Abstract: The invention relates to an electrolysis cell of the single-element type design for chlor-alkali electrolysis plants, comprising an anode compartment and a cathode compartment, each of the two compartments containing an electrode connected to the rear wall of the respective compartment by means of parallel bars. The electrodes are thus subdivided into several sections. In accordance with the invention, at least one of two electrodes is provided with a curved shape in each section, this curved section protruding towards the opposite electrode and pressing a membrane area against the opposite electrode. According to a preferred embodiment, the curved shape of the various electrode sections is obtained by means of springs.

Abstract: The invention relates to a current collector for electrochemical diaphragm or membrane-type cells, comprising a layer obtained by interlacing or weaving of a multiplicity of first sets of metal wires with a multiplicity of single metal wires or of second sets of metal wires and provided with substantially parallel corrugations. Such layer is coupled to a planar element consisting of a cloth or a flattened stocking formed by weaving of a single metal wire. The current collector is characterised by a low angular coefficient of the pressure/thickness ratio over a wide range of compression levels.

Abstract: An electrolytic ozone cell anode spring fastening board structure includes a solid polymer electrolyte membrane (1), an anode electrocatalyst layer (2), a diffusion layer (3), frame body and support parts (5). A diffusion layer counterpiece (4) has one side attached to the diffusion layer (3), the other side of the diffusion layer counterpiece (4) equipped with a centered elevated step, which contacts the center of the convex side of a spherical spring board (6). In addition, the solid polymer electrolyte membrane (1), frame body and support parts (5), diffusion layer (3), diffusion layer counterpiece (4) and spring board (6) are held together by mechanical fastening means. It prevents a decrease in ozone generation rate in electrolytic ozone cell that can occur from the metal board deformation and thinning of the anode electrocatalyst layer.

Abstract: Provided are an electrolytic cathode structure that can suppress the degradation of an activated cathode even if a reverse current flows upon the stoppage of operation of an electrolyzer in an electrode structure allowing the distance between the electrode and an electrode current collector to be maintained at an approximately constant value, and an electrolyzer using the same. The electrolytic cathode structure includes a metal elastic cushion member 1 compressed and accommodated between an activated cathode 2 and a cathode current collector 3. At least a surface layer of the cathode current collector 3 consumes a larger oxidation current per unit area than the activated cathode. The electrolyzer is partitioned by an ion exchange membrane into an anode chamber for accommodating an anode and a cathode chamber for accommodating a cathode. The electrolytic cathode structure is used for the cathode.

Abstract: The invention relates to a coating mask (1) for electrolytically coating the piston ring groove (39) of a piston (38), which is made of an elastically deformable material and has openings (3 to 10) that are arranged axially and are distributed in a uniform manner over the periphery, into which rods (11 to 18) of an expansion device (19) can be introduced, the rods being arranged in a displaceable manner such that the expansion device (19) can increase the radial diameter of the coating mask (1) and also the inner opening (2) so that the piston (38) can be introduced into the inner opening (2). The radial diameter of the coating mask (1) is selected in such a manner that after the reduction of radial diameter of the coating mask (1) and the inner opening, the elastically tensed coating mask (1) presses sealing lips (44, 45) of the coating groove (37) against the piston (38), on both sides of the piston ring groove (39).

Abstract: An ion exchange membrane electrolyzer is provided, which is characterized in that a current is passed through at least one electrode in contact with a plate spring member formed at a portion of an electrode retainer member parallel with a flat plate form of electrode chamber partition, wherein said electrode retainer member is joined at a belt junction to the flat plate form of electrode chamber partition with a space between them, said electrode is provided with a floating mount means at a portion thereof other than a portion of contact with the plate spring member, and said floating mount means is provided with an engaging portion that is engaged with a fixed engaging member to enable said electrode to move in a perpendicular direction to an electrode surface and in a range of displacement of said plate spring member.

Abstract: Method and device for supplying electrical power to a wafer that is at least partially submerged in a liquid. The device comprises: —a container filled with the liquid; —a transportation device comprising a wafer carrier device for transporting the wafer at least partially submerged through the liquid; —a power supply device for supplying electrical power to the wafer.

