Abstract: A heat sink assembly for a light fixture can include at least one heat sink fin disposed in thermal communication with at least one heat-generating component of the light fixture, where the at least one heat sink fin includes a thermoplastic material. The at least one heat sink fin can absorb and dissipate sufficient heat to comply with applicable industry standards for the light fixture.

Abstract: Systems, methods, and software are disclosed herein having enhanced modular carrier form factors. In an implementation, a network card apparatus comprises a network card assembly. The network card assembly comprises a network interface card and a connector card coupled to the network interface card and comprising a U.2 connector configured to mate with a U.2 connector of the modular bay of the rackmount chassis assembly.

Abstract: A circuit board includes a heatsink configured to be coupled to the circuit board via a first coupling mechanism, the first coupling mechanism providing an asymmetrical downward force for coupling the heatsink to the circuit board. The circuit board further includes a second coupling mechanism configured to provide a counter force to the asymmetrical downward force of the first coupling mechanism. The counter force can be configured on an overhang portion of the heatsink that does not cover a circuit on the circuit board.

Abstract: A semiconductor module is provided to include: a plurality of semiconductor chips; a lead frame that is connected to the plurality of semiconductor chips; and a main terminal that is connected to the lead frame, wherein the lead frame has an electrical connection portion that electrically connects the plurality of semiconductor chips to the main terminal, and a heat dissipation portion that is provided to extend from the electrical connection portion. The heat dissipation portion does not extend a path of a current that flows between the main terminal and the plurality of semiconductor chips.

Abstract: The invention relates to an electronic module (6), in particular a power module, having at least one electrical/electronic component (7) and having a housing (8), which at least partly extends around the component (7), wherein the housing (8) is made of cement composite (1), and wherein the cement composite (1) has at least one particulate filler (2). According to the invention, the particulate filler (2) has aluminum nitride particles (3), which each have a coating only of aluminum oxide (4).

Abstract: An electromechanical actuator for rack-and-pinion steering includes a stator, rotor, and electronic system. The electronic system includes at least one first electronic sub-system and a second electronic subsystem, each operatively connected to the stator and the rotor. The at least one first electronic sub-system is arranged at least on a first circuit carrier plane and a second circuit carrier plane, and includes a first power output stage, a first control unit, and a first rotor position sensor arrangement. The second electronic sub-system is arranged at least on the first circuit carrier plane and a third circuit carrier plane, and includes a second power output stage, a second control unit, and a second rotor position sensor arrangement. The first, second and third circuit carrier planes are arranged perpendicular to an axis of rotation of the rotor, and are spaced apart from each other along the axis of rotation.

Abstract: Heat sinks containing polymeric protrusions on a base and optionally further including a foil or tape, as well as methods of making and using thereof, are described herein.

Abstract: A leadless packaged semiconductor device includes a metal substrate having at least a first through-hole aperture having a first outer ring and a plurality of cuts through the metal substrate to define spaced apart metal pads on at least two sides of the first through-hole aperture. A semiconductor die that has a back side metal (BSM) layer on its bottom side and a top side with circuitry coupled to bond pads is mounted top side up on the first outer ring. A metal die attach layer is directly between the BSM layer and walls of the metal substrate bounding the first through-hole aperture that provides a die attachment that fills a bottom portion of the first through-hole aperture. Bond wires are between metal pads and the bond pads. A mold compound is also provided including between adjacent ones of the metal pads.

Abstract: An electronic module has a sealing part 90; electronic elements 15, 25 provided in the sealing part 90; back-surface exposed conductors 10, 20, 30 having back-surface exposed parts 12, 22, 32, which have back surfaces exposed from the sealing part 90, and having one-terminal parts 11, 21, 31, which extend from the back-surface exposed parts 12, 22, 32 and protrude outward from a side of the sealing part 90; and back-surface unexposed conductors 40, 50 having unexposed parts 42, 52, which are sealed in the sealing part 90, and having other-terminal parts 41, 51, which extend from the unexposed parts 42, 52 and protrude outward from a side of the sealing part 90. The electronic elements 15, 25 are placed on the back-surface exposed parts 12, 22, 32. The other-terminal parts 41, 51 have a width narrower than a width of the one-terminal parts 11, 21, 31.

