Abstract: A method of manufacturing a micro flux gate sensor and a micro flux gate sensor manufactured according to the method are provided. The method includes operations of forming a lower coil portion of an excitation coil and a magnetic field detecting coil on a wafer, forming connection portions with a certain height at predetermined positions of the lower coil portion, forming a first insulation layer to cover the lower coil portion and the connection portions, forming a magnetic core on the first insulation layer, forming a second insulation layer to cover the magnetic core and forming an upper coil portion electrically connected to the connection portions to form the excitation coil and the magnetic field detecting coil, and forming a third insulation layer to cover the upper coil portion.

Abstract: A method for multi-layer electrodeposition in a single bath is also provided. A substrate is immersed in a bath. An electrodeposition operation is initiated for depositing a first layer of material on the substrate. The electrodeposition operation includes agitating the bath and applying current pulses. The electrodeposition operation is later altered for depositing a second layer of material on the first layer, where the second layer is of a different composition than the first layer. In the altered mode, the current density is changed for altering a composition of material deposited on the substrate, the duration and/or frequency of the current pulses are altered, and the bath is agitated at a different rate of agitation.

Abstract: A process for electrodepositing at least one ferromagnetic material into a three dimensional pattern within a substrate is provided. The process comprises providing a substrate material, dielectric or conductor, having a three dimensional recessed pattern in at least one outer surface thereof, dielectric substrate materials also having an electrical conductive seed layer at least within the three dimensional pattern. An electrolytic bath is prepared comprising at least one ferromagnetic material and at least one accelerating, inhibiting, or depolarizing additive. The at least one ferromagnetic material comprises at least one metal cation selected from the group consisting of Ni2+, Co2+, Fe2+, Fe3+, and combinations thereof. The substrate is placed into the electrolytic bath and the electrolytic bath contacts the conducting three dimensional pattern in the substrate or the conducting seed layer within the pattern on a dielectric substrate. A counter electrode is placed into the electrolytic bath.

Abstract: A method for constructing a magnetic write head for use in perpendicular magnetic recording, the write head having a write pole with a trailing shield that wraps around the write pole. The method allows the trailing shield to be constructed with a very well controlled trailing gap thickness and also allows the write pole to be constructed with a well controlled track width and a straight, flat trailing edge. The method includes depositing a magnetic write pole over a substrate and forming a mask structure over the write pole layer. The mask structure includes an end point detection layer that can be removed by reactive ion etching. An ion mill is performed to form a write pole by removing magnetic write pole material that is not covered by the mask layer. A layer of non-magnetic material is deposited and is ion milled to expose the end point detection layer.

Abstract: A method for de-tabbing a dielectric tab extending between and bonded to first and second stainless steel portions of a disk drive head suspension component. Exemplary first and second stainless steel portions are a flexure base region and a flexure tongue. The method includes applying laser energy to the dielectric tab. The laser energy is characterized by one or more parameters, e.g., a pulse width and/or an energy density, causing de-bonding of the dielectric tab from the first and second stainless steel portions.

Abstract: Methods and structures for the fabrication of perpendicular thin film heads are disclosed. Prior to the deposition of shield structures, capped seed layers having a dual layer structure are utilized, improving photo resist adhesion and plated shield adhesion, without the need to deposit, then remove, traditional inorganic anti-reflection coatings prior to shield plating.

Abstract: A method for forming a via in an alumina protective layer on a structure such as a magnetic write head for use in perpendicular magnetic recording. A structure such as a magnetic pole, and or magnetic trailing shield, is formed over a substrate and is covered with a thick layer of alumina. The alumina layer can then be planarized by a chemical mechanical polishing process (CMP) and then a mask structure, such as a photoresist mask, is formed over the alumina layer. The mask structure is formed with an opening disposed over the contact pad. A reactive ion mill is then performed to remove portions of the alumina layer that are exposed at the opening in the mask, thereby forming a via in the alumina layer.

