion of food to be regenerated and at least one conduct (65, 65b, 65c, 68a, 69, 69a, 69b) for feeding a heating fluid into said at least one compartment (16, 18), heating means (72) being provided at said at least one conduct in order to heat said heating fluid at a desired temperature depending on the recipe of the food of said at least one packaged cooked and subsequently cooled to chilled, ambient or frozen temperatures portion of food.
    Type: Grant
    Filed: October 7, 2013
    Date of Patent: December 18, 2018
    Assignee: Nutresia SA
    Inventor: Jonathan Pennella
  • Patent number: 10136551
    Abstract: A method of cooling a computer server that includes a plurality of server modules, and is positioned in an enclosed room, includes transferring heat generated by a server module of the plurality of server modules to a hot plate of a liquid cooling system. The liquid cooling system may be positioned within the server module, and the hot plate may have a surface exposed to the enclosed room. The method may also include positioning a cold plate of a room-level cooling system in thermal contact with the hot plate. The method may also include directing a cooling medium through the room-level cooling system to transfer heat from the hot plate to a cooling unit positioned outside the room.
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: November 20, 2018
    Assignee: Asetek Danmark A/S
    Inventor: Steven B. Branton
  • Patent number: 10119770
    Abstract: A planar heat pipe includes a container having a hollow portion provided at a central portion thereof with two opposing plate-shaped bodies, and a working fluid enclosed in the hollow portion. The hollow portion is provided with a wick structure. At least one of the plate-shaped bodies is a composite member of two or more types of metal members that are laminated and integrated. A metal member of the composite member forming a layer that contacts the hollow portion has a thermal conductivity of greater than or equal to 200 W/m·K and a metal member of the composite member forming a layer that contacts an exterior has a thermal conductivity of less than or equal to 100 W/m·K, a peripheral portion of the hollow portion being sealed.
    Type: Grant
    Filed: August 17, 2015
    Date of Patent: November 6, 2018
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Hirofumi Aoki, Hiroshi Sakai, Tatsuro Miura, Yoshikatsu Inagaki
  • Patent number: 10080263
    Abstract: A cooking appliance includes at least one housing assembly and at least one cooking chamber formed in the housing assembly. The at least one cooking chamber includes at least one loading opening. At least one cooking chamber door closes the at least one loading opening. The at least one cooking chamber door includes at least one frame assembly and at least one window assembly. The at least one frame assembly includes a plurality of edges, with at least one contact face at each of the edges on a side of the at least one cooking chamber door that faces the at least one cooking chamber when the at least one cooking chamber door is closed. At least one of the contact faces is an at least one extended contact face that is significantly larger than the remaining contact faces with respect to at least one geometric dimension.
    Type: Grant
    Filed: August 21, 2015
    Date of Patent: September 18, 2018
    Assignee: MIELE & CIE. KG
    Inventors: Ruediger Hoehn, Timo Lippert, Carolin Kaudewitz, Micha Reifert
  • Patent number: 10034487
    Abstract: A method and apparatus for producing popping candy which is formed in molds. A reactor with one or more trays holds the product and one or more moveable transmission mechanisms and one or more lids provided at each end of the reactor act as inlets and outlets. One or more two way valves regulate and maintain inside pressure of the reactor and cooling and heating mechanisms are provided.
    Type: Grant
    Filed: October 1, 2015
    Date of Patent: July 31, 2018
    Inventor: Tolga Erden
  • Patent number: 10012454
    Abstract: A heat dissipation device includes a first copper sheet and a second copper sheet. The first copper sheet includes a number of first recesses and the second copper sheet includes a number of corresponding second recesses. The second copper sheet is fixed on the first copper sheet and an airtight receiving cavity is formed by each first recess and each the second recess, a working fluid in the airtight receiving cavity carries unwanted heat away.
