Conductor Structure (nonsuperconductive) Patents (Class 174/126.1)
  • Publication number: 20130008707
    Abstract: Provided is a metal strip for an electromagnetic interference shield case. The metal strip is uniform in width and thickness. A metal clip that is integrated with at least one pair of face-to-face elastic parts and is appropriate for soldering is fitted on an end of the metal strip along a width direction of the metal strip. The metal strip is bent and cut so as to have a shape corresponding to a ground pattern disposed on a printed circuit board, and then, a bottom surface of the metal clip is soldered to the ground pattern or a solder member disposed on the ground pattern.
    Type: Application
    Filed: May 16, 2012
    Publication date: January 10, 2013
    Applicants: Joinset Co., Ltd.
    Inventor: Sun-Ki Kim
  • Publication number: 20130002380
    Abstract: The present invention relates to a method for producing an electric contact element from a semifinished product and to the electric contact element and the corresponding semifinished product.
    Type: Application
    Filed: January 14, 2011
    Publication date: January 3, 2013
    Applicants: TYCO ELECTRONICS AMP GMBH, UMICORE AG & CO. KG
    Inventors: Jens Heinrich, Ralf Hoffmann, Peter Sandeck, Martin Wieberger, Peter Braumann, Andreas Koffler, Bernd Kempf, Allen Molvar
  • Publication number: 20130000952
    Abstract: A transparent conductor includes a film of a conductive ceramic. Additives are at least partially incorporated into the film. The additives are at least one of electrically conductive and semiconducting, and at least one of the additives has an aspect ratio of at least 3.
    Type: Application
    Filed: June 28, 2012
    Publication date: January 3, 2013
    Inventors: Arjun Daniel Srinivas, Michael Eugene Young, Matthew R. Robinson
  • Publication number: 20120325297
    Abstract: Disclosed is a constitution formed from an oxide of an element having a smaller work function than aluminum. This oxide is comprises an oxide of vanadium (V), an oxide of an alkaline earth metal and an oxide of an alkali metal. The elements for the alkaline earth metal are comprise one or more elements out of the elements calcium (Ca), strontium (Sr) and barium (Ba) and at least contain barium. The elements for the alkali metal include at least one or more of sodium (Na), potassium (K), rubidium (Rb) and cesium (Cs). When the element vanadium is included as vanadium pentoxide (V2O5), the vanadium pentoxide content is 40-70 wt %. Thus, a glass composition for aluminum electrode wiring with an apparent work function for electrode wiring that is smaller than the work function for aluminum (Al) can be provided without the inclusion of lead.
    Type: Application
    Filed: February 17, 2011
    Publication date: December 27, 2012
    Applicants: HITACHI CHEMICAL COMPANY, LTD., HITACHI, LTD.
    Inventors: Takashi Naito, Takuya Aoyagi, Shinichi Tachizono, Kei Yoshimura, Yuji Hashiba
  • Publication number: 20120319151
    Abstract: In one aspect, a cathode including the first metal layer, the transparent conductive layer formed on the first metal layer, and the second metal layer formed on the transparent conductive layer is applied to the organic light emitting device and thicknesses of the first metal layer, the transparent conductive layer, and the second metal layer are controlled so that the external light reflection of the organic light emitting device is prevented. The cathode may further include the third metal layer formed on the second metal layer.
    Type: Application
    Filed: April 10, 2012
    Publication date: December 20, 2012
    Applicant: Samsung Mobile Display Co., Ltd.
    Inventors: Sang-Hwan Cho, Yoon-Hyeung Cho, Byoung-Duk Lee, Min-Ho Oh, Yong-Tak Kim, So-Young Lee, Yun-Ah Chung, Seung-Yong Song, Jong-Hyuk Lee
  • Patent number: 8334226
    Abstract: Presented is a variety of products and apparatuses employing a conductive nonwoven web. Products and apparatuses include an RFID system, a radiofrequency shielding system, a flexible electronic circuit component, a heating element, an antenna, an electromagnetic energy shield, a membrane switch, a keypad, and a packaging system. In one embodiment, the conductive nonwoven web contains conductive carbon fibers in combination with pulp fibers and/or synthetic fibers. Electric pathways are formed into the conductive material using ultrasonic energy. The electric pathways can be used to produce various electronic devices.
    Type: Grant
    Filed: May 28, 2009
    Date of Patent: December 18, 2012
    Assignee: Kimberly-Clark Worldwide, Inc.
    Inventors: Davis-Dang H. Nhan, Thomas Michael Ales, Thomas David Ehlert, Sudhanshu Gakhar
  • Publication number: 20120305286
    Abstract: Provided are a soft dilute copper alloy material, a soft dilute copper alloy wire, a soft dilute copper alloy sheet, a soft dilute copper alloy stranded wire, and a cable, a coaxial cable and a composite cable using same. The disclosed soft-3dilute-copper-alloy material contains: copper; at least one additional element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Mn, and Cr; and inevitable impurities as the remainder. The soft dilute copper alloy material is characterized in that the average grain size is at most 20 ?m in the surface layer up to a depth of 50 ?m from the surface.