Abstract: There is provided an ion exchange membrane electrolyzer, wherein at least one electrode is energized by coming into contact with plate spring bodies formed on the electrode side of an electrode holding member forming a space with an electrode chamber partition bonded to a plate-like electrode chamber partition by a strip-like bonded portion, the electrode has a connected portion extending from a plane parallel to the ion exchange membrane toward the electrode holding member side in a direction perpendicular to the electrode plane, the connected portion is provided with an engaging opening extending in a direction perpendicular to the electrode plane, and the engaging opening engages with an engaging member, permitting the electrode to move in a direction perpendicular to the electrode plane within the displacement range of the plate spring bodies.

Abstract: An ion exchange membrane electrolyzer comprises electrodes at least either of which is held in contact with leaf springs formed integrally with a leaf spring holding member arranged in an electrode chamber so as to extend toward the electrode and remain electrically energized at the respective electrode touching sections thereof, each of the leaf springs having a crooked section arranged at a position separated from its connecting section connecting itself to the leaf spring holding member and adapted to be bent toward the leaf spring holding member when the electrode touching section is pressed toward the leaf spring holding member side.

Abstract: An anode holder is used to hold an anode in a plating tank. The anode holder includes a bar having a conductive portion connected to a power source, a conductive anode shaft attached to the bar, and an anode connected to the conductive anode shaft. The conductive anode shaft includes an external thread portion provided at an end of the conductive anode shaft, an O-ring, and a step portion provided between the O-ring and the external thread portion. The step portion has a diameter larger than a diameter of the external thread portion but smaller than a diameter of the O-ring. The anode includes an internal thread hole to which the external thread portion of the conductive anode shaft is screwed. The anode also includes a receiving portion for receiving the step portion of the conductive anode shaft in a state such that the O-ring of the conductive anode shaft is brought into contact with an inner surface of the receiving portion.

Abstract: A loading apparatus for use in electroplating processes includes a container designed to sealingly receive a plurality of airfoil blades fitted with gaskets. Each fitted airfoil blade is disposed in contact with a plurality of electrical contact assemblies having a spring-like design which ensures an adequate connection is made and complete plating of the airfoil blades occurs.

Abstract: Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupled to a second end of the housing. The contact element electrically couples the adapter and the ball with is retained in the housing between seat and the adapter.

Abstract: Embodiments of the invention may further provide a contact ring for an electrochemical plating system. The contact generally includes a substrate receiving member having a substrate support surface formed thereon, a plurality of electrical contact pins extending from the substrate support surface, a first seal positioned on the substrate support surface radially inward of the plurality of electrical contacts, and a second seal positioned radially outward of the plurality of electrical contacts. Additionally, the contact ring generally includes a fluid inlet configured to supply a fluid to a volume between the first seal and the second seal.

Abstract: A reactor for electroplating a workpiece includes a vessel having a ring contact arranged to support a workpiece in a horizontal orientation. In an embodiment of the invention, an electrode is arranged below the ring contact, and a pressing member is arranged above the ring contact to press a workpiece into electrical engagement with the ring contact. The vessel may be adapted to contain an electroplating fluid between a top of the ring contact and the electrode. In one embodiment, a movable intermediate workpiece support assembly is carried by the vessel, the support assembly being actuatable to lower a workpiece carried thereby to deliver the workpiece to be supported accurately and precisely on the ring contact.

Abstract: A contact assembly for supporting a substrate in an electrochemical plating system, wherein that contact assembly includes a contact ring and a thrust plate assembly. The contact ring includes an annular ring member having an upper surface and a lower surface, an annular bump member positioned on the upper surface, and a plurality of flexible and conductive substrate contact fingers extending radially inward from the lower surface. The thrust plate includes an annular plate member sized to be received within the annular ring member, and a seal member extending radially outward from the plate member, the seal member being configured to engage the annular bump member for form a fluid seal therewith.

