Abstract: In a device, rod-shaped objects 10 (rods of various length and diameter) are electrochemically partially processed in dip plants (galvanized, pickled). Stationary tubular electrodes 30, into which the rods 10 are centrically entered, are provided in the plating tank of the plant. The surfaces to be plated are each axially limited by an adjustable membrane carrier 26, in which elastic shielding membranes 9 for delimiting the field lines are arranged. The membranes 9 are held by membrane holders 5. The membrane holders 5 are arranged in a cage where they are free to move radially and are provided with inner centering springs 7 and with outer centering springs 19 so that the membrane holder 5 and the membranes 9 are held in such a way as to be self-centering.

Abstract: A process cell for processing wafers and other planar articles, including a horizontally-transportable carrier for supporting a wafer in a substantially vertical orientation and an enclosure for housing the carrier and performing one or more processes to the wafer. The enclosure including a carrier inlet to allow the horizontal passage of a carrier into the process cell and a carrier outlet to allow the horizontal passage of a carrier to outside of the process cell. One embodiment of a process cell is configured to perform a pre- or post-treatment of a wafer, such as treating the wafer with acid solution and/or with de-ionized water. Another embodiment of the process cell is configured to perform electroplating of the wafer. Another process cell is configured to the process empty carriers, including the striping of undesired plating deposition on cathode contacts.

Abstract: A wafer plating system horizontally transporting vertically oriented wafers into one or more process cells. The wafer processing system includes a carrier rotatable from a substantially horizontal orientation to a substantially vertical orientation. A cathode assembly secures the wafer onto the carrier and electrically couples the wafer to a power supply.

Abstract: Disclosed are a process for producing a zinc oxide film comprising the steps of transporting a conductive long substrate via above at least one electrode comprised of zinc in an electrodeposition bath held in an electrodeposition tank and applying an electric field between the electrode and the conductive long substrate, thereby forming a zinc oxide film on the conductive long substrate, the process comprising a first step of forming the zinc oxide film on a part of the conductive long substrate; a second step of stopping the application of the electric field and the transportation; and a third step of bringing at least a region of a part of the conductive long substrate being in contact with the electrodeposition bath in the second step into non-contact with the electrodeposition bath, and an apparatus suitably used for the process. The process and apparatus enables high-quality zinc oxide films to be produced.

Abstract: A substrate plating apparatus forms a plating layer on the surface of a substrate and stores the substrate until the next process in a way that the substrate is not exposed to the atmosphere. The substrate plating apparatus is not only capable of introducing semiconductor wafers continuously one by one into the plating apparatus without loading the wafers into cassettes, but is also capable of preventing particle contamination and the formation of oxidized film on the surface of the wafers, thus reducing the number of process and reducing the installation area required for the apparatus. The substrate plating apparatus includes a plating process section (20) for plating a substrate, a washing process section (10) for washing the substrate after the plating process, and a storage vessel (16) containing a storing solution in which the substrate is immersed after having been plated and washed.

Abstract: An electroplating apparatus includes a plurality of feeding rollers adapted to advance a sheet-shaped article, and a spraying unit. The spraying unit has a pair of upper and lower casings, each of which includes a casing body defining a chamber, and a net plate disposed to confront with the article. An electrolyte is sprayed from the chamber via meshes in the net plate and onto a side surface of the article. An anode current-conducting assembly includes a conducting net that is disposed fixedly within the chamber and that is superimposed on the net plate so as to cover the meshes in the net plate, and two conducting units respectively in electrical contact with two opposite side portions of the conducting net so as to supply electric current to the conducting net.

Abstract: A method for making semiconductor interconnect features in a dielectric layer is provided. The method includes depositing a copper seed layer over a barrier layer that is formed over the dielectric layer and into etched features of the dielectric layer. The copper seed layer is then treated to remove an oxidized layer from over the copper seed layer. The method then moves to electroplating a copper fill layer over the treated copper seed layer. The copper fill layer is configured to fill the etched features of the dielectric layer.

