Abstract: The present invention relates to a grind machining apparatus, which comprises a grinding wheel and an electrochemical processing module. The grinding wheel has a grinding surface on the surface. The electrochemical processing modules is disposed at the grinding wheel. The processing surface of the electrochemical processing module faces the direction away from an axle of the grinding wheel and is located lower than the grinding surface. By using the above grind machining apparatus, alternate compound machining including electrochemical oxidation processing and mechanical grind machining can be performed.

Abstract: An electroplating apparatus applies an electroplated coating to a female thread formed on a pipe end portion of a steel pipe. The apparatus includes an inner seal member, a capsule, a discharge outlet, an opening, a cylindrical insoluble anode, a plating solution supply tube, and a plurality of nozzles. The seal member divides the interior of the steel pipe at a location longitudinally inward of a region on which the female thread is formed. The capsule is attached to the pipe end portion. The outlet is designed to discharge a plating solution inside the capsule therefrom. The opening facilitates discharge of the solution inside the capsule. The anode is disposed in the inside of the pipe end portion. The supply tube projects from an end of the anode. The nozzles eject a plating solution between the outer surface of the anode and the inner surface of the pipe end portion.

Abstract: The present invention is a device and system for recovering metal ions from bodies of water. The device comprises two electrode cylinders, a keel, at least two connectors, a buoyant housing and a power supply. The first electrode cylinder comprises a top, a bottom, an exterior surface, a longitudinal axis and a means for connecting to a power supply. The second electrode cylinder is affixed within the first electrode cylinder by a bracket and has a means for connecting to a power supply. The keel is affixed to the bottom of the exterior surface along the longitudinal axis of the first electrode cylinder. There are least two connectors affixed to the top along the longitudinal axis of the first electrode cylinder.

Abstract: Methods of electroplating metal on a substrate while controlling azimuthal uniformity, include, in one aspect, providing the substrate to the electroplating apparatus configured for rotating the substrate during electroplating, and electroplating the metal on the substrate while rotating the substrate relative to a shield such that a selected portion of the substrate at a selected azimuthal position dwells in a shielded area for a different amount of time than a second portion of the substrate having the same average arc length and the same average radial position and residing at a different angular (azimuthal) position. For example, a semiconductor wafer substrate can be rotated during electroplating slower or faster, when the selected portion of the substrate passes through the shielded area.

Abstract: Axially fed fluid is sheared during long residence time in a radial workspace between counter-rotating coaxial disk-shaped centrifugal impellers. Gases evolve in the fractal turbulence of a shear layer, which is forced between laminar boundary layers, and an axial suction pump axially extracts evolved noncondensables and volatiles through cores of radial vortices in the shear layer. Cavitation due to shear between the impellers kills pathogens by shock waves, microjets, OH radicals, and nearby UV light pulses. Oppositely charged electrodes bounding the workspace cause electroporesis and electrohydraulic cavitation. The electrodes are counter-rotating ridged armatures of disk dynamos, forming a dynamic capacitor having audio frequency pulsed electric fields. Electrode erosion by arcing is prevented by shear between the electrodes.

Abstract: An electroerosion machining system comprises an electrode, a power supply, an electrolyte supply, an electroerosion controller connected to and monitoring the power supply, and a working apparatus configured to move the electrode relative to the workpiece. The electroerosion machining system further comprises a CNC controller configured to cooperate with the electroerosion controller to control the working apparatus, and to calculate a wear value of the electrode. Further, the CNC controller is configured to segment the toolpath of every layer into a plurality of segments, and to divide the compensation value for every layer to be machined into a plurality of value segments, and further to use the value segments to compensate for electrode wear along the respective toolpath segments during machining of the workpiece. An electroerosion machining method is also presented.

Abstract: Electrolysis cell (10) comprises a DC voltage source (12) with positive and negative terminals (14, 16) to alternating electrodes (18) and (20) respectively. The source (12) produces a voltage that cycles between a minimum voltage Vmin and a maximum voltage Vmax where Vmin?0 volts, and Vmax=Vmin+?, where ?>0 volts. Thus, the voltage provided by the DC source (12) is in the form of a periodic wave having a period T, and frequency f. As the voltage source (12) cycles its voltage from Vmin to Vmax, there is an intermediate peak VP1 between Vmin and Vmax. When the voltage reaches VP1, it decreases for a period of time TP1, before again ramping up to voltage Vmax. The voltage then decreases relatively rapidly to Vmin, completing one cycle of period T.