    Type: Grant
    Filed: April 20, 2015
    Date of Patent: July 3, 2018
    Assignees: Avary Holding (Shenzhen) Co., Limited., GARUDA TECHNOLOGY CO., LTD
    Inventors: Xian-Qin Hu, Fu-Yun Shen, Ming-Jaan Ho
  • Patent number: 9995537
    Abstract: The purpose of this invention is to provide a sheet-shaped heat pipe that makes it possible to reduce a pressure loss caused by a vapor flow or a pressure loss caused by a working fluid flow to improve the maximum amount of heat to be transported and reduce thermal resistance by increasing the cross-sectional area of a vapor flow passage or a fluid flow passage, which has been limited by the length of a container in a height direction. A heat pipe (20) is provided with a protruding portion (24) so that the height of the wick-occupied portion (23) serving as the fluid flow passage is larger than the height of the space portion (22) serving as the vapor flow passage.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: June 12, 2018
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Hirofumi Aoki, Masami Ikeda, Yoshikatsu Inagaki
  • Patent number: 9962622
    Abstract: An object is to provide a highly-efficient evaporator capable of effectively avoiding reduction in steam generation efficiency due to the Leidenfrost phenomenon while maintaining a heating surface in a heating chamber for steam generation in a high-temperature region to be subjected to the influence of the Leidenfrost phenomenon by not reducing heating power required for heating the inside of the heating chamber from outside or not heat-insulating the heating chamber. To achieve this object, a sleeve-like sheet made of foamed nickel is disposed as a foamed member 64 containing metal as a principal component near a heating surface 69 and along an entire periphery of the heating surface 69 in a heating chamber 68 formed inside a pipe body 67 to be heated from the outside in such a manner as to contact the heating surface 69. While water supplied to the inside of the sleeve-like sheet passes through this inside, the water is diffused to permeate the surrounding sleeve-like sheet.
    Type: Grant
    Filed: July 1, 2014
    Date of Patent: May 8, 2018
    Assignee: SUMITOMO PRECISION PRODUCTS CO., LTD.
    Inventor: Makoto Hirakawa
  • Patent number: 9953771
    Abstract: A heat dissipation apparatus, system and method for an air circuit breaker (ACB) switchgear has at least one pair of primary contact toes constructed and arranged to connect to a terminal of the circuit breaker. A bus bar joint is connected to the primary contact toes. The heat dissipation apparatus comprises an evaporator clamped to the primary contact toes. A condenser is located at a higher elevation than the evaporator and at least two electrically isolating pipes fluidly connect the evaporator with the condenser. A dielectric fluid in the evaporator can be heated to a vapor state, with one of the pipes transferring the vapor to the condenser and the second pipe returning the condensed dielectric fluid back to the evaporator for cooling the at least one pair of primary contact toes.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: April 24, 2018
    Assignee: Anord Control Systems Limited
    Inventor: Patrick Kennelly
  • Patent number: 9939205
    Abstract: A heat dissipater having capillary component includes: a heat spreader including a shell member having at least one through hole and a first capillary structure disposed in the shell member; a heat pipe, received in the through hole and including a pipe member and a second capillary structure disposed in the pipe member. The pipe member includes an opening formed in the shell member; and a capillary component, accommodated in the shell member and including a block member extended with a protruding part and arranged adjacent to the first capillary structure. The protruding part is received in the opening and arranged adjacent to the second capillary structure. Accordingly, the heat pipe and the heat spreader can be combined for operation, and an internal working fluid can flow between the heat pipe and the heat spreader.
    Type: Grant
    Filed: April 2, 2015
    Date of Patent: April 10, 2018
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chien-Hung Sun, Lei-Lei Liu, Xiao-Min Zhang
  • Patent number: 9939170
    Abstract: The rapid thermal cycling of a material is targeted. A microfluidic heat exchanger with an internal porous medium is coupled to tanks containing cold fluid and hot fluid. Fluid flows alternately from the cold tank and the hot tank into the porous medium, cooling and heating samples contained in the microfluidic heat exchanger's sample wells. A valve may be coupled to the tanks and a pump, and switching the position of the valve may switch the source and direction of fluid flowing through the porous medium. A controller may control the switching of valve positions based on the temperature of the samples and determined temperature thresholds. A sample tray for containing samples to be thermally cycled may be used in conjunction with the thermal cycling system. A surface or internal electrical heater may aid in heating the samples, or may replace the necessity for the hot tank.
