Abstract: A camera module, an integral base component of same, and a manufacturing method therefor are provided. The camera module includes at least one lens, at least one photosensitive chip, at least one filter, and at least one integral base component. The integral base component includes a base part and a circuit board part. The base part is integrally packaged in the circuit board part. The photosensitive chip is mounted on the circuit board part. The base part forms at least one through hole so as to provide the photosensitive chip with a light path. The lens is arranged on the light path of the photosensitive chip.

Abstract: Various embodiments of a sealed package and a method of forming such package are disclosed. The package can include a non-conductive substrate that includes a cavity disposed in a first major surface. A cover layer can be disposed over the cavity and attached to the first major surface of the non-conductive substrate to form a sealed enclosure. The sealed package can also include a feedthrough that includes a via between a recessed surface of the cavity and a second major surface of the substrate, and a conductive material disposed in the via. An external contact can be disposed over the via on the second major surface of the non-conductive substrate, where the external contact is electrically connected to the conductive material disposed in the via. The sealed package can also include an electronic device disposed within the sealed enclosure that is electrically connected to the external contact.

Abstract: An electronic-component-embedded substrate includes a base having flexibility and cavities formed therethrough, electronic components disposed in the cavities, respectively, and interconnects disposed on the base and connected to the electronic components, wherein the interconnects include a metal foil having openings that abut the electronic components, and include a plating layer disposed on the metal foil and connected to the electronic components through the openings.

Abstract: A multiple-damascene structure is located below a semiconductor device footprint on a printed wiring board, where the structure includes multiple recesses that containing useful devices coupled to a semiconductive device.

Abstract: Various embodiments of a sealed package and a method of forming such package are disclosed. The package can include a non-conductive substrate that includes a cavity disposed in a first major surface. A cover layer can be disposed over the cavity and attached to the first major surface of the non-conductive substrate to form a sealed enclosure. The sealed package can also include a feedthrough that includes a via between a recessed surface of the cavity and a second major surface of the substrate, and a conductive material disposed in the via. An external contact can be disposed over the via on the second major surface of the non-conductive substrate, where the external contact is electrically connected to the conductive material disposed in the via. The sealed package can also include an electronic device disposed within the sealed enclosure that is electrically connected to the external contact.

Abstract: A board in an aspect of the present invention includes a substrate, a first film, a first layer, and a second film. The substrate has a first elastic modulus. The first film is at an upper surface of the substrate. The first layer is at a lower surface of the substrate. The first layer has a second elastic modulus lower than the first elastic modulus and has a first thermal expansion coefficient. The second film is at a lower surface of the first layer. The second film includes the same material as the first film and has a second thermal expansion coefficient lower than the first thermal expansion coefficient.

Abstract: An electric connection box includes a housing having an opening formed by side walls, a lock protruding plate, a lid to be attached to the housing, a hook, a lock portion, a protective wall, lock pieces and slits. The protective wall is configured to, when the lid is attached to the housing, cover a cable connection portion provided on the second side wall. The lock pieces extend in parallel to the protective wall and extend from the protective wall toward a first direction. The pair of slits respectively includes a receiving opening to, when the lid is attached to the housing, accommodate respective one of the pair of lock pieces, the pair of slits being to receive the lock pieces when engagement at the lock portion is carried out. The receiving opening opens, when the lid is attached to the housing, toward a second direction.

Abstract: A housing is disclosed. In an embodiment a housing includes a housing opening, a pressure-compensating element mounted on an inner side of the housing opening, a protective wall mounted on an outer side of the housing opening surrounding the housing opening and a bridge arranged over the outer side of the housing opening and protruding beyond the housing opening, wherein the bridge is shaped and arranged such that a projection of the bridge at least partially covers the housing opening.

Abstract: A communications and processing module is provided. The communications and processing module is electrically coupleable to a circuit breaker to provide the circuit breaker with additional capabilities. The communications and processing module includes a housing, at least one electrical contact positioned in the housing, an output lug positioned in the housing, wherein an electrical path is defined between the at least one electrical contact and the output lug, at least one sensor positioned in the housing and operable to sense at least one operating condition of the circuit breaker, and at least one communications interface positioned in the housing and communicatively coupled to the at least one sensor, the communications interface operable to receive data from the at least one sensor that is indicative of the at least one sensed operating condition to facilitate exporting the received data to a remote computing device.