Abstract: The invention provides an ion exchange membrane electrolyzer ensuring a satisfactory circulation of electrolyte, high electrolytic efficiency and great ridigity. An anode chamber partition in a flat sheet form is joined to a cathode chamber partition in a flat sheet form. An electrode retainer member in a sheet form is joined to at least one partition at a belt-like junction. A projecting strip with an electrode joined thereto is located between adjacent junctions. A space on an electrode surface side of the electrode retainer member defines a path through which a fluid goes up in the electrode chamber, and a space that spaces away from the space defines a path through which an electrolyte separated from a gas at a top portion of the electrode goes down.

Abstract: The invention provides an ion exchange membrane electrolyzer. An electric current is passed through at least one electrode while the electrode is in contact with a plurality of comb-like flat leaf spring tags extending at an angle from a flat leaf spring form of retainer member located on an electrode partition provided in an electrode chamber. Each pair of comb-like flat leaf spring tags are arranged in such a way that adjacent flat leaf spring tags extend in mutually opposite directions.

Abstract: A semiconductor wafer holder including first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer.

Abstract: The invention relates to an electrolysis cell comprising an anode frame (26), an anode (24), a cation-exchange membrane (34), a gas diffusion electrode (32), a current collector (10) and a cathode frame (12), with the anode (24), the cation-exchange membrane (34), the gas diffusion electrode (32) and the current collector (10) being held together elastically so that there is no gap between the individual components anode (24), cation-exchange membrane (34), gas diffusion electrode (32) and current collector (10). The elastic cohesion is preferably achieved by the current collector (10) being elastically fastened to the cathode frame (12) and/or the anode (24) being elastically fastened to the anode frame (26).

Abstract: An anode assembly for insertion in a gap between a section of reinforced concrete and another solid structure, which may be another section of concrete, comprises an anode attached to a body of deformable material which is preferably resiliently deformable, whereby, when the assembly is inserted into the gap, the anode is pressed into electrical contact with the concrete surface.

Abstract: A cathode cartridge (N) for an electroplating tester includes a cathode conductor (10) that conducts electricity to a surface (Wa) to be plated of a silicon wafer (W) as an object to be plated, a first insulator (20) that covers a front side of the silicon wafer (W) and holds the cathode conductor (10), and a second insulator (30) that covers a back side of the silicon wafer (W) and holds the silicon wafer (W). Negative portions other than the surface (Wa) to be plated of the silicon wafer (W) are insulated from plating solution with a first O-ring (22) fitted in the first insulator (20) and a second O-ring (32) fitted in the second insulator (30).

Abstract: The invention relates to a substrate carrier for holding substrates, especially semiconductor wafers. Good sealing of the wafer surface and electrical contact are made possible in that the substrate carrier has a first and a second part having a central opening matching the form of the substrate, wherein the substrate is received between the first and the second part and a peripheral seal having at least one undercut is provided in the inner periphery of the second part.

Abstract: A plating clamp assembly for use with a plating system including a plating bath and an article transport assembly to selectively engage an article to be plated as the article is moved through the plating bath by the article transport assembly to coat at least a selected portion of the surface of the article with material without creating faults on the selected portion of the surface of the article.

Abstract: Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second conductive elements. The first conductive element can have multiple electrical contacts, of identical or different configurations, or may be in the form of a conductive pad, and can contact or otherwise electrically interconnect with the substrate surface over substantially all of the substrate surface. Upon application of a potential between the first and second conductive elements while the electrolyte makes physical contact with the substrate surface and the second conductive element, the conductive material is deposited on the substrate surface. It is possible to reverse the polarity of the voltage applied between the anode and the cathode so that electro-etching of deposited conductive material can be performed.

Abstract: The present invention has an object of providing a bipolar type ion exchange electrolytic cell which is capable of minimizing the anode-cathode distance by a movable system which has a low electric resistance and which is simple and inexpensive, thereby to substantially reduce the electrolysis voltage.