Abstract: Device (60) having one or more operative units (55) for electroplating a film by chemical reaction with a specially made liquid product (29) and application of direct current, on sheets (50) for printed circuits continuously translating between one or more pairs of opposing oblong chambers (210, 130) respectively supplied with tubular nozzles (231) and with one longitudinal slit nozzle (233) and having internal electrodes (220, 240) electrically connected to the negative pole of a generator of direct current, between one or more pairs of titanium contact rollers (61-62, 130-131), electrically connected to the positive pole of the current, and plastic containment rollers (100-101, 110-111) of the liquid (29) rotating in each pair reciprocally in opposite directions, due to closure of the electric circuit between the liquid product (29), pumped in under pressure by the pump and projected by the nozzles (213, 233) of the chambers (210, 230) against the sheets (50), and said sheets through the contact rollers.

Abstract: An object is to provide a metallic-conduit-armored type linear member in which a linear member and the like contained in a metallic conduit do not become damaged and a defect in the metallic conduit can be repaired, a metallic conduit for armoring the linear member, and a method and a system for manufacturing the metallic-conduit-armored type linear member. The method comprises a basic process (I) in which a metallic tape (1) is formed into a tubular member, a seam of the tubular member is joined to complete a sealed metallic conduit, and a metallic-conduit-armored type linear member (12) is formed by loading a linear member (5) inside the metallic conduit, and a metallic coating process (II) in which a metallic coating layer is formed on an outer surface of the sealed metallic conduit by performing plating by using a room-temperature molten-salt electrolytic bath subsequent to the basic process (I).

Abstract: There are provided a method and apparatus for forming interconnects by embedding a metal such as copper (Cu) into recesses for interconnects formed on the surface of a substrate such as a semiconductor substrate. The method of the present invention includes the steps of: providing a substrate having fine recesses formed in the surface; subjecting the surface of the substrate to plating in a plating liquid; and subjecting the plated film formed on the surface of the substrate to electrolytic etching in an etching liquid.

Abstract: Electro-plating apparatus 1 has an electro-plating bath 2 containing electrolyte 3, an anode configuration immersed in electrolyte 3 being a planar anode 4 and an arcuate solid anode 5. In use, a continuous web of flexible substrate 6 (onto both side of which material is to be deposited) is passed along a transport system 7 in a direction shown by arrow A. Transport system 7 comprises a set of rollers 8, 9 of which rollers 8 are generally cylindrical, driving rollers while rollers 9 are cathode connectors and have a number of circumferential projections 10 which ensure electrical contact with unconnected or discreet regions on substrate 6. Another electro-plating apparatus 20 has a cathode connector configuration 21 with four comb electrodes 22 each having a main portion 23 with a plurality of teeth 24 each of which has end 25 inclined in the direction of the movement fo the substrate.

Abstract: A process for electrolytically processing a flat perforated item, comprising the steps of: moving the item in a transport direction to a treatment station where the item is contacted with an electrolyte, continuously mechanically wiping, in the presence of one of a cathodic item and an anode, and an anodic item and a cathode, a surface of the item using means for reducing the thickness of a diffusion layer depleted in metal ions adjacent the surface of the item, which means include a wiping roller extending perpendicular to the transport direction over the entire width of the item and in contact with the item; and moving the electrolyte in a direction substantially perpendicular to a plane of the item so as to direct the electrolyte only toward the perforations in the item and to convey the electrolyte through the in the item under pressure.

Abstract: In a device for surface treatment, in particular for electrochemical coating followed by electrophoretic coating, the material to be treated is moved through coating vessels in one or more planes. This is carried out using stepped cage conveyors which are provided, at different heights, with bearing arms for trays on which the material to be treated is located. Horizontal electrodes, past which the trays are moved, project between the bearing arms of each plane or into the space between each tray.

Abstract: A system for reclaiming cadmium and tellurium from cadmium telluride solar cell. The system comprises a crushing apparatus for crushing cells into pieces, a first conveyor for transporting solar cells to the crushing apparatus, a barrel for receiving etchant for etching the crushed cell pieces, a second conveyor for transporting crusehed pieces of cells from the crushing apparatus to the barrel, and a screen separator for separating the crushed cell pieces into at least three components.