Abstract: A heat sink includes a plurality of heat-radiating fins provided on a base, wherein the heat-radiating fins each have a projection-and-recess shape in which a sectional shape along the base is inscribed in a regular hexagon, wherein projections of the projection-and-recess shape are held in contact with the regular hexagon. In adjacent heat-radiating fins, sides of the regular hexagon, with which the projections are held in contact, are opposed to each other in an entire region. The heat-radiating fins are arranged so that distances between the sides opposed to each other at a distance are equal.

Abstract: A heatsink for pluggable optical devices that incorporates features to limit the travel and deformation of the mating/mated spring clip that holds the heatsink to the cage of a pluggable optical device. The heatsink bearing surface takes the shape and contour of the leaf spring portion of the spring clip, thereby contacting and supporting it well before it plastically yields and permanently deforms. The shape of this feature, which may be coupled to or integrally formed with the heatsink bearing surface, can match exactly the shape of the spring clip or approximate the shape using a curved, variable, or other easier to manufacture profile, as long as the associated protrusions extend up into the corners of the leaf spring portion of the spring clip. This feature effectively acts as a hard stop and prevents the spring clip from being compromised due to improper handling or installation.

Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area.

Abstract: Disclosed are a single plate heat radiation device and a method, and the device includes: a single plate heat radiator, a single plate, a first shielding plate having a panel portion, and a second shielding plate configured for heat radiating. A boss is provided on the second shielding plate. The boss is connected to the single plate radiator through an opening in the single plate and is configured for conducting the heat collected from the single plate by the single plate radiator to the second shielding plate. By means of the present invention, the problem of poor heat radiating effect in the related technology, caused by limited heat radiating area for convective heat radiating and limited heat radiating path for conductive heat radiating, is solved, and thereby the effects of increased heat radiating area and increased heat radiating path are achieved.

Abstract: A multi-LED system includes a carrier; and a plurality of light-emitting diodes arranged on the carrier, wherein the carrier has a main body, and a plurality of electrical components are embedded in the main body.

Abstract: The invention in part, is a heat removal system or apparatus providing a method of mounting and electrically connecting heat dissipating electrical devices, preferably in a radial geometry while achieving good surface-to-surface clamping force, in liquid and or air cooled variants. A variation of the invention can provide arc safety for high power density applications. In specific embodiments, the invention also provides low inductance as a result of minimal loop area while also providing high voltage isolation between devices. The N-sided geometry and effective clamping methodology offer low mass and volume. A variation of the invention also provides a signal interface for driving power electronics devices. A unique cylindrical electrical device package with terminals can support capacitor, inductor and transformer integration in a common package. The various elements of the invention can be combined together to minimize size and weight, while addressing high voltage, noise and thermal management.

Abstract: A junction box used for making electrical connections to a photovoltaic panel. The junction box has two chambers including a first chamber and a second chamber and a wall common to and separating both chambers. The wall may be adapted to have an electrical connection therethrough. The two lids are adapted to seal respectively the two chambers. The two lids are on opposite sides of the junction box relative to the photovoltaic panel. The two lids may be attachable using different sealing processes to a different level of hermeticity. The first chamber may be adapted to receive a circuit board for electrical power conversion. The junction box may include supports for mounting a printed circuit board in the first chamber. The second chamber is configured for electrical connection to the photovoltaic panel. A metal heat sink may be bonded inside the first chamber.

Abstract: A chip includes a semiconductor substrate, an electrical connector over the semiconductor substrate, and a molding compound molding a lower part of the electrical connector therein. A top surface of the molding compound is lower than a top end of the electrical connector. A recess extends from the top surface of the molding compound into the molding compound.

Abstract: A semiconductor package includes a semiconductor chip; a connection member having a first surface on which the semiconductor chip is disposed and a second surface opposing the first surface, an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip, a passivation layer on the second surface of the connection member; and an UBM layer partially embedded in the passivation layer, wherein the UBM layer includes an UBM via embedded in the passivation layer and connected to the redistribution layer of the connection member and an UBM pad connected to the UBM via and protruding from a surface of the passivation layer, and a width of a portion of the UBM via in contact with the UBM pad is narrower than a width of a portion of the UBM via in contact with the redistribution layer.

