Abstract: An evaporation source cover, an evaporation source and an evaporation apparatus are disclosed. The evaporation source cover comprises a cover body and an elastic dredging member which is arranged on the cover body. The elastic dredging member comprises a bottom part and a top part. The elastic dredging member is fixed to a surface of the cover body at the bottom part. The elastic dredging member is configured to extend and contract in a direction perpendicular to the surface of the cover body.

Abstract: A method for manufacturing metal oxide-grown carbon fibers including immersing carbon fibers in a solution for forming a metal oxide seed layer and electrodepositing a metal oxide seed on the surfaces of carbon fibers, or irradiating microwave thereto to form a metal oxide seed layer, and irradiating microwave to the metal oxide seed layer-formed carbon fibers to grow metal oxide. The method for manufacturing metal oxide-grown carbon fibers can reduce process time, and improve process energy efficiency and production efficiency. The method for manufacturing metal oxide-grown carbon fibers can offer metal oxide-grown carbon fibers with improved interfacial shear stress.

Abstract: A method of manufacturing an article, including taking an article formed in an initial state via an additive manufacturing process and performing a second manufacturing process to transform the article into a second state, which includes mounting the article in a holding device, processing at least one first feature on the article, which includes processing at least one set of mounting features on the article, re-mounting the article via the at least one set of mounting features, and then processing at least one second feature on the article.

Abstract: A self-assembling structure using non-equilibrium driving forces leading to “living crystals” and other maniputable particles with a complex dynamics. The dynamic self-assembly assembly results from a competition between self-propulsion of particles and an attractive interaction between the particles. As a result of non-equilibrium driving forces, the crystals form, grow, collide, anneal, repair themselves and spontaneously self-destruct, thereby enabling reconfiguration and assembly to achieve a desired property.

Abstract: A partial plating device includes a drum jig which has a plurality of positioning pins provided on the outer peripheral surface thereof, and which feeds a metal member around the outer periphery thereof by engaging the metal member with the positioning pins; a rotating shaft which rotatably supports the drum jig, a jet unit that supplies plating liquid to the metal member, and a brake unit that reduces the circumferential speed of the drum jig, and which is fitted to the rotating shaft. A plating device and a partial plating method in which plating is not carried out on the first region of a metal member on the carrying-in side of the drum jig, but in which plating is carried out on the second region of a metal member on the carrying-out side.

Abstract: The present invention provides a device for single-sided electrolytic treatment of a flat substrate. The device comprises a bath for electrolytic fluid and conveying means for conveying the flat substrate in a conveying direction at the free surface of the fluid in the bath, with the flat substrate being horizontally oriented such that the underside of the flat substrate makes contact with the free surface of the fluid in the bath. The conveying means comprise two conveying elements disposed opposite each other, which extend along two respective conveying paths, which conveying paths each comprise an electrolytic part, which electrolytic parts extend on two opposite longitudinal sides of the bath.

Abstract: A wire discharge machining apparatus includes a numerical control unit carrying out numerical control of the wire discharge machining apparatus according to a machining program and a display unit displaying information concerning machining of the workpiece by the wire discharge machining apparatus. The numerical control unit includes a wire-remaining-length calculating unit calculating a length of the wire remaining in a wire bobbin attached to the wire discharge machining apparatus and a wire-consumed-length calculating unit calculating an estimated length of the wire used for machining of the workpiece.