    Type: Application
    Filed: February 8, 2011
    Publication date: December 6, 2012
    Inventors: Seigi Aoyama, Toru Sumi, Hiromitsu Kuroda, Hideyuki Sagawa
  • Publication number: 20120306701
    Abstract: An electric conductive trace includes an arch-shaped variation of a shape of at least a portion of a fractal of at least a second iteration. The portion of the fractal is larger than double of a first iteration of the fractal. The shape varied to be arch-shaped for changes of direction includes a curve radius larger than a predefined minimum curve radius.
    Type: Application
    Filed: April 6, 2012
    Publication date: December 6, 2012
    Inventors: Alexander Popugaev, Rainer Wansch, Lars Weisgerber, Bernhart Pelger-Alzner
  • Publication number: 20120298401
    Abstract: Disclosed herein is a method for fabricating a three-dimensional ultrafine conducting polymer wire having a high aspect ratio by local chemical polymerization using a micropipette.
    Type: Application
    Filed: January 22, 2010
    Publication date: November 29, 2012
    Applicant: POSTECH ACADEMY-INDUSTRY FOUNDATION
    Inventors: Jung Ho Je, Ji Tae Kim, Seung Kwon Seol
  • Publication number: 20120298402
    Abstract: The present invention is directed to a method for forming a patterned conductive film, which comprises the step of bringing a substrate having a layer made of platinum microcrystal particles formed thereon in a pattern and a complex of an amine compound and an aluminum hydride into contact with each other at a temperature of 50 to 120° C. According to the present invention, there is provided a method for forming a patterned conductive layer, which can ensure electrical bonding with a substrate and also can be suitably applied to various electronic devices, simply without requiring a massive and heavy apparatus.
    Type: Application
    Filed: January 26, 2011
    Publication date: November 29, 2012
    Applicants: JSR CORPORATION, JAPAN SCIENCE AND TECHNOLOGY AGENCY
    Inventors: Tatsuya Shimoda, Yasuo Matsuki, Zhongrong Shen
  • Publication number: 20120300417
    Abstract: The present invention is a power distribution mounting component operable at high voltages. More specifically, the power distribution mounting component includes: an insulating layer; current-carrying first conductor layers sandwiching the insulating layer; and a second conductor layer (thinner than the first conductor layers) interposed between the insulating layer and at least one of the first conductor layers. Each the second conductor layer between the insulating layer and the overlying current-carrying first conductor layer is sufficiently thinner than the first conductor layer and is therefore formed in close adhesion to the insulating layer, thereby increasing the partial discharge inception voltage of the power distribution mounting component and therefore its insulation reliability.
    Type: Application
    Filed: January 24, 2011
    Publication date: November 29, 2012
    Applicant: Hitachi, Ltd
    Inventors: Junpei Kusukawa, Hironori Matsumoto
  • Patent number: 8314347
    Abstract: A wiring board with lead pins includes: connection pads formed on a wiring board, and lead pins bonded through a conductive material to the connection pads, wherein each of the lead pins has a head portion that is formed in one end of a shaft portion to be larger in diameter than the shaft portion, the head portions are bonded to the connection pads by the conductive material, a face of the wiring board on which the connection pads are formed is resin-sealed by a first resin to be thicker than the head portions, except portions to which the head portions are bonded, and sides of faces of the head portions to which the shaft portions are connected are sealed to be in close contact with the first resin by a second resin.
    Type: Grant
    Filed: December 14, 2009
    Date of Patent: November 20, 2012
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Kenta Uchiyama, Akihiko Tateiwa, Yuji Kunimoto
  • Publication number: 20120285733
    Abstract: An object of the present invention is to provide an electronic component using a Cu-based conductive material that can suppress oxidization even in a heat treatment in an oxidizing atmosphere and that can suppress an increase in an electrical resistance. In an electronic component having an electrode or a wiring, a ternary alloy made from three elements consisting of Cu, Al, and Co is used as a Cu-based wiring material that can prevent oxidization of the electrode or the wiring. Specifically, part or the whole of the electrode or the wiring has a chemical composition in which an Al content is 10 at % to 25 at %, a Co content is 5 at % to 20 at %, and the balance is composed of Cu and unavoidable impurities, and the chemical composition represents a ternary alloy in which two phases of a Cu solid solution formed by Al and Co being dissolved into Cu and a CoAl intermetallic compound coexist together.
