Abstract: A method of making a component includes applying a clamping force to the component, the component coupled to a carrier strip of a panel via a polymeric tab and separating a portion of the polymeric tab from a substrate of the component, thereby causing the component to be detached from the panel.

Abstract: A magnetoresistive magnetic tunnel junction (MTJ) stack includes a free magnetic region, a fixed magnetic region, and a dielectric layer positioned between the free magnetic region and the fixed magnetic region. In one aspect, the fixed magnetic region consists essentially of an unpinned, fixed synthetic anti-ferromagnetic (SAF) structure which comprises (i) a first layer of one or more ferromagnetic materials, including cobalt, (ii) a multi-layer region including a plurality of layers of ferromagnetic materials, wherein the plurality of layers of ferromagnetic materials include a layer of one or more ferromagnetic materials including cobalt, and (iii) an anti-ferromagnetic coupling layer disposed between the first layer and the multi-layer region. The free magnetic region may include a circular shape, the one or more ferromagnetic materials of the first layer may include cobalt, iron and boron, and the dielectric layer may be disposed on the first layer.

Abstract: A magnetoresistive magnetic tunnel junction (MTJ) stack includes a free magnetic region, a fixed magnetic region, and a dielectric layer positioned between the free magnetic region and the fixed magnetic region. In one aspect, the fixed magnetic region consists essentially of an unpinned, fixed synthetic anti-ferromagnetic (SAF) structure which comprises (i) a first layer of one or more ferromagnetic materials, including cobalt, (ii) a multi-layer region including a plurality of layers of ferromagnetic materials, wherein the plurality of layers of ferromagnetic materials include a layer of one or more ferromagnetic materials including cobalt, and (iii) an anti-ferromagnetic coupling layer disposed between the first layer and the multi-layer region. The free magnetic region may include a circular shape, the one or more ferromagnetic materials of the first layer may include cobalt, iron and boron, and the dielectric layer may be disposed on the first layer.

Abstract: The manufacture method of a coil component includes the steps of bonding a dummy metal layer onto one face of a mounting base, stacking a base insulating resin on the dummy metal layer, stacking a first spiral wiring and a first insulating resin in this order on the base insulating resin to cover the first spiral wiring with the first insulating resin and stacking a second spiral wiring and a second insulating resin in this order on the first insulating resin to cover the second spiral wiring with the second insulating resin to thereby form a coil substrate, detaching the mounting base from the dummy metal layer in a bonding face between the one face of the mounting base and the dummy metal layer, removing the dummy metal layer from the coil substrate, and covering the coil substrate with a magnetic resin.

Abstract: Chip electronic component and manufacturing method thereof disclosed. An example aspect provides a chip electronic component. The chip electronic component includes a magnetic body including a magnetic material, a coil part embedded in the magnetic body and formed to be connected to a first coil conductor and a second coil conductor, an insulating layer covering the first coil conductor and the second coil conductor, and a magnetic layer formed on the insulating layer.

Abstract: Provided herein are apparatuses and methods related to creating a patterned resist layer on a substrate; selectively treating at least a resist-contacting layer of the substrate in contact with the patterned resist layer to create a patterned growth guiding mechanism and growing patterned magnetic features guided by the patterned growth guiding mechanism.

Abstract: A method fabricates a magnetic transducer having air-bearing surface (ABS) location and an intermediate layer having a trench therein. The trench has a shape and location corresponding to a main pole. The method includes depositing at least one main pole layer. A portion of the main pole layer(s) is in the trench. A refill layer is provided on the main pole layer(s). The main pole layer(s) may not be patterned after being provided and before the refill layer is provided. At least the refill layer is planarized. A full-film metal planarization is performed for at least one of the refill layer and the at least one main pole layer. The full-film metal planarization may include a bulk ion mill and/or ion beam scan.

Abstract: Provided herein is a microwave device using a magnetic material nano wire array and a manufacturing method thereof, the device including a template having a nano hole array filled with a metal magnetic material.