Abstract: A lower shield layer is formed by being embedded in a first recess formed in an under layer. Accordingly, the distance between the lower shield layer and a slider can be reduced. Also, a second metal layer is formed from above a gap layer covering an electrode extracting layer over above the under layer hindwards therefrom. Accordingly, the second metal layer can be brought closer to the slider side than an upper shield layer. Consequently, the thermal dissipation effects of the thin-film magnetic head can be improved.

Abstract: A method for manufacturing a magnetic write head for perpendicular magnetic recording. The method allows the write head to be formed with a write pole having a concave trailing edge. The method further allows the amount of concavity of the trailing edge to be accurately and carefully controlled both within a wafer and between wafers. A write pole is formed using a mask that includes a hard mask, a RIEable layer and an endpoint detection layer. A layer of non-magnetic material (ALD layer) is deposited, and then, an ion milling process is used to remove a portion of the ALD layer disposed over the write pole and mask. A reactive ion etch process is performed to remove the RIEable layer leaving the ALD layer to form non-magnetic side walls with upper portions that extend above the write pole.

Abstract: A method of manufacturing a magnetic head for perpendicular magnetic recording that includes a pole layer and a pole-layer-encasing layer. The method includes the steps of: forming a nonmagnetic layer that will be formed into the pole-layer-encasing layer; forming a polishing stopper layer on the top surface of the nonmagnetic layer, the polishing stopping layer being made of a nonmagnetic conductive material and having a penetrating opening with a shape corresponding to the plane geometry of the pole layer; forming a groove in the nonmagnetic layer by selectively etching a portion of the nonmagnetic layer exposed from the opening; forming a magnetic layer to be the pole layer such that the groove is filled; and polishing the magnetic layer until the polishing stopper layer is exposed, so that the magnetic layer is formed into the pole layer.

Abstract: Methods for forming write heads. One method includes forming a mask layer above a pole tip layer; forming a layer of resist above the mask layer; patterning the resist; removing portions of the mask layer not covered by the patterned resist; shaping a pole tip from the pole tip layer; depositing a layer of dielectric material above the pole tip and flux shaping layer, wherein the layer of dielectric material extends about adjacent to the mask layer; depositing a stop layer over the dielectric material, the stop layer abutting the mask layer; and polishing for forming a substantially planar upper surface comprising the mask layer and stop layer. Another method includes depositing a layer of dielectric material at least adjacent the pole tip, wherein the layer of dielectric material extends about adjacent to the mask layer. A further method includes forming dishing in the pole tip.

Abstract: A hybrid method of fabricating magnetic core elements of an on-chip inductor structure addresses issues associated with conventional bottom up and damascene magnetic core plating techniques. The process uses two seed layers: a low resistance seed layer that solves the IR drop problem associated with the damascene plating techniques and a high resistance seed layer that is local to magnetic core features thus avoiding eddy current related performance degradation associated with the bottom up techniques.

Abstract: A perpendicular write head including a main pole and a trailing shield, the main pole being made of a diamond-like carbon (DLC) layer as hard mask and a rhodium (Rh) layer as shield gap, both DLC and Rh layers being CMP stop layers so as to avoid corner rounding and damage from chemical mechanical planarization (CMP) process, the DLC layer being removed by reactive ion etching (RIE) to create a trench, the trailing shield being deposited into the trench for self alignment.

Abstract: A head suspension for supporting a head slider over a storage media in a dynamic storage device is provided with a head suspension component having a spring metal layer, an electrically conductive layer and a dielectric layer interposed between the metal layer and the electrically conductive layer. A plurality of electrically conductive traces with bond pads are formed in the electrically conductive layer. A feature datum is also formed in the electrically conductive layer on a detachable carrier strip. The feature datum defines a first edge in the electrically conductive layer parallel to an edge of the bond pads.

Abstract: This invention describes a manufacturable method, including a CMP liftoff process, for removing masking materials after ion milling for fabricating the write pole of a magnetic head. Significant parameters for the CMP assisted liftoff process include the thickness of the remaining mask materials after the write pole ion milling for effective CMP assisted liftoff, the thickness of the dielectric fill material deposited to protect the write pole during the CMP liftoff step, and the type of CMP slurry, polishing pad and the polishing conditions that are required to yield satisfactory results.