    Type: Grant
    Filed: August 25, 2015
    Date of Patent: April 10, 2018
    Assignee: Lawrence Livermore National Security, LLC
    Inventors: Neil Reginald Beer, William J. Benett, James M. Frank, Joshua R. Deotte, Christopher Spadaccini
  • Patent number: 9936608
    Abstract: Production of a heat absorption device comprising a first face intended to be in contact with a hot source and a second face opposite to the first face, a network of cells filled with a first phase change material being arranged between the first face, a passage between cells being filled with at least one second phase change material different from the first phase change material.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: April 3, 2018
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Ulrich Soupremanien, Emmanuel Ollier
  • Patent number: 9930811
    Abstract: An apparatus includes an enclosure defining an interior space and includes a server-rack port configured to engage one or more of racks such that one or more servers installed in each rack are contiguous to the interior space. The enclosure is inside of a room and each server includes a fan that draws air from the interior space into the server and expels the air outside of the enclosure into the room. The apparatus also includes a mixing chamber that is contiguous to the enclosure. The mixing chamber includes a set of one or more dampers that are contiguous to natural air outside of the room and that are opened up when a temperature outside reaches a threshold value.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: March 27, 2018
    Assignee: Excalibur IP, LLC
    Inventors: Scott Noteboom, Albert Dell Robison, Jesus Suarez, Norman Holt
  • Patent number: 9908643
    Abstract: A passive thermal system for use in aerospace vehicles includes a first passive thermal panel having at least one internal resident heat pipe, wherein the first passive thermal panel is further configured to provide an embedded interface between a portion of the resident heat pipe and at least one heat pipe extending from a neighboring passive thermal panel. The embedded interface is facilitated via an internal channel that is adjacent to the internal resident heat pipe. The channel is dimensioned and arranged to receive a portion of a heat pipe extending from a passive thermal panel that will be situated adjacent to the first passive thermal panel. The embedded interface is also facilitated by an arrangement that imparts a compressive force to the non-resident heat pipe that urges it against the resident heat pipe.
    Type: Grant
    Filed: August 5, 2015
    Date of Patent: March 6, 2018
    Assignee: WorldVu Satellites Limited
    Inventors: Alexander D. Smith, Armen Askijian, Daniel W. Field, James Grossman
  • Patent number: 9907206
    Abstract: A method of cooling a computer server that includes a plurality of server modules, and is positioned in an enclosed room, includes transferring heat generated by a server module of the plurality of server modules to a hot plate of a liquid cooling system. The liquid cooling system may be positioned within the server module, and the hot plate may have a surface exposed to the enclosed room. The method may also include positioning a cold plate of a room-level cooling system in thermal contact with the hot plate. The method may also include directing a cooling medium through the room-level cooling system to transfer heat from the hot plate to a cooling unit positioned outside the room.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: February 27, 2018
    Assignee: Asetek Danmark A/S
    Inventor: Steven B. Branton
  • Patent number: 9902931
    Abstract: A culture apparatus is provided which can suppress condensation on walls of a culture space and the like to suppress adverse effects on a culture material. In the culture apparatus having a culture space formed in a heat insulating box main body, a humidification water reservoir for humidifying the culture space is disposed in the heat insulating box main body. A heat transfer condensation member in which a condensation portion at one end and a cooling portion at the other end are integrated is disposed such that the cooling portion is disposed outside the heat insulating box main body, while the condensation portion is disposed inside the culture space. The condensation portion is disposed so that condensed water on the surface thereof is led into the humidification water reservoir.
    Type: Grant
    Filed: September 22, 2015
    Date of Patent: February 27, 2018
    Assignee: PANASONIC HEALTHCARE HOLDINGS CO., LTD.
    Inventors: Tomoyoshi Tokumaru, Masahiko Kobayashi
  • Patent number: 9897393
    Abstract: The present invention relates to a heat dissipating module which comprises a first flat shell body and a plurality of second flat shell bodies. The first flat shell body has a first chamber and a first wick structure formed on an inner wall of the first chamber. Each of the second flat shell bodies defines a second chamber which is provided with a working fluid and a second wick structure therein. Each of the second flat shell bodies has a heat pipe plugged and connected to the first flat shell body. Therefore, the working fluid in each of the second chambers flows into the first chamber through the corresponding heat pipes to perform heat dissipation by liquid-vapor circulation.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: February 20, 2018
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Wen-Ji Lan
  • Patent number: 9874708
    Abstract: An optical module blind mating heat relay system, comprising a linecard comprising a circuit board; a heat relay apparatus comprising a first heat pipe on the circuit board, a radiator attached to the circuit board and in thermal contact with the first heat pipe; a heat relay receiver assembly comprising a receiver housing having a slot and a contact slug connected to the receiver housing and in thermal contact with the first heat pipe; a pluggable optical module removably engaged with the linecard; and a second heat pipe having a pluggable optical module portion contacting the pluggable optical module and having a plug portion removably positioned within the slot of the receiver housing, the plug portion in thermal contact with the contact slug, the second heat pipe removable from the receiver housing while the linecard is receiving electrical power.