Abstract: A wiring board includes a first insulating layer; and a coil formed on the first insulating layer and including a first magnetic layer formed on the first insulating layer and formed by a plating layer, a coil portion formed on the first magnetic layer, a second insulating layer formed on the first insulating layer to cover the first magnetic layer and the coil portion, and a second magnetic layer formed on the second insulating layer and formed by a plating layer.

Abstract: A method of fabricating a magnetic recording disk including providing a magnetic recording layer having a pattern of raised areas and recessed areas formed thereon and providing a mask layer on the raised areas of the magnetic recording layer. The method further including electrodepositing a first protection layer on the magnetic recording layer, removing the mask layer, and depositing a second protection layer above the first protection layer.

Abstract: A method for determining a critical dimension of a structure along a plane of interest from a measurement along a test plane that is not necessarily located at the plane of interest. The method involves slicing a structure along a test plane and measuring a marker feature in this test plane. A determination of a critical dimension of a feature at the plane of interest is then determined based on the measurement of the marker feature measurement at the test plane. This testing methodology can be useful, for example in the measurement of a critical dimension of a write pole at an air bearing surface plane form a measurement of a test feature at a plane that is not necessarily located at the air bearing surface plane.

Abstract: A method for making a magnet rotor assembly part by providing a bonded metal part having a determinable crush strength, impregnating the bonded metal part with a curable resin and curing the resin so that the crush strength of the assembly part is increased above the determinable crush strength both initially and after extended exposure to temperatures of at least 160° C. Improved crush strength in the magnet sleeve and in other bonded metal parts, both initially and after exposure to high temperatures is accomplished by impregnating the parts with a curable resin.

Abstract: A method is described for forming a magnetic recording head substrate. The method includes utilizing a metal feature on the magnetic recording head substrate as a grounding path. The magnetic recording head substrate is submerged in a solution containing ions of a second material, and the ions of the second material are electrodeposited on the magnetic recording head substrate.

Abstract: A method of manufacturing a boundary acoustic wave device includes the steps of forming an electrode on a first medium layer, forming a second medium layer so as to cover the electrode on the first medium layer, and forming a sound absorbing layer on an external surface of the second medium layer. The sound absorbing layer has an acoustic velocity of transverse waves that is lower than an acoustic velocity of transverse waves of the second medium layer.

Abstract: Disclosed herein are a nickel plating solution and a method for forming a nickel layer on an external electrode of a chip component by using the nickel plating solution, the nickel plating solution including: a nickel ion; a chloride ion; and a pH buffer, wherein the pH buffer is used by mixing an inorganic acid, and an organic acid and a salt thereof, so that the damage to a body of the chip component can be reduced by containing organic acid and a salt thereof in the nickel plating solution for forming the nickel plating layer on the external electrode of the chip component having a body formed of a material including ferrite or manganese oxide.

Abstract: A method and system plates CoFeX, where X is an insertion metal. The method and system include providing a plating solution including hydroxymethyl-p-tolylsulfone (HPT). The plating solution being configured to provide a CoFeX film having a high saturation magnetic flux density of greater than 2.3 Tesla and not more than 3 weight percent of X. The method and system also include plating the CoFeX film on a substrate in the plating solution. In some aspects, the plated CoFeX film may be used in structures such as main poles of a magnetic recording head.

Abstract: A method of manufacturing an inductor for a microelectronic device comprises providing a substrate (610), forming a first plurality of inductor windings (111, 211, 411, 620, 2030) over the substrate, forming a magnetic inductor core (112, 212, 412, 810) over the first plurality of inductor windings, and forming a second plurality of inductor windings (113, 213, 413, 1010) over the magnetic inductor core. In another embodiment, the method comprises forming the inductor on a sacrificial substrate (1610) such that the inductor can subsequently be mounted onto a carrier tape (1810). In yet another embodiment, a method of manufacturing a substrate for a microelectronic device comprises forming an inductor within a build-up layer (101, 102, 103, 104) of a substrate.

