Abstract: A short-arc discharge lamp may include an arc tube section; at least one side tube section connected to at least one end of the arc tube section; at least one electrode provided inside the arc tube section; and at least one lead rod which is provided inside the at least one side tube section and which is connected to the at least one electrode; wherein the at least one lead rod has at least one metal body disposed so as to be in contact with the at least one lead rod; the at least one side tube section has at least one reduced diameter region; the at least one lead rod is supported by the at least one reduced diameter region via the at least one metal body; and at least one coating film is formed on at least one surface of the at least one metal body.

Abstract: Electrical feedthroughs for battery housings are presented. The electrical feedthroughs include a connector, a ceramic insulator, and a terminal. A first seal couples the connector to the ceramic insulator via a first braze alloy. A second seal couples the ceramic insulator to the terminal via a second braze alloy. The electrical feedthroughs can also include a spacer. A first seal couples the connector to the ceramic insulator; a second seal couples the ceramic insulator to the spacer; and the third seal couples the spacer to the terminal. The first seal, the second seal, and the third seal include, respectively, a first braze alloy, a second braze alloy, and a third braze alloy.

Abstract: A conductive member that includes a flexible conductor in which a plurality of strands are bundled together and that has flexibility; a rigid conductor that has a shape retaining property; a body that is formed at an end portion of the rigid conductor and that surrounds the flexible conductor and is fixed to the flexible conductor; and a sliding contact that has a form protruding from an inner circumference of the body and with which the strands can make sliding contact, wherein the sliding contact has a bent shape.

Abstract: A positive electrode contains a first active material and a second active material. The first active material and the second active material each contain a lithium composite oxide containing at least manganese (Mn), nickel (Ni), and cobalt (Co) as transition metals. The first active material has a particulate shape. An average porosity V1 in a particle of the first active material satisfies 10[%]?V1?30[%]. An average particle diameter D1 of the first active material satisfies 6 [?m]?D1?20 [?m]. The second active material has a particulate shape. An average porosity V2 in a particle of the second active material satisfies 0[%]?V2?10[%]. An average particle diameter D2 of the second active material satisfies 1 [?m]?D2?6 [?m].

Abstract: Electrical feedthroughs for battery housings are presented. The electrical feedthroughs include a connector, a ceramic insulator, and a terminal. A first seal couples the connector to the ceramic insulator via a first braze alloy. A second seal couples the ceramic insulator to the terminal via a second braze alloy. The electrical feedthroughs can also include a spacer. A first seal couples the connector to the ceramic insulator; a second seal couples the ceramic insulator to the spacer; and the third seal couples the spacer to the terminal. The first seal, the second seal, and the third seal include, respectively, a first braze alloy, a second braze alloy, and a third braze alloy.

Abstract: A feed-through component for a conductor feed-through which passes through a part of a housing, for example a battery housing, is embedded in a glass or glass ceramic material and has at least one conductor, for example an essentially pin-shaped conductor, and a head part. The surface, in particular the cross-sectional surface, of the head part is greater than the surface, in particular the cross-sectional surface, of the conductor, for example of the essentially pin-shaped conductor. The head part is embodied such that is can be joined to an electrode-connecting component, for example an electrode-connecting part, which may be made of copper, a copper alloy CuSiC, an aluminum alloy AlSiC or aluminum, with a mechanically stable and non-detachable connection.

Abstract: Electrical feedthroughs for battery housings are presented. The electrical feedthroughs include a connector, a ceramic insulator, and a terminal. A first seal couples the connector to the ceramic insulator via a first braze alloy. A second seal couples the ceramic insulator to the terminal via a second braze alloy. The electrical feedthroughs can also include a spacer. A first seal couples the connector to the ceramic insulator; a second seal couples the ceramic insulator to the spacer; and the third seal couples the spacer to the terminal. The first seal, the second seal, and the third seal include, respectively, a first braze alloy, a second braze alloy, and a third braze alloy.