Abstract: An apparatus for plating a conductive film directly on a substrate with a barrier layer on top includes anode rod (1) placed in tube (109), and anode rings (2), and (3) placed between cylindrical walls (107) and (105), (103) and (101), respectively. Anodes (1), (2), and (3) are powered by power supplies (13), (12), and (11), respectively. Electrolyte (34) is pumped by pump (33) to pass through filter (32) and reach inlets of liquid mass flow controllers (LMFCs) (21), (22), and (23). Then LMFCs (21), (22) and (23) deliver electrolyte at a set flow rate to sub-plating baths containing anodes (3), (2) and (1), respectively. After flowing through the gap between wafer (31) and the top of the cylindrical walls (101), (103), (105), (107) and (109), electrolyte flows back to tank (36) through spaces between cylindrical walls (100) and (101), (103) and (105), and (107) and (109), respectively.

Abstract: Processing tools, components of tools, and methods of making and using such devices for electrochemical processing of microelectronic workpieces. One aspect of the invention is directed toward reaction vessels for electrochemical processing of microelectronic workpieces, processing stations including such reaction vessels, and methods for using these devices. For example, one embodiment of a reaction vessel includes an outer container having an outer wall, a first outlet configured to introduce a primary fluid flow into the outer container, and at least one second outlet configured to introduce a secondary fluid flow into the outer container separate from the primary fluid flow. The reaction vessel can also include at least one electrode, and it can also have a field shaping unit.

Abstract: An electrochemical deposition system comprising a fixture adapted to selectively grasp and release an electrochemical process cell is provided. The system may include a lift/lower mechanism coupled to the fixture and adapted to automatically stop lowering the fixture at a process cell elevation, a rotation mechanism coupled to the fixture and adapted to automatically stop rotating the fixture when aligned with a process cell location and when aligned with a process cell exchange location. The fixture adapted to selectively grasp and release an object to be lifted may include a cam/follower coupling between a rotatable portion of the fixture and a gripping portion of the fixture. To grasp a process cell with the fixture, the rotating portion of the fixture may be rotated so as to retract the gripping portion of the fixture causing the gripping portion to close around the process cell.

Abstract: The present invention provides an electrochemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electrochemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells. Preferably, the electrochemical deposition system includes a spin-rinse-dry (SRD) station disposed between the loading station and the mainframe, a rapid thermal anneal chamber attached to the loading station, and a system controller for controlling the electrochemical deposition process and the components of the electrochemical deposition system.

Abstract: A conveyorized electroplating device having an anode positioned proximate to a plurality of absorptive applicator assemblies that apply a plating solution to a substrate and a conveyor device that grips the substrate thereby isolating the electrical contact from the plating solution. The conveyorized electroplating device has a fluid bed assembly with a manifold and an anode, a conveyor device adjacent to the fluid bed assembly, and a plurality of absorptive applicator assemblies, wherein the plurality of absorptive applicator assemblies are adjacent and in close proximity to the anode and in fluid communication with the fluid bed assembly. The conveyor device isolates the electrical contacts from the plating solution and is able to handle various sizes and thicknesses of substrates.

Abstract: An apparatus for electroplating a workpiece is disclosed in which the apparatus includes a workpiece holding structure. The workpiece holding structure includes a workpiece support having at least one surface that is disposed to engage a front side of the workpiece and at least one electrical contact disposed for contact with at least one corresponding electrical contact on a back-side of the workpiece. The workpiece includes one or more electrically conductive paths between the at least one corresponding electrical contact and a front-side of the workpiece to facilitate electroplating of the front-side surface.

Abstract: This invention comprises a driven conveyor for transporting work pieces into one or more flood plating cells for electroplating a metal onto the planar surfaces and surfaces of the through holes of the work piece. An electrolyte solution is pumped by one or more recirculating pumps into the flood cell at such a rate as to maintain the liquid at a desired level covering the anodes and work pieces while work pieces are moved through the cells. One or more power sources provide direct current to the anodes and to the electrified contactors to transmit electrical current to the work pieces. The electrified contactors are positioned across the path of the work piece and spaced outside of the flood cell such that the electrolyte solution does not contact the contactors. Plating will occur so long as the work piece is in contact with one or more of the electrified contactors and the electrolyte.

