Abstract: Disclosed is a machine having a moving member. The moving member including a cold plate having a plurality of slots through the cold plate. The moving member also including a plurality of ferromagnetic cores coupled to the cold plate, each of the plurality of ferromagnetic cores protruding through a respective one of the plurality of slots, creating gaps between the plurality of ferromagnetic cores. The moving member also including a plurality of armature windings coupled to the cold plate, the plurality of armature windings occupying the gaps between the plurality of ferromagnetic cores.

Abstract: A method, apparatus, and system provide the ability to design a convective cooling channel in a computer. Input data is acquired and includes a geometry of an object to be cooled, a design objective, and boundary conditions. Channel designs corresponding to the input data are generated using an iterative topology optimization. One of the channel designs is selected and output.

Abstract: A heat exchange device includes a heat exchanger and two pumps. The heat exchanger defines a heat exchange pathway, an inflow pathway communicated with the heat exchange pathway for guiding a cooling liquid to flow into the heat exchange pathway, and an outflow pathway opposite to the inflow pathway for guiding the cooling liquid to flow out from the heat exchange pathway. Each of the pumps includes a case body defining a flow-guiding chamber communicated with and disposed between the heat exchange pathway and the outflow pathway, a rotor mounted in the flow-guiding chamber, and a stator mounted to the case body for driving rotation of the rotor, facilitating flowing movement of the cooling liquid toward the outflow pathway.

Abstract: Transmissions and methods therefor are disclosed herein. A transmission includes a housing, an input shaft, and a cooling unit. The input shaft extends outside of the housing and is configured to receive rotational power from a rotational power source. The cooling unit is supported by the input shaft. The cooling unit includes a heat exchanger.

Abstract: A thermal transistor is provided. The thermal transistor includes a metallic thermal conductor, a non-metallic thermal conductor, and a thermal resistance adjusting unit. The metallic thermal conductor and the non-metallic thermal conductor are contact with each other to form a thermal interface. The thermal resistance adjusting unit is configured to generate an bias voltage U12 between the metallic thermal conductor and the non-metallic thermal conductor.

Abstract: A coolant supply device includes a coolant tank having first and second coolant reservoirs arranged in parallel with a predetermined space therebetween and a communicating part arranged between the first and second coolant reservoirs to allow them to communicate with each other, and formed to have a U-shaped overall shape. The coolant supply device further includes pumps pumping up coolant from the second coolant reservoir and supplying the coolant to predetermined destinations. The coolant supplied by the pumps is returned to the first coolant reservoir and flows into the second coolant reservoir through the communicating part. The first coolant reservoir has a first agitating nozzle body disposed therein for discharging coolant to assist a flow of coolant flowing toward the communicating part, and the second coolant reservoir has a second agitating nozzle body disposed therein for discharging coolant to assist a flow of coolant flowing therein from the communicating part.

Abstract: A heat dissipating device includes a bottom assembly, a first light guide positioned on the bottom assembly, a first light assembly positioned on the first light guide, and an outer cover positioned on the bottom assembly and at least partially enclosing the bottom assembly, the first light guide, and the first light assembly. The outer cover defines a first opening on a top surface thereof, at least a portion of the first light guide is received in the first opening, and light from the first light assembly is emitted from the heat dissipating device through the exposed portion of the first light guide.

Abstract: Modular cooling water assemblies for combined cycle power plant systems are disclosed. Each of the assemblies may include a pump and a heat exchanger, both positioned on a support structure. Additionally, each of the assemblies may include a closed cooling water system supported by the support structure. The closed cooling water system may include a return header fluidly coupled to a return conduit for receiving cooling water previously utilized by the combined cycle power plant system. The closed cooling water system may also include a supply header positioned adjacent the return header, and fluidly coupled to a supply conduit for supplying the cooling water to the combined cycle power plant system. Additionally, the closed cooling water system may include a closed cooling water circuit fluidly coupling the return header to the supply header. The closed cooling water circuit may be fluidly coupled to the heat exchanger and the pump.

Abstract: A liquid cooling module for cooling an electronic component includes a housing supporting the electronic component, where the housing includes a cavity containing a cooling liquid. A liquid flow channel can be in fluid communication with the cavity and define a liquid cooling loop. A cold plate supporting the housing can have a cooling channel thermally coupled to the liquid flow channel.

Abstract: A flow path member may include silicon nitride ceramics. The flow path member may have an inlet port, an outlet port, and a flow path connected to the inlet port and the outlet port inside the flow path member. A plurality of needle-shaped crystals may be arranged on a surface of the flow path where the needle-shaped crystals intersect each other.