Abstract: A four cable operated scissors grab, comprising a pair of scissor levers that are connected via a pivot joint to pivot about a pivoting axis, which scissor levers each include a grab shell and a hoist cable connection situated on a first side of the lever with respect to the pivot joint, and a closing cable connection situated on a second side of the lever that is opposite with respect to the pivot joint, so that in use a dedicated hoisting cable is fastened to each lever on the first side of the lever, and a dedicated closing cable is fastened to each lever at the second side of the lever. The scissor levers each include a sheave on the second side of the lever, and said sheaves are each arranged as a first and final closing sheave, so that in use each of the two closing cables extend in a single pass from a closing cable connection on the second side of one lever via the closing sheave on the second side of the other lever to depart from the grab and continue upward to a crane carrying the grab.

Abstract: A high voltage impedance device with surface leakage proof configuration is applied in a divider. Aforementioned divider is assembled by a high impedance element, an inner case body and an outer case body. The high impedance element is sealed in the inner case body and a closed interlayer between the inner case body and the outer case body is filled with noble gas as an insulating layer. While the high impedance element is applied in high voltage, the closed interlayer can prevent the current-leakage from forming impedance paralleled with the high impedance element. The current-leakage is formed on the surface of insulting portion, or is formed by moisture, dust or corona effect. Therefore, the current-leakage proof divider may maintain the stability/linearity of the voltage division and then reduce the distance between two ends of the high impedance element effectively and still maintain the linearity of measuring voltage.

Abstract: A temperature sensor includes a thermo-sensitive element, a pair of element electrode wires electrically connected to the thermo-sensitive element, a glass sealing body that covers the thermo-sensitive element and part of the pair of the element electrode wires, and a tablet formed with a pair of insertion holes extending in an axial direction thereof, through which the pair of the element electrode wires pass respectively. The glass sealing body includes a sealing part formed so as to extend from an element side end surface thereof located on a side of the thermo-sensitive element toward the thermo-sensitive element, and a sagging part formed in each of the pair of the insertion holes so as to extend integrally from the sealing part. The length of the sagging part in the axial direction being smaller than or equal to 1.5 mm.

Abstract: A sealing structure of a multicore cable includes the multicore cable, a rubber stopper, a cap, and a holder. The multicore cable includes first to fourth electric wires covered with a sheath. The rubber stopper is fitted on an end of the sheath and first to fourth through holes through which the first to the fourth electric wires are passed, respectively. The cap is fitted on the rubber stopper and presses the rubber stopper inward. The holder includes a sheath holding portion for holding the sheath and a cap holding portion for holding the cap.

Abstract: A crystal device having electrode lands on a principal surface of a first package member, a crystal oscillator bonded to and held by the electrode lands, a second package member bonded to the principal surface of the first package member by an adhesive layer, a glass layer provided on the principal surface of the first package member, and the glass layer having adhesive spread preventing parts and an extended portion. The adhesive spread preventing parts prevent the adhesive of the adhesive layer from spreading out. The extended portion is extended to reach the lower surfaces of the electrode lands.

Abstract: A substrate structure having a component-disposing area and a process thereof are provided. The substrate structure having a component-disposing area includes a core layer, a first dielectric-layer, a laser-resistant metallic-pattern and a second dielectric-layer. The core layer includes a first surface, a component-disposing area and a patterned metallic-layer disposed on the first surface and including multiple pads, and the pads are located within the component-disposing area. The first dielectric-layer is disposed on the core layer and includes multiple openings to respectively expose the pads. The laser-resistant metallic-pattern is disposed on the first dielectric-layer and surrounds a projection area of the first dielectric-layer which the component-disposing area is orthogonally projected on.

Abstract: One aspect relates to a housing for an active implantable medical device, whereby the housing, at least parts thereof, includes an electrically insulating ceramic material, and has at least one electrically conductive conducting element, whereby the at least one conducting element is set up to establish at least one electrically conductive connection between an internal space of the housing and an external space. One aspect provides the at least one conducting element to include at least one cermet, whereby the housing and the at least one conducting element are connected in a firmly bonded manner.

Abstract: A feedthrough assembly includes a metallic ferrule, an insulator mounted within the ferrule, a plurality of feedthrough wires mounted within and extending through the insulator, and a ground wire directly attached to the ferrule, wherein the ground wire does not pass through or alongside the insulator.