Abstract: A flexure 11 has a substrate 13 made of a thin conductive metal plate, a base insulating layer 31 made of flexible resin formed on the substrate, wiring patterns 15 formed on the base insulating layer and connected to a slider mount 17, and a cover insulating layer 33 formed over the wiring patterns. The flexure 11 is substantially coated with a conductive polymer layer 39 having a thickness in the range of 18 to 130 nm. The flexure 11 prevents electrostatic accumulation and ion migration that are trade-offs.

Abstract: A magnetic structure includes a first magnetic layer, a nonmagnetic insulating layer, a nonmagnetic adhesion layer disposed on the top surfaces of the first magnetic layer and the nonmagnetic insulating layer, and a second magnetic layer disposed on the nonmagnetic adhesion layer. The nonmagnetic insulating layer contains an oxygen atom. The nonmagnetic adhesion layer is composed of one element or a plurality of elements selected from the group consisting of Al, Si and nonmagnetic transition metal elements except Ru, and the bond enthalpy of a diatomic molecule composed of an atom of the one element or each of the plurality of elements and an oxygen atom is 400 kJ/mol or higher. The nonmagnetic adhesion layer has a thickness within a range of 0.3 to 0.8 nm. The first magnetic layer and the second magnetic layer are ferromagnetically coupled to each other.

Abstract: A coating method for forming a pattern on a workpiece is provided. First, a workpiece surface is provided. Second, a mask having a shape conforming to a predetermined pattern is provided. Next, the workpiece surface includes a first portion exposed outside and a second portion shielded by the mask. A shielding layer is formed on the exposed first portion of the workpiece surface. The mask is removed from the workpiece to expose the second portion. A coating layer over the shielding layer and the exposed second portion is formed. The coating layer consists of a first part overlaying the shielding layer and a second part overlaying the second portion. The mask is attached onto the coating layer and aligned with the second portion of the workpiece surface. The first part of the coating layer, the shielding layer, and the mask are then removed.

Abstract: A scalable MEMS inductor is formed on the top surface of a semiconductor die. The MEMS inductor includes a plurality of magnetic lower laminations, a circular trace that lies over and spaced apart from the magnetic lower laminations, and a plurality of upper laminations that lie over and spaced apart from the circular trace.

Abstract: A method is disclosed for defining discrete magnetic and non-magnetic regions on the magnetic film layer of a storage media substrate. The method applies anodic oxidation of a cobalt-containing magnetic film layer to remove cobalt, followed by controlled deposition of a non-magnetic matrix into the regions where the cobalt has been removed. Deposition may either be electrodeposition, collimated vacuum deposition, or other methods depending upon the composition of the non-magnetic matrix being deposited. The method may be performed in a single electrochemical cell.

Abstract: A method for manufacturing a magnetic write head having a write pole with a tapered leading edge formed on a substrate having a tapered surface and a wrap-around, trailing magnetic shield. The method uses a multi-layer anti-reflective coating prior to formation of the shield so that reflection from the tapered surface of the substrate does not affect the lithography of the mask used to form the trailing shield. The multi-layer antireflective coating is constructed of materials that can be left in the finished head, thereby eliminating problems associated with removal of the anti-reflective coating.

Abstract: A method of forming a write pole in a PMR head is disclosed that involves forming an opening in a mold forming layer. A conformal Ru seed layer is formed within the opening and on a top surface. An auxiliary layer made of CoFeNi or alloys thereof is formed as a conformal layer on the seed layer. All or part of the auxiliary layer is removed in an electroplating solution by applying a (?) current or voltage during an activation step that is controlled by activation time. Thereafter, a magnetic material is electroplated with a (+) current to fill the opening and preferably has the same CoFeNi composition as the auxiliary layer. The method avoids Ru oxidation that causes poor adhesion to CoFeNi, and elevated surfactant levels that lead to write pole impurities. Voids in the plated material are significantly reduced by forming a seed layer surface with improved wettability.