Abstract: A substrate plating apparatus forms an interconnection layer on an interconnection region composed of a fine groove and/or a fine hole defined in a substrate. The substrate plating apparatus includes a plating unit for forming a plated layer on a surface of the substrate including the interconnection region, a chemical mechanical polishing unit for chemically mechanically polishing the substrate to remove the plated layer from the surface of the substrate leaving a portion of the plated layer in the interconnection region, a cleaning unit for cleaning the substrate after the plated layer is formed or the substrate is chemically mechanically polished, a drying unit for drying the substrate after the substrate is cleaned, and a substrate transfer unit for transferring the substrate to and from each of the first plating unit, the first chemical mechanical polishing unit, the cleaning unit, and the drying unit.

Abstract: A conveyorized electroplating device having an anode positioned proximate to a plurality of absorptive applicator assemblies that apply a plating solution to a substrate and a conveyor device that grips the substrate thereby isolating the electrical contact from the plating solution. The conveyorized electroplating device has a fluid bed assembly with a manifold and an anode, a conveyor device adjacent to the fluid bed assembly, and a plurality of absorptive applicator assemblies, wherein the plurality of absorptive applicator assemblies are adjacent and in close proximity to the anode and in fluid communication with the fluid bed assembly. The conveyor device isolates the electrical contacts from the plating solution and is able to handle various sizes and thicknesses of substrates.

Abstract: The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells. Preferably, the electro-chemical deposition system includes a spin-rinse-dry (SRD) station disposed between the loading station and the mainframe, a rapid thermal anneal chamber attached to the loading station, and a system controller for controlling the electro-chemical deposition process and the components of the electro-chemical deposition system.

Abstract: The present invention generally provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs rules and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical deposition system generally comprises a front-end loading station, a mainframe including one or more processing cells, and an electrolyte replenishing system fluidly connected to the one or more electrical processing cells. The electrolyte replenishing system comprises a main electrolyte supply tank and an analyzer module and dosing module coupled thereto. The analyzer module includes one or more chemical analyzers to monitor the concentrations of various chemicals in the main electrolyte supply tank. Information provided by the analyzer module is transmitted via a central control system to the dosing module.

Abstract: A radio frequency sputtering apparatus and a film forming method using the same are disclosed. The method includes the steps of floating a shield adjacent to the substrate, applying an RF power to the substrate as well as the target to induce a self-bias voltage to the target and the substrate, and restricting a plasma discharge region in accordance with the ionization of a process gas to an adjacency to the target, thereby decreasing the bombarding of the film on the wafer by positive ions of the plasma and negative ions from the target.

Abstract: A transport system for the implementation of electrolytic deposition, coating or etching; and more particularly, an apparatus for selective electrolytic metallization and deposition utilizing a fluid head arrangement. A method is provided for making and maintaining an electrical contact with a product being processed in a transport system employed for selective electrolytic metallization and deposition, coating or etching. The method of making and maintaining an electrical contact with a product being processed may be utilizing a fluid head arrangement.

Abstract: A method and an apparatus for the continuous chromium-plating of elongated members such as bars and the like: the bar to be plated is fed and rotated through at least one tubular shaped chromium-plating anode into which an electrolytic solution suitable for depositing a layer of chromium on the bar, as the latter advances through the said anode, is supplied. The electrolytic solution is supplied into the anode from the bottom upwards, through sets of holes over the bottom and the upper surfaces of the anode; the bottom holes communicate with a pressure balancing and flow distribution chamber for the electrolytic solution. This results in an electrolytic flow upwardly directed in a perpendicular direction to the longitudinal axis of the bar, the temperature of which may be controlled by changing the flow rate of the electrolytic solution circulating inside the anode.

Abstract: A process for applying a metallization interconnect structure to a semiconductor workpiece having a barrier layer deposited on a surface thereof is set forth. The process includes the forming of an ultra-thin metal seed layer on the barrier layer. The ultra-thin seed layer having a thickness of less than or equal to about 500 Angstroms. The ultra-thin seed layer is then enhanced by depositing additional metal thereon to provide an enhanced seed layer. The enhanced seed layer has a thickness at all points on sidewalls of substantially all recessed features distributed within the workpiece that is equal to or greater than about 10% of the nominal seed layer thickness over an exteriorly disposed surface of the workpiece.