Abstract: The present invention is related to a method for forming a structure that contains alternating first and second ferromagnetic layers of different material compositions. A substrate containing a supporting matrix with at least one open pore and a conductive base layer is first formed. Electroplating of the substrate is then carried out in an electroplating solution that contains at least one ferromagnetic metal element and one or more additional, different metal elements. A pulsed current with alternating high and low potentials is applied to the conductive base layer of the substrate structure to thereby form alternating ferromagnetic layers of different material compositions in the open pore of the supporting matrix.

Abstract: A method of manufacturing a micro flux gate sensor that has a good electrical connection and can be easily manufactured includes operations of forming a metal pattern, forming a first insulation layer to cover the metal pattern and forming viaholes to expose a certain portion of the metal pattern, applying an electrical signal through the metal pattern and plating the viaholes with a metal material to form a connection portion, forming a magnetic core on an upper portion of the first insulation layer, forming a second insulation layer to cover the magnetic core and forming an upper coil portion electrically connected to the connection portion to form the excitation coil and the magnetic field detecting coil, forming a third insulation layer to cover the upper coil portion, and removing a certain portion of the metal pattern to leave only the lower coil portion of the metal pattern.

Abstract: For forming an annular magnetostrictive coat on an outer peripheral surface of a rotational shaft associated with a magnetostrictive torque sensor, a magnetostrictive coat forming method comprises a step of fitting a cylindrical masking jig over the outer peripheral surface of the rotational shaft and securing the masking jig to the outer peripheral surface, a step of placing the rotational shaft in a plating tank to thereby form the magnetostrictive coat by plating on the outer peripheral surface, and a step of detaching the masking jig from the rotational shaft.

Abstract: A thin film magnetic head is described, the magnetic head having an insulating layer and a protrusion which has an upper portion and a base portion, and the upper portion has an extended portion. The insulating layer is present under the extending part. A method of manufacturing the magnetic head includes forming a first insulating layer around the lower core layer; simultaneously forming a coil layer by plating the lower core layer with a coil insulating underlayer interposed between the lower coil layer and a coil lead layer connected to the coil layer on the first insulating layer; forming a coil insulating layer of an inorganic material on the coil layer and the coil lead layer; and, simultaneously forming a first plating underlayer for forming an upper core layer by plating, a second plating underlayer on the first coil lead layer exposed through the plating-forming opening, and a current-carrying lead layer.

Abstract: The present invention provides a thin film magnetic head achieving improved recording performance by sharpening recording magnetic field gradient as much as possible. The thin film magnetic head has a return yoke layer disposed on a trailing side of a magnetic pole layer, and width W3 of an exposed surface of a lower TH specifying part in a TH specifying portion in the return yoke layer is equal to or larger than width W1 of an exposed surface of the magnetic pole layer (W3?W1), and is less than width W4 of an exposed surface of an upper TH specifying part (W3<W4). Since a part (magnetic flux) of a magnetic flux emitted from the exposed surface to the outside flows in the exposed surface while being spread a little in the width direction, spread of the magnetic flux is suppressed at the time of recording. Therefore, the recording magnetic field gradient near an air bearing surface is sharpened and recording performance is improved.

Abstract: The invention is directed to improvement of a write element of a thin film magnetic head. The first pole portion projects from a flat surface of a first yoke portion at a medium-facing surface side and having a reduced width at its upper end. The second pole portion faces the upper end of the first pole portion, having the same width as the upper end of the first pole portion, with the gap film interposed between the second pole portion and the upper end of the first pole portion. The first pole portion includes a magnetic film adjacent to the gap film, the magnetic film etched at both sides in width direction to have a narrowed portion having substantially the same width as the second pole portion, and a base portion connected to the narrowed portion, increasing in thickness toward the narrowed portion.