Abstract: This electrical switching device, able to be integrated into an electrical traction box including a cooling device of the switching device, includes an electrical assembly provided with an electrical switching element. This switching device also includes a base for receiving the electrical assembly, intended to be positioned between the electrical assembly and the cooling device, and pressing elements for pressing the electrical assembly extending between the support element and the base and configured to exert a bearing force on the base, able to keep the base bearing against the cooling device when the switching device is integrated into the traction box.

Abstract: A cooling system comprising of a coolant manifold, a heat sink configured to fit in the coolant manifold, a plurality of cooling fins formed in the heat sink, and a coolant configured to flow through the coolant manifold to the heat sink. Diamond shaped pin fins associated with the heat sink create a series of divergent fluid paths for the cooling fluid that helps to create turbulence and improved heat transfer.

Abstract: An exemplary passive heat transfer apparatus is suited for transferring heat away from an electronic heat generating device to another environment. A gasket has many spaced-apart holes that are transverse to two major opposing surfaces of the gasket. A thermally conductive material is disposed within and fills the holes for conducting heat from one of the two major surfaces to the other major surface. The thermally conductive material is a nanocomposite material having nano-particles aligned substantially perpendicular to the two major opposing surfaces. The thermally conductive material as disposed in the holes has no interfacial boundaries that could adversely affect the transfer of heat.

Abstract: The disclosed apparatus may include (1) a plurality of fluid-cooled plates that thermally couple to a plurality of electronic components included on a multi-chip module, (2) at least one source conduit that (A) is operatively coupled to at least one fluid-cooled plate within the plurality of fluid-cooled plates and (B) feeds cooling fluid from a condenser to the fluid-cooled plate, (3) at least one return conduit that (A) is operatively coupled to at least one additional fluid-cooled plate within the plurality of fluid-cooled plates and (B) returns the cooling fluid from the additional fluid-cooled plate toward the condenser, and (4) an assembly that (A) is mechanically coupled to the fluid-cooled plates and (B) reinforces the thermal couplings between the fluid-cooled plates and the electronic components included on the multi-chip module. Various other apparatuses, systems, and methods are also disclosed.

Abstract: An encapsulated circuit board assembly has a circuit board assembly that includes a substrate with a first surface and one or more electronic components mounted to the first surface to form an irregularly contoured front side of the circuit board assembly. A thermoformed sheet encapsulates the irregularly contoured front side of the circuit board assembly. Vacuum forming and pressure forming methods are used to apply a thermoformable sheet to the irregularly contoured front side of the circuit board assembly.

Abstract: Provided are (i) a heat transport structure which is excellent in heat transfer efficiency and (ii) a method of producing such a heat transport structure. The heat transport structure in accordance with an embodiment of the present invention includes: a first thermally conductive material in which through holes are formed; and second thermally conductive materials which are fitted in the respective through holes in a perpendicular direction which is a direction perpendicular to a surface direction, a thermal conductivity which the first thermally conductive material exhibits in the surface direction being higher than a thermal conductivity which the first thermally conductive material exhibits in the perpendicular direction, each of the second thermally conductive materials being held by an inner surface of a corresponding one of the through holes and having fitting strength of not less than 0.5 N/mm per unit circumference of the corresponding one of the through holes.

Abstract: A power electronic arrangement having a power semiconductor module and an external load-connecting element is provided with the external load-connecting element has a first connection device, and the power semiconductor module has a housing, a base plate and an internal load-connecting element with a second connection device, wherein the base plate has a first cut out through which the first connection device extends into the interior of the power semiconductor module and is connected there in a frictionally locking and electrically conductive fashion to a second connection device of the internal load-connecting element.

Abstract: A heat sink assembly for a light fixture can include at least one heat sink fin disposed in thermal communication with at least one heat-generating component of the light fixture, where the at least one heat sink fin includes a thermoplastic material. The at least one heat sink fin can absorb and dissipate sufficient heat to comply with applicable industry standards for the light fixture.