    Type: Grant
    Filed: December 31, 2015
    Date of Patent: January 23, 2018
    Assignee: Infinera Corporation
    Inventor: Matthew James Kelty
  • Patent number: 9863716
    Abstract: A heat exchanger is disclosed which includes a plurality of heat exchanger plates. Each plate has a plurality of hollowed out pins arranged in a pin fin pattern. Each plate also includes an inlet aperture and an outlet aperture in fluid communication with one another. A plurality of heat pipes are defined by several of the plurality of hollowed out pins. A wicking material is arranged within the several hollowed out pins. A heat transfer fluid at least partially fills each heat pipe.
    Type: Grant
    Filed: July 26, 2013
    Date of Patent: January 9, 2018
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Jay W Kokas, Leo J Veilleux, Jr., Rudolph Thomas Beaupre
  • Patent number: 9858753
    Abstract: Techniques for reducing electromagnetic (EM) emission in a wager-based gaming machine. A gaming machine includes one or more processors configured to generate a bus clock signal having a fundamental frequency and fundamental spectral components at harmonics of the fundamental frequency. The fundamental spectral components each have a fundamental amplitude. A signal processor is configured to generate a spread spectrum clock signal having a nominal frequency substantially equivalent to the fundamental frequency of the bus clock signal as well as nominal spectral components at harmonics of the nominal frequency. However, the nominal spectral components each have a nominal amplitude less than the fundamental amplitude of a fundamental spectral component at the same harmonic. A bus connects the signal processor with one or more elements and carries the spread spectrum clock signal to the one or more elements, thereby reducing EM emissions from the bus.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: January 2, 2018
    Assignee: IGT
    Inventors: Calvin DeCoursey, Gene E. Powell
  • Patent number: 9746249
    Abstract: A heat pipe structure includes a first tubular body and a second tubular body. The first tubular body has a first receiving space. A first working fluid is contained in the first receiving space. The second tubular body is disposed in the first receiving space. The second tubular body has a second receiving space. A second working fluid is contained in the second receiving space. The solidification temperature of the first working fluid is different from the solidification temperature of the second working fluid so that the heat pipe structure can be activated at low temperature to keep operating at normal temperature to enhance the performance. Moreover, the assembly applicability is enhanced to lower the assembling cost.
    Type: Grant
    Filed: November 12, 2014
    Date of Patent: August 29, 2017
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Sung-Wei Lee
  • Patent number: 9746248
    Abstract: A heat pipe system for conducting thermal energy. The heat pipe system includes a sealed tube having along its length a reservoir region, an evaporator region, and a condenser region, the tube having a first end and a second end and an inside wall. The system also includes a wick disposed adjacent the inside wall of the tube, the wick including a first portion at the first end of the tube and a second portion adjacent the first portion, wherein the first portion of the wick is thicker than the second portion of the wick, and wherein the second portion of the wick does not extend to the second end of the tube. The system also includes a working fluid contained within the tube.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: August 29, 2017
    Assignee: Thermal Corp.
    Inventors: Sergey Y. Semenov, John Gilbert Thayer, Nelson J. Gernert
  • Patent number: 9721869
    Abstract: The heat sink structure includes a vapor chamber, a heat pipe, and capillary elements. The vapor chamber includes a housing, a first capillary structure covering inside the housing, and a first working fluid filled inside the housing. The housing includes through holes and an inner top wall. Both ends of the heat pipe are inserted through the two through holes respectively and are exposed from the housing. The heat pipe includes a pipe body, a second capillary structure covering inside the pipe body, and a second working fluid filled inside the pipe body. Each of the capillary elements is connected to the inner top wall. One end of each of the capillary elements is in contact with the first capillary structure, and the other end of each of the capillary elements is in thermal contact with the heat pipe.
    Type: Grant
    Filed: March 19, 2015
    Date of Patent: August 1, 2017
    Assignee: COOLER MASTER CO., LTD.