Abstract: Systems and methods for dissipating heat from an electrical component using an external structure of a trailer or shed as a heat sink are disclosed. A heat-producing electrical component such as a variable frequency drive (VFD) using an insulated-gate bipolar transistor (IGBT) is housed in a trailer and is thermally coupled to an exterior wall of the trailer to use the wall as a heat sink to dissipate heat from the VFD and IGBT. An adapter can be used to couple VFDs and IGBTs of different sizes and configurations to a support site on the exterior wall.

Abstract: In accordance with embodiments of the present disclosure, a system may include an information handling resource and an expansion cold plate thermally coupled to the information handling resource and configured to be fluidically coupled to a refrigeration system and configured to expand a refrigerant within the expansion cold plate in order to cool the information handling resource.

Abstract: A turbomachine includes a compressor having an inter-stage gap between adjacent rows of rotor blades and stator vanes. A combustor is connected to the compressor, and a turbine is connected to the combustor. An intercooler is operatively connected to the compressor, and includes a first plurality of heat pipes that extend into the inter-stage gap. The first plurality of heat pipes are operatively connected to a first manifold, and the heat pipes and the first manifold are configured to transfer heat from the compressed airflow from the compressor to heat exchangers. A cooling system is operatively connected to the turbine, and includes a second plurality of heat pipes located in the turbine nozzles. The second plurality of heat pipes are operatively connected to a second manifold, and the heat pipes and the second manifold are configured to transfer heat from the turbine nozzles to the heat exchangers.

Abstract: A plane heating element includes a mesh that has warp threads and weft threads. A coating containing carbon nanotubes can be applied to the mesh. A water-repellent and electrically-insulating protective layer made of styrene butadiene copolymer can be additionally applied to the mesh.

Abstract: An energy storage power plant for harvesting electric energy, and suitable for converting electric energy into thermal energy is provided. The thermal energy can be temporarily stored in at least two thermal stores until demanded and retrieved to increase the energy content of water in a water circuit upon demand. The power plant has the at least two thermal stores, each has at least one converting device that allows electric energy to be directly or indirectly converted into thermal energy, the thermal stores being thermally chargeable by temporarily storing thermal energy, wherein one thermal store is for storing sensible heat and one thermal store is for storing latent heat; and at least one energy generating unit operated using the water in the water circuit, the energy content of the water having been increased by the temporary storage of thermal energy, in order to generate electric energy when operated.

Abstract: A cooling structure for an inverter (31) controls a motor (6) to drive an automobile. This inverter device (22) includes a power circuit section (28) having an inverter (31) to convert a DC power of a battery (19) to an AC power for the motor (6), and a casing (39) enclosing the power circuit section (28). A fin (41) is provided in an outer surface of the casing (39), a coolant path (42) for the flow of a cooling medium is provided within the casing (39) or in the outer surface thereof, and a pump (43) circulating the cooling medium in the coolant path (42) is disposed on or in the casing (39). With this structure, the flow resistance for cooling the inverter (31) is reduced to allow the pump (43) to be downsized and a proper cooling can be accomplished to the amount of heat by the inverter (31).

Abstract: A heat conveying structure for an electronic device, the heat conveying structure including an evaporating section that has a chamber structure with first fins erected therein, is thermally connected to the electronic device, evaporates a liquid coolant on the surfaces of the first fins to thereby change the liquid coolant to a vapor coolant, and sends out liquid coolant present near the first fins along with the vapor coolant as a gas-liquid two-phase flow coolant, a condensing section that has a chamber structure with second fins erected therein, and changes the gas-liquid two-phase flow coolant in contact with the second fins to a liquid coolant, a vapor pipe that connects the evaporating section and the condensing section, and moves the gas-liquid two-phase flow coolant sent out from the evaporating section to the condensing section, and a liquid pipe that connects the evaporating section and the condensing section.

Abstract: A system for regulating the temperature and flow rate of a heat transfer fluid for use in a hybrid steam-generating plant is described. A bypass section may be incorporated into the piping network of a primary steam-generating source to route heat transfer fluid from a hot source to a mixer downstream of at least one heat exchanger. Heat transfer fluid from the hot source may be mixed with cooler heat transfer fluid exiting the heat exchanger in the event that the supply from a secondary steam-generating source is lost or becomes intermittent. The result is a system that maintains a constant flow rate of heat transfer fluid through the heat exchangers while minimizing adverse temperature gradient effects that may result from steam production variability and plant operation outside of design point parameters.