    Type: Application
    Filed: April 8, 2010
    Publication date: November 15, 2012
    Inventors: Takahiko Kato, Takashi Naito, Hiroki Yamamoto, Takuya Aoyagi, Seiichi Watanabe, Seiji Miura, Norihito Sakaguchi, Kazuki Aoshima, Kenji Ohkubo
  • Publication number: 20120288758
    Abstract: It is an object of the present invention to provide a sheet-shaped three-dimensional network aluminum porous body for a current collector which is suitably used for electrodes for nonaqueous electrolyte batteries and electrodes for capacitors, an electrode and a capacitor each using the same. In such a three-dimensional network aluminum porous body for a current collector, the aluminum porous body has been made to have a compressive strength in a thickness direction of 0.2 MPa or more in order to efficiently fill an active material into the sheet-shaped three-dimensional network aluminum porous body.
    Type: Application
    Filed: May 30, 2012
    Publication date: November 15, 2012
    Applicants: SUMITOMO ELECTRIC TOYAMA CO., LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Akihisa HOSOE, Kazuki OKUNO, Hajime OTA, Koutarou KIMURA, Kengo GOTO, Hideaki SAKAIDA, Junichi NISHIMURA
  • Publication number: 20120288757
    Abstract: It is an object of the present invention to provide a sheet-shaped three-dimensional network aluminum porous body for a current collector which is suitably used for electrodes for nonaqueous electrolyte batteries and electrodes for capacitors, an electrode and a capacitor each using the same. The three-dimensional network aluminum porous body for a current collector of the present invention is a sheet-shaped three-dimensional network aluminum porous body for a current collector used for electrodes, and the aluminum porous body has been made to have an average cell diameter of 50 ?m or more and 1000 ?m or less in order to enhance the filling performance of an active material slurry.
    Type: Application
    Filed: May 30, 2012
    Publication date: November 15, 2012
    Applicants: SUMITOMO ELECTRIC TOYAMA CO, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Akihisa Hosoe, Kazuki Okuno, Hajime Ota, Koutarou Kimura, Kengo Goto, Hideaki Sakaida, Junichi Nishimura
  • Publication number: 20120285726
    Abstract: Disclosed are: an electrically conductive element having high electrical conductivity; a photosensitive material for formation of an electrically conductive element, which is suitable for producing the electrically conductive element; and an electrode. The electrically conductive element comprises: a support; a metal pattern layer comprising an electrically conductive metal; and an electrically conductive microparticle-containing layer comprising needle-shaped electrically conductive microparticles having an average long axis length of from 0.2 ?m to 20 ?m, an average short axis length of from 0.01 ?m to 0.02 ?m, and an aspect ratio of 20 or more, a binder, and a sucrose fatty acid ester.
    Type: Application
    Filed: January 20, 2011
    Publication date: November 15, 2012
    Applicant: FUJIFILM CORPORATION
    Inventors: Tsukasa Tokunaga, Akira Ichiki
  • Publication number: 20120276431
    Abstract: To provide a cell connector for the electrically conductive connection of a first cell terminal of a first electrochemical cell and a second cell terminal of a second electrochemical cell of an electrochemical device, which allows a reliable and fail-safe connection of the cell terminals, it is proposed that the cell connector comprises a first contact section for connection to the first cell terminal, a second contact section for connection to the second cell terminal and an elastically and/or plastically deformable compensation region, which connects the first contact section and the second contact section to one another and allows a movement of these contact sections relative to one another.
    Type: Application
    Filed: April 10, 2012
    Publication date: November 1, 2012
    Inventors: Jan Groshert, Armin Diez, Wolfgang Fritz, Michael Kohnle, Axelle Hauck, Philipp Petz, Hubertus Goesmann
  • Publication number: 20120273254
    Abstract: A pad includes a first mating section and a second mating section. The first mating section includes a first horizontal plane and a first inclined plane. The second mating section includes a second horizontal plane and a second inclined plane. The first mating section is a copper foil capable of being connected to a wire. The second mating section is made of insulating material. The first inclined plane and the second inclined plane are bonded together.
    Type: Application
    Filed: August 25, 2011
    Publication date: November 1, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: HUA-LI ZHOU, CHIA-NAN PAI, SHOU-KUO HSU
  • Patent number: 8299356
    Abstract: A semiconductor-device bonding wire includes a core member formed of an electrically-conductive metal, and a skin layer mainly composed of a face-centered cubic metal different from the core member and formed thereon. An orientation ratio of <111> orientations in crystalline orientations <hkl> in a wire lengthwise direction at a crystal face of a surface of the skin layer is greater than or equal to 50%, and the <111> orientations have an angular difference relative to the wire lengthwise direction, the angular difference being within 15 degrees.