Abstract: A process and apparatus utilizing at least one conformable anode (40) in a plating process to apply a plating to an article (10). A wire or other material suitable for an anode is shaped to conform to the approximate shape of a region of the article to be coated. The anode is powered by an electrical power source (44), and the article serves as the cathode. The anode and article are both immersed in a plating bath (38). The article and anode are rotated relative to one another about a central axis (22) of the article. The relative movement between the anode and the article causes a uniform plating (46) to be applied to selected regions of the article that pass the anode. Another anode (50) can be arranged in fixed relation with the article to cause plating to a separate selected region of the article concurrently with the other anode.

Abstract: A method of electroplating conductive material on semiconductor wafers controls undesirable surface defects by reducing the electroplating current as the wafer is being initially immersed in a plating bath. Further defect reduction and improved bottom up plating of vias is achieved by applying a static charge on the wafer before it is immersed in the bath, in order to enhance bath accelerators used to control the plating rate. The static charge is applied to the wafer using a supplemental electrode disposed outside the plating bath.

Abstract: A water treatment device having a tank containing an anode and a cathode. A motor is provided to impart rotational motion to the cathode. A scraping means is fixed to the interior of the tank and extend inward toward the tank so as to define a gap between the scraping means and the cathode. As mineral deposits accumulate on the cathode they are removed by the scraping means and the rotational motion of the cathode.

Abstract: An electroerosion machining system comprises an electrode, a power supply, an electrolyte supply, an electroerosion controller connected to and monitoring the power supply, and a working apparatus configured to move the electrode relative to the workpiece. The electroerosion machining system further comprises a CNC controller configured to cooperate with the electroerosion controller to control the working apparatus, and to calculate a wear value of the electrode. Further, the CNC controller is configured to segment the toolpath of every layer into a plurality of segments, and to divide the compensation value for every layer to be machined into a plurality of value segments, and further to use the value segments to compensate for electrode wear along the respective toolpath segments during machining of the workpiece. An electroerosion machining method is also presented.

Abstract: A work piece is electroplated or electroplanarized using an azimuthally asymmetric electrode. The azimuthally asymmetric electrode is rotated with respect to the work piece (i.e., either or both of the work piece and the electrode may be rotating). The azimuthal asymmetry provides a time-of-exposure correction to the current distribution reaching the work piece. In some embodiments, the total current is distributed among a plurality of electrodes in a reaction cell in order to tailor the current distribution in the electrolyte over time. Focusing elements may be used to create “virtual electrode” in proximity to the surface of the work piece to further control the current distribution in the electrolyte during plating or planarization.

Abstract: Axially fed fluid is sheared during long residence time in a radial workspace between counter-rotating coaxial disk-shaped centrifugal impellers. Gases evolve in the fractal turbulence of a shear layer, which is forced between laminar boundary layers, and an axial suction pump axially extracts evolved noncondensibles and volatiles through cores of radial vortices in the shear layer. Cavitation due to shear between the impellers kills pathogens by shock waves, microjets, OH radicals, and nearby UV light pulses. Oppositely charged electrodes bounding the workspace cause electroporesis and electrohydraulic cavitation. The electrodes are counter-rotating ridged armatures of disk dynamos, forming a dynamic capacitor having audio frequency pulsed electric fields. Electrode erosion by arcing is prevented by shear between the electrodes. The device is also a continuous crystallizer.

Abstract: An electrode (10) is provided for electrochemical reduction of a workpiece (20) that is to be treated. The electrode (10) has a predefined contour and contains an electrically conductive material. The electrically conductive material of the predefined contour forms an electrode core (12). The outside of the electrode core (12) is covered with an insulation layer (13). The insulation layer (13) is porous and is made of an electrically non-conductive material.

Abstract: To avoid the formation of undesirable plating on electric supply rollers, there is provided a continuous plating apparatus in which a planar article to be plated is vertically clamped on both sides by electric supply rollers and the article to be plated is moved horizontally in a plating bath by the rotation of the electric supply rollers to plate both surfaces of the article to be plated. The apparatus is characterized in that the electric supply rollers are divided into conductive segments and non-conductive segments in the circumferential direction, with only the conductive segment which is in contact with the article to be plated being negatively charged, and other conductive segments which are at a distance from the article being positively charged.