Abstract: Among other things, methods, systems and apparatus are described for implementing nanomotor-based micro- and nanofabrication. In one aspect, a method of fabricating nanoobjects comprises functionalizing a nanomotor with a reagent. The method also includes controlling a movement of the functionalized nanomotor in a solution containing material to react with the reagent to induce a localized deposition or precipitation of a product onto a surface of a substrate or etching of the substrate.

Abstract: A magnetic writer comprises a write pole, a substrate and a non-magnetic, oxygen-free buffer material. The write pole has a leading edge, a trailing edge, a first side and second side. The substrate is at the leading edge of the write pole. The non-magnetic, oxygen-free buffer material is located between the write pole and the substrate.

Abstract: A magnetic layer that may serve as a top pole layer and bottom pole layer in a magnetic write head is disclosed. The magnetic layer has a composition represented by FeWCoXNiYVZ in which w, x, y, and z are the atomic % of Fe, Co, Ni, and V, respectively, and where w is between about 60 and 85, x is between about 10 and 30, y is between 0 and about 20, z is between about 0.1 and 3, and wherein w+x+y+z=100. An electroplating process having a plating current density of 3 to 30 mA/cm2 is used to deposit the magnetic layer and involves an electrolyte solution with a small amount of VOSO4 which is the V source. The resulting magnetic layer has a magnetic saturation flux density BS greater than 1.9 Telsa and a resistivity ? higher than 70 ?ohms-cm.

Abstract: An apparatus for plating a magnetic film on a substrate includes: a track including a plurality of stopping points along the track; a permanent magnet placed on the track such that the permanent magnet can be moved along the track towards and away from the stopping points; at least one plating tank positioned on the stopping point; and a removable high permeability iron flux concentrator inserted into gaps between the substrate and inside walls of the plating tank, substantially surrounding the substrate and extending around and under the substrate.

Abstract: A suspension for supporting a magnetic head is provided with a load beam formed of a thin-plate spring. A recess for accommodating a damper is formed in the load beam. The damper is affixed to a bottom surface of the recess.

Abstract: A method includes providing a voltage switchable dielectric material having a characteristic voltage, exposing the voltage switchable dielectric material to a source of ions associated with an electrically conductive material, and creating a voltage difference between the source and the voltage switchable dielectric material that is greater than the characteristic voltage. Electrical current is allowed to flow from the voltage switchable dielectric material, and the electrically conductive material is deposited on the voltage switchable dielectric material. A body comprises a voltage switchable dielectric material and a conductive material deposited on the voltage switchable dielectric material using an electrochemical process. In some cases, the conductive material is deposited using electroplating.

Abstract: A method for forming a magnetic write head using a damascene process that does not form voids in the magnetic structure. An opening is formed in an alumina layer, the opening being configured to define a trench. Then a first layer of magnetic material is deposited into the trench. A CMP process is then performed to remove any voids that have formed in the first magnetic layer. Then a second layer of magnetic material is deposited over the first layer of magnetic material. In another embodiment of the invention, a opening is formed in the alumina layer, and a first layer of magnetic material is electroplated into the opening. A thin layer of non-magnetic material is then deposited, and a second layer of magnetic material is deposited over the thin layer of non-magnetic material. The thin layer of alumina advantageously provides a laminate structure that avoids data erasure.

Abstract: A method for manufacturing a disk drive head suspension having a plated load point dimple. A photoresist mask having an opening with load point-defining side walls and a load point diameter is formed over a planar portion of a spring metal member. Metal is plated onto the spring metal member in the opening to form a load point having the load point diameter on the planar portion of the spring metal member.

Abstract: A method for manufacturing a boundary acoustic wave device includes the steps of preparing a laminated structure in which an IDT electrode is disposed at an interface between first and second solid media and reforming the first medium and/or the second medium by externally providing the laminated structure with energy capable of reaching the inside of the first medium and/or the second medium and thus adjusting a frequency of the boundary acoustic wave device. The above provides a boundary acoustic wave device manufacturing method that enables frequency adjustment to be readily performed with high accuracy.