Abstract: A hermetic feed-through includes a housing body defining a hollow space, a plurality of conductive pins and a seal structure. The plurality of conductive pins extend through the hollow space. The seal structure is provided in the hollow space and includes a single-piece glass component. The single-piece glass component hermetically seals at least two conductive pins to the housing body and electrically insulates the at least two conductive pins from the housing body.

Abstract: The present disclosure relates to feedthrough contacts for electronic components of the type used in implantable stimulators such as, for example, cardiac pacemakers, ICDs, CRT-Ds, and/or neurostimulators. A feedthrough conductor includes a metallic electrode, wherein a part of the metallic electrode (2) has a locally enlarged diameter in the region of the passage through an opening (3) in the component housing (4). The ridge (5) formed as a result exerts pressure onto the elastic sealing material (6) disposed around the electrode (2) in a tubular shape, thereby producing a hermetic seal between the electrode surface and the sealing material (6), and between the sealing material (6) and the wall (4) of the housing opening (3). The feedthrough conductor is sealed using an adhesive material (7) on the outer side of the electronic component.

Abstract: A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.

Abstract: A feedthrough assembly includes a metallic ferrule, an insulator mounted within the ferrule, a plurality of feedthrough wires mounted within and extending through the insulator, and a ground wire directly attached to the ferrule, wherein the ground wire does not pass through or alongside the insulator.

Abstract: An electrical feedthrough, in particular for use in an electro-medical implant, having a flange enclosing at least one feedthrough bushing and at least one terminal pin enclosed by the at least one feedthrough bushing, the terminal pin having at least one section which can be joined at a lower energy in the interior of the implant.

Abstract: A hermetically sealing device includes a conductive seal member (2) which is integrated with a conductive member (1) extending into a casing (3) and seals a space between the conductive member (1) and an inserting section for the conductive member (1) on the casing (3). In the conductive member (1), an electromagnetic wave shield layer (11) is laminated on a cover film which protects the surface of a base film having a circuit pattern, an insulating layer (12) is laminated on the electromagnetic wave shield layer (11), the insulating layer (12) has an opening section (12a) such that a part of the flat section of the electromagnetic wave shield layer (11) is exposed, and the seal member (2) is integrated with the conductive member (1) to cover the opening section (12a) and is brought into contact with the electromagnetic wave shield layer (11) through the opening section (12a).

Abstract: A structure of a panel which can be thinned down to about a panel thickness of a PDP and a manufacturing method thereof are provided. A gas filling hole is provided to a surface of a rear glass substrate of a PDP, the surface coming in contact with a front glass substrate of the PDP. Vacuuming and filling of a discharge gas are performed through the gas filling hole. After filling of the discharge gas, a mechanism for lifting solder iron up and down and supplying solder provided inside a chamber inserts a tip of an ultrasonic soldering iron into the gas filling hole to start supplying a solder which is a material for a plug sealant. When a series of forming steps of the plug sealant are finished, the ultrasonic soldering iron is retreated before the solder is solidified to finish formation of the plug sealant.

Abstract: The present disclosure provides a method for fabricating a MEMS device including multiple bonding of substrates. In an embodiment, a method includes providing a micro-electro-mechanical systems (MEMS) substrate including a first bonding layer, providing a semiconductor substrate including a second bonding layer, and providing a cap including a third bonding layer. The method further includes bonding the MEMS substrate to the semiconductor substrate at the first and second bonding layers, and bonding the cap to the semiconductor substrate at the second and third bonding layers to hermetically seal the MEMS substrate between the cap and the semiconductor substrate. A MEMS device fabricated by the above method is also provided.

Abstract: A hermetic feed-through includes a housing body defining a hollow space, a plurality of conductive pins and a seal structure. The plurality of conductive pins extend through the hollow space. The seal structure is provided in the hollow space and includes a single-piece glass component. The single-piece glass component hermetically seals at least two conductive pins to the housing body and electrically insulates the at least two conductive pins from the housing body.