Abstract: A substantially uniform layer of a metal is electroplated onto a work piece having a seed layer thereon. The current of a plating cell is provided from an azimuthally asymmetric anode, which is rotated with respect to the work piece (i.e., either or both of the work piece and the anode may be rotating). The azimuthal asymmetry provides a time-of-exposure correction to the current distribution reaching the work piece, whereby peripheral regions of the work piece see less current than central regions over the period of rotation. In some embodiments, the total current is distributed among a plurality of anodes in the plating cell in order to tailor the current distribution in the plating electrolyte over time. Focusing elements may be used to create “virtual anodes” in proximity to the plating surface of the work piece to further control the current distribution in the electrolyte during plating.

Abstract: A cathode current control system employing a current thief for use in electroplating a wafer is set forth. The current thief comprises a plurality of conductive segments disposed to substantially surround a peripheral region of the wafer. A first plurality of resistance devices are used, each associated with a respective one of the plurality of conductive segments. The resistance devices are used to regulate current through the respective conductive finger during electroplating of the wafer. Various constructions are used for the current thief and further conductive elements, such as fingers, may also be employed in the system. As with the conductive segments, current through the fingers may also be individually controlled. In accordance with one embodiment of the overall system, selection of the resistance of each respective resistance devices is automatically controlled in accordance with predetermined programming.

Abstract: An apparatus for rotary cathode electroplating having a head assembly, a substrate/thief assembly having a thieving ring which includes a number of individually chargeable segments, and a secondary induction assembly including a secondary core and a secondary winding. A motor drives the substrate/thief assembly to rotate relative to the head assembly. A controller directs electrical charge to each of the individually chargeable segments of the thieving ring. An electrical storage device stores electrical energy which is to be supplied to the controller. A charging apparatus induces a magnetic flux which induces an alternating current in the secondary winding of the secondary induction assembly. A converter converts the induced alternating current to direct current, which is then stored on the electrical storage device.

Abstract: A cathode current control system employing a current thief for use in electroplating a wafer is set forth. The current thief comprises a plurality of conductive segments disposed to substantially surround a peripheral region of the wafer. A first plurality of resistance devices are used, each associated with a respective one of the plurality of conductive segments. The resistance devices are used to regulate current through the respective conductive finger during electroplating of the wafer. Various constructions are used for the current thief and further conductive elements, such as fingers, may also be employed in the system. As with the conductive segments, current through the fingers may also be individually controlled. In accordance with one embodiment of the overall system, selection of the resistance of each respective resistance devices is automatically controlled in accordance with predetermined programming.

Abstract: Both a process and plant are provided for electrolytically coating with a metal layer the casting surface of a roll for twin-roll or single-roll continuous casting of thin metal strip. The casting surface is at least partially immersed in an electrolyte solution containing a salt of the metal to be deposited, so as to face at least one anode. The surface is placed at a cathode and a relative movement is created between the casting surface and the electrolyte solution. Insulating masks are interposed between the anode or anodes and the arrises of the casting surface, the insulating masks preventing a concentration of the lines of current on the arrises and in their vicinity.

Abstract: Recovery of silver from a photographic fixer solution in an electrolytic cell is controlled so as to maintain a high current efficiency whilst minimizing unwanted side effects. The difference between plating voltages when operating at two different current levels is monitored, and the plating current adjusted in response to detection of a maximum of said differences. Such control allows the cell to be operated continually at high current efficiency in response to changing chemical conditions within the cell.

Abstract: An internal stress testing device for high speed electroplating is disclosed. The testing device comprises: a tank to be filled with a plating solution; a metal plate for anode disposed within the tank; a metal rod for cathode disposed within the tank and rotatably held by a motor at a position opposite to the metal plate for anode; a metal plate for cathode in the shape of a thin plate mounted on the metal rod; and a DC power supply connected to the metal plate for anode and the metal rod for cathode.

Abstract: A technique for utilizing an electric field to initiate electroless deposition of a material to form layers and/or structures on a semiconductor wafer. The wafer is disposed between a positive electrode and a negative electrode and disposed so that its deposition surface faces the positive electrode. A conductive surface on the wafer is then subjected to an electroless copper deposition solution. When copper is the conductive material being deposited, positive copper ions in the solution are repelled by the positive electrode and attracted by the negatively charged wafer surface. Once physical contact is made, the copper ions dissipate their charges by accepting electrons from the conductive surface, thereby forming copper atoms on the surface. The deposited copper have the catalytic properties so that when a reductant in the solution is absorbed at the copper sites and then oxidized, additional electrons are released into the conductive surface.