    Type: Grant
    Filed: December 2, 2008
    Date of Patent: October 30, 2012
    Assignees: Nippon Steel Materials Co., Ltd., Nippon Micrometal Corporation
    Inventors: Tomohiro Uno, Keiichi Kimura, Takashi Yamada
  • Publication number: 20120267673
    Abstract: It is an object to improve joining properties of electrodes and reliability of the electrodes for supplying electrical power to a semiconductor. The semiconductor light-emitting element includes an n-type semiconductor layer, a light-emitting layer, a p-type semiconductor layer, a transparent conductive layer, a p-electrode formed on the transparent conductive layer and an n-electrode formed on the n-type semiconductor layer. The p-electrode includes a p-side second metal layer composed of a metallic material containing Au and provided to be exposed to the outside and a p-side first metal layer composed of a metallic material containing Au with hardness higher than that of the metallic material composing the p-side second metal layer, the p-side first metal layer being provided closer to the transparent conductive layer than the p-side second metal layer along the p-side second metal layer.
    Type: Application
    Filed: April 19, 2012
    Publication date: October 25, 2012
    Applicant: SHOWA DENKO K.K.
    Inventors: Takehiko OKABE, Daisuke HIRAIWA, Mamoru KITSUKAWA
  • Publication number: 20120270737
    Abstract: Vapor-liquid-solid growth of nanowires is tailored to achieve complex one-dimensional material geometries using phase diagrams determined for nanoscale materials. Segmented one-dimensional nanowires having constant composition display locally variable electronic band structures that are determined by the diameter of the nanowires. The unique electrical and optical properties of the segmented nanowires are exploited to form electronic and optoelectronic devices. Using gold-germanium as a model system, in situ transmission electron microscopy establishes, for nanometer-sized Au—Ge alloy drops at the tips of Ge nanowires (NWs), the parts of the phase diagram that determine their temperature-dependent equilibrium composition. The nanoscale phase diagram is then used to determine the exchange of material between the NW and the drop. The phase diagram for the nanoscale drop deviates significantly from that of the bulk alloy.
    Type: Application
    Filed: June 18, 2012
    Publication date: October 25, 2012
    Applicant: BROOKHAVEN SCIENCE ASSOCIATES, LLC
    Inventors: ELI ANGUELOVA SUTTER, PETER WERNER SUTTER
  • Publication number: 20120257331
    Abstract: A power supply assembly which can drive a number of different devices at different voltages. A rack holds a number of breaker modules, and each breaker module can connect to one or many breakout boxes. The breakout boxes are keyed to the breaker modules, so that the breaker boxes will not be energized with power unless they are the proper voltage and/or configuration to receive that power. The coil of a contactor in the breaker module is powered by a key wire that is connected through specified pins in the breakout box. Therefore, no power is ever provided to the breakout box unless it is of the proper voltage configuration. In addition, feeder power to the power supply assembly is provided over bolted connections, without any wire connections between the power feed and the circuit breaker.
    Type: Application
    Filed: June 19, 2012
    Publication date: October 11, 2012
    Applicant: PRODUCTION RESOURCE GROUP LLC
    Inventors: James Bornhorst, John Covington
  • Publication number: 20120255762
    Abstract: To provide metal nanowires which have high electrical conductivity and excellent heat resistance while maintaining excellent light transmission, a production method thereof, a transparent electrical conductor and a touch panel. Metal nanowires of the present invention include: silver; and a metal other than silver, wherein the metal nanowires have an average major axis length of 1 ?m or more and the metal other than silver is nobler than silver, and wherein when P (atomic %) indicates an amount of the metal other than silver in the metal nanowires and ? (nm) indicates an average minor axis length of the metal nanowires, P and ? satisfy the following expression 1: 0.1<P×?0.5<30??(Expression 1) where P is 0.010 atomic % to 13 atomic % and ? is 5 nm to 100 nm.
    Type: Application
    Filed: November 25, 2010
    Publication date: October 11, 2012
    Applicant: FUJIFILM CORPORATION
    Inventors: Kensuke Katagiri, Takeshi Hunakubo
  • Patent number: 8282846
    Abstract: A metal interconnect structure, which includes a bond pad, an overlying anti-reflective coating layer, an overlying passivation layer, and an opening that exposes a top surface of the bond pad, eliminates corrosion resulting from the anti-reflective layer being exposed to moisture during reliability testing by utilizing a side wall spacer in the opening that touches the side wall of the passivation layer, the side wall of the anti-reflective coating layer, and the top surface of the bond pad.