Abstract: In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing an organic stiffener with an EMI shield for RF integration. For instance, in accordance with one embodiment, there is an apparatus having therein: a substrate layer having electrical traces and a ground plane therein; a functional semiconductor die electrically interfaced to the electrical traces of the substrate layer; a heat pipe thermally interfaced to a top surface of the functional semiconductor die; one or more interposers of an organic dielectric material electrically connected to the ground plane of the substrate layer and electrically connected to the heat pipe; in which the one or more interposers form the electromagnetic shield to electrically shield the functional semiconductor die; and further in which the one or more interposers form the organic stiffener are to mechanically retain the substrate layer in a planer form. Other related embodiments are disclosed.

Abstract: An electronic device (e.g. a server module) includes a substrate and a supporting member. The supporting member is attached to the peripheral portion of the substrate so as to support the substrate on the mounting surface. Owing to the vertical orientation of the substrate supported by the supporting member, it is possible to reduce any space used to temporarily keep the substrate for the purpose of a maintenance operation or the like. Thus, it is possible to improve the workability of an operator conducting a maintenance operation on the electronic device.

Abstract: A semiconductor module includes a semiconductor chip; an insulating circuit board that has on one of principal surfaces of an insulating substrate a circuit member electrically connected to the semiconductor chip, and a first metal member disposed in the other principal surface of the insulating substrate; a second metal member that is disposed on a side of an outer edge of the first metal member and is at least partially disposed further toward an outer side than the insulating substrate; a molding resin portion that seals the semiconductor chip, the insulating circuit board, and the second metal member such that a portion of the first metal member and a portion of the second metal member are exposed; a cooler; a first bonding member that bonds the cooler and the first metal member; and a second bonding member that bonds the cooler and the second metal member.

Abstract: A power amplifier arrangement for a motor vehicle includes a printed circuit board disposed between a housing on a first side of the printed circuit board and a heat sink on a second side of the printed circuit board. A power amplifier is mounted on the second side of the printed circuit board. A bracket is supported by the housing. A clamping spring is supported by the bracket such that the clamping spring is in biased engagement with the first side of the printed circuit board, and such that the power amplifier is pressed into engagement with the heat sink.

Abstract: A recess in a metal housing accommodating a high frequency package includes a first space and a second space and has a winners podium shape in cross-sectional view. A thermally conductive material is sandwiched between the metal housing having heat dissipating fins and the high frequency package.

Abstract: High thermal performance microelectronic modules containing thermal extension levels are provided, as are methods for fabricating such microelectronic modules. In various embodiments, the microelectronic module includes a module substrate having a substrate frontside and a substrate backside. At least one a microelectronic device, such as a semiconductor die bearing radio frequency circuitry, is mounted to the substrate frontside. A substrate-embedded heat spreader, which is thermally coupled to the microelectronic device, is at least partially contained within the module substrate, and extends to the substrate backside. A thermal extension level is located adjacent the substrate backside and extends away from the substrate backside to terminate at a module mount plane. The thermal extension level contains a heat spreader extension, which is bonded to and in thermal communication with the substrate-embedded heat spreader.

Abstract: Various embodiments may include an electronic assembly comprising: a first circuit carrier having a first mounting face for electronic components; a second circuit carrier having a second mounting face for electronic components; wherein the second mounting face faces the first mounting face and is connected thereto; and an electronic component connected both to the first mounting face and the second mounting face; wherein the first mounting face includes a contact region between the first circuit carrier and the component; and the contact region is flexible in a direction perpendicular to the first mounting face in comparison to an adjacent region of the first circuit carrier surrounding the contact region and in comparison to the second circuit carrier.

Abstract: A vehicle battery charger includes a charger housing that contains electrical circuitry that is configured to couple with a power source for charging a vehicle battery. The battery charger also includes two projecting members that are coupled with the electrical circuitry and that extend through spaced apart apertures in the charger housing. An exterior portion of each of the two projecting members comprises an exposed conductive surface that is configured to be engaged by a clamp of a jumper cable that extends to the vehicle battery.