Abstract: A connector-equipped case that includes a case that includes a through hole; a connector fixed to the case, the connector including: a core that supports a plurality of terminals; and a hood that is formed by forming a region around the through hole of the case and a portion of the core in one piece; and an adhesive layer that is interposed between the case and the hood, wherein a constituent material of the adhesive layer is an adhesive that contains acrylic rubber.

Abstract: A method for processing an integrated optical circuit chip includes securing a panel dam around a periphery of an array of integrated optical circuit chips that share a substrate. The method also includes filling an area circumscribed by the panel dam with an insulating polymer to a level below a top surface of the integrated optical circuit chips. The method further includes singulating a given integrated optical circuit chip in the array of integrated optical circuit chips.

Abstract: A MEMS device is disclosed. In an embodiment a MEMS device includes a substrate having an active region and at least one integrated electrical and mechanical connection element configured to electrically and mechanically mount the MEMS device to a carrier, wherein the connection element comprises a stress-reducing structure.

Abstract: A radiation beam window assembly may include a substrate and a spacer panel comprising a rigid low-density core with first and second fiber skins disposed on opposing surfaces of the foam core and a central opening disposed completely through the spacer panel and disposed over the substrate. A beam window panel may comprise a rigid low-density foam core comprising first and second fiber skins disposed on opposing surfaces of the foam core. The beam window panel may further include a cathode formed over the first fiber skin and aligned with the central opening of the spacer panel. A channel may be formed completely around a perimeter of the cathode, and the second fiber skin may comprise a ground ring. A pressure plate may be disposed over the beam window panel and mechanically coupled to the substrate, the pressure plate comprising a conductive layer configured to be electrically grounded with the ground ring.

Abstract: A bulkhead passthrough connector containing a printed circuit board (PCB) for transferring electrical signals across a bulkhead to an electronic valve actuator, an electronic valve actuator configured to operate and communicate with a valve using a PCB through a bulkhead, the electronic valve actuator, and a method of assembling a bulkhead passthrough connector incorporating a PCB. The embodiments may include a passthrough partition which separates one side of the bulkhead from another. A PCB retainer may also be secured to the passthrough partition. The PCB is attached to the PCB retainer and extends from one side to another side of the bulkhead through the passthrough partition. The PCB further includes electrical paths printed on the PCB and electrical connectors located on both sides of the bulkhead to enable communication with external devices.

Abstract: The invention relates to a vacuum arc extinguishing chamber contact, a vacuum arc extinguishing chamber and a vacuum circuit breaker. The contact includes a contact blade, a first contact cup and a second contact cup. The first contact cup is arranged in the second contact cup. One end of the first contact cup is connected with the second contact cup, and the other end of the first contact cup is connected with the contact blade. The contact blade is connected with the second contact cup. According to the invention, a single longitudinal magnetic field is split into a plurality of independent longitudinal magnetic field areas, a plurality of coils are used for shunting current, and the current density is reduced, thereby solving the contradiction between interrupting of the large short-circuit current and the temperature rise of the large rated current.

Abstract: An endoscope includes an image pickup device inserted into a through hole in a housing, in which the image pickup device includes an optical unit including a distal end lens and optical members, and an image pickup unit, the distal end lens is fixed to a distal end portion of the through hole, the optical members are held by a lens frame, the lens frame being inserted into the through hole, and a part of the lens frame being bonded to the through hole, and the image pickup unit includes a unit frame fixed to the lens frame, a front portion of the unit frame being inserted into the through hole and being bonded to the through hole, and an outer surface of a rear portion of the unit frame including stoppers to which a jig is to be fixed, the rear portion not being inserted into the through hole.

Abstract: An optical semiconductor apparatus includes: a package substrate that includes a recess that opens on a top surface of the package substrate; a light emitting device housed in the recess; a window member provided to cover an opening of the recess; and a sealing structure that seals a space between the package substrate and the window member. The sealing structure includes a first metal layer provided in a shape of a frame on the top surface of the package substrate, a second metal layer provided in a shape of a frame on an inner surface of the window member, and a metal bonding part provided between the first metal layer and the second metal layer. An entirety of one of the first and second metal layers is positioned in a region where the other of the first and second metal layers is provided.

Abstract: Various embodiments of a sealed package and a method of forming such package are disclosed. The package can include a non-conductive substrate that includes a cavity disposed in a first major surface. A cover layer can be disposed over the cavity and attached to the first major surface of the non-conductive substrate to form a sealed enclosure. The sealed package can also include a feedthrough that includes a via between a recessed surface of the cavity and a second major surface of the substrate, and a conductive material disposed in the via. An external contact can be disposed over the via on the second major surface of the non-conductive substrate, where the external contact is electrically connected to the conductive material disposed in the via. The sealed package can also include an electronic device disposed within the sealed enclosure that is electrically connected to the external contact.