Abstract: The anodizing treatment station (3) in a vertical paint plant (2) of aluminum profiles hanging in succession by means of hooks (8) on a main overhead conveyor (4) moving along a main conveyor line (5) which passes through at least one pre-treatment station and at least one powder or liquid paint station, comprises at least one oxidation bath (9) and a secondary overhead conveyor (10) moving along secondary conveyor line (11) in synchronism with said main conveyor (4), the main conveyor line (5) having a first main loading and/or unloading segment (12), facing said oxidation bath (9), wherein specific first main loading and/or unloading means (13) are adapted to transfer groups (8c) of hooks (8) from said main conveyor (4) to said oxidation bath (9) and/or vice versa, in that the secondary conveyor line (11) has a first secondary loading and/or unloading segment (14), facing said oxidation bath (9), wherein specific first secondary loading and/or unloading means (15) are adapted to transfer groups (8c) of hook

Abstract: An electropolishing or electroplating system and method for metal conveyor belts is described. As opposed to conventional polishing processes in which the product is guided around rollers which direct the product into and out of an electrolyte bath, embodiments of the present invention pass the product through a housing supplied with a continuous directional flow of electrolyte. Thus, the electroplating or electropolishing can be targeted to specific areas of the product, such as the edges and/or the center of a conveyor belt, and straight products can pass through the housing without deformation.

Abstract: A continuous plating apparatus, when the number of the workpieces simultaneously transferred in the plating tank in a completely immersed state is N, (N+1) cathode relay members that extend in a workpiece transfer direction and (N+1) power supply units being provided outside the plating tank, anode terminals of the power supply units being connected to opposed anodes that are provided in the plating tank, cathode terminals of the power supply units being respectively connected to the cathode relay members so that power is supplied to each of the workpieces transferred in the plating tank from a corresponding power supply unit among the power supply units through a corresponding cathode relay member among the cathode relay members, and each of the power supply units being able to be controlled by constant current control when being transferred in the plating tank in a completely immersed state, by current gradual increase control when being carried into the plating tank in a partially immersed state, and by cu

Abstract: It is an object of this disclosure to provide high productivity, low cost-of-ownership manufacturing equipment for the high volume production of photovoltaic (PV) solar cell device architecture. It is a further object of this disclosure to reduce material processing steps and material cost compared to existing technologies by using gas-phase source silicon. The present disclosure teaches the fabrication of a sacrificial substrate base layer that is compatible with a gas-phase substrate growth process. Porous silicon is used as the sacrificial layer in the present disclosure. Further, the present disclosure provides equipment to produce a sacrificial porous silicon PV cell-substrate base layer.

Abstract: An apparatus (1) for continuous electrolytic surface finishing of bars (2) is described, comprising at least one cathode (3), one electrolytic cell (4) containing an electrolyte (5) and comprising an inlet (6) and an outlet (7) for the bars (2), and at least one longitudinal anode (8) along the route of the bars (2) inside the electrolytic cell (4), and means (9) for feeding the bars (2) along the axis of the bars (2) for introducing the bars (2) into the cell (4). Said at least one cathode (3) consists of a plurality of sliding contacts (11), each of which is provided with a selectively and independently actuatable energetic source (30) thereof.

Abstract: Arrangements for plating a single surface of a thin foil are described. In one aspect, a metal foil is wrapped tightly at least partially around a plating solution drum. The drum is partially immersed in a plating solution such that the waterline of the metal plating solution is below a break point where the metallic foil strip begins to unwind from the plating solution drum. With this arrangement, one side of the metallic foil strip is exposed to the metal plating solution, while the opposing back side of the metallic foil strip does not come in substantial contact with the metal plating solution. In this manner, the exposed side of the foil is plated while the back surface of the foil is not plated. The drum may be rotated to convey the foil through the plating solution.

Abstract: A method for plating a belt substrate including conveying a belt substrate through a plating tank, contacting an immersed cathode power-supply device and/or an auxiliary cathode power-supply device with the belt substrate conveyed into the interior of the plating tank such that the belt substrate becomes a cathode, and electrically plating a surface of the belt substrate in the interior of the plating tank while the immersed cathode power-supply device and/or the auxiliary cathode power-supply device maintains cathode power-supply to the belt substrate conveyed into the interior portion of the plating tank. The immersed cathode power-supply device and the auxiliary cathode power-supply device are positioned in the interior portion of the plating tank and are electrically connected by a short circuit wiring.