    Inventor: Chien-Hung Sun
  • Patent number: 9715241
    Abstract: A wireless system for monitoring and control of the temperature of a product in transport includes a controller system wirelessly connected to a temperature system and a valve control system. The temperature system measures the current temperature of the product and wirelessly transmits the temperature information to the controller system. The valve control system controls the position of a valve allowing heated fluid to move through the product, heating the product. The controller system allows an operator to input a high temperature limit and low temperature limit and alarm, and using the current temperature of the product, wirelessly signals the valve control system to open or close the valve in order to keep the temperature of the product between the high temperature limit and low temperature limit. The controller system monitors and records the product temperature, high and low temperature limits and alarms, and provides a report of the data.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: July 25, 2017
    Assignee: Knappco Corporation
    Inventor: Claude W. Mixon
  • Patent number: 9714777
    Abstract: A thermal control arrangement includes a first heat pipe and a plurality of thermoelectric coolers. The plurality of thermoelectric coolers is disposed between the first heat pipe and a thermal load, each of the plurality of thermoelectric coolers having a first surface and a second surface, each respective first surface having a first thermally conductive coupling to the first heat pipe and each respective second surface having a second thermally conductive coupling to the thermal load.
    Type: Grant
    Filed: February 18, 2014
    Date of Patent: July 25, 2017
    Assignee: Space Systems/Loral, LLC
    Inventor: Gordon Wu
  • Patent number: 9706688
    Abstract: In accordance with embodiments of the present disclosure, a system may include a structural element and a heat pipe. The structural element may be for mechanically supporting an information handling resource. The heat pipe may be thermally and mechanically coupled to the structural element, such that the heat pipe conducts heat generated by an information handling resource supported by the structural element to the structural element.
    Type: Grant
    Filed: September 2, 2014
    Date of Patent: July 11, 2017
    Assignee: Dell Products L.P.
    Inventors: Russell C. Smith, William K. Coxe, Corey Dean Hartman, Andrew L. McAnally
  • Patent number: 9677041
    Abstract: A culture apparatus is provided which can suppress condensation on walls of a culture space and the like to suppress adverse effects on a culture material. In the culture apparatus having a culture space formed in a heat insulating box main body, a humidification water reservoir for humidifying the culture space and a heat transfer condensation member penetrating the heat insulating box main body are provided. One end of the heat transfer condensation member is disposed inside the culture space, while the other end is disposed outside the heat insulating box main body. The heat transfer condensation member is positioned such that a condensation portion disposed inside the culture space is inclined downward to the one end, and the one end leads condensed water condensed on the surface of the condensation portion into the humidification water reservoir.
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: June 13, 2017
    Assignee: PANASONIC HEALTHCARE HOLDINGS CO., LTD.
    Inventors: Tomoyoshi Tokumaru, Masahiko Kobayashi
  • Patent number: 9554491
    Abstract: A data center cooling system includes a cooling liquid supply conduit fluidly coupled between a cooling plant and an air-to-liquid heat exchanger positioned to receive a heated airflow from one or more racks. At least one rack supports a plurality of heat-generating electronic devices. The system further includes a cooling liquid return conduit fluidly coupled between the cooling plant and the air-to-liquid heat exchanger; and a heat transfer module thermally coupled to the cooling liquid supply and return conduits between the cooling plant and the air-to-liquid heat exchanger. The heat transfer module includes a cold side and a warm side, with the cold side thermally coupled to the cooling liquid supply conduit to transfer heat from a flow of a cooling liquid in the cooling liquid supply conduit to the warm side of the heat transfer module, and the warm side including a heat sink.
    Type: Grant
    Filed: July 1, 2014
    Date of Patent: January 24, 2017
    Assignee: Google Inc.
    Inventors: Eehern J. Wong, Gregory P. Imwalle, Emad Samadiani
  • Patent number: 9528728
    Abstract: A parallel magnetic refrigerator assembly, includes at least two magnetocaloric stages arranged in parallel connection, each having in use a cold side and a hot side; each magnetocaloric stage including hot and cold side heat exchange circuit for carrying a heat exchange fluid to respectively receive and transfer heat from the magnetocaloric stages; wherein the hot and cold side heat exchange circuit are configured such that in use a heat exchange fluid passes in thermal contact with the respective hot and cold sides of both magnetocaloric stages. The magnetocaloric stages have substantially the same temperature spans but different cold end and hot end temperatures. In this way the device temperature span may be substantially larger than the individual temperature span of each magnetocaloric stage.
    Type: Grant
    Filed: January 29, 2010
    Date of Patent: December 27, 2016
    Assignee: TECHNICAL UNIVERSITY OF DENMARK
    Inventors: Anders Smith, Christian R. H. Bahl, Nini Pryds
  • Patent number: 9504187
    Abstract: An electronic device housing, includes: a housing case including a housing area which houses a heat generating component; a duct, including ends which are in communication with the housing area at different positions respectively and a body portion disposed outside the housing area, in which first air inside housing case which is heated by the heat generating component flows; and a flow device, disposed in the housing case, configured to circulate the first air and make second air which radiates heat in the duct flow towards a side of the housing area side.