Abstract: A wafer chuck for holding a wafer during electropolishing and/or electroplating of the wafer includes a top section, a bottom section, and a spring member. In accordance with one aspect of the present invention, the top section and the bottom section are configured to receive the wafer for processing. The spring member is disposed on the bottom section and configured to apply an electric charge to the wafer. In accordance with another aspect of the present invention, the spring member contacts a portion of the outer perimeter of the wafer. In one alternative configuration of the present invention, the wafer chuck further includes a seal member to seal the spring member from the electrolyte solution used in the electropolishing and/or electroplating process.

Abstract: An apparatus and associated method that removes electrolyte solution from a substrate, the apparatus comprises a thrust plate and a substrate extension unit. The thrust plate at least partially defines a spin recess. The substrate extension unit can be displaced between a retracted position and an extended position relative to the spin recess. The substrate extension unit is disposed within the spin recess when positioned in the retracted position. The substrate extension unit at least partially extends from within the spin recess when positioned in the extended position. The substrate is processed by immersing at least a portion of the substrate in a wet solution. The substrate is removed from the wet solution. The substrate extension unit extends into its extended position, and the substrate is spun. Extending the substrate extension unit limits the formation of fluid traps within the substrate holder assembly or between the substrate and the substrate holder assembly.

Abstract: A particular anode assembly can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a semiconductor wafer. The anode assembly includes a rotatable shaft disposed within a chamber in which the operation is performed, an anode housing connected to the shaft, and a porous pad support plate attached to the anode housing. The support plate has a top surface adapted to support a pad which is to face the wafer, and, together with the anode housing, defines an anode cavity. A consumable anode may be provided in the anode cavity to provide plating material to the solution. A solution delivery structure by which the solution can be delivered to said anode cavity is also provided. The solution delivery structure may be contained within the chamber in which the operation is performed. A shield can also be mounted between the shaft and an associated spindle to prevent leakage of the solution from the chamber.

Abstract: The invention relates to an electrode assemblage clamping device for an electrode comprising two parallel, essentially flat and rectangular electrode members, and at least one current supply rod/conductor bar, arranged between and in conductive contact with said electrode members. The device comprises a clamping means provided along at least a part of the vertical peripheral edges of said electrode elements, said clamping means comprising a resilient member and an abutment member. The latter are configured such that each electrode member is clamped between one respective part each of the abutment member and of the resilient member.

Abstract: Electro-plating apparatus 1 has an electro-plating bath 2 containing electrolyte 3, an anode configuration immersed in electrolyte 3 being a planar anode 4 and an arcuate solid anode 5. In use, a continuous web of flexible substrate 6 (onto both side of which material is to be deposited) is passed along a transport system 7 in a direction shown by arrow A. Transport system 7 comprises a set of rollers 8, 9 of which rollers 8 are generally cylindrical, driving rollers while rollers 9 are cathode connectors and have a number of circumferential projections 10 which ensure electrical contact with unconnected or discreet regions on substrate 6. Another electro-plating apparatus 20 has a cathode connector configuration 21 with four comb electrodes 22 each having a main portion 23 with a plurality of teeth 24 each of which has end 25 inclined in the direction of the movement fo the substrate.

Abstract: A semiconductor wafer holder including first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer.

Abstract: A workholder for an ECM process comprises a set of jaws which define an interior workpiece holding region are mounted on the surface of a diaphragm which is movable under air pressure from a flat to a more generally spheroid shape with the injection of pressurized air between the diaphragm and a backing plate. As the air is injected, and the diaphragm becomes more spheroid, the jaws are moved a substantially equal distance away from the center axis of the workholding region. The workpiece, which typically incorporates or is mounted on a circular shaft, is placed in the center of the workholding region, and the air pressure is removed, causing the diaphragm to return to its original flat shape and the jaws to snap back to their original positions resting against the shaft.

Abstract: A holding clamp device, for releasably holding a thick planar article over ground, comprising: an elongated main arm member, defining first and second opposite end portions; a pair of first and second tubular bar members, each defining an outer end portion and an opposite inner end portion; a rail member, integral to an intermediate section of the main arm member and slidably engaged by the second bar member inner end portion, wherein the second bar member is maintained by the rail member parallel to the first bar and wherein the second bar member is movable relative to the first bar member while continuously remaining parallel thereto; a first biasing member, continuously biasing the first and second bar members toward one another; and a second biasing member, for discretely biasing the second bar member away from the first bar member, against the continuous bias of the first biasing member.