Abstract: Techniques for electrodeposition of thin film solar panels are provided. In one aspect, an electrodeposition apparatus is provided. The electrodeposition apparatus includes at least one electroplating cell; and a conveyor for moving panels over the electroplating cell, wherein the conveyor comprises at least one metal belted track over the electroplating cell surrounding a plurality of metal rollers. The electroplating cell can include an anode at a bottom of the electroplating cell; and a plurality of paddles at a top of the electroplating cell. A baffle may be located in between the anode and the paddles. An electroplating process is also provided.

Abstract: A superstrate, such as a sheet of polymer film, is used as a transport during metallization of solar cells. The back sides of the solar cells are attached to the sheet of polymer film. Contact holes are formed through the sheet of polymer film to expose doped regions of the solar cells. Metals are formed in the contact holes to electrically connect to the exposed doped regions of the solar cells. The metals are electroplated to form metal contacts of the solar cell. Subsequently, the solar cells are separated from other solar cells that were metallized while supported by the same sheet of polymer film to form strings of solar cells or individual solar cells.

Abstract: An electroplating system is provided for electroplating a workpiece. The system includes a plating wheel having a side and a cylindrical wall extending from the side. The plating wheel has an interior chamber that at least partially defines a solution chamber that is configured to hold an electroplating solution. The cylindrical wall includes an opening extending through the cylindrical wall into fluid communication with the interior chamber. An external anode is located proximate to and positioned outside the cylindrical wall of the plating wheel to define an electroplating work area therebetween. An internal anode is held within the interior chamber of the plating wheel and positioned to align with the work area.

Abstract: A continuous plating apparatus, when the number of the workpieces simultaneously transferred in the plating tank in a completely immersed state is N, (N+1) cathode relay members that extend in a workpiece transfer direction and (N+1) power supply units being provided outside the plating tank, anode terminals of the power supply units being connected to opposed anodes that are provided in the plating tank, cathode terminals of the power supply units being respectively connected to the cathode relay members so that power is supplied to each of the workpieces transferred in the plating tank from a corresponding power supply unit among the power supply units through a corresponding cathode relay member among the cathode relay members, and each of the power supply units being able to be controlled by constant current control when being transferred in the plating tank in a completely immersed state, by current gradual increase control when being carried into the plating tank in a partially immersed state, and by cu

Abstract: An apparatus for continuously forming thin ceramic coatings on metal sheets, foils or wires. The apparatus has a reaction chamber, perforated nylon sheets, nylon bar guides, copper rods attached to a power supply, nylon collecting rods, and an inlet and an outlet. The reaction chamber is capable of containing an electrolytic solution. The copper rods are separately connected to the R, Y, or B phase of the power supply. Each phase is provided with two thyristors and the output of the thyristors is connected to the copper rods using current transformers. A process for continuously forming thin ceramic coatings on metal sheets, foils or wires is also provided.

Abstract: An electropolishing or electroplating system and method for metal conveyor belts is described. In some embodiments, the system has a metal conveyor belt held in constant tension; a tank for holding an electrolytic fluid, the tank having an interior space suitable to contain the fluid, a metal plate and the metal conveyor belt; and an electrical current supply. In an electropolishing application, the current passes from the metal conveyor belt, through the fluid and into the metal plate. In an electroplating application, the current passes from the metal plate, through the fluid and into the metal conveyor belt.

Abstract: Arrangements for plating a single surface of a thin foil are described. In one aspect, a metal foil is wrapped tightly at least partially around a plating solution drum. The drum is partially immersed in a plating solution such that the waterline of the metal plating solution is below a break point where the metallic foil strip begins to unwind from the plating solution drum. With this arrangement, one side of the metallic foil strip is exposed to the metal plating solution, while the opposing back side of the metallic foil strip does not come in substantial contact with the metal plating solution. In this manner, the exposed side of the foil is plated while the back surface of the foil is not plated. The drum may be rotated to convey the foil through the plating solution.