Abstract: Provided is a thin film magnetic head capable of inhibiting the occurrence of track erasing and improving the reliability of magnetic recording. Two taper surfaces are disposed on both sides of a return yoke layer. As no corner portion which may induce concentration of a magnetic flux exists on the both sides of the return yoke layer, even if the magnetic flux emitted from a pole layer is returned to the return yoke layer through a hard disk, a magnetic field strength is not locally and pronouncedly concentrated in proximity to the taper surfaces of the return yoke layer. Thereby, the concentration of the magnetic flux can be prevented, and the probability of the occurrence of unnecessary recording decreases, so the occurrence of track erasing can be inhibited, and the reliability of magnetic recording can be improved.

Abstract: For forming an annular magnetostrictive coat on an outer peripheral surface of a rotational shaft associated with a magnetostrictive torque sensor, a magnetostrictive-coat forming method comprises a step of fitting a cylindrical masking jig over the outer peripheral surface of the rotational shaft and securing the masking jig to the outer peripheral surface, a step of placing the rotational shaft in a plating tank to thereby form the magnetostrictive coat by plating on the outer peripheral surface, and a step of detaching the masking jig from the rotational shaft.

Abstract: A hermetically sealed mobile hard disk drive that combines high storage capacity and performance with low power consumption and portable operation, including an integrated base substrate. One embodiment is a method for fabricating an integrated base substrate with a plurality of spiral conductors, MR stripes, and interconnect conductors fabricated by a semiconductor process, and upon which electronic integrated circuits are later assembled. Various embodiments of the invention can support a single or dual rotor spindle assembly, a multi-arm actuator assembly, and a housing to form a hermetically sealed chamber with the integrated base substrate. Various embodiments of the invention can be filled with low viscosity gas at ambient pressure or a lower than ambient pressure.

Abstract: At least one of lower and upper magnetic cores is composed of magnetic films each of which contains two or more elements of Co, Ni, and Fe, which are formed by electroplating in a plating bath with pH 2 or less, and which have a saturation magnetic flux density of 23,000 gauss or more.

Abstract: A method of manufacturing a magnetic head is provided which can improve controlling a thickness of a gap layer. A coil base layer having at least a surface layer formed of one or two or more alloys selected from Au, Ru, and Rh is formed on a contact layer. Thereby, since a surface of the coil base layer is not oxidized due to air exposure, the contact layer is not oxidized. As such, the coil base layer protects the contact layer, so that it is not necessary to perform an etching process for removing an oxide layer, as in the related art. Therefore, it is possible to further improve controlling a thickness of a gap layer without cutting the gap layer by the etching process, as compared with the related art.

Abstract: A method of manufacturing a magnetoresistance effect element includes forming an insulating layer on a first ferromagnetic layer, forming an aperture reaching the first ferromagnetic layer by thrusting a needle from the top surface of the insulating layer, and depositing a ferromagnetic material to form a second ferromagnetic layer overlying the insulating layer which buries the aperture. The aperture can have an opening width not larger than 20 nm. A current flowing between the first ferromagnetic layer and the needle can be monitored, and thrusting of the needle can be interrupted when the current reaches a predetermined value.

Abstract: Method of forming a ferromagnetic layer on at least one surface of a dielectric material that may be serve as an inductive core on a printed circuit board or a multichip module. Conductive leads can form two separate coils around the core to form a transformer, and a planar conducing sheet can be placed on or between one or more of the dielectric layers as magnetic shielding. The core can be formed at least in part by electroless plating, and electroplating can be used to add a thicker layer of less conductive ferromagnetic material. Ferromagnetic layers are formed by dipping the dielectric surface in a solution containing catalytic metal particles having a slight dipole, and placing the surface in a metal salt to cause a layer containing metal to be electrolessly plated upon the dielectric. Surface roughening techniques can be used before the dipping to help attract the catalytic particles.

Abstract: A method for fabricating a coil and pedestal for a write head using a common seed layer is described. A nonmetallic gap layer is deposited on a planarized pole piece surface. Openings for the pole piece pedestal and the back gap pole piece are etched through the nonmetallic gap layer. A seed layer comprising a magnetic material is deposited on the etched gap layer. Preferably the coil is fabricated first on the planar surface of the seed layer. The coil structure, the pedestal pole piece, back-gap pole piece, side and center tap connections are fabricated on the same seed layer. The remaining seed layer is removed, the coil is encapsulated, the wafer is refilled with alumina and the wafer is planarized. The prior art process can be resumed at this point. Optionally a second seed layer such as copper (Cu) can be used.

