Abstract: A housing for an assembly of electronic components mounted on a circuit board is predominantly made of plastic, and includes a plastic housing cover and a housing floor. Metal surfaces are provided in the housing to preferentially condense moisture from the air in the housing upon cooling, to avoid condensation on the circuit board or the electronic components. The metal surfaces may be a metal casing around an electronic component, a metallized layer deposited on an inner surface of the housing, a metal insert in the housing, a metal housing floor, or an additional metal floor plate adjacent to a plastic housing floor. A hydrophobic film enforces condensate droplet formation, and channels and drain holes drain the condensate droplets out of the housing. An encapsulating film is unnecessary on the electronic components, because condensation on these components is avoided.

Abstract: An optical device is enclosed within a package or module having an optically transmissive or transparent cover that is sealed with an adhesive preform that has been pre-applied onto the bonding areas of the cover. The adhesive preforms are formed of a wet adhesive deposited on a sheet of optically transmissive or transparent material as a preform in predetermined locations and are B-staged or dried to form dry solid adhesive preforms. The preforms may be continuous or have one or more small gaps therein. The sheet of optical material is diced or singulated to produce individual optical covers having an adhesive preform thereon.

Abstract: A communications cabinet for use with copper/fiberoptic converters has electrical connections between power, copper and fiberoptic conductors and the converters preformed as conductive traces on a printed circuit board mountable in a housing. Electrical connections between power, copper and fiberoptic conductors passing through apertures in the housing and corresponding connections to the converters are made through a patch field formed of connectors mounted in the housing, each receiving terminal connectors on the conductors and converter terminations. Seal members are mounted in the housing adjacent apertures through one wall of the housing for sealingly encompassing the copper, fiberoptic and/or the power conductors passing through the apertures in the housing. The printed circuit board receives the converters in a plug-in mount without separate fasteners. An extension cabinet is fixed to the housing and receives power conductor and cables.

Abstract: A weather resistant cabinet for housing electrical equipment includes a one-piece, unitary tubular housing. The tubular housing has two open ends and is preferably formed from aluminum using a deep-drawing process. Two covers are attached to the two open ends of the tubular housing. The two covers include heat sinks and are preferably formed from aluminum using an extruding process. The covers are attached to the tubular housing using either mechanical fasteners and a gasket, or by a dip-brazing process.

Abstract: A container box for use in a communication apparatus. The container box has a container case defining an internal space; partitions connected to the container case for partitioning the internal space to have at least two accommodating chambers; and a container cover corresponding to each of the at least two accommodating chambers. Each cover is connected to the container case for independently closing and opening the at least two accommodating chambers. Wherein the at least two accommodating chambers each have differing degrees of waterproof level.

Abstract: An overmolded electronic module and a method for forming the module. The method entails both overmolding a circuit board and underfilling one or more surface-mount circuit devices physically and electrically connected to the board with solder bump connections. The circuit board is supported on a heatsink that thermally contacts a surface of the device opposite the circuit board. The board is optionally then encased on the heatsink with a retainer that includes means for biasing the circuit device against the heatsink. Finally, the circuit board is overmolded with a polymeric material to form an overmolded body that encases the circuit board and the circuit device with the heatsink. The overmold process is carried out so that a portion of the overmolded body completely underfills the circuit device and encapsulates its solder bump connections.

Abstract: An electrical connection configuration connects a circuit carrier to conductor tracks of a conductor-track carrier. Both the circuit carrier and the conductor-track carrier are carried by a base plate. The circuit carrier and the conductor-track carrier have a region in which they overlap and in which they are connected by an electrically conductive adhesive.

Abstract: An electrically conductive housing having a shell-like lid which closes the housing, and the lid and housing mesh with one another on their periphery. The lid comprises a molded sheet-steel part and is provided on its periphery with tonguelike protrusions. The protrusions on their ends self-lockingly engage a wall portion of the housing. As a result, the housing and lid are electrically conductively connected to one another. The shilding action of the housing with the lid for an electrical device disposed in the housing is improved.

Abstract: An electronic enclosure having a cover and a base member reduced in height by providing the necessary height on the decoupling area around and generally in the same vertical space as is occupied by the thickness of glass provided to hermetically seal the enclosure. The glass is formed inside and kept away from the decoupling area by an inner ring fixed to the base member, or by a tool which is removed after the glass has been applied to seal the enclosure.