Abstract: Techniques for forming metal catalyst particles on a metal tip, and nanostructures on a metal tip are provided.

Abstract: A wrap around shield of a write head is fabricated in multiple processes, with side shields fabricated in one process, and a trailing shield formed in another process. These multiple processes form a stitched wrap around shield, resulting in more flexible and accurate placement of the trailing shield and side shields with respect to the write pole. These processes also independently form the dimensions (shapes and sizes) of the side shields and the trailing shield which allows better control of writeability, saturation, and adjacent track interference of the perpendicular recording write head.

Abstract: Methods for fabricating thin film magnetic head coil structures are disclosed. The methods disclose deposition of a first thick seed layer, followed by deposition of an ultra-thin second seed layer. Coil structures having sub-micron pitch and high aspect ratios are deposited on the second ultra-thin seed layer, which is removed from between the coil windings via an isotropic etch process such as wet etching or RIE. Subsequent to selective removal of the ultra-thin second seed layer, the first thick seed layer is utilized to deposit pole and backgap structures, eliminating the need to deposit (and remove) a subsequent seed layer on the coil structure.

Abstract: A method for manufacturing a write pole for perpendicular magnetic recording for accurately defining a side shield throat height and write pole flare point. The magnetic structure includes a write pole portion and first and second side shield portions. The side shields portions are magnetically connected with the write pole portion in a region in front of an intended air bearing surface plane (e.g. in the direction from which lapping will progress). The side shields portions are each separated from the write pole portion in a region behind the intended air bearing surface plane by notches that terminate at a desired location relative to the intended air bearing surface plane and which open up in a region behind the intended air bearing surface plane.

Abstract: Disclosed are embodiments of a circuit and method for electroplating a feature (e.g., a BEOL anti-fuse device) onto a wafer. The embodiments eliminate the use of a seed layer and, thereby, minimize subsequent processing steps (e.g., etching or chemical mechanical polishing (CMP)). Specifically, the embodiments allow for selective electroplating metal or alloy materials onto an exposed portion of a metal layer in a trench on the front side of a substrate. This is accomplished by providing a unique wafer structure that allows a current path to be established from a power supply through a back side contact and in-substrate electrical connector to the metal layer. During electrodeposition, current flow through the current path can be selectively controlled. Additionally, if the electroplated feature is an anti-fuse device, current flow through this current path can also be selectively controlled in order to program the anti-fuse device.

Abstract: A method of preparing a polymer actuator includes providing an ionic conductive polymer membrane; forming first and second metal electrodes respectively over first and second surfaces of the ionic conductive polymer membrane; substituting water used in the formation of the first and second metal electrodes with an ionic liquid stable to an electrolysis; and coating the first and second surfaces of the metal electrodes with a coating material.

Abstract: A magnetic head includes: an encasing layer made of a nonmagnetic material and having a groove that opens in the top surface; a nonmagnetic metal layer made of a nonmagnetic metal material, disposed on the top surface of the encasing layer, and having a penetrating opening that is contiguous to the groove; and a pole layer made of a magnetic metal material and encased in the groove of the encasing layer and in the opening of the nonmagnetic metal layer. The pole layer has an end face located in a medium facing surface, the end face having a first portion and a second portion that is located farther from a substrate than the first portion and connected to the first portion. The first portion has a width that decreases as the distance from the substrate decreases. The second portion has a uniform width that defines the track width. In the medium facing surface, the nonmagnetic metal layer exists on both sides of the second portion, the sides being opposed to each other in the direction of track width.

Abstract: A method for defining a perpendicular magnetic head is provided. The method includes forming a portion of the read and write head including depositing a sensor film on a surface only over a region of the read head to form a sensor; depositing a full-film shaping pole layer over the write head; defining a track width of the sensor; patterning a photoresist to define a pole tip of the write head including write track width and flare position, and at the same time to define a back edge of the sensor; removing material of the sensor and pole tip from the areas not covered by the photoresist; completing the fabrication of the write and read head layers; and lapping the write pole concurrently with the sensor to define the flare position of the pole tip and to define a sensor height with accurate positioning of write head flare.