    Type: Grant
    Filed: February 27, 2010
    Date of Patent: October 9, 2012
    Assignee: National Semiconductor Corporation
    Inventor: Rodney L. Hill
  • Patent number: 8278555
    Abstract: A conductor includes elemental wires made from an aluminum alloy containing Si whose content is 0.3-1.2 mass %, Mg whose content makes an Mg/Si weight ratio in a range from 0.8 to 1.8, and a remainder essentially including Al and an unavoidable impurity. The conductor has tensile strength of 240 MPa or more, breaking elongation of 10% or more, impact absorption energy of 8 J/m or more, and electrical conductivity of 40% IACS or more. The production method includes the step of preparing a strand by bunching elemental wires with the above composition, and the step of subjecting the wire to solution treatment, quenching, and aging heat treatment. Solution treatment temperature is 500-580° C., and aging heat treatment temperature is 150-220° C. Heating in solution treatment is high frequency induction heating.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: October 2, 2012
    Assignees: Autonetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Yasuyuki Otsuka, Yoshihiro Nakai, Taichirou Nishikawa
  • Patent number: 8262942
    Abstract: The inventive subject matter relates to hollow carbon nanospheres (HCNS) as a material for making ion storage material, and particularly lithium ion storage material used for batteries.
    Type: Grant
    Filed: February 9, 2009
    Date of Patent: September 11, 2012
    Assignee: The George Washington University
    Inventors: Michael J. Wagner, Jonathan Cox, Thomas McKinnon, Keith Gneshin
  • Publication number: 20120222885
    Abstract: A transparent conductive (TC) film includes a main transparent conductive layer and a plurality of conductors electrically contacting with the main transparent conductive layer. The conductors are disposed on the surface of the main transparent conductive layer separately from each other. The transparent conductive film of the present invention has numerous separate conductors to collect electrical current which flow in the TC film, thereby reducing the internal resistance of the TC film while keeping the light transmission unchanged. Furthermore, the new conductor layout reduces the risk of the TC film from high current density damages, thereby achieving better reliability.
    Type: Application
    Filed: April 11, 2011
    Publication date: September 6, 2012
    Applicant: SAE Magnetics (H.K.) Ltd.
    Inventors: Wingkeung MAK, Hotong LEE
  • Publication number: 20120218677
    Abstract: An object of the present invention is to provide an electrode sintered body wherein shrinkage is prohibited and conductivity is good. An electrode sintered body including intermetallic compound comprising nickel and aluminum is provided. And then an internal electrode paste, which can inhibit shrinkage of an internal electrode layer, is manufactured by raising sintering temperature of conducting particle materials constituting internal electrode sheet to be internal electrode layers after firing. Further, a high-function multilayer electronic device using electrode paste for internal electrodes is manufactured.
    Type: Application
    Filed: February 14, 2012
    Publication date: August 30, 2012
    Applicant: TDK CORPORATION
    Inventors: Ryuji FUJISAWA, Mayumi SUZUKI, Kyotaro ABE
  • Publication number: 20120217060
    Abstract: An aluminum alloy wire having excellent bending characteristics, strength, and electrically conductive characteristics, an aluminum alloy stranded wire, a covered electric wire including the above-described alloy wire or stranded wire, and a wire harness including the covered electric wire are provided. The aluminum alloy wire contains not less than 0.1% and not more than 1.5% by mass of Mg, not less than 0.03% and not more than 2.0% of Si, not less than 0.05% and not more than 0.5% of Cu, and a remainder including Al and an impurity, satisfies 0.8?Mg/Si ratio by mass ?3.5, has an electrical conductivity from 35% IACS to 58% IACS, a tensile strength from 150 MPa to 400 MPa, and an elongation not less than 2%. The aluminum alloy wire is manufactured through the steps of casting?rolling?wiredrawing?solution heat treatment.
    Type: Application
    Filed: October 27, 2010
    Publication date: August 30, 2012
    Inventors: Misato Kusakari, Taichiro Nishikawa, Yoshihiro Nakai, Yoshiyuki Takaki, Yasuyuki Otsuka
  • Publication number: 20120211261
    Abstract: The layered actuator comprises at least two electrode layers and an electronically nonconductive membrane in between, where the electrode layer contains carbide-derived carbon, a polymer material and an ionic liquid. The layered actuator bends due to relocation of the membrane ions when direct current is applied to the electrodes.
    Type: Application
    Filed: October 26, 2010
    Publication date: August 23, 2012
    Inventors: Alvo Aabloo, Friedrich Kaasik, Viljar Palmre, Janno Torop
  • Publication number: 20120212158
    Abstract: The present invention relates to an electrode system, in particular of a gas discharge device for generating EUV radiation and/or soft X-rays. The electrode system comprises at least two electrodes (1, 2) formed of an electrode material which contains Mo or W or an alloy of Mo or W as a main component. The electrode material has a fine grained structure with fine grains having a mean size of <500 nm. With the proposed electrode system, a high thermo-mechanical and thermo-chemical resistance of the electrodes is achieved. The electrode system can therefore be used in known EUV light sources using liquid Sn and being operated at high temperatures.
    Type: Application
    Filed: September 29, 2010
    Publication date: August 23, 2012
    Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.