Abstract: An electrolytic combined processing machine includes a grinding wheel spaced apart from and facing a workpiece, a current switching circuit for switching a coarse grinding to a fine grinding of the workpiece by the grinding wheel, and an infeed switching circuit for switching the infeed speed of an infeed table which allows the grinding wheel to relatively approach the workpiece. The switching operation is based on a measurement result obtained from a size measuring unit which measures a processing amount of the workpiece. During fine grinding, the infeed speed of the grinding wheel is the same as the speed of a passivation coating film generated on the workpiece. Workpieces, particularly of brittle materials, can be processed in a state of less processing distortion with improved surface roughness, flatness and efficiency.

Abstract: An apparatus for electroplating conductive surfaces, in particular rotatable surfaces. A hand held anode includes a porous surface material such as polypropylene wool, backed by an inert anode mounted on a handle and connected to a source of direct current. A delivery tube through the anode handle allows liquid to be delivered to the surface material. A manually actuatable valve system on the anode handle permits liquids from a selected one of plural supply tubes to be connected to the delivery tube. In operation, the anode is connected to a positive polarity direct current sources, a plating liquid is directed from a supply to the valve system, then to the anode surface material through the delivery tube. Depending on the direct current polarity selected and the liquid selected for delivery to the anode material, the workpiece surface may be cleaned, treated or plated. A series of movable trays are positioned below the workpiece to catch liquid that may drip from the anode surface material.

Abstract: Apparatus for controlling the wetting behavior of the surface of a cylinder formed of passivatable metal. A wetting device is used to apply an electrolyte to the surface of the metal cylinder. A direct current source is connected between the wetting device and the cylinder and a control device is used to control the voltage necessary for passivating the surface of the cylinder as a function of the pH value of the electrolyte and the type of metal forming the surface of the cylinder. The oleophilic or oleophobic characteristics of the cylinder are thus controlled.

Abstract: An apparatus for electro-coating disc-like workpieces (can ends for food cans) comprises an electrolyte tank and a carrier wheel mounted for rotation with one third of its periphery in the electrolyte. The wheel carries equi-spaced pallets, each defining a pocket for holding a workpiece with its periphery in good electrical contact with the pallet while the pallet is carried by the wheel through the electrolyte adjacent a counter electrode. Energisation of the pallets is achieved by sliprings each having three conductive segments connected to respective pallets spaced equally around the wheel. Adjacent segments in adjacent sliprings are staggered for sequential energisation of the pallets while submerged in the electrolyte. Electrical control means (a) test for the presence of a workpiece in a pocket, and for the degree of workpiece contact with its pocket, and (b) control the electric current passing to each separate pallet.

Abstract: An apparatus for the electrolytic plating of computer memory discs comprising a plating container for the receipt of a liquid plating bath, a spindle fitted to the plating container, a prime mover connected to the spindle for causing relative rotational movement, a fixed and non-translatable stationary anode attached to the plating container, an electrical transmission system connected to the spindle and to the anode, and suitable current distribution controllers positioned within the plating container. The spindle has a receiving area for fixing to the inner diameter of a computer memory disc. The stationary anode is positioned on opposite sides of the receiving area of the spindle. The electrical transmission system includes a contact surface for establishing electrical contact with the edge of a computer memory disc. The current distribution controllers are adjacent the contact surface of the electrical conductors.

Abstract: A current collecting assembly for a body, such as an electrodepositing drum, mounted to rotate about a shaft (16) includes a current collector removably connected to an end of the shaft (16), a current conductor (12) connected to a current supply conductor (19) and means (13,14) for pressing a contact portion (12a) of the current conductor means (12) against the current collector (11) with a predetermined pressure. The contact portion (12a) is carried by a hollow body (12b) through which water is passed to water cool the contact portion (12a).

Abstract: An apparatus for electrolytic plating of computer memory discs comprising a plating container, a spindle, a prime mover, an anode, and an electrical transmission system. The plating container contains a liquid plating bath having a nickel compound included therein. The spindle is rotatably mounted to the plating container. The spindle has a section for receiving the computer memory disc radially. The prime mover is connected to the spindle so as to apply rotational energy to the spindle. The anode is fastened to the plating container generally adjacent and in plane parallel to the disc. Another anode is placed on the opposite side of the disc. The electrical transmission system is connected to the disc about the spindle and to the anode.

Abstract: During electrolytical treatment, a printing cylinder is held between center points, of which one is provided adjustably with a centering sleeve in a tail spindle. A belt connects the tail spindle in force transmitting relationship to a drive. The tail spindle is axially displaceable together with the inner housing of the apparatus, so that an electric contact ring at the end of the tail spindle is engageable with the front surface of a printing cylinder. The current conduction to the contact ring takes place via cooled carbon brushes located between the tail spindle bearings and the contact ring. A current conducting sleeve encompassing the end region of the tail spindle and being contacted by the carbon brushes, prevents the tail spindle carrying the printing cylinder from being exposed to electric current.