Abstract: A conductive contact ring for an electroplating or electrodeposition process on a cylindrical surface includes a frame defining an opening through which the object can be passed and an array of electrically conductive fibers spanning the opening. The frame is electrically conductive and is connected to a DC power source in the process. Two or more contact rings can be used in a process to provide consistent electrical contact with the surface sliding therethrough. A single contact ring can have first and second groups of filaments spaced from each other along the axial length of the surface.

Abstract: An apparatus and system for electromotively coating a part can include a conveyor that has a plurality of hangars that are configured to be positively connected to respective parts that are to be coated. An attachment mechanism can be provided on the hangar and the part, the attachment mechanism being configured to exert force in more than a single direction. The part can be a conductive plastic part and can include an attachment structure that is formed thereon, for example, screw threads integrally formed in the part. The hangar can include a similar fastener that is configured to connect to the attachment structure of the part. For example, the fastener of the hangar can be a screw thread that mates with threads integrally or otherwise formed on the part.

Abstract: The present invention advantageously provides for, in different embodiments, low-cost deposition techniques to form high-quality, dense, well-adhering Group IBIIIAVIA compound thin films with macro-scale as well as micro-scale compositional uniformities. In one embodiment, there is provided a method of growing a Group IBIIIAVIA semiconductor layer on a base, and includes the steps of depositing on the base a film of Group IB material and at least one layer of Group IIIA material, intermixing the film of Group IB material and the at least one layer of Group IIIA material to form an intermixed layer, and forming over the intermixed layer a metallic film comprising at least one of a Group IIIA material sub-layer and a Group IB material sub-layer. Other embodiments are also described.

Abstract: A transport roller for transporting articles comprises a spindle (3) and a coil (5) on the spindle (3). The coil (5) comprises a flexible central section (17), and a first end section (13) and a second end section (15) that are affixed at two opposite sides of the flexible central section (17) to the spindle (3).

Abstract: An apparatus (1) for continuous electrolytic surface finishing of bars (2) is described, comprising at least one cathode (3), one electrolytic cell (4) containing an electrolyte (5) and comprising an inlet (6) and an outlet (7) for the bars (2), and at least one longitudinal anode (8) along the route of the bars (2) inside the electrolytic cell (4), and means (9) for feeding the bars (2) along the axis of the bars (2) for introducing the bars (2) into the cell (4). Said at least one cathode (3) consists of a plurality of sliding contacts (11), each of which is provided with a selectively and independently actuatable energetic source (30) thereof. (FIG.

Abstract: In order to remove treatment liquid (21) from a planar material to be treated (10), which is transported in an assembly for the electrolytic or wet-chemical treatment of the material to be treated (10), or to promote the exchange of material on the surface of the material to be treated (10), a roll with a roll surface (4, 14) is provided. The roll surface (4, 14) is arranged relative to a transport path of the material to be treated (10) so that a gap (8, 18) remains between the roll surface (4, 14) and a useful region of the material to be treated (10) opposing the roll surface (4, 14), which extends over the useful region. The roll is driven rotatably so that at the gap (8, 18) a relative speed is produced between the roll surface (4, 14) and the material to be treated (10).

Abstract: An apparatus that performs an electrolytic plating on a plating surface of a belt substrate is provided. The apparatus includes a plating tank, a conveyor device configured to carry a belt substrate through an interior of the plating tank, an immersed cathode power-supply section provided within the interior of the plating tank, an auxiliary cathode power-supply section provided within the interior of the plating tank, and short-circuit wiring configured to short-circuit the immersed cathode power-supply section to the auxiliary cathode power-supply section. A plating method for performing electrolytic plating on a plating surface of a belt substrate is provided.