Abstract: Provided is an electrical part, a nonaqueous electrolyte cell, and a lead wire and a sealable container for use therein, with which the adhesive property and sealing performance in an initial state and in an electrolyte-contacting state are enhanced. An electrical part includes a sealable container that includes a metal layer and a lead conductor that extends from inside of the sealable container to outside of the sealable container, the sealable container and the lead conductor being heat-sealed in a seal part. At least in part of the seal part, a thermal adhesive layer containing aluminum polyphosphate is provided in a portion between the metal layer and the lead conductor so as to be in contact with the lead conductor.

Abstract: An electrical feed-through assembly and method of making an electrical feed-through assembly provide an electrical feed-through assembly that can survive exposure in a high pressure liquid, for example, seawater at least 9000 psi, for substantial periods of time, for example, twenty years, without substantial leakage of the high pressure liquid into or through the electrical feed-through assembly.

Abstract: A feedthrough assembly includes a ferrule, an insulating structure, at least one terminal pin and a glass seal that fixedly secures the insulating structure within the ferrule. The insulating structure has a top portion, a bottom portion, and an inner diameter portion. The inner diameter portion defines at least one aperture extending from the top portion to the bottom portion of the insulating structure. The at least one terminal pin extends through the at least one aperture. The glass seal comprises about 30% B2O3, about 30% to about 40% of a member selected from the group consisting of CaO, MgO, SrO, and combinations thereof, with the proviso that the individual amounts of CaO and MgO are each not greater than about 20%, about 5% La2O3, about 10% SiO2, and about 15% Al2O3, wherein all percentages are mole percentages.

Abstract: A packaging system having a housing for providing a hermetically sealed interior space for receiving and supporting optoelectronic components. The housing has at least one section of wall comprising a layer of liquid crystal polymer (LCP). At least one hermetically sealed electrical port is formed in the LCP wall section over a predetermined area and comprises a layer of metal adhered to and overlying the predetermined area on the of the LCP wall section. An electrode passes through the metal from the exterior of the system to the interior space to provide an electrical communication path between the optoelectronic components and the exterior of said packaging system. A solder joint is formed between the electrode and the layer of metal to provide a hermetic connection between the layer of metal and the electrode to assure that the hermeticity of the housing remains unchanged with the electrical port present.

Abstract: A hermetically sealed microelectromechanical system (MEMS) package for an implantable medical device is presented. The MEMS comprises a first substrate that includes an aperture. A feedthrough assembly is coupled to the aperture; the feedthrough assembly comprises a conductive element housed in a glass insulating member. A second substrate is coupled to the first substrate.

Abstract: A method of providing a hermetic, electrical connection between two electrical components by mating at least one metal pin in a glass-ceramic to metal seal connector to two electrical components, wherein the glass-ceramic to metal seal connector incorporates at least one metal pin encased (sealed) in a glass-ceramic material inside of a metal housing, with the glass-ceramic material made from 65-80% SiO2, 8-16% Li2O, 2-8% Al2O3, 1-5% P2O5, 1-8% K2O, 0.5-7% B2O3, and 0-5% ZnO. The connector retains hermeticity at temperatures as high as 700° C. and pressures as high as 500 psi.

Abstract: The present invention is directed to low-cost, low-processing temperature, and simple reinforcement, repair, and corrosion protection for hermetically sealed modules and hermetic connectors. A thin layer of glass is applied over the module's seal or the connector' glass frit. The layer of glass comprises an alkali silicate glass. The layer of glass is produced from a material which is a low viscosity liquid at room temperature prior to curing and is cured at low temperatures (typically no more than about 160 degrees Celsius). Subsequent to curing, the layer of glass is intimately bonded to the seal, watertight, and is stable from about negative two-hundred forty-three degrees Celsius to at least about seven-hundred twenty-seven degrees Celsius. The glass layer provides corrosion protection, seals any existing leaks, and possesses good flexibility and adhesion. The resulting bond is hermetic with good aqueous durability and strength similar to that of monolithic structures.

Abstract: An electrical part comprising a lead conductor and a sealed vessel including a metal layer, the lead conductor extending from the inside of the sealed vessel to the outside, wherein the lead conductor and the sealed vessel are fusion-bonded through a thermal adhesive layer at the sealing portion, and wherein a softening-resistant layer having through holes made in the thickness direction is provided between the lead conductor and the metal layer at the sealing portion. A nonaqueous electrolyte cell comprising an electrode and a nonaqueous electrolyte both enclosed inside the sealed vessel. A sealed vessel and a lead conductor having an insulating coating layer, both of which can be used in the electrical part or the like.