Abstract: A flow path member 1 according to one aspect of the invention includes a main body 4 formed of a ceramic sintered body in which a first flow path 6 is provided so as to allow a fluid to flow therethrough, wherein the main body 4 includes a projection 10 formed of part of the ceramic sintered body on an inner wall of the first flow path 6. An adsorption device according to one aspect of the invention includes the flow path member 1 that adsorbs a workpiece 2 and a fluid supplying unit that supplies a fluid to the first flow path 6 of the flow path member 1. A cooling device according to one aspect of the invention includes the flow path member 1 that cools an object and a fluid supplying unit that supplies a fluid which is a cooling fluid to the first flow path 6 of the flow path member 1.

Abstract: A heat dissipating assembly suited for an electronic device is provided. The electronic device has at least one heat source. The heat dissipating assembly includes a first tube, a second tube, and a fluid. The first tube has an inlet and an outlet, wherein a bore size of the inlet is smaller than a bore size of the outlet. Heat generated from the heat source is transferred to the first tube. Two opposite ends of the second tube are connected to the inlet and the outlet such that the first and the second tubes are formed into a closed loop. The fluid is filled in the closed loop. The fluid in the first tube transferred from the inlet toward the outlet absorbs the heat and is transferred to the second tube for heat dissipating. An electronic device is also provided.

Abstract: A cooling member includes a heat-transfer member, a refrigerant introducing pipe and a covering material. The heat-transfer member has a surface with a groove opened to the surface of the heat-transfer member. The refrigerant introducing pipe is pressed into the groove. The covering material coats the surface of the heat-transfer member and the refrigerant introducing pipe.

Abstract: A heat exchanger is provided, in particular for a motor vehicle, with at least one thermoelectric element to generate a heat flow, wherein the thermoelectric element is arranged on a carrier element, wherein several carrier elements arranged on top of one another along a stacking spindle form a carrier element stack, in which a first fluid channel for a first fluid and a second fluid channel for a second fluid, fluidically separated from the first, are constructed.

Abstract: A water-blocking apparatus for cooling water for a hot-rolled steel sheet according to the present invention, which blocks cooling water sprayed onto a hot-rolled steel sheet at a sprayed water density of higher than 4 m3/m2/min and equal to or less than 10 m3/m2/min when the hot-rolled steel sheet is cooled after finish rolling of a hot-rolling process, includes: a plurality of water-blocking nozzles which spray water-blocking water onto the hot-rolled steel sheet. Impact areas of the water-blocking water respectively sprayed from the water-blocking nozzles are continuously lined up in a straight line in a width direction of the hot-rolled steel sheet on a surface of the hot-rolled steel sheet and the adjacent impact areas partially overlap.

Abstract: A cooling device for cooling heat-generating devices such as disk laser according to a desired thermal profile to generate desired edge effects and optical properties. An example cooling device includes a back plate for supporting the heat-generating device. The back plate is part of a cooling device housing with a wall providing an enclosure that contains a nozzle member. The nozzle member encloses the cooling device housing on a side opposite the back plate. A nozzle coolant surface is formed on an end of the nozzle member. The nozzle coolant surface extends outward from its center to an edge to form a coolant chamber with the back plate. Coolant fluid may enter the coolant chamber through inlet paths formed in the nozzle member and exit through a chamber gap between the nozzle coolant surface edge and inside of the housing wall.

Abstract: The disclosure provides a cooler for use in a plasma generation chamber of a radiation source for an extreme ultraviolet wavelength range. The cooler has a heat sink which is at least partially manufactured of a substrate material having a thermal conductivity of greater than 50 W/mK. A coolant duct is formed in the substrate material, and the coolant duct is configured to have a coolant flow therethrough. The cooler also includes a connection piece made of a metal or a metal alloy for connecting a coolant line to the coolant duct. The cooler further includes a connecting element for connecting the connection piece to the heat sink so that, when the connection piece is connected to the heat sink, a continuous line is formed by the coolant duct and the coolant line.

Abstract: A single-pass cold plate assembly having a base and a cover arranged in confronting relationship to define a cold plate with a spiral channel and a manifold with the manifold having a manifold inlet and a manifold outlet and where coolant may be introduced into the manifold inlet and may complete a single pass through the cold plate assembly.