Abstract: In a method for continuously coating a wafer for solar cell production, in a coating bath comprising metal such as nickel, copper or silver, said metal is deposited on the wafer. The wafer is introduced into the coating bath and, at a point in time at which the wafer already extends into the coating bath with a first region, but does not extend into it with a second region, a current surge is effected at the second region of the wafer, This initiates the electrodeposition of the metal on the first region of the wafer extending into the coating bath for a subsequent automatic coating with the wafer having been completely introduced into the coating bath, also on the remaining area of said wafer, without a further current surge or current flow.

Abstract: A contacting device for a galvanization apparatus comprises contacting rollers with a continuous rigid external face, which is joined to a jacket section. The jacket section is provided with an inner opening that is wider than a rotating shaft on which the contacting roller sits. This allows the contacting roller to be moved in a radial direction, wherein electric contacting and securing of a basic position is obtained via springs in every one of the radially moved positions. The moveability of the contacting roller ensures good contact as the contacting roller rests against substrates also when the substrates are uneven. The contact pressure can be relatively small.

Abstract: An exemplary electroplating apparatus includes an electroplating tank containing an electroplating solution and including a first side and a second side, a pay out reel arranged adjacent to the first side, a plurality of parallel anode plates in the electroplating solution, a plurality of first conveying rollers in the electroplating solution and adjacent to the first side of the electroplating tank, a plurality of second conveying rollers in the electroplating solution and adjacent to the second side of the electroplating tank, the conveying rollers arranged in a staggered fashion and aligned with the respective anode plates and being electrifiable to allow a current to flow through the flexible substrate, and a take up reel arranged adjacent to the second side. The conveying rollers cooperate to convey the flexible substrate from the pay out reel to the take up reel along a zigzag path.

Abstract: A plating apparatus includes a plating tank. The plating tank contains a plating solution. A long-sized substrate is transported by transport rollers to pass through inside of the plating tank. Three or more bar-shaped anodes are provided in the plating tank to line up along the long-sized substrate. A surface area of each of the anodes arranged at both ends is smaller than a surface area of another anode.

Abstract: The invention relates to an apparatus for galvanically depositing an electrically conductive layer onto a carrier on which, at least in some regions, a starter layer suitable for electroplating is disposed. The apparatus has an electroplating bath in which an electrolyte for depositing conductive material is provided, at least two contact rollers which are disposed outside of the electroplating bath and which can be connected as cathode and/or anodes, and at least one deflection roller which is connected between the contact rollers, the position of the deflection roller being changeable between two contact rollers such that by changing the position of the deflection roller a distance to be covered by the carrier and which is formed between two contact points of two adjacent contact rollers corresponds to the extension of the starter layer to be coated.

Abstract: A technique for electrically isolating a vehicle body carrier from a vehicle body during an electrodeposition coating process, and a vehicle body carrier that has been so electrically isolated. Points of potential charge transfer to the vehicle body carrier are preferably isolated. Electric current is routed to a vehicle body on the carrier by means of a conductor cable that preferably runs through the hollow interior of at least one vehicle carrier support member to a conductive vehicle body support component, thereby electrically charging the vehicle body. The retention component and other conductive points of contact between the vehicle body and the vehicle body carrier are isolated to prevent charge transfer. In this manner, the vehicle body carrier will not attract e-coat during the electrodeposition process and, therefore, will not experience a buildup of e-coat material.

Abstract: Embodiments of the invention contemplate the formation of a low cost flexible solar cell using a novel electroplating method and apparatus to form a metal contact structure. The apparatus and methods described herein remove the need to perform one or more high temperature screen printing processes to form conductive features on the surface of a solar cell substrate. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. Solar cell substrates that may benefit from the invention include flexible substrates may have an active region that contains organic material, single crystal silicon, multi-crystalline silicon, polycrystalline silicon, germanium, and gallium arsenide, cadmium telluride, cadmium sulfide, copper indium gallium selenide, copper indium selenide, gallilium indium phosphide, as well as heterojunction cells that are used to convert sunlight to electrical power.