Abstract: An embodiment of the present invention provides a wiring substrate which allows bending of the wiring substrate to be carried out concurrently with reflow for mounting an electronic component to the wiring substrate. A component-mounted body (1) of an embodiment of the present invention includes a wiring substrate (10) and at least one bend assisting body (30) which is belt-like and formed on the wiring substrate (10). The wiring substrate (10) is bent so that a straight bending line is formed along a direction in which the at least one bend assisting body (30) extends. This forms, in the wiring substrate (10), a depressed portion (14) which can contain an IC chip (20).

Abstract: Two insulation covers that can be vertically separated clamp a gate-driving-circuit substrate so as to form a gate driving apparatus. The gate driving apparatus is fixed to a cooler by fixing screws inserted through a pair of insertion bores in the two insulation covers that are arranged in a horizontal direction. A gate control terminal and a ground control terminal provided on the gate-driving-circuit substrate are screwed and fixed to, and thus electrically and mechanically connected to, a corresponding gate control terminal and a corresponding ground control terminal of a power module attached to the cooler. This allows the gate-driving-circuit substrate to be covered with the insulation covers for insulation protection and to be fixed to the cooler using a fixing member such as a screw.

Abstract: A submodule includes a power pack including a plurality of switching modules, first and second input bus bars connected with the switching modules to protrude toward a first outside of the power pack and a bypass switch provided at the first outside of the power pack and coupled to the first and second input bus bars.

Abstract: A module is tested for compatibility with a chassis without being inserted into the chassis. A platform specification and chassis configuration is obtained. Information about the module is received from an NFC tag attached to the module. The information about the module is analyzed against the platform specification and chassis configuration. Based on the analysis, one of a set of conditions is determined to exist. A first condition exists when the module will not be supported according to the platform specification. A second condition exists when the module will be supported and there are no empty slots for which the module will be compatible with the chassis configuration. A third condition exists when the module will be supported and there is at least one empty slot for which the module will be compatible with the chassis configuration. An indication, perceptible to a user, of a determined condition is generated.

Abstract: An electronic apparatus includes a substrate, a heat radiating member which faces the substrate with a gap therebetween, a fixing assembly which fixes the heat radiating member to the substrate, a heat transfer plate disposed on a side of the substrate with respect to the heat radiating member, and a thermal bonding material which is interposed between the heat radiating member and the heat transfer plate, and has elasticity, wherein an electronic device is inserted between the substrate and the heat transfer plate.

Abstract: An electric device including a first metal layer, a second metal layer, and a buffer layer. The first metal layer includes a first groove. The second metal layer includes a second groove. The buffer layer is located between the first metal layer and the second metal layer. A through hole passes through the first metal layer, the buffer layer and the second metal layer. The bottom of the first groove is interconnected with the bottom of the second groove via the through hole. The width of the second groove is greater than the width of the first groove.

Abstract: An apparatus is described for suppressing EMI emissions in an electrical device. In one example, the apparatus includes absorbing material surrounding at least a portion of an electrical component and electrically conductive material configured to contact at least one side of the absorbing material.

Abstract: A thermal management system for an electromagnetic induction-power transfer system. The system may include a charging apparatus including a housing that defines an interface surface. An accessory or induction-power consuming apparatus may be positioned proximate to the interface surface. The housing of the charging apparatus may include a power source and a power-transferring coil coupled to the power source and positioned below the interface surface. A thermal mass may be positioned within the housing and spaced apart from the interface surface. The housing may include a thermal path that is configured to conduct heat from the interface surface to the thermal mass.

Abstract: A circuitry assembly including an electrical component, a peripheral circuitry that supports the electrical component, a support assembly affixed to the peripheral circuitry to evacuate heat excess generated by the electrical component and the peripheral circuitry, a main circuitry separated from the support assembly by a spacing, the main circuitry having a plurality of detection bands, and a plurality of ribbons electrically connecting the peripheral circuitry with the main circuitry and deformable between an undamaged state and a damaged state, wherein in the undamaged state the plurality of ribbons steps over the spacing and the plurality of detection bands and in the damaged state at least one ribbon of the plurality of ribbons contacts at least one detection band of the plurality of detection bands and generate a short circuit.