    Inventors: Christof Metzmacher, Jeroen Jonkers, Rolf Theo Anton Apetz
  • Publication number: 20120211260
    Abstract: For providing a shield wire, in which efficiency of processing terminal treatment of braid can be improved, and an apparatus for processing terminal treatment of braid, an apparatus for processing terminal treatment of braid of a shield wire includes a first hold unit holding a top of the braid covering the electric wire, a second hold unit holding a far-side of the braid, a push unit pushing the top toward the far-side so as to fold a part of braid from the top to form an overlap portion, and a forming unit forming the overlap portion into a cone shape, in which the top is located. The formed overlap portion is clamped by a set of inner and outer ring brackets.
    Type: Application
    Filed: May 1, 2012
    Publication date: August 23, 2012
    Applicant: Yazaki Corporation
    Inventors: Nobuhiro KAWASE, Hirofumi HIRAYAMA
  • Patent number: 8247697
    Abstract: Provided is an anisotropic conductive film having enhanced adhesion strength to a circuit member and attaining high conduction reliability; a joined structure; and a method for producing the joined structure. The conductive film electrically connects a first circuit member with a second circuit member having a nitrogen atom containing film on a surface thereof facing the first circuit member, the conductive film including a first layer which is to be located at a first circuit member side, and a second layer which is to be located at a second circuit member side, wherein the first layer comprises a cationic curing agent and a first thermosetting resin, and the second layer comprises a radical curing agent and a second thermosetting resin, and wherein at least one of the first and second layers comprises conductive particles, and the difference in maximum exothermic peak temperature between the first and second layers is within the range up to 20° C.
    Type: Grant
    Filed: November 25, 2009
    Date of Patent: August 21, 2012
    Assignee: Sony Chemical & Information Device Corporation
    Inventor: Tomoyuki Ishimatsu
  • Publication number: 20120200205
    Abstract: A conductive component and a method for treating the conductive component to modify conduction through the component are disclosed. The method includes heating the component such that annealing of an exterior layer of the component occurs without annealing of an interior layer of the component, wherein the interior layer is disposed adjacent to and integral with the exterior layer. The method further includes cooling the component such that annealing of the exterior layer ceases without annealing of the interior layer. The component includes an annealed exterior layer having a thickness of less than or equal to approximately 10 millimeters, and a non-annealed interior layer disposed adjacent to and integral with the exterior layer.
    Type: Application
    Filed: February 4, 2011
    Publication date: August 9, 2012
    Applicant: GENERAL ELECTRIC COMPANY
    Inventor: Andrew Batton Witney
  • Publication number: 20120203493
    Abstract: An electrical wire includes a core comprising an electrically conductive material that conducts electricity along the length of the electrical wire. The core also includes an acoustic conductive material that conducts acoustic waves along the length of the electrical wire. The core also includes an acoustic waveguide that provides internal reflection for the acoustic waves conducted through the core, and that guides the acoustic waves along the length of the electrical wire. The response acoustic wave signals may be compared against a failure model for the wire in order to determine the reliability of the electrical wire.
    Type: Application
    Filed: February 7, 2012
    Publication date: August 9, 2012
    Inventors: William Kurt Dobson, Zivile Ratkeviciute
  • Publication number: 20120193123
    Abstract: A power supply line for high-frequency current has a two-layered tubular conductor including an inner tube portion and an outer tube portion which is concentric to the inner tube portion and integrally linked thereto by four connecting portions along the entire length in the longitudinal direction. The four connecting portions are circumferentially disposed at predetermined intervals. By providing the four connection portions between the inner tube portion and the outer tube portion, it is possible to more accurately position the inner tube portion and to reduce high frequency resistance when compared with the likes of conventional power supply lines for high-frequency current having only one connecting portion between an inner tube portion and an outer tube portion.
    Type: Application
    Filed: September 28, 2010
    Publication date: August 2, 2012
    Applicant: Panasonic Corporation
    Inventors: Yasushi Futabatake, Hiroshi Maeda, Kouichi Teraura, Yokihiro Matsunobu, Masato Toki, Shinji Hara
  • Patent number: 8232479
    Abstract: There is provided an electronic apparatus capable of ESL reduction. The electronic apparatus includes a capacitor and a mounting board. The capacitor includes a multilayer body, an internal electrode, and a terminal electrode. The mounting board has a connection pad formed on its upper surface and has a through conductor formed inside thereof that is connected to the connection pad. The capacitor is mounted on the mounting board by connecting the terminal electrode to the connection pad. The internal electrode has an end portion exposed at an area ranging from an end face to a middle portion of a lateral face in the multilayer body. In a planar view, the through conductor is located immediately below a part of the end portion of the internal electrode exposed at the lateral face of the multilayer body, the part lying furthermost from the end face.