Abstract: Provided is a touch control system of an electronic product in underwater environment. The touch control system includes a sealing device which is configured to accommodate the electronic product. The sealing device includes a sealed chamber interlayer and a sealed shell. Herein the sealed chamber interlayer is opposite to the touch screen of the electronic product and is capable of being pressed and rebounded and is transparent, and the sealed shell is connected with the sealed chamber interlayer in a sealing manner. The sealed chamber interlayer covers a surface of the touch screen completely. The sealed shell covers other surfaces of the electronic product, and implements touch control to the touch screen by applying an external force to the sealed chamber interlayer. Underwater high-accuracy maneuverability of the touch screen of the electronic product may be implemented when an external force is applied to the sealed chamber interlayer by a finger.

Abstract: A method of fabricating an electronic component includes forming a functional unit on a main surface of a substrate, forming a sacrificial layer covering the functional unit on the main surface, forming a cap layer covering the sacrificial layer, the cap layer forming a periphery enclosing the cavity on the main surface, forming holes through the cap layer, forming a cavity by removing the sacrificial layer using a wet etching process through the holes, the holes including a peripheral hole communicating an inside of the cavity with an outside of the cavity along the main surface, and forming a first resin layer covering the cap layer and the main surface.

Abstract: Various embodiments of a sealed package and a method of forming such package are disclosed. The package can include a non-conductive substrate that includes a cavity disposed in a first major surface. A cover layer can be disposed over the cavity and attached to the first major surface of the non-conductive substrate to form a sealed enclosure. The sealed package can also include a feedthrough that includes a via between a recessed surface of the cavity and a second major surface of the substrate, and a conductive material disposed in the via. An external contact can be disposed over the via on the second major surface of the non-conductive substrate, where the external contact is electrically connected to the conductive material disposed in the via. The sealed package can also include an electronic device disposed within the sealed enclosure that is electrically connected to the external contact.

Abstract: Chip scale package such as a chip scale package having a chip integrated therein to provide an integrated chip scale package.

Abstract: A sealing process of LED modules, comprising: (1) a waterproof wire goes through a wire-through hole of a heat sink to be connected with a positive-negative solder joints on a PCB board, wherein the positive-negative solder joint and the position that the waterproof wire going through are subjected to glue sealing treatment, and a waterproof sealing process is operated between the waterproof wire and the wire-through hole; (2) fix the PCB board on the heat sink; (3) place one sealing ring into one of the grooves; (4) apply evenly a ring of liquid silica gel along the other groove of the lens set and the amount of the liquid silica gel is limited to completely sticking the solid silica gel sealing ring; (5) the heat sink installed with the PCB board and the waterproof wire as processed in step (2) is inversely buckled on the lens set which is set with the solid silica gel ring and the liquid silica gel as processed in step (4), so as to fix the heat sink entirety and the lens set.

Abstract: A method and apparatus for incorporation of high power device dies into smaller system packages by embedding metal “coins” having high thermal conductivity into package substrates, or printed circuit boards, and coupling the power device dies onto the metal coins is provided. In one embodiment, the power device die can be attached to an already embedded metal coin in the package substrate or PCB. The power device die can be directly coupled to the embedded metal coin or the power device die can be attached to a metallic interposer which is then bonded to the embedded metal coin. In another embodiment, the die can be attached to the metal coin and then the PCB or package substrate can be assembled to incorporate the copper coin. Active dies are coupled to each other either through wire bonds or other passive components, or using a built-up interconnect.

Abstract: A hermetic sealing cap includes a base material, a first plated layer formed on the base material, and a second plated layer formed on the first plated layer. A surface of the base material is sectioned into a first region, a second region not adjacent to the first region inside the first region, a third region adjacent to the first region inside the first region, and a fourth region adjacent to the first region outside the first region. In the third region and the fourth region, the first plated layer is exposed to be oxidized.

Abstract: An electronic device having a unitary housing is disclosed. The device can include a first housing component having an open cavity, an internal electronic part disposed within the cavity, a second housing component disposed across the cavity, and a support feature disposed within the cavity and arranged to support the second housing component. The first housing component can be formed from metal, while the second housing component can be formed from a plurality of laminated foil metal layers. The second housing component can be attached to the first housing component via one or more ultrasonic welds, such that a fully enclosed housing is created. The fully enclosed housing can be hermetically sealed, and the outside surfaces thereof can be machined or otherwise finished after the ultrasonic welding.