Abstract: An improved electrochemical grinding wheel electrode consisting essentially of electrically conductive abrasive grains bonded together with an essentially nonconductive bonding matrix. The abrasive grains are admixed with an amount of 10 to 30% by volume of the bonding matrix and sintered together to form the porous, homogeneous electrode body, e.g. in the form of a wheel, having a specific resistivity not greater than 100 ohm-cm, preferably between 0.1 and 10 ohm-cm.

Abstract: An apparatus and a method for rotary electroplating a thin metallic film having a uniform thickness and composition throughout. The apparatus includes a flow-through jet plate having nozzles of increasing size and uniformly spaced radially therethrough, or the same sized nozzles with varying radial spacing therethrough so as to provide a differential flow distribution of the plating solution that impinges on the wafer-cathode where the film is deposited. The spacing and size of the nozzles are critical to obtaining a uniform thickness. The electrical currents to the wafer and to the thieving ring are controlled by variable resistors so as to keep the electrical current to the cathode constant throughout the plating process. In a preferred embodiment the flow-through jet plate has an anode associated therewith in which the exposed area of the anode is maintained at a constant amount during the deposition.

Abstract: The disclosure illustrates a method and apparatus for precision balancing a rotatable element such as the turbine shaft assembly of a turbocharger. The turbine-shaft assembly is placed in a machine that detects the position and degree of unbalance. The material contributing to the unbalance is then removed from the wheel using electrochemical machining in which material is removed from the turbine through anodic dissolution of the turbine wheel material by passage of a current through a conductive work piece and electrolyte to the wheel. A means is provided to indicate the time integrated current flow of the electrochemical machining process. The time integrated current flow is related to unbalance units so that the electrochemical machining is terminated when the desired amount of mass is removed to achieve balance by reaching the determined time integrated current flow.

Abstract: At least one cylinder having electrically conductive portions and in tangential contact with a metallic tube is associated with a tank filled with electrolyte which is brought to the contact surface between cylinder and tube as a result of rotational motion imparted to the cylinder or to the tube by suitable driving means. An electric current generator is connected to the metallic tube and to at least one of the conductive portions of the cylinder.

Abstract: There is described a method for manufacturing by electroplating substantially flat dies or similar, which comprises adjusting the electric current strength by varying the sparing between the cathode and the anode inside the electrolyte proper.

Abstract: A method for the high speed chromium plating of piston rings, cylinder liners and the like wherein the cathodic workpiece is rotated at a peripheral speed of 1-4 m/sec. relative to a concentrically disposed anode. The latter may comprise a single spoked member or a plurality of rectangular pieces to thereby create a turbulence in the electrolyte bath. When a cylindrical anode is used, a bladed agitator is secured to the rotating workpiece to generate turbulence. The interelectrode spacing is from 0.1 to 4t cm with a multipolar anode, where t is the thickness of an anode pole. The current density is from 200 - 600 amps/dm.sup.2, and the bath temperature is from 20.degree. - 50.degree. C or from 65.degree. - 80.degree. C, depending on the plating characteristics desired.

Abstract: A metal powder e.g. copper or zinc, is produced from a dilute aqueous solution of the metal by subjecting the dilute aqueous solution to electrolysis in a cell having a rotating cylinder cathode and in accordance with the equation:I = KCV.sup.xwhere I is the current density, K is a constant for a given cell, C is the concentration of metal ion in aqueous solution, V is the peripheral velocity of the rotating cylinder cathode and x = 0.7 to 1.0. A diaphragm cell is preferably used. Dilute aqueous solutions treated include mining liquors and viscose rayon plant effluent.This invention relates to metals and is particularly concerned with the recovery or extraction of metals in powder form by electrolytic means.

Abstract: A hollow niobium body, rotatable about a horizontal axis, is arranged for partial immersion in an electrolyte of H.sub.2 SO.sub.4, HF and H.sub.2 O. A generally concentric opening at one end receives a cathode. Evolved gases rise therefrom and escape into a vapor space above without contacting the immersed surfaces of the niobium body. The cathode is hollow and is perforate in the portion introduced into the body in order to feed electrolyte into the body. For polishing, constant electric voltage is applied between the hollow niobium body and the cathode and adjusted in such a manner that damped current oscillations occur which are superimposed on the electrolytic current. Not later than after the complete decay of the current oscillations, the voltage is turned off until the oxide layer built up during the current oscillations is dissolved.