Abstract: A main pole layer of a magnetic head includes a first portion disposed at a distance from a medium facing surface, and a second portion that is smaller in thickness than the first portion and disposed between the first portion and the medium facing surface. The step of forming the main pole layer includes the steps of forming a plating layer such that one of ends of the plating layer closer to the medium facing surface is located at a position that coincides with the position of one of ends of the first portion closer to the medium facing surface; forming a first nonmagnetic layer to cover the plating layer; polishing the first nonmagnetic layer and the plating layer; forming a space by removing the plating layer; forming a magnetic layer, which will be the main pole layer, in the space and on the top surface of the first nonmagnetic layer; forming a second nonmagnetic layer to cover the magnetic layer; and polishing the second nonmagnetic layer and the magnetic layer.

Abstract: A thin-film magnetic head comprises a read head and a write head. The read head and the write head are placed such that a top shield layer of the read head and a bottom pole layer of the write head are opposed to each other. A magnetism intercepting layer is provided between the top shield layer and the bottom pole layer. The magnetism intercepting layer is made of a nonmagnetic metal material that is capable of being formed through plating, such as platinum. The top shield layer, the magnetism intercepting layer and the bottom pole layer are consecutively formed through plating.

Abstract: An electromagnetic actuator comprises a core with a coil wound around a stator magnetically coupled to each end of the cored a movable element that can be displaced relative to the stator, and a supporting means for supporting the movable element. The stator and the movable element each have a projection and a depression parallel to the displacement direction of the movable element and are placed in such a way that the projection and depression of the stator engage with the projection and depression of the movable element.

Abstract: A mask frame assembly for evaporation includes a mask and a frame which supports the mask. The mask includes a metal layer having a predetermined pattern, and a coating layer which is formed on a surface of the metal layer so as to increase a precision of the predetermined pattern and a surface roughness of the mask.

Abstract: A lower magnetic pole layer and/or an upper magnetic pole layer are formed of a CoFe? alloy in which the component ratio X of Co is 8 to 48 mass %, the component ratio Y of Fe is 50 to 90 mass %, the component ratio Z of the element ? (the element ? is at least one of Ni and Cr) is 2 to 20 mass %, and the equation X+Y+Z=100 mass % is satisfied. Consequently, the saturated magnetic flux density can be 2.

Abstract: A method of making a magnetic head involves providing a partially constructed magnetic head which has a top surface formed by a front P2 pole tip, a back gap P2 pedestal, and insulator materials disposed between the front P2 pole tip and the back gap P2 pedestal; forming a layer of selectively etchable materials over the top surface of the partially constructed magnetic head, the layer having a front edge that is recessed away from an air bearing surface (ABS); forming additional insulator materials over the selectively etchable material layer and over a front portion of the front P2 pole tip; performing a chemical-mechanical polishing (CMP) to form a substantially coplanar top surface with the selectively etchable material layer and the additional insulator materials; etching to remove the selectively etchable material layer; and depositing yoke layer materials over the resulting structure.

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract: A metal film made of a metal material (e.g., NiFe, CoFeNi, or FeCo) including an iron atom is formed on a substrate (S101). Subsequently, the metal film formed on the substrate is plasma-processed in an environment including a gas (e.g., an oxygen gas having a tetrafluoromethane or trifluoromethane gas added thereto) containing oxygen and fluorine atoms (S103). Then, a resist material (e.g., a chemically amplified positive resist material) is applied onto the plasma-processed metal film, so as to form a resist film (S105). Thereafter, the resist film is partly removed, so as to expose a part of the surface of metal film in conformity to a desirable pattern, thereby forming a resist frame (S107).