    Type: Grant
    Filed: March 4, 2015
    Date of Patent: November 22, 2016
    Assignee: Fujitsu Limited
    Inventors: Yuichi Hagiwara, Takao Tomiyama, Manabu Miyamoto, Hiroshi Yano, Kenichi Oide, Yoshihiro Ito, Takanori Iwamatsu
  • Patent number: 9491892
    Abstract: Cooling systems for providing cooled air to electronic equipment are described. The systems can include large storage tanks or waste treatment systems to improve the efficiency of the plant and reduce impact on the environment.
    Type: Grant
    Filed: October 7, 2013
    Date of Patent: November 8, 2016
    Assignee: Google Inc.
    Inventors: Andrew B. Carlson, William Hamburgen, Donald L. Beaty, Robert Wasilewski
  • Patent number: 9470924
    Abstract: The exemplary embodiments herein provide a figure eight closed loop of circulating gas pathways wrapping around an electronic display. One or more open loop ambient air pathways may pass through the figure eight but do not allow the circulating gas and the ambient air to mix. In some embodiments, the open loop ambient air pathway travels along a rear surface of the electronic display. In some embodiments, the circulating gas pathways contain a front channel placed in front of the electronic display, a rear channel placed behind the electronic display, and a center channel placed between the front and rear channels. Pass-through apertures may be placed within the path of the circulating gas and/or the ambient air to allow the paths of the two gaseous matters to cross without allowing them to mix with one another.
    Type: Grant
    Filed: July 8, 2014
    Date of Patent: October 18, 2016
    Assignee: Manufacturing Resources International, Inc.
    Inventors: William Dunn, Kevin O'Connor
  • Patent number: 9470431
    Abstract: A method for measuring HVAC efficiency is disclosed which may be used to test various elements within the HVAC system to determine whether any element, such as a heating coil, is operating at an acceptable efficiency when compared to design specifications or previously established standards. The method may also be used to easily determine volumetric flow rate of air through the system at various points simply.
    Type: Grant
    Filed: April 29, 2015
    Date of Patent: October 18, 2016
    Inventor: Lance Rock
  • Patent number: 9445533
    Abstract: An electronic component case for a vehicle is provided. The electronic component case includes a case body having a first space in which electronic components are disposed and a second space, which has an opening that is opened to the outside, defined adjacent to the first space to receive heat generated from the electronic components, wherein a coolant for cooling the electronic components is introduced into and discharged from the second space, and a cover disposed on the case body to seal the opening of the second space. The cover includes a first cover sealing the opening and a second cover sealing the opening and having one surface on which a first cooling part for increasing a surface area of the second cover is disposed. The first cover and the second cover are compatible with each other.
    Type: Grant
    Filed: November 18, 2014
    Date of Patent: September 13, 2016
    Assignee: LSIS CO., LTD.
    Inventor: Jong In Sun
  • Patent number: 9426932
    Abstract: A server includes a tray that has a front portion and a back portion. A motherboard is disposed in the front portion of the tray and the motherboard is coupled to a heat sink. A fan is disposed in the back portion of the tray. A hard drive is disposed between the motherboard and the fan and the hard drive is operatively connected to the motherboard. The server also includes a heat pipe that has a body longitudinally bounded by an inlet and an outlet. The inlet is coupled to the heat sink, while the outlet is coupled to the fan. The body of the heat pipe extends past the hard drive. A power supply is also disposed in the tray and is operatively connected to the motherboard, the fan, and the hard drive.
    Type: Grant
    Filed: June 29, 2013
    Date of Patent: August 23, 2016
    Assignee: Silicon Graphics International Corp.
    Inventors: Robert Michael Kinstle, Kevin Schlichter, Seitu Barron
  • Patent number: 9366484
    Abstract: A heat dissipation pipe loop and a backlight module using the heat dissipation pipe loop are provided. The heat dissipation pipe loop includes: a first evaporator section, a second evaporator section arranged opposite to the first evaporator section, a first pipe, a second pipe arranged opposite to the first pipe, and a heat dissipation liquid arranged in the first pipe and the second pipe. The first pipe includes a first gas pipe connected to the first evaporator section, a first condenser pipe connected to the first gas pipe, and a first liquid pipe connected to the first condenser pipe and the second evaporator section. The second pipe includes a second gas pipe connected to the second evaporator section, a second condenser pipe connected to the second gas pipe, and a second liquid pipe connected to the second condenser pipe and the first evaporator section.