Abstract: A heat-receiver includes: a first plate that receives heat at one face from a heat generating body; a second plate that is disposed facing another face of the first plate with a spacing therebetween, and that has a greater plate thickness than a plate thickness of the first plate; a first coupling portion that couples together the first plate and the second plate; and a second coupling portion that couples together the first plate and the second plate at a position that faces across the first plate toward the heat generating body, with a gap between the second coupling portion and the first coupling portion through which a coolant is capable of passing, and that has a width along the other face of the first plate that is greater than a width of the first coupling portion, as viewed along the coolant passing direction.

Abstract: A temperature control system for a semiconductor manufacturing process having at least one target includes: a heat exchange loop operatively associated with each target, and a mixing valve operatively associated with each heat exchange loop. This mixing valve has a body defining a mixing chamber. The mixing chamber has an inlet, an outlet, a hot inlet, a cold inlet, and a closure means associated with each inlet. Alternatively, the mixing valve may include: a body defining a mixing chamber, the mixing chamber having an inlet, an outlet, a hot inlet, and a cold inlet, a moveable gate operatively associated with each inlet for controlling the flow of fluid through said inlets, and a motor for moving the gates. A process for manufacturing semiconductors includes the step of providing a temperature control system having at least one target including a mixing valve, as described above.

Abstract: An adjustable frequency drive including a number of power modules and a heat management system is provided. Each of the number of power modules includes a number of inverters. Each inverter includes a number of power poles. The heat management system includes a housing assembly, a first heat management assembly, and a second heat management assembly. The housing assembly defines a power module enclosure and a liquid cooling assembly enclosure. The first heat management assembly is substantially disposed in the power module enclosure. The second heat management assembly is not substantially disposed in the power module enclosure.

Abstract: A housing or other enclosure used to facilitate fluid cooling of a circuitry of a battery charger, such as but not limited to a battery charger of the type used to facilitate charging a high voltage vehicle battery with AC energy provided from a utility power grid. The housing may include a groove and seal arrangement operable to seal a fluid coolant chamber used to cool the circuitry from leaking fluid during use.

Abstract: Embodiments of the present invention disclose a liquid cooling apparatus, which includes a cold plate (202), a fast connector (204), and a first interface (2011), where the fast connector (204) includes a first connector (2041) and a second connector (2042), where the first connector (2041) is fixedly connected to the cold plate (202); the first interface (2011) is configured to connect to a second interface (2012) corresponding to the first interface; and the liquid cooling apparatus further includes a guide rail (203), where the guide rail (203) is a moving rail of the second connector (2042), and when the first connector (2041) and the second connector (2042) are in a connected state and the second connector (2042) is located at an end on the guide rail (203) that is close to a board (201), a distance between the first interface (2011) and the second interface (2012) is greater than 0.

Abstract: A member 10 for a semiconductor manufacturing apparatus includes an AlN electrostatic chuck 20, a cooling plate 30, and a cooling plate-chuck bonding layer 40. The cooling plate 30 includes first to third substrates 31 to 33, a first metal bonding layer 34 between the first and second substrates 31 and 32, a second metal bonding layer 35 between the second and third substrates 32 and 33, and a refrigerant path 36. The first to third substrates 31 to 33 are formed of a dense composite material containing SiC, Ti3 SiC2, and TiC. The metal bonding layers 34 and 35 axe formed by thermal compression bonding of the substrates 31 to 33 with an Al—Si—Mg metal bonding material interposed between the first and second substrates 31 and 32 and between the second and third substrates 32 and 33.

Abstract: Cooling assemblies including a porous three dimensional surface such as a heat sink are disclosed. In one embodiment, a cooling assembly includes a heat transfer substrate having a surface, a thermally conductive fin extending from the surface, a metal mesh bonded to a surface of the thermally conductive fin, and sintered metal particles bonded to the metal mesh and the surface of the thermally conductive fin. The metal mesh defines a macro-level porosity, and the sintered metal particles define a micro-level porosity. In another embodiment, a cooling assembly includes a heat transfer substrate having a surface, a thermally conductive fin extending from the surface of the heat transfer substrate, and sintered metal particles bonded to the surface of the thermally conductive fin. An average diameter of the sintered metal particles increases from a base of the thermally conductive fin to a top of the thermally conductive fin.