Abstract: A solderable cover for solder attachment to an electronic substrate comprises a non-solderable cover defining an attachment pattern, a solderable metal layer in the shape of the attachment pattern, and a layer of adhesive bonding the solderable metal layer to the attachment pattern of the non-solderable cover, wherein the adhesive exhibits bond strength and resiliency sufficient to maintain the solderable metal layer attached to the non-solderable cover when raised in temperature to a melting temperature of a solder.

Abstract: A hermetic seal includes a package base, a glass material provided on the inside of the package base, and a lead pin that is provided to penetrate through the glass material and is composed of a copper-tungsten alloy.

Abstract: The invention is a terminal assembly having a casing with at least one delivery tapered-cone conductor and at least one return tapered-cone conductor routed there-through. The delivery and return tapered-cone conductors are electrically isolated from each other and positioned in the annuluses of ordered concentric cones at an off-normal angle. The tapered cone conductor service can be AC phase conductors and DC link conductors. The center core has at least one service conduit of gate signal leads, diagnostic signal wires, and refrigerant tubing routed there-through. A seal material is in direct contact with the casing inner surface, the tapered-cone conductors, and the service conduits thereby hermetically filling the interstitial space in the casing interior core and center core. The assembly provides simultaneous high-current, high-pressure, low-inductance, and high-reliability service.

Abstract: A position adjustment of substrates is facilitated by using a sealing/bonding material consisting of a translucent colored glass material. A plasma display panel has a frontside substrate and a backside substrate facing to each other, on which electrodes are formed respectively, and a sealing/bonding material placed on a sealing/bonding area on a peripheral portion of one of the substrates, by which the two substrates are sealed and bonded to each other. The sealing/bonding material is made from a translucent colored material.

Abstract: A glass composition substantially free from lead and bismuth and containing vanadium oxide and phosphor oxide as main ingredients, wherein the sintered glass of the glass composition exhibits 109 ?cm or more at 25 ° C.

Abstract: A substrate processing apparatus which irradiates a substrate under processing with an electron beam and processes the substrate with the electron beam is disclosed. The substrate processing apparatus includes an electron beam generation mechanism which generates the electron beam, first area having a plurality of first static electricity deflecting devices whose thicknesses gradually increase in a traveling direction of the electron beam, and a second area disposed on a downstream side of the electron beam of the first area and having a plurality of second static electricity deflecting devices whose thicknesses are nearly same in the traveling direction of the electron beam. The substrate processing apparatus may further include a plurality of lenses whose thicknesses gradually decrease in the traveling direction of the electron beam, at least one of the plurality of lenses being disposed in each of the first area and the second area.

Abstract: A communications enclosure apparatus for use in a power line communications network, including a box, the box including a connection mechanism to connect the box to a standard interface of an electricity device, and the box including a water proofing system to provide the communications enclosure with all environment functionality.

Abstract: A feedthrough is insulated and hermetically sealed by brazing a ceramic disk to a case cover and by brazing the top surface of the ceramic disk to the bottom surface of a feedthrough pinhead. Using this technique instead of forming a compression seal, the surface area for bonding is increased, increasing bond strength. The ceramic disk electrically insulates the feedthrough pin from the cover, and provides a large surface area for mechanically sealing the cell with the braze. Considering the small size of many cells, this increased surface area is important for getting a good seal and increasing bond strength. This design also creates a longer fluid path, providing greater hermeticity. Furthermore, a greater range of component material combinations is available because CTE compatibility limitations of the feedthrough pin, cover, and insulator are minimized. This feedthrough is applicable to broad array of applications and numerous material combinations.

Abstract: A feedthrough terminal pin assembly includes an outer ferrule hermetically sealed through a braze joint to an insulator seated within the ferrule is described. The insulator is also hermetically brazed to at least one terminal pin. The terminal pin is provided with a braze retention structure such as an annular groove that prevents braze material from filleting past the groove. Similarly, either the ferrule or the insulator is provided with a retention structure such as an annular groove that prevents braze material spill out from the insulator/ferrule interface. In that manner, the braze retention structures keep braze material from accumulating in unwanted areas where it could adversely affect hermeticity as well as proper attachment of an EMI filter to the feedthrough assembly.