    Type: Grant
    Filed: June 29, 2010
    Date of Patent: July 31, 2012
    Assignee: Kyocera Corporation
    Inventor: Hisashi Satou
  • Publication number: 20120168200
    Abstract: A process for producing a joint structure of a steel sheet and an aluminum sheet, in which the steel sheet and the aluminum sheet are joined to each other so as to be electrically connected to each other. The process is characterized by comprising a step of forming at least one resin coating film in a thickness of 0.1 to 5.0 ?m on a contact surface on the steel sheet side, wherein the resin is selected from the group consisting of a polyolefin resin, a polyurethane resin and an epoxy resin.
    Type: Application
    Filed: December 3, 2010
    Publication date: July 5, 2012
    Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
    Inventors: Masatoshi Iwai, Shoji Hisano, Takeshi Ohwaki, Shinji Sakashita, Kasumi Yanagisawa, Akihiko Tatsumi
  • Publication number: 20120161209
    Abstract: An interconnect is disclosed with enhanced immunity of electrical conductivity to defects. The interconnect includes a material with charge carriers having topological surface states. Also disclosed is a method for fabricating such interconnects. Also disclosed is an integrated circuit including such interconnects. Also disclosed is a gated electronic device including a material with charge carriers having topological surface states.
    Type: Application
    Filed: March 3, 2011
    Publication date: June 28, 2012
    Applicant: THE TRUSTEES OF PRINCETON UNIVERSITY
    Inventors: Ali Yazdani, N. Phuan Ong, Robert J. Cava
  • Publication number: 20120156567
    Abstract: A subject-matter of the invention is a novel process for the preparation of sulphur-modified monolithic porous carbon-based materials by impregnation with a strong sulphur-based acid, the materials capable of being obtained according to this process and the use of these materials with improved supercapacitance properties to produce electrodes intended for energy storage systems. Electrodes composed of sulphur-modified monolithic porous carbon-based materials according to the invention and lithium batteries and supercapacitors comprising such electrodes also form part of the invention.
    Type: Application
    Filed: November 11, 2011
    Publication date: June 21, 2012
    Applicant: HUTCHINSON
    Inventors: David Ayme-Perrot, Marie Dieudonné, Philippe Sonntag, Anne-Caroline Pasquier
  • Publication number: 20120129701
    Abstract: A conductor for transmitting electrical power having a cylindrical core (1) clad with a strip of metallic material (2), possibly comprising a superconductor, placed, in the shape of a tube, longitudinally around said core (I), its longitudinal edges being welded to each other along a weld seam (3). The core (1) has a slot (4, 4?) placed under said weld seam (3).
    Type: Application
    Filed: October 18, 2011
    Publication date: May 24, 2012
    Inventors: Christian-Eric Bruzek, Arnaud Allais, Claus-Friedrich Theune
  • Publication number: 20120125659
    Abstract: Provided are a copper conductor film and manufacturing method thereof, and patterned copper conductor wiring, which have superior conductivity and wiring pattern formation, and with which there is no decrease in insulation between circuits, even at narrow wiring widths and narrow inter-wiring spacing.
    Type: Application
    Filed: December 17, 2008
    Publication date: May 24, 2012
    Inventors: Hideo Nakako, Kazunori Yamamoto, Yasushi Kumashiro, Youichi Machii, Shunya Yokozawa, Yoshinori Ejiri, Katsuyuki Masuda
  • Publication number: 20120129740
    Abstract: The invention relates to a coating (7) made up of a metal layer (8), in which a lubricant (1) which can be released by wear is embedded. In order to provide a wear-resistant coating (7) which is simply structured and economical to produce, the invention provides for the lubricant (1) to consist of an at least singly branched organic compound (2). The present invention further relates to a self-lubricating component (11) with a coating (7) according to the invention applied at least in certain portions, to a method for producing a coating (7), and also to a coating electrolyte (10) comprising at least one type of metal ions and at least one lubricant (1) consisting of an at least singly branched organic compound (2).
    Type: Application
    Filed: July 30, 2010
    Publication date: May 24, 2012
    Applicants: Tyco Electronics Corporation, Tyco Electronics Amp GmbH
    Inventors: Dominique Freckmann, Helge Schmidt
  • Publication number: 20120127681
    Abstract: Disclosed herein are a soldering connecting pin, a semiconductor package substrate and a method of mounting a semiconductor chip using the same. A semiconductor chip is mounted on the printed circuit board using the soldering connecting pin inserted into a through-hole of the printed circuit board, thereby preventing deformation of the semiconductor package substrate and fatigue failure due to external shocks.