Abstract: Cooling assemblies and power electronics modules having multiple-level porosity structures with both a micro- and macro-level porosity are disclosed. In one embodiment, a cooling assembly includes a jet impingement assembly including a fluid inlet channel fluidly coupled an array of orifices provided in a jet plate, and a heat transfer substrate having a surface. The heat transfer substrate is spaced apart from the jet plate. A first array of metal fibers is bonded to the surface of the heat transfer substrate in a first direction, and a second array of metal fibers is bonded to the first array of metal fibers in a second direction. Each metal fiber of the first array of metal fibers and the second array of metal fibers includes a plurality of metal particles defining a micro-porosity. The first array of metal fibers and the second array of metal fibers define a macro-porosity.

Abstract: The invention relates to a device for heating the heat engine (7) of a vehicle, comprising: a reactor (3) in which a reagent that can cause an exothermic reaction with a reaction fluid is disposed, a circuit (5) for supplying reaction fluid to the reactor (3), a heat-exchange circuit (8) between the reactor (3) and the heat engine (7) of the vehicle, and a circuit (9) for regenerating the reagent.

Abstract: Heat dissipating system and method are disclosed. An example method includes removing heat from a rack component via a thermal transport. The method also includes applying a pressure at a fluid cooled thermal bus bar on a rack system to form a thermally conductive dry disconnect interface and form a heat path between the thermal transport and the fluid cooled thermal bus bar.

Abstract: The invention relates to a heat exchanger (1) for a vehicle comprising a heat engine, said exchanger comprising a first circuit, a second circuit and a tank. According to the invention, the first circuit comprises first ducts for conveying exhaust gases, the second circuit comprises second ducts for conveying a heat-transfer fluid, and the tank can receive a reagent.

Abstract: An apparatus for cooling a heat-generating component is disclosed. The apparatus includes a cooling chamber containing a liquid metal. The cooling chamber has a heat-conducting wall thermally coupled to the heat-generating component. A plurality of extendable tubes making up an array of cooling pin fins is attached to the cooling chamber. Each of the extendable tubes has a port end that opens into the cooling chamber and a sealed end that projects away from the cooling chamber. Moreover, each of the extendable tubes has an extended position when filled with liquid metal from the cooling chamber and a retracted position when emptied of the liquid metal. A pump system is included for urging the liquid metal from the cooling chamber into the plurality of extendable tubes.

Abstract: An undercover for a vehicle, connected to an underbody below a muffler mounted on the underbody, includes: a main body panel in a plate shape, through which insertion holes are formed; a heat absorption plate to be connected to the insertions holes; and a heat radiation plate to be connected to the heat absorption plate, the remote ends of which are exposed below the main body panel. A heat exchange function is added to an undercover that has been used simply as a cover for protecting the muffler from foreign substance, thereby cooling more efficiently the muffler.

Abstract: An improved flue gas cooler 10, or bank of coolers 10, handles flue gas G from aluminum reduction cells in an aluminum smelter plant. Each flue gas cooler 10 has a gas inlet chamber 14, a gas outlet chamber 16, and a matrix of gas cooling tubes 18 extending between the inlet chamber and the outlet chamber. Each cooling tube 18 has a bell-shaped inlet end 19 comprising an aerodynamically curved gas-accelerating profile effective to facilitate streamlined flow of flue gas G into the tube. The improved flue gas cooler makes it possible to connect the flue gas cooler to receive flue gas G direct from the aluminum reduction cells without getting clogged by dust and sublimates present in the flue gas.

Abstract: A radiator includes: a tube through which a coolant flows; and a single tank including: a supplying chamber communicating with an end of the tube, for supplying the tube with the coolant; and a collecting chamber communicating with the other end of the tube, partitioned to the supplying chamber, and for collecting the coolant discharged from the tube.

Abstract: A heat dissipation device that includes a base plate having a plurality of substantially circular channels which are substantially concentrically arranged; and a fluid distribution structure adjacent the base plate, wherein the fluid distribution structure has a plurality of inlet conduits extending substantially radially from a central area with each of the plurality of inlet conduits having at least one fluid delivery port extending through the fluid distribution structure to at least one base plate circular channel, and wherein the fluid distribution structure has a plurality of outlet zones defined between adjacent inlet conduits with each of the plurality of outlet zones having at least one fluid removal port extending through the fluid distribution structure to at least one base plate circular channel.

Abstract: An apparatus for facilitating servicing of a liquid-cooled electronics rack is provided. The apparatus includes a coolant tank, a coolant pump in fluid communication with the coolant tank, multiple parallel-connected coolant supply lines coupling the coolant pump to a coolant supply port of the apparatus, and a coolant return port and a coolant return line coupled between the coolant return port and the coolant tank. Each coolant supply line includes a coolant control valve for selectively controlling flow of coolant therethrough pumped by the coolant pump from the coolant tank. At least one coolant supply line includes at least one filter, and one coolant supply line is a bypass line with no filter. When operational, the apparatus facilitates filling of coolant into a cooling system of a liquid-cooled electronics rack by allowing for selective filtering of coolant inserted into the cooling system.