Abstract: An electronic component cap for producing a package having a sealed region by being bonded to a base, having a brazing material-fused surface to which a brazing material is fused and a sealing surface corresponding to the sealed region. The brazing material-fused surface has a non-flat work surface formed by plastic working, and a ratio (Sc/Sf) of a surface area (Sc) of the brazing material-fused surface per unit area to a surface area (Sf) of the sealing surface per unit area satisfies 1<Sc/Sf?1.6. The cross-sectional shape of the work surface may be one of various shapes such as a groove shape, an approximately V shape, and a circular-arc shape. The cap has a good wettability when a brazing material is fused. Also, the brazing material does not wet-spread excessively when the brazing material is melted again for sealing work.

Abstract: Various embodiments of a sealed package and a method of forming such package are disclosed. The package can include a non-conductive substrate that includes a cavity disposed in a first major surface. A cover layer can be disposed over the cavity and attached to the first major surface of the non-conductive substrate to form a sealed enclosure. The sealed package can also include a feedthrough that includes a via between a recessed surface of the cavity and a second major surface of the substrate, and a conductive material disposed in the via. An external contact can be disposed over the via on the second major surface of the non-conductive substrate, where the external contact is electrically connected to the conductive material disposed in the via. The sealed package can also include an electronic device disposed within the sealed enclosure that is electrically connected to the external contact.

Abstract: An electrical connection box applied to a wire harness includes a casing that includes an accommodating space that is formed therein and that accommodates an electronic component, and a guiding space that is partitioned horizontally lateral to the accommodating space therein via a partition wall, and that extends in a vertical direction and guides water entered therein to a vertically downside. The casing includes a water-preventing rib that is provided in the guiding space, and that guides water guided to the vertically downside in the guiding space, in a direction of avoiding from an avoidance target portion that is positioned vertically below the guiding space.

Abstract: A product positioning device includes a support, a first guide rail, a second guide rail, a support platform, a latching device, and a driving device. The first guide rail and the second guide rail are positioned on the support. The support platform is configured to receive a product to be positioned. The support platform is movable to an end of the first guide rail. The latching device is movable to a position holding the product to be positioned against the support platform. The driving device is movable to a position nearer the support platform. The driving device is further slidably engaged with the second guide rail. The driving device moves to the driving device position as the support platform moves to the end of the first guide rail, and the latching device moves to the latching device position as the driving device moves to the driving device position.

Abstract: A resonant transducer includes a silicon single crystal substrate, a silicon single crystal resonator disposed over the silicon single crystal substrate, a shell made of silicon, surrounding the resonator with a gap, and forming a chamber together with the silicon single crystal substrate, an exciting module configured to excite the resonator, a vibration detecting module configured to detect vibration of the resonator, a first layer disposed over the chamber, the first layer having a through-hole over the resonator, a second layer disposed over the first layer, the second layer covering a gap being positioned above the through-hole and being communicated with the through-hole, and a third layer covering the first layer and the second layer, and the third layer sealing the gap.

Abstract: A sealing process of LED modules includes a waterproof wire put through a wire-through hole of a heat sink to be connected with a positive-negative solder joints on a PCB board, which are subjected to glue sealing treatment. A waterproof sealing process is operated between the waterproof wire and wire-through hole. The PCB board is fixed on the heat sink. One sealing ring is placed into a groove. A ring of liquid silica gel is evenly applied along the other groove. The heat sink installed with the PCB board and the waterproof wire are inversely buckled on the lens set which is fixed with the solid silica gel ring and liquid silica gel. At least two waterproof sealing rings are used to isolate an LED chip from the outside so as to prevent all water vapor or other harmful gases from corroding the chip and the PCB.

Abstract: A package for housing a semiconductor element includes a base body including a bottom plate section and a frame-shaped side wall section; and an input/output terminal provided so as to pass through the side wall section, the input/output terminal having a plate section on which line conductors are formed, and a vertical wall section which is fixed to the plate section so as to continue to the side wall section and so that the line conductors are sandwiched between the plate section and the vertical wall section and both ends of the line conductors are exposed from the vertical wall section. The vertical wall section has a thick section in a center portion of a side surface of the vertical wall section in a direction along the side wall section, the thick section having thick wall thickness, a lower end of the thick section being fixed to the plate section.