Abstract: Electrical contacting system for an electrophoretic dip painting plant for motor vehicle bodies, where the bodies are guided through an electrophoretic dip paint bath by an overhead conveyor having hangers for engaging beneath the body carriers. Each conveyor hanger has at least two lower contacting devices secured thereto and each body carrier has at least four upper contacting devices secured thereto. Each upper contacting device has a protective bell open at the bottom and storing an air bubble in the submerged state. In the area of the air bubble the bell has a downwardly concave, partially circular cylindrical support and contact surface and has a horizontal cylinder axis extending transversely to the conveyance direction. At its outer side facing the guide element, two locking elements form a vertical opening therebetween to interact with a locking nose on the guide element where the locking noses pass through the openings formed by the locking elements.

Abstract: Apparatus for transferring sheet-like objects from one position to another comprises a control frame including a vertical control member and a gripping device within the control frame and including a control member counterpart engaging the vertical control member of the control frame in a manner permitting relative movement of the control frame and the gripping device over a predetermined vertical range. A loading member is coupled to the gripping device for lowering the gripping device from an upper position to a lower position and for raising the gripping device from the lower position to the upper position, and a positioning member is attached to the gripping device for engaging a complementary member when the gripping device is at the lower position.

Abstract: An electroplating machine is disclosed as including an electrode positioning apparatus, an electrolyte delivery apparatus, an apparatus for covering a roller, an apparatus for dissolving copper oxide powder in an electrolyte passing through the apparatus, and an apparatus allowing the variation of the distance between two rollers. The electrode positioning apparatus has a first open end and a second end joined by two sets of connecting members, in which the connecting members in each set are parallel to one another and equally spaced from the adjacent member. The electrolyte delivery apparatus includes a pipe connected to a source of electrolyte and a nozzle through which the electrolyte is deliverable to an electrode mounted on the electrode positioning apparatus. The nozzle includes an elongate gap and the electrolyte exits the nozzle continuously along the entire length of the elongate gap. The electrode positioning and the electrolyte delivery apparatus are slidably engageable with each other.

Abstract: A continuous plating apparatus in which a planar article, to be plated, laid vertically on a rail is delivered while being clamped on both sides by vertical rotational rollers including a drive roller, and continuously fed through a slit provided liquid-tightly in a plating bath wall into a plating bath, and after the plating, fed out of the bath through a slit provided liquid-tightly in the plating bath wall in the same way, meets the following requirements: i) an upper end of the drive roller is arranged to be slanted forwardly and the slant of the drive roller is in the range of 1 to 10° so as to prevent the article to be plated from stepping during delivering; ii) a part of an rotational roller and/or a drive roller is an electric feeding roller, and a means for peeling a plated layer adhered to the surface of the electric feeding roller is provided; iii) a means for depressing the electric feeding roller against the article to be plated is provided for always keeping constant the flow of the curre

Abstract: To quickly remove, away from a rail, an article which is subject to defects in the case where the feeding of the article to be delivered along the rail and plated is hindered, there is provided a continuous plating apparatus in which a planar article (3) to be plated is laid in a vertical direction on a rail (2) horizontally provided in a plating bath, and the article to be plated is clamped on both surfaces by rollers (5 and 17) fixed to vertical rotary shafts (4 and 10) and moved on and along the rail (2) to thereby plate the article (3), characterized in that an upper end side of each unit composed of the plurality of rotary shafts (10) is moved in a direction away from the article (3) to be plated. By only moving the upper ends of the rotary shafts (10) in the direction away from the articles (3) to be plated and by slanting the rotary shaft (10), the articles (3) having an inconvenience can be removed upwardly without removing the rotary shafts (10).

Abstract: This invention comprises a driven conveyor for transporting work pieces into one or more flood plating cells for electroplating a metal onto the planar surfaces and surfaces of the through holes of the work piece. An electrolyte solution is pumped by one or more recirculating pumps into the flood cell at such a rate as to maintain the liquid at a desired level covering the anodes and work pieces while work pieces are moved through the cells. One or more power sources provide direct current to the anodes and to the electrified contactors to transmit electrical current to the work pieces. The electrified contactors are positioned across the path of the work piece and spaced outside of the flood cell such that the electrolyte solution does not contact the contactors. Plating will occur so long as the work piece is in contact with one or more of the electrified contactors and the electrolyte.