    Type: Application
    Filed: January 20, 2011
    Publication date: May 24, 2012
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ji Man RYU, Kwan Ho LEE, Kyu Bum HAN, Seog Moon CHOI, Jin Su KIM
  • Publication number: 20120118620
    Abstract: Disclosed herein are a lead pin for a printed circuit board and a printed circuit board using the same. The lead pin for a printed circuit board includes: a connection pin; and a pin head part formed at one end portion of the connection pin and including a protrusion, the diameter thereof being formed to be increasingly small based on a surface contacting the connection pin and the outer peripheral surface thereof being provided with a protrusion-shaped or depression-shaped band, whereby it forms a protrusion-shaped band or a depression-shaped band on the pin head part of the lead pin to increase a contacting area with the solder, thereby improving an adhesion between the lead pin and the printed circuit board.
    Type: Application
    Filed: January 10, 2011
    Publication date: May 17, 2012
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Ho Baek, Seok Hyun Park, Ki Taek Lee
  • Publication number: 20120118609
    Abstract: An electrode base in which a lead wire made of aluminum is bonded to a surface of a glass substrate that is a thin-film base having a plate thickness of about 0.7 to 2.0 mm, by using an ultrasonic bonding method. An external lead-out electrode made of copper is formed so as to extend from a surface of one end portion of the lead wire to a region outside the glass substrate. The lead wire functions as an internal signal receiver, and the external lead-out electrode has an external signal transmission function.
    Type: Application
    Filed: June 23, 2009
    Publication date: May 17, 2012
    Applicant: Toshiba Mitsubishi-Electric Indus. Sys. Corp.
    Inventors: Akio Yoshida, Masahisa Kogura
  • Publication number: 20120118606
    Abstract: Disclosed herein are conductive film including: a base member; N transparent electrodes formed on one surface of the base member, the N transparent electrodes being arranged in a second direction of the base member, while being extended in a first direction of the base member; and electrode wirings each correspondingly connected to one end or both ends of the N transparent electrodes and including wiring portions configured of a plurality of wirings extended in a third direction of the base member and bent and extended in the second direction of the base member and insulating portions having the wiring portions impregnated therein and formed on an upper surface of one side or both sides of the transparent electrode and a manufacturing method thereof. Accordingly, the plurality of wirings are formed in a three-dimensional shape vertically in the insulating portion rather than a plane of the base member, making it possible to reduce the area of a non-display region due to the electrode wirings.
    Type: Application
    Filed: April 8, 2011
    Publication date: May 17, 2012
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Il Kim, Woon Chun Kim, Yong Soo Oh, Jong Young Lee
  • Publication number: 20120118607
    Abstract: There is provided an aluminum-alloy material having sufficient electric conductivity and tensile strength as a wiring material and excellent in wire-drawing property, and an electric wire or cable using the same. An electric wire or cable includes an aluminum-alloy strand formed of an aluminum-alloy including Fe: 0.1% by mass or more to less than 1.0% by mass, Zr: 0 to 0.08% by mass, Si: 0.02 to 2.8% by mass, at least one of Cu: 0.05 to 0.63% by mass and Mg: 0.04 to 0.45% by mass, and the remainder being aluminum and unavoidable impurities.
    Type: Application
    Filed: July 6, 2010
    Publication date: May 17, 2012
    Inventors: Kenichi Ishibashi, Kazumi Mochizuki, Yasunobu Kondo
  • Publication number: 20120103196
    Abstract: A thermal management apparatus includes an electrohydrodynamic fluid accelerator in which an emitter electrode and another electrode are energizable to motivate fluid flow. One of the electrodes includes a solid solution formed of a solvent metal having a first performance characteristic and a solute material having a second performance characteristic. The first and second performance characteristics are exhibited substantially independently in the electrode as the solvent metal and solute material remain substantially pure within the solid solution. A method of making an EHD product includes providing an electrode with such a solid solution and positioning the electrode relative to another electrode to motivate fluid flow when energized.
    Type: Application
    Filed: October 28, 2010
    Publication date: May 3, 2012
    Applicant: TESSERA, INC.
    Inventor: Giles Humpston
  • Patent number: 8158254
    Abstract: The embodiments disclosed herein relate to the fabrication of complex two-dimensional conductive silicide nanostructures, and methods of fabricating the nanostructures. In an embodiment, a conductive silicide includes a plurality of connected and spaced-apart nanobeams linked together at an about 90-degree angle, the plurality of nanobeams forming a two-dimensional nanostructure having a mesh-like appearance. In an embodiment, a method of fabricating a two-dimensional conductive silicide includes performing chemical vapor deposition, wherein one or more gas or liquid precursor materials carried by a carrier gas stream react to form a nanostructure having a mesh-like appearance and including a plurality of connected and spaced-apart nanobeams linked together at an about 90-degree angle.
    Type: Grant
    Filed: August 25, 2009
    Date of Patent: April 17, 2012
    Assignee: The Trustees of Boston College
    Inventors: Dunwei Wang, Sa Zhou