Abstract: A modular LED explosion-proof lamp usable in any environment includes a body, a wiring box assembly, an illumination unit and a positioning assembly. The body includes a first coupling port, a second coupling port and a third coupling port. The wiring box assembly is connected to the first coupling port, or the second coupling port or the third coupling port. The illumination unit is connected to the first coupling port, or the second coupling port or the third coupling port. The positioning assembly is connected to the first coupling port, or the second coupling port or the third coupling port. Hence the wiring box assembly, the illumination unit or the positioning assembly can be selectively connected to the first coupling port, or the second coupling port or the third coupling port. Thus the modular LED explosion-proof lamp can be assembled in a plurality of implementation fashions.

Abstract: Provided is a waterproof box capable of increasing the amount of water discharged from a double wall without reducing the rigidity of a body case. A waterproof box is provided with a body case and an upper cover attached to the body case so as to cover an opening of the body case. A peripheral wall of the body case has a double-wall structure including an outer wall and an inner wall. Liquid penetrating from a seam between the upper cover and the outer wall passes between the outer wall and the inner wall and is discharged to the outside of the body case. A wide width portion and a narrow width portion which have mutually different gaps between the outer wall and the inner wall are formed in the body case.

Abstract: An electronic device comprises a substrate, at least one electronic chip mounted on and electrically connected to the substrate and being configured as a system control unit for controlling a connected system, a heat removal structure thermally connected to the at least one electronic chip and configured for removing heat generated by the at least one electronic chip upon operation of the electronic device, and an overmolding structure configured for at least partially encapsulating at least the at least one electronic chip and the substrate.

Abstract: A method for manufacturing an electronic device is provided, in which a base and a lid as a cover body are bonded together while forming an interior space between the base and the lid. The method includes: a step of preparing the lid including a groove communicating the interior space with the outside, the groove being in a back surface of the lid; a step of accommodating a gyro element as an electronic component in the interior space; a first bonding step of bonding the base and the lid together by seam welding at an area for bonding except for a portion corresponding to the groove; and a second bonding step of bonding the base and the lid by welding using a laser beam at a portion of the area for bonding, the portion including an end of the groove on the outside side, to thereby close the groove.

Abstract: One aspect relates to a housing for an active implantable medical device, whereby the housing, at least parts thereof, includes an electrically insulating ceramic material, and has at least one electrically conductive conducting element, whereby the at least one conducting element is set up to establish at least one electrically conductive connection between an internal space of the housing and an external space. One aspect provides the at least one conducting element to include at least one cermet, whereby the housing and the at least one conducting element are connected in a firmly bonded manner.

Abstract: A solar power inverter having a sealing means includes: a main case having an opening on a front surface thereof, the opening open and closed by a main cover; an auxiliary case coupled to one side surface of the main case, and having a second opening on a front surface thereof, the second opening open and closed by an auxiliary cover; and a gasket interposed between the main case and the auxiliary case, wherein the main case and the auxiliary case are coupled to each other by coupling bolts which pass through the main case, the gasket and the auxiliary case.

Abstract: An electronic device includes a case, a heat source, a radiator, and an air stream generator. The case has an air ventilation hole and an opening. The radiator is disposed in the case and in thermal contact with the heat source. The radiator includes a main body having a first, a second, and a third side surface. A first air inlet, an air outlet, and a second air inlet are disposed on the first side surface, the second side surface, and the third side surface, respectively. The third side surface and the case are separated by a distance from each other. The second air inlet is disposed between a geometric middle plane of fins of the main body and the second side surface. The distance between the second air inlet and the first side surface is greater than that between the air ventilation hole and the first side surface.

Abstract: A seal cover includes a cover main body (10) shaped to cover an opening of a case and to be attached to a surface of the case. A seal ring holder (20A) is on the underside of the cover main body (10) and is arranged to fit into the opening. A seal ring (25) is on the outer peripheral surface of the seal ring holder (20A) and closely contacts the inner peripheral surface of the opening. An interlock connector (40) projects from the seal ring holder (20A) for connecting to the waiting connector and sets an energizing circuit in an energized state or a non-energized state upon being connected to or separated from the waiting connector. The interlock connector (40) is mounted on the seal ring holder (20A) to be movable in a direction perpendicular to a connecting direction to the waiting connector.

Abstract: An electronics and/or gearing housing, in particular for a worm wheel of a window lifting drive, of a motor vehicle is provided. The electronics and/or gearing housing has a housing body, within which an electronic assembly is arranged, and a cover, which is joined to the housing body via ultrasonic welding.