Abstract: A cooling module includes a casing with a thermal-transmittance wall having an interior surface and an exterior surface, a coolant inlet, a vapor outlet, and a converting component with a plurality of orifices and dividing an interior of the casing into a coolant chamber and a vaporization chamber. A liquid coolant is ejected through the plurality of orifices to form plumes toward the interior surface of the thermal-transmittance wall and exchange heat with the thermal-transmittance wall resulting in coolant vapor. In a cooling system, a vapor conduit then carries the vapor to a condenser, and a coolant conduit returns the condensed coolant to the cooling module. The cooling system is used to cool a lamp device.

Abstract: A fluid heat exchanger can define a plurality of microchannels each having a first end and an opposite end and extending substantially parallel with each other microchannel. Each microchannel can define a continuous channel flow path between its respective first end and opposite end. A fluid inlet opening for the plurality of microchannels can be positioned between the microchannel first and opposite ends, a first fluid outlet opening from the plurality of microchannels can be positioned adjacent each of the microchannel first ends, and an opposite fluid outlet opening from the plurality of microchannels can be positioned adjacent each of the microchannel opposite ends such that a flow of heat transfer fluid passing into the plurality of microchannels flows along the full length of each of the plurality of microchannels outwardly from the fluid inlet opening. Related methods are disclosed.

Abstract: A heat exchange device comprising a fluid flow passage having a plurality of successive segments in fluid flow communication with one another, the segments being adapted to maintain a developing flow therein and thereby improve heat transfer.

Abstract: Devices, systems, and methods for cooling electronic component heat spreaders, for example, a heat spreader mounted over a CPU of personal computer, are disclosed. The devices, systems, and methods employ a housing having an internal cavity with an open bottom; a gasket positioned between the open bottom and the heat spreader; a cooling fluid inlet to the housing adapted to direct a cooling fluid upon the heat spreader in a direction substantially normal to heat spreader; and a cooling fluid outlet positioned to remove the cooling fluid from the housing. Though aspects of the invention can be applied to any electronic component that can benefit from enhanced heat dissipation, users of high-performance computer equipment, such as, gamers, scientific and mathematical modelers, and engineers may find aspects of the invention particularity advantageous.

Abstract: A system, configured to be disposed in a information technology equipment rack for providing ice thermal storage, includes a tank configured to hold water, a heat exchanger disposed in water in the tank and configured to convey a two-phase liquid and vapor refrigerant and to transfer heat between the water and the refrigerant, a first valve connected to a liquid and a vapor refrigerant line and configured to selectively connect the liquid refrigerant line to a first port and the vapor refrigerant line to a second port in a first mode and to connect the liquid refrigerant line to the second port and the vapor refrigerant line to the first port in a second mode, a thermostatic expansion valve connected to an inlet of the heat exchanger, and a liquid/vapor pump connected to an outlet of the heat exchanger and to the second port of the first valve.

Abstract: Low void fraction thermal energy storage articles, systems, and methods for making and using such thermal energy storage articles and systems. Thermal energy storage units include a thermal energy storage body having a particular void volume and a mixing cavity-creating element. Thermal energy storage modules include two or more thermal energy storage bodies arranged adjacently with an intervening cavity defined by a cavity-creating element. The total void volume of a thermal energy storage module (i.e., the sum of the void volume of the passages of the thermal energy storage bodies and the cavity) is between about 10% and about 40%.

Abstract: An integrated cooling and climate control system for an offshore wind turbine featuring a reservoir having first and second chambers located in an upper region of the tower. Upper and lower cooling circuits distribute coolant fluid through heat generating structures in the nacelle to a lower portion of the wind turbine where the heated coolant fluid is thermally connected to a sea water heat sink. The cooled coolant fluid is then distributed back to the reservoir. The reservoir has a hollow center and is positioned on a platform having a hollow center. The inlet and outlet pipes of the upper cooling circuit freely hang inside the reservoir chambers so that they may be displaced as the nacelle yaws in order to maintain sufficient circulation of the coolant fluid in the upper cooling circuit. In jacket foundation configurations, the tubular support structures may serve as the lower cooling circuit pipes.