Abstract: An electronic device may have buttons, a display, and a vibrator unit. Buttons may be included in electronic devices such as glass buttons, metal buttons, buttons that are assembled on printed circuit boards, and buttons that are partly formed from antenna structures. Button coatings may be used to improve the sliding performance of metal-on-metal buttons. A layer of polymer may be interposed between a button plate and a housing structure. A glass button member may have an underside on which a layer of patterned ink is formed. Elastomeric members may be used to reduce button rattle. Portions of a button may be provided with conductive features that form portions of an antenna.

Abstract: A circuit component arrangement includes a base and a plurality of circuit components mounted to the base. A bonding agent adheres the circuit components in intimate contact to the base. The bonding agent is disposed in a respective open channel defined in an outward facing surface of the base in contact with each of the circuit components. A method of assembling a circuit component arrangement includes temporarily fastening a plurality of circuit components to a base. A bonding agent is injected into a respective open channel defined in the base to adhere each of the plurality of circuit components to the base. The plurality of circuit components are unfastened from the base. Injecting a bonding agent can include ceasing injection of bonding agent upon appearance of bonding agent in a window opening in fluid communication with the open channel.

Abstract: A semiconductor package includes a die, a passivation layer, a plurality of first electrical conductive vias, a plurality of second electrical conductive vias, a plurality of thermal conductive vias and a connecting pattern. The die includes a plurality of first pads and a plurality of second pads. The passivation layer is disposed on the die. The first electrical conductive vias and the second electrical conductive vias extend through the passivation layer and contact the first pads and the second pads respectively. The thermal conductive vias are disposed on the passivation layer. Each of the thermal conductive vias is spaced apart from the first and second electrical conductive vias. The connecting pattern is disposed on the passivation layer and connects the first electrical conductive vias and the thermal conductive vias. The thermal conductive vias are connected to the first pads through the connecting pattern and the first electrical conductive vias.

Abstract: A semiconductor device package has a die, a pattern of dielectric material formed on an active surface of the die, a plurality of metal contacts electrically connected to the die and surrounded by the pattern, a mold compound formed around the pattern, the die and the metal contacts, and a redistribution layer formed on a grinded surface of the mold compound and electrically connected to the metal contacts. The dielectric material has a young's modulus lower than a young's modulus of the mold compound, and the dielectric material has a coefficient of thermal expansion lower than a coefficient of thermal expansion of the mold compound.

Abstract: The disclosed apparatus may include (1) a cage that houses at least one field-replaceable electronic module that, when operational, emits heat within a computing device, wherein the cage comprises (A) a front entry side that facilitates installation of the field-replaceable electronic module and (B) a back side that is located opposite the front entry side, (2) a heatsink that removably interfaces with the field-replaceable electronic module when the field-replaceable electronic module is installed in the cage, and (3) a spring plate that (A) is coupled to the heatsink and (B) applies force to the heatsink such that the heatsink (I) is pressed against the field-replaceable electronic module and (II) establishes thermal contact with the field-replaceable electronic module to facilitate heat transfer from the field-replaceable electronic module to the heatsink. Various other apparatuses, systems, and methods are also disclosed.

Abstract: The present disclosure relates to an electronic control apparatus for a vehicle, and the electronic control apparatus includes: an electronic control board which has a top side on which a heating element is mounted; a heat sink which radiate heat generated from the heating element to the outside; at least one screw which couples the electronic control board and the heat sink; and a heat radiating pad which transfer heat of the heating element to the heat sink, in which a stepped portion having a predetermined depth is formed on the contact surface of the heat sink so that the heat radiating pad is inserted thereto, and the depth of the stepped portion is formed to be smaller than a thickness of the heat radiating pad so that the heat radiating pad is pressed and inserted between the electronic control board and the heat sink.

Abstract: A fluid pipe device is provided, which includes a pipe member forming a flow channel for flowing a fluid; a heating member for generating heat to heat the pipe member; a metal heat transfer member abutting against the heating member and conducting the heat to the pipe member; and a terminal member electrically connecting the heating member and the heat transfer member. The heat transfer member includes a first heat transfer member and a second heat transfer member, and at least one of the first heat transfer member and the second heat transfer member forms the terminal member at one portion, and the first heat transfer member is provided in the pipe member in such a way as not to be exposed inside the flow channel of the pipe member.