Abstract: A sealing structure to seal a housing for electronic equipment such as a cellular phone, and which provides reliable sealing for the housing, and at the same time can attain to improve design with a simple construction. A sealing structure, which seals a housing, is provided with a seal member mounted on the housing, a substrate integrally molded with the seal member, and having at least a part thereof lying in the inside of the housing in a state where the seal member is mounted on the housing, and a light source element arranged on the substrate board, wherein the seal member is transparent or translucent, and it is constructed such that the light source element is arranged in a region of hermetic sealing formed by the seal member, whereby at least a part of the seal member emits light by the light radiated from the light source element.

Abstract: An electrical box includes one or more sides joined to form a front opening to receive an electrical device. The electrical box also includes a flange extending laterally from the one or more sides. The flange includes a blade edge configured to have an initial engagement with a surface of a wallboard when the electrical box is installed in an opening of the wallboard. When the electrical box is installed in the opening of the wallboard, the blade edge forms a vapor-tight barrier between the electrical box and the surface of the wallboard.

Abstract: Disclosed is an exemplary a re-enterable enclosure for a cable splice. The enclosure includes a cover and a base configured for engagement with the cover, wherein the cover and the base form a cavity for enclosing the cable splice when the base and cover are in a closed position. The enclosure also includes first and second sealing members disposed in the base and the cover. The first sealing member has first and second end portions coupled by a longitudinal member, wherein each end portion includes at least two lobes separated by a gap. The second sealing member includes a third end portion having a protrusion, wherein the protrusion on the third end portion is configured for insertion into the gap between the lobes of one of the first and second end portions of the first sealing member to form an intermating seal.

Abstract: A flame sensor apparatus and a cable assembly apparatus are provided for use in sensing characteristics of a flame within a combustion chamber. The flame sensor apparatus includes an electrical assembly remote from a sensor assembly. A cable assembly extends between the sensor assembly and the electrical assembly. The cable assembly includes two cable ends and a housing that defines an internal volume. Cable fittings are connected to the cable ends through a first seal. A second seal is located in the annular space between the electrical cable and the cable fitting opening at the first cable end. The cable assembly includes a third seal and at least one deformable sealing component located at the second cable end. The seals are configured to prevent moisture, gas, and contaminants from passing through the cable fitting opening. Additionally, a method of sealing an electrical cable and a flexible conduit is provided.

Abstract: A cable closure includes a housing that delimits an interior of the cable closure and seals off the cable closure toward the outside. The housing is formed by a covering body having shells hinged together and cable insertion regions provided on mutually opposite sides of the shells. Sealing elements are positioned at the mutually opposite sides of the covering body proximate the cable insertion regions. A closing mechanism having a latch and latch support is configured to lock the shells together. The latch support has a first end section pivotably attached to one of the shells and a second end section pivotably attached to the locking latch, which in turn has an end section serving as an actuating handle for closing and opening the cable closure.

Abstract: An electronic component package has a first sealing member main surface with mounted electronic element, and a second sealing member. An outer circumference portion of a second sealing member is molded into a tapered shape, providing a tapered area in at least part of the outer circumference. A flat area adjacent to the tapered area is provided in at least part of a flat portion inward of the outer circumference portion of the surface of the second sealing member. A first area corresponding to the tapered area and a second area corresponding to the flat area are provided adjacent to each other on a first main surface of the first sealing member with mounted electronic component element. A width W2 of the second area is 0.66 to 1.2 times a width W4 of the flat area. First and second bonding layers are formed and bonded with each other by heating.

Abstract: An electronic apparatus includes: a substrate which has a step portion in an edge portion; an electronic component which is bonded to a surface of the substrate inward of the step portion of the substrate; and a cap member which is bonded to the step portion so as to seal the electronic component, wherein a wall surface of the step portion is formed to be inclined from the step portion toward an electronic component bonding region or to be perpendicular to the step portion.

Abstract: A seal structure for an electronic control device having a circuit board housed in a watertight space a housing that is formed by fitting a plurality of fitting members together, has first and second seal portions which are formed at a fitting surface portion between the fitting members that are fitted together. One side of a pair of the fitting members of each of the first and second seal portions is provided with a seal groove, the other side is provided with a protruding line. An auxiliary seal groove and an auxiliary protruding line are formed on opposing surfaces of the seal groove and the protruding line at a merged part where the first and second seal portions meet each other. The auxiliary seal groove and the auxiliary protruding line continuously extend from the seal groove up to an end surface of the protruding line.