Abstract: The present invention generally provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs rules and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, a rapid thermal anneal chamber disposed adjacent the loading station, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells. One aspect of the invention provides a post electrochemical deposition treatment, such as a rapid thermal anneal treatment, for enhancing deposition results.

Abstract: A method and a system are provided for plating workpieces as part of an "on-track" in-line or a radially arranged manufacturing system, including "on-site" measurement of at least one plating characteristic for computer controlled process regulation and quality control. Movement of workpieces between various stations is controlled in response to a comparison of the measured value(s) of the plating characteristic(s) and (a) target value(s) or target range(s) of values.

Abstract: The invention relates to a method and device for the electrochemical treatment of electrically mutually insulated, electrically conductive areas on an item to be treated by means of a treatment liquid. Insulated, for example etched structures on circuit boards cannot be treated electrochemically with known methods since there exists no electrical connection to the bath current source from individual areas. According to the invention, this connection is produced by brushes which touch the structured surfaces to be treated with their electrically conductive and thin fibres. A large number of brushes which are arranged transversely to the direction of transportation take care of the fact that all the electrically conductive areas on the item to be treated which are arranged in an insulated manner from one another are contacted electrically at least one after another and that the achieved contact time is sufficiently long.

Abstract: An electroplating apparatus comprising: an electroplating tank assembly for receiving an electroplating solution; transfer structure for transferring a substrate to be electroplated along a transfer passage within the electroplating tank assembly; at least one pair of sparger assemblies for dispersing the electroplating solution in the direction of the substrate; at least one pair of anode baskets for containing anode material; electricity feeding circuitry for feeding electricity to the anode material contained in the at least one pair of anode baskets; and at least one pair of anode shield assemblies positioned to direct a current flux toward the substrate to provide for a uniform distribution of plating material thereon.

Abstract: A holder (102) made from an HF-resistant material includes annular suction pads (105, 108). The suction pad (105) is used to hold a small silicon substrate by suction, and the suction pad (108) is used to hold a large silicon substrate by suction. This makes silicon substrates with various sizes processable. A silicon substrate is held by suction by reducing a pressure in a space in a groove of the suction pad by a pump (120). An opening (103) is formed in the holder (102) so that the both surfaces of the silicon substrate are brought into contact with an HF solution (115). The silicon substrate is anodized by applying a DC voltage by using a platinum electrode (109a) as a negative electrode and a platinum electrode (109b) as a positive electrode, and thereby a substrate having a porous layer is produced.

Abstract: A transport device for conveying vertically oriented plate-like articles for chemical or electrolytic surface treatment, the device having clamping elements maintained in the manner of tongs, which can be actuated by means of a sliding body and a linkage mechanism for grasping a plate-like article. The linkage mechanism consists of two crank arms which are associated with each other and guided in such a way that the course of their movement consists of two sections, namely a spreading or clamping movement extending essentially horizontally for grasping and releasing the plate-like article to be held, and an essentially vertically extending lifting and lowering movement for dipping and removing the transport device in the respective treatment liquid for the plate-like article.

Abstract: There is disclosed an apparatus for depositing metal on a member comprising: (a) a first electrode comprising a first corrugated side; (b) a second electrode having the same polarity as the first electrode and comprising a second corrugated side, wherein the second corrugated side is disposed opposite the first corrugated side, and spaced therefrom; (c) a channel defined by the first corrugated side and the second corrugated side for movement of the member therebetween, wherein the channel has a plurality of alternating expansive areas and constrictive areas; and (d) a conveyor device for transporting the member through the channel.

Abstract: A method and apparatus for performing high speed chemical treatment of v type cylinder blocks. First the cylinder bores of one bank are treated. Then those of the other bank are treated. This permits a simple but compact treating plant.