Abstract: A method of fabricating a patterned magnetic recording disk is described. The method may include electrodepositing a protection layer on the magnetic recording layer of the disk.

Abstract: A method for forming a head having a trailing shield that includes forming a gap layer above a pole, forming a mask above the gap layer, and forming a trailing shield above the gap layer and adjacent the mask, a throat height of the trailing shield being defined between the mask.

Abstract: A magnetic read/write head is produced with an insert layer between the substrate and the magnetic transducer. The insert layer has a lower coefficient of thermal expansion than the substrate, which reduces the temperature pole tip recession (T-PTR) of the head because the insert layer is an intervening layer between the substrate and magnetic transducer. The insert layer is produced by plating, e.g., an Invar layer over the substrate prior to fabricating the magnetic transducer. The Invar layer is annealed and the structure planarized prior to depositing a non-magnetic gap layer followed by the fabrication of the magnetic transducer.

Abstract: A thin-film magnetic head is manufactured as follows. First, a base insulating layer having a magnetic pole forming depression sunken into a form corresponding to the main magnetic pole layer is formed, a stop film for CMP is formed such as to fill the magnetic pole forming depression, and then a magnetic layer is formed on the stop film. Next, the magnetic layer is separated by forming a separation groove substantially surrounding the magnetic pole forming depression on the outside thereof, and thus separated magnetic layer is formed with a cover insulating film adapted to cover the whole upper face. The surface is polished by CMP until the stop film is exposed, so that the part of magnetic layer remaining on the inside of the magnetic pole forming depression is used as the main magnetic pole layer. Further, a recording gap layer, a write shield layer, and a thin-film coil are formed.

Abstract: Components of a plurality of magnetic heads are formed on a single substrate to fabricate a magnetic head substructure in which a plurality of pre-head portions are aligned in a plurality of rows. The substructure is cut to separate the plurality of pre-head portions from one another, and the plurality of magnetic heads are thereby fabricated. The surface formed by cutting the substructure is lapped to form a lapped surface. The lapped surface is lapped so as to reach a target position of a medium facing surface. The substructure incorporates first to fourth resistor elements each of which detects the position of the lapped surface. The third and fourth detection elements are located at positions shifted from the first and second resistor elements along the direction orthogonal to the medium facing surface.

Abstract: A stable FePt plating solution is provided. Further, a process for electroplating is provided for producing an FePt magnetic material having an especially strong coercive force and excellent properties by using the plating solution. The plating solution contains ionic Fe, ionic Pt, and a complex agent, at a molar ratio (Fe/Pt) of the ionic Fe to the ionic Pt ranging from 0.75 to 3.

Abstract: Methods and structures for the fabrication of perpendicular thin film heads are disclosed. Prior to the deposition of shield structures, seed layers having anti-reflective properties are utilized, eliminating the need to deposit, then remove, traditional inorganic anti-reflection coatings prior to shield plating.

Abstract: A method for forming a magnetic write pole with a trapezoidal cross-section is described. The method consists of first forming a magnetic seedlayer on a base followed by depositing a removable material layer on the seedlayer, and then a resist layer on the removable material layer. A trench is then formed in the resist, and the resist is heated to cause the cross-sectional profile of the trench to assume a trapezoidal shape. The resist is then capped with another resist layer and further heated to cause the width of the trapezoidal trench to become narrower. The cap layer and removable material layer at the bottom of the trench are then removed and the trench filled with magnetic material by electroplating. The resist and seedlayer external to the trench are finally removed to form a write pole with a trapezoidal cross-section.

Abstract: The method of manufacturing a thin film magnetic head includes forming a first recessed portion for insulation and a second recessed portion for contact that reach the substrate through the first insulating layer from a side of the first insulating layer of the substrate having the first insulating layer thereon; forming a second insulating layer on the substrate in the first recessed portion; and forming the lower shield layer in the first recessed portion and a contact portion in the second recessed portion.