Abstract: A problem during electrolytic treatment of printed circuit boards having a very thin basic metallization is that the treatment yields irregular results in various regions on the surface of the printed circuit board. In overcoming this problem the invention provides a device for electrolytically treating an at least superficially electrically conducting work piece having at least two substantially opposing side edges. The device comprises current supply devices for the work piece, said current supply devices each comprising contact strips located on the opposing side edges which are capable of electrically contacting the work piece at the substantially opposing side edges.

Abstract: A continuous plating system with mask registration is disclosed herein that uses drums and rollers with protruding pins which engage with guide holes in a masking belt and a lead frame. Through engagement with the pins the masking belt is keyed to the lead frame as the lead frame passes through a plating solution tank.

Abstract: Disclosed is a system and a method for manufacturing flexible copper clad laminate film capable of efficiently electroplating both surfaces of a polyimide-based film to form copper plating layers thereon while making it easy to repair and maintain the apparatus or clean its plating or cleaning bath. The system includes a pickling device adapted to spray a pickling liquid to both surfaces of a to-be-plated film to remove oxide coatings from the copper coatings; a number of water-cleaning devices for removing the pickling liquid and copper electrolyte remaining on the film; at least one plating device positioned between the water-cleaning devices to form copper plating layers on both surfaces of the film; an antirust device for preventing the copper plating layers, which have been formed by the plating device, from rusting; and a drying device for drying the antirust liquid on the film, which has been subjected to antirust treatment.

Abstract: A continuous plating system with mask registration is disclosed herein that uses drums and rollers with protruding pins which engage with guide holes in a masking belt and a lead frame. Through engagement with the pins the masking belt is keyed to the lead frame as the lead frame passes through a plating solution tank.

Abstract: Disclosed is an apparatus for manufacturing an electrolytic metal foil, which includes an electrolytic cell containing electrolyte; an upper drum installed in an upper portion of the electrolytic cell to be rotatable and to which a negative potential is applied; a lower drum soaked in the electrolyte of the electrolytic cell and installed to be rotatable together with the upper drum; a cathode belt mounted around outer circumferences of the upper and lower drums to move along an endless track and electrically connected to the upper drum so that the negative potential is applied thereto; and an anode unit installed to form a space from a metal electroplating surface of the cathode belt soaked in the electrolytic cell so that a positive potential is applied thereto, the anode unit having a slit for supplying the electrolytic to the space. This apparatus may increase a production rate of electrolytic metal foils.

Abstract: A transport system for circuit boards (12) in treatment devices (11) which runs the circuit boards (12) between pairs of rollers (20, 21). The pairs of rollers are arranged in roller tracks (17, 18) running parallel to the edge of the circuit board (12) in a narrowly defined boundary region (16). The rollers are arranged with the axes (22) and shafts (23) thereof arranged at an angle (?) relative to the transport direction (14) or the perpendicular (35) thereof, such as to exert a tensile force on the circuit boards in the transverse direction thereof and thus stiffening the same. Transport through treatment, for example galvanization, etching, cleaning etc., without contact with the useful region (15) of the circuit board (12) is thus possible.

Abstract: The invention relates to a device for the electrolytic coating of at least one electrically conductive substrate (8) or a structured or full-surface electrically conductive surface on a nonconductive substrate (8), which comprises at least one bath, one anode and one cathode (1), the bath containing an electrolyte solution containing at least one metal salt, from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer while the cathode is brought in contact with the surface to be coated of the substrate and the substrate is transported through the bath. The cathode comprises at least one band (2) having at least one electrically conductive section (12), which is guided around at least two rotatable shafts (3).

Abstract: The invention provides a method for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, comprising the steps of immersing the substrate with the pattern present thereon in an electrolytic bath, electrically contacting in the electrolytic bath a negatively charged electrode with the pattern during immersion of the substrate, and effecting contacting movement in the electrolytic bath of the electrode and the pattern with respect to each other during immersion of the substrate. The invention furthermore provides a device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate.