Abstract: The present invention provides an ion exchange membrane type electrolyzer, which comprises electrodes at opposed positions via an ion exchange membrane, spacers are mounted in dot-like arrangement on openings of electrode surface to maintain spacing between the ion exchange membrane and surface of at least one of the electrodes.

Abstract: A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution.

Abstract: A holding clamp device, for releasably holding a thick planar article over ground, comprising: an elongated main arm member, defining first and second opposite end portions; a pair of first and second tubular bar members, each defining an outer end portion and an opposite inner end portion; a rail member, integral to an intermediate section of the main arm member and slidably engaged by the second bar member inner end portion, wherein the second bar member is maintained by the rail member parallel to the first bar and wherein the second bar member is movable relative to the first bar member while continuously remaining parallel thereto; a first biasing member, continuously biasing the first and second bar members toward one another; and a second biasing member, for discretely biasing the second bar member away from the first bar member, against the continuous bias of the first biasing member.

Abstract: The invention relates to a holder to be used during the stripping of a metal deposit produced on the surface of a mother plate in electrolytic refining, which mother plate has a supporting bar (12) fixed at one edge of the plate for supporting the mother plate during the stripping (16), and an edge strip (10) at least on the edge opposite to where the supporting bar (12) is fixed. According to the invention the holder (1) has at least one pressing member (4), so that during the stripping (16) the metal deposit (15) is pressed by the pressing member (4) in order to make a contact between the deposit (15) and the pressing member (4) close to the edge strip (10) installed on the edge opposite to where the supporting bar (12) is fixed.

Abstract: A cathode frame for receiving and retaining a cathode plate for electrowinning and/or electrorefining processes is constructed as an integrally-formed frame body having a base member and side members which provide a continuous channel therethrough for retaining the peripheral edge of a cathode plate, and is further structured with a cross frame extending between the side members for receiving a cathode plate therethrough. The cross frame is sized and positioned to extend proud of the frame body thereby providing contact surfaces for striking when recovering the cathode plate from the frame. In an alternative embodiment of the invention, the cross frame is integrally formed with the side members and base member and the cathode frame is configured to retain a filter media thereagainst.

Abstract: A fixture for supporting a workpiece during electroplating of a metal upon the workpiece in a conductive electroplating bath includes a non-conductive frame member for receiving the workpiece therein. The fixture further includes a current distribution means having a plurality of contacts. The plurality of contacts are disposed inwardly for providing an equally distributed electrical contact with an outer perimeter region of the workpiece. The workpiece is supported between the frame member and the current distribution means. Lastly, a thief electrode is perimetrically disposed about the workpiece and spaced a prescribed distance from the workpiece by a gap region. During plating of a metal upon the workpiece, the gap region between the thief and the workpiece is filled with the conductive electroplating bath. An electroplating apparatus having a fixture for supporting a workpiece during an electroplating process and a method of supporting the workpiece to be electroplated are also disclosed.

Abstract: An apparatus and process for electroplating a pin grid array device having a plurality of pins, the pins having a side surface and an extremity. The apparatus comprises a contact plate defining a plane and having a plurality of electrically conductive flexible contact fingers extending from the contact plate away from the plane, the contact fingers adapted to flex when contacted by the pins. The process comprises contacting each of the plurality of pins with a flexible contact finger extending from a single electrically conductive plate, the conductive plate defining a plane, wherein the flexible contact fingers extend away from the plane.

Abstract: A product conveying mechanism is provided for an electroplating device which electroplates a thin-wall ribbonlike product such as a printed wiring board given to be plated. It suspends the product from the upper part thereof nipped with a jig supported laterally movably by a cathode bar and conveys the product laterally in an electrolyte solution held in a tank meanwhile feeding an electric current from the cathode bar via the jig to the product through the upper part thereof. The product conveying mechanism is particularly furnished with a jig of striking originality combining the function of nipping a product and the function of feeding an electric current to the product.