Abstract: A method of treating a body of conducting material electrolytically which comprises the steps of placing the material to be treated in an aqueous oxidising electrolyte, passing an electric current through the electrolyte and the material to be treated and sparging the electrolyte with gas. The material to be treated is placed in a basket comprising a conducting frame having an insulating container fitted therein, the basket being insertable in and removable from the electrolyte as desired. The insulating container is removable from the conducting frame, the frame having retaining means for receiving the insulating container. The container includes a base having perforations to allow electrolyte to contact the material to be treated. The electrolyte is sparged with gas in the region where the material to be treated is in contact with it, the gas being supplied by a plurality of pipes (21, 22) extending across the electrolyte at a location beneath the perforated base of the insulating container.

Abstract: The printed circuit boards (LP) are conducted through treatment baths (BB1 through BB3) in vertical attitude on at least two horizontal conveying paths (TW1 through TW4) proceeding next to one another, these treatment baths being accommodated in treatment cells (BZ10 through BZ13, BZ20 through BZ23, BZ30 through BZ33) that are arranged successively and next to one another. The end walls of the treatment cells are provided with vertical slots (S) and allocated seals (D) for the passage of the printed circuit boards. The bath liquid emerging from treatment cells arranged next to one another is collected in common collecting tanks (AW1 through AW3) and is returned into the treatment cells with the assistance of pumps (P). A common treatment cell for treatment zones lying next to one another can also be provided in a common collecting tank. The conveying of the printed circuit boards on the conveying paths lying next to one another preferably ensues with a common conveyor device.

Abstract: The plate-shaped workpieces (W) are conducted through a treatment cell (BZ) containing a treatment bath in vertical attitude on a horizontal conveying path with the assistance of contacting and conveying means, the end walls of said treatment cell having vertical slots for the passage of the workpieces (W). The bath liquid emerging from the treatment (BZ) is collected in a collecting tank and is returned such into the treatment cell (BZ) with the assistance of a pump that an at least largely vertical flow direction (SR) derives at both sides of the conveying path. The bath liquid is diverted toward the surface of the workpieces (W) with guide devices (LV) arranged at both sides of the convoying path in the treatment cell (BZ). An improved ion exchange in the region of the workpieces (W) is effected by the guide devices (LV). In, for example, the electrolytic treatment of printed circuit boards, the metal deposition can thus be undertaken with high current densities.

Abstract: The present invention includes an apparatus and method for continuously adjusting the anode/cathode distance for controlling uniformity of deposition. The entire cathode head is mounted on a lead screw which, when manually turned, moves the cathode head in or out in relation to the anode basket. Alternatively, the lead screw mechanism is driven by a servo motor and is suitably controlled by a computer which monitors the voltage and current in the electroforming cell and adjusts the screw accordingly. The present invention also includes an apparatus and method for a hinged, coated, metal clamping mechanism for fixturing a master against a backplate. To avoid plating of the metallic clamping ring, the metal is coated with a suitable substantially non-conductive, substantially non-chipping, extremely thin material.

Abstract: An automatic transferring and processing apparatus of a cathode and method thereof. A cathode having an electro-deposited metal is taken out of an electrolytic cell, rotated by a stock cathode pivot, transferred through a stock moving carriage and stock conveyor to a processor for processing an electro-deposited metal disposed on the cathode, transferred through an alignment conveyor and an alignment moving carriage to an alignment cathode pivot, rotated by the alignment cathode pivot, and inserted into a predetermined electrolytic cell.

Abstract: The device for the selective treatment of the surface of workpieces by flooding the workpieces with a treatment liquid comprises a bath (1), interchangeable holders (10) in the bath for the workpieces, at least one pip (15-21) leading into the bath (1) taking the liquid to the holders (10) and at least one outlet pipe (26) for the liquid leaving the bath (1). The holders (10) are fitted on an extractor (7) and in the side walls of the bath (10) there is a closable access (31) through which the extractor (7) can be removed.

Abstract: A high speed electrical plating apparatus employing a moving fluid and a tubular anode. The tubular anode contains pellets of the material being plated so as to make up for those utilized during the plating process. The electrodes are configured in such a way that the electrode need not be removed for servicing and also so that the pellets need not be serviced as frequently as with prior are constructions. In addition, the electrode is configured in such a way as to permit the pellets to shift as they dissolve without jamming and also to provide more uniform plating.