    Type: Grant
    Filed: November 28, 2013
    Date of Patent: June 14, 2016
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
    Inventor: Gang Yu
  • Patent number: 9341468
    Abstract: A measuring apparatus includes a light projecting and receiving device configured to project and receive light, and measures an object based on the projected and received light. The measuring apparatus comprises a chamber configured to enclose a first space for accommodating the object; a partition configured to separate the first space from a second space which accommodates the light projecting and receiving device, and configured to transmit the light; a first regulator configured to regulate temperature of the first space to a first temperature by flowing a gas through the first space; and a second regulator configured to regulate temperature of the second space to a second temperature different from the first temperature by flowing a gas through the second space. The partition includes a plurality of partition walls disposed with a gap.
    Type: Grant
    Filed: November 3, 2013
    Date of Patent: May 17, 2016
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Tomofumi Nishikawara, Takahiro Yamamoto
  • Patent number: 9303856
    Abstract: A backlight unit includes a chassis, an LED, a light guide plate, a duct member, and dissipative LED attachment portion. The chassis includes a light exit portion through which light exits. The LED is arranged close to an end portion of the chassis. The light guide plate is arranged closer to a middle area of the chassis than the LED and light from the LED is guided toward the light exit portion thereby. The duct member is arranged on the side opposite to the light exit portion side of the chassis and has an air passage therein. The dissipative LED attachment portion is provided to the duct member and includes one part facing the air passage and another part protruding to inside of the chassis and to which the LED is attached.
    Type: Grant
    Filed: January 25, 2013
    Date of Patent: April 5, 2016
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Mitsuru Hosoki
  • Patent number: 9238513
    Abstract: Spacecraft, radiator panels for spacecraft, kits for radiator panels, inserts associated with radiator panels, heat pipes associated with radiator panels, and methods of assembling radiator panels are disclosed herein. Radiator panels according to the present disclosure include at least one insert that is positioned adjacent to a heat pipe between two spaced-apart face-sheets, with the insert being configured to secure a package to the inside face-sheet opposite of the heat pipe.
    Type: Grant
    Filed: March 6, 2012
    Date of Patent: January 19, 2016
    Assignee: The Boeing Company
    Inventor: Richard William Aston
  • Patent number: 9234453
    Abstract: A cover for a charge air cooler of a turbocharged engine. The cover body defines a cooling water plenum, which has an opening at a first side of the cover for attachment over a water outlet of the charge air cooler. A plurality of valve housings are formed integrally with the body of the cover at a second side of the cover opposite the cooling water plenum opening. Each valve housing has a peripheral wall that extends from the cover to define an inner chamber, which opens into an inner fluid passage formed in the cover.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: January 12, 2016
    Assignee: General Electric Company
    Inventors: Charles Atz, Pranav Raina, Nitin Kumar N, Surendra Panwar, Anand Gosbal
  • Publication number: 20150144076
    Abstract: A heat recovery vapor trap is provided for removal of vapor condensate from a container, while preventing any appreciable escape of vapor, and for achieving beneficial heat recovery from said condensate prior to temperature degradation associated with depressurization, whereby useful heating to much higher temperature is possible. The trap is indirect acting, and is preferably mechanically actuated by a float.
    Type: Application
    Filed: June 13, 2014
    Publication date: May 28, 2015
    Inventor: Donald C. Erickson
  • Publication number: 20150135755
    Abstract: A high efficiency ventilation system may include a partition configured to separate a supply air stream and a return air stream, an energy recovery ventilator, a heat recovery ventilator, a refrigerant flow controlling condensing unit, and a direct expansion coil. The refrigerant flow controlling condensing unit may be configured to send a refrigerant to the direct expansion coil and configured to receive a refrigerant from the direct expansion coil. The direct expansion coil may be disposed between the energy recovery ventilator and the heat recovery ventilator. The high efficiency ventilation system may be configured to supply ventilation air to a controlled environment at a particular temperature and a particular humidity.
    Type: Application
    Filed: November 15, 2014
    Publication date: May 21, 2015
    Inventors: David Rich, Kevin Krimmel
  • Patent number: 9030823
    Abstract: Disclosed herein is a heat dissipation system for a power module, including: first cooling medium flow parts and second cooling medium flow parts allowing cooling media to flow in first and second directions, respectively.