Abstract: Manufacturing equipment and manufacturing process steps that improve upon prior art processes for the manufacturing of filament tube and arc tube light sources, their components and subassemblies, and lamps employing said light sources. A double ended, tipless filament tube or arc tube light source incorporates a drawn-down tubular body, and one piece foliated leads with spurs for process handling and for spudding into a filament with stretched-out legs. Bugled ends on the body provide a novel cutoff means, facilitate a flush-fill finishing process, and enhance mounting and support of the light sources in lamps. The foliated leads are made from a continuous length of wire in a process including foil hammering and two-bath AC electrochemical etching. Cost-reduced light source and lamp production enables affordable household consumer lamps, even when containing two series-connected halogen filament tubes.

Abstract: An implantable component including a feedthrough assembly and a method for forming the feedthrough assembly wherein a coating forming a fluid barrier over an insulator, an insulator-to-terminal pin interface and an insulator-to-ferrule interface is incorporated.

Abstract: A solder joint or seal attaching components having dissimilar coefficients of thermal expansion is made thin (e.g., less than 20 ?m and preferably about 5 ?m) and of a solder such as an indium-based solder that has a tendency to creep. The solder is toroidal or otherwise shaped to avoid tensile stress in the solder. Axial shearing stress in the solder causes reversible creep without causing failure of the joint or seal. In one embodiment, a toroidal solder seal has a diameter, a footprint, and a thickness in approximate proportions of 5000:200:1.

Abstract: An implantable component including a feedthrough assembly and a method for forming the feedthrough assembly wherein a coating forming a fluid barrier over an insulator, an insulator-to-terminal pin interface and an insulator-to-ferrule interface is incorporated.

Abstract: A feed-through assembly for an IMD and a method for fabricating the same are provided. The feed-through assembly has a ferrule having a first aperture disposed therethrough. An insulating member is disposed at least partially within the first aperture. The insulating member has a second aperture, an inside surface and an outside surface. A metallization region overlies at least a portion of the inside surface and at least a portion of the outside surface of the insulating member. The metallization region is formed of a first layer of titanium and a second layer of niobium. A portion of a terminal pin of platinum is disposed through the second aperture. A first brazing seal is disposed between the insulating member and the ferrule and a second brazing seal is disposed between the insulating member and the terminal pin. The first and second brazing seals are formed of gold.

Abstract: A hermetically sealed current conducting terminal assembly for installation in an opening in the wall of a housing. The terminal assembly includes a current conducting pin assembly comprising a first pin member electrically connected to a second pin member at a conductive core and a first and second seal that electrically isolate the pin assembly from the housing.

Abstract: A feed-through assembly for an IMD and a method for fabricating the same are provided. The feed-through assembly has a ferrule having a first aperture disposed therethrough. An insulating member is disposed at least partially within the first aperture. The insulating member has a second aperture, an inside surface and an outside surface. A metallization region overlies at least a portion of the inside surface and at least a portion of the outside surface of the insulating member. The metallization region is formed of a first layer of titanium and a second layer of niobium. A portion of a terminal pin of platinum is disposed through the second aperture. A first brazing seal is disposed between the insulating member and the ferrule and a second brazing seal is disposed between the insulating member and the terminal pin. The first and second brazing seals are formed of gold.

Abstract: Feed through assemblies and methods for their manufacture are provided. The feedthrough assemblies include a ferrule, an insulating material contacting the ferrule, and a terminal extending through the ferrule and having first and second areas separated by an area contacting the insulating material. A brazing material contacts the insulating material and the terminal's first area, and a conductive material covers the terminal's second area. The presence of the conductive material causes current density to be dispersed away from the brazing material.

Abstract: A solder glass which has, by weight: about 60 to 67% Sb2O3; about 27 to 32% B2O3; and from greater than 0 to 10% ZnO. The glass has a softening point between 388 and 466° C., depending on the ZnO content. The glass can be employed as a molten seal in electrical devices such as tungsten halogen or metal halide lamps.