Abstract: Apparatus and systems for the application of a coating to an object. The systems comprise a continuous belt comprising at least one supporting member positioned to retain the object thereon, a drive member in operative engagement with the continuous belt, a coating unit in communication with the continuous belt, and a drying unit in communication with the continuous belt and the coating unit and arranged such that the object is coated and dried on the continuous belt. The supporting member of the belt may include at least one blade member comprising a plurality of projections, at least one of which is positioned to contact the object.

Abstract: A system for electrochemical mechanical polishing of a conductive surface of a wafer is provided. The system includes a wafer holder to hold the wafer and a belt pad disposed proximate to the wafer to polish the conductive surface. Application of a potential difference between conductive surface and an electrode and establishing relative motion between the belt pad and the conductive surface result in material removal from the conductive surface. Electrical contact to the surface is provided through either contacts embedded in the belt pad or contacts placed adjacent the belt pad.

Abstract: A feeder belt for strip-shaped parts used to feed the strip-shaped parts in various processes such as plating, deflashing, or other processes for manufacturing semiconductors or other articles at industrial scale. By improving the structure of a finger for a feeder belt including a belt body, the separation, fatigue, and the sliding of the finger during feeding of the strip-shaped parts is resolved. Since external force can be applied in the horizontal direction when loading and unloading the strip-shaped parts, peripheral devices are simplified.

Abstract: A system for coating variable and/or unlimited length parts is provided. The system comprises a process tank, a coating material supply, and an open-ended process tank conveyor is provided. The process tank comprises an entry port, an exit port opposite the entry port, and a process path extending from the entry port to the exit port. The process tank is in communication with the coating material supply. The open-ended process tank conveyor defines a tank conveyor path extending from a receiving end to a dispensing end along at least a portion of the process path, wherein the process tank conveyor defines an open-ended configuration at the receiving end of the tank conveyor and an open-ended configuration at the dispensing end of the tank conveyor.

Abstract: A method of improving the material properties of a composite by electrodepositing various polymers, organic compounds or inorganic compounds onto each individual carbon (graphite) fiber strand, whether individual fiber or as a fabric to form an homogeneous chemically-bonded composite as opposed to the formation of a heterogeneous, non-chemically bonded composite. Thus, electrodeposition forms a unique discrete interface at the molecular layer (nanolayer) between the reinforcement (fiber) and the matrix (resin) over as opposed to any previous resin infusion process.

Abstract: A feed belt for strip-shaped elements includes a belt body and a plurality of fingers, the fingers being previously fabricated and coupled to the belt body at constant pitches. The belt body includes fitting openings and slits formed at one side of the fitting openings. Each fitting opening serves to be coupled with a fitting portion and an elastic hinge portion formed at one side of each finger. Each slit serves to be coupled with a bent gripper portion formed at the other side of the finger so as to allow movement of the bent gripper portion. The fitting portion and the elastic hinge portion of the finger, to be coupled into the fitting opening, are integrally formed. The bent gripper portion to be fitted into the slit is integrally connected with the elastic hinge portion through a direction conversion portion.

Abstract: A new device is provided for the electrorefining of uranium in spent metallic nuclear fuels by the separation of unreacted zirconium, noble metal fission products, transuranic elements, and uranium from spent fuel rods. The process comprises an electrorefiner cell. The cell includes a drum-shaped cathode horizontally immersed about half-way into an electrolyte salt bath. A conveyor belt comprising segmented perforated metal plates transports spent fuel into the salt bath. The anode comprises the conveyor belt, the containment vessel, and the spent fuel. Uranium and transuranic elements such as plutonium (Pu) are oxidized at the anode, and, subsequently, the uranium is reduced to uranium metal at the cathode. A mechanical cutter above the surface of the salt bath removes the deposited uranium metal from the cathode.