    Type: Grant
    Filed: September 11, 2012
    Date of Patent: May 12, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kwang Soo Kim, Do Jae Yoo, Young Ho Sohn, Bum Seok Suh, In Wha Jeong
  • Publication number: 20150114599
    Abstract: An air intake duct of a motorcycle extends rearwardly from a front portion of a motorcycle body so as to pass laterally of the left side of a motorcycle frame structure, and incoming wind is supplied as an intake air through the air intake duct to a combustion engine. The air intake duct is divided in a widthwise direction of the motorcycle. An upper dividing face of the air intake duct is disposed inward of an intermediate position, in a motorcycle widthwise direction, of the air intake duct.
    Type: Application
    Filed: January 6, 2015
    Publication date: April 30, 2015
    Inventors: Shohei Naruoka, Hisatoyo Arima, Satoaki Ichi, Hiroyuki Watanabe, Kozo Arai, Yoshinobu Tanaka
  • Publication number: 20150114598
    Abstract: A device of heat transfer is provided. A heating pipe is connected with an external heat source. A communicating pipe set is contacted with a heat sink. A heat-transfer fluid spontaneously circulates inside reverse thermosiphon loop and transfers heat downwardly. A heat source is located at a higher level and the heat sink is located at a lower level. Heat transfer distance is long and no additional power is required. The heat transferred can be used for heating other fluid or solid. Besides, the heat can be used for transforming thermal energy into electric energy in conjunction with a Stirling engine, an organic Rankine engine or a thermoelectric module.
    Type: Application
    Filed: July 16, 2014
    Publication date: April 30, 2015
    Inventors: Heng-Yi Li, Tsair-Fuh Huang, Meng-Chang Tsai
  • Patent number: 8991476
    Abstract: An objective of the present invention is to store heat into a thermal storing material using a plurality of thermal transport mediums, in a thermal storage device utilizing natural convection of a thermal storage material resulting from temperature difference of the thermal storage material. The thermal storage device of the invention has a plurality of thermal transport mediums 6a and 6b having different temperatures, a thermal storage material 2 which stores heat of the thermal transport mediums 6a and 6b or whose heat is drawn by the thermal transport mediums 6a and 6b, a thermal storage portion 1 accommodating the thermal storage material 2, and a first and a second thermal storage tanks 3 and 4 formed by dividing an inner space of the thermal storage portion 1, and a thermal exchange between the thermal transport medium 6a or 6b and the thermal storage material 2 takes place in the individual thermal storage tanks.
    Type: Grant
    Filed: January 31, 2008
    Date of Patent: March 31, 2015
    Assignees: Toyota Jidosha Kabushiki Kaisha, T.Rad Co., Ltd.
    Inventors: Kenji Tsubone, Seiichi Hashi, Masahito Tsukahara, Masataka Fukuzawa, Kouji Narita
  • Publication number: 20150083368
    Abstract: A heat exchanger has a liquid-liquid heat exchange region and a gas-liquid heat exchange portion. The heat exchange can define a continuous liquid flow path through the liquid-liquid heat exchange region and through the gas-liquid heat exchange portion. The continuous flow path can first pass through the liquid-liquid heat exchange region and then through the gas-liquid heat exchange portion. In other embodiments, the continuous flow path first passes through the gas-liquid heat exchange portion and then through the liquid-liquid heat exchange portion. In some embodiments, the heat exchanger includes a plurality of liquid-liquid heat exchange regions and a plurality of air-liquid heat exchange regions juxtaposed therewith relative to the continuous flow path.
    Type: Application
    Filed: November 22, 2014
    Publication date: March 26, 2015
    Inventor: Geoff Sean Lyon
  • Publication number: 20150075750
    Abstract: A charge-air cooling device for a fresh air system of an internal combustion engine may include a housing which contains a charge-air duct and a heat exchanger having an internal coolant path and an external charge-air path. The housing may have a mounting opening, through which the heat exchanger is pushed into the housing in a longitudinal direction of the heat exchanger such that, in a pushed-in state, the charge-air duct leads through the charge-air path. The housing may include at least one wall in a receiving region which receives the heat exchanger. The wall may be elastic and, by the heat exchanger being pushed into the receiving region, the wall may be transferred from a relaxed state when the heat exchanger has not been pushed into the receiving region, into a stressed state when the heat exchanger has been pushed into the receiving region.
    Type: Application
    Filed: March 7, 2013
    Publication date: March 19, 2015
    Inventors: Veit Bruggesser, Oliver Fischer, Juergen Stehlig