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract: A soft magnetic thin film of CoFe alloy having a high Br and low Hc is prepared by furnishing a plating tank including cathode and anode compartments which are separated by a diaphragm or salt bridge so as to permit charge transfer, but inhibit penetration of Fe ions, feeding a plating solution containing Co ions and divalent Fe ions to the cathode compartment, feeding an electrolyte solution to the anode compartment, immersing a substrate in the plating solution, immersing an anode in the electrolyte solution, electroplating, and heat treating the plated film at 100–550° C.; or by immersing a substrate and a soluble anode in a plating solution containing Co ions and divalent Fe ions, electroplating, and heat treating the plated film at 100–550° C.

Abstract: The magnetic head includes a P2 pole tip in which the P2 pole tip material is electroplated upon a sidewall of the P2 pole tip photolithographic trench. To accomplish this, a block of material is deposited upon a write gap layer, such that a generally straight, vertical sidewall of the block of material is disposed at the P2 pole tip location. Thereafter, an electroplating seed layer is deposited upon the sidewall. A P2 pole tip trench is photolithographically fabricated such that the sidewall (with its deposited seed layer) is exposed within the P2 pole tip trench. Thereafter, the P2 pole tip is formed by electroplating pole tip material upon the seed layer and outward from the sidewall within the trench. The width of the P2 pole tip is thus determined by the quantity of pole tip material that is deposited upon the sidewall.

Abstract: A major problem in Lead Overlay design for GMR structures is that the magnetic read track width is wider than the physical read track width. This is due to high interfacial resistance between the leads and the GMR layer which is an unavoidable side effect of prior art methods. The present invention uses electroplating preceded by a wet etch to fabricate the leads. This approach requires only a thin protection layer over the GMR layer to ensure that interface resistance is minimal. Using wet surface cleaning avoids sputtering defects and plating is compatible with this so the cleaned surface is preserved Only a single lithography step is needed to define the track since there is no re-deposition involved.

Abstract: A method is provided for making a backing layer for an ultrasonic matrix array transducer useful in medical imaging and the like. A conductive grid is provided which includes a plurality of micro-contacts each joined together by a common base so that spaces are provided between the free ends of the contacts. A mold for the grid is filled with an acoustically absorbent material such that the absorbent material fills the spaces between the contacts, so as to produce a block when cured. The common base is removed so as to separate the contacts from one another within the block. Further machining exposes the opposite ends of micro-contacts so that a like number of contact faces or pads are provided at opposed surfaces of the backing layer. Improved transducer constructions are also disclosed.

Abstract: A method of fabricating a thin film magnetic recording head including a perpendicular recording head having an auxiliary pole, a main pole and a shield against an external magnetic field. The shield against the external magnetic field is formed so that an edge of the shield against the external magnetic field is disposed at a position recessed at least from an edge of the main pole relative to a surface against a medium.

Abstract: A first magnetic film is formed in a primary pattern which is larger than its definitive pattern and of which edges are located within frames to be used in a frame-plating method for the second magnetic film after forming the first pole portion and the gap film. Then, the second magnetic film is formed by the frame-plating method, and the first magnetic film is etched into the definitive pattern through the second magnetic film as a mask.

Abstract: A process for forming magnetic targets for position and speed sensors, and magnetic targets formed according to the process. The targets are formed on a conductor-clad substrate by first applying a layer of photoresist material and then patterning and etching the photoresist to form trenches defining the shape and dimensions of the targets. Magnetic material is formed in the trenches and magnetized to form the targets.

Abstract: A gap layer of a thin-film magnetic head is formed of NiP. The P content of the NiP gap layer is controlled to be within the range of 11 mass percent to 14 mass percent so that the gap layer is nonmagnetic.

Abstract: An inductive write element is disclosed for use in a magnetic data recording system. The write element provides increased data rate and data density capabilities through improved magnetic flux flow through the element. The write element includes a magnetic yoke constructed of first and second magnetic poles. The first pole includes a pedestal constructed of a high magnetic moment (high Bsat) material, which is preferably FeRhN nanocrystalline films with lamination layers of CoZrCr. The second pole includes a thin inner layer of high Bsat material (also preferably FeRhN nanocrystalline films with lamination layers of CoZrCr), the remainder being constructed of a magnetic material capable of being electroplated, such as a Ni—Fe alloy. An electrically conductive coil passes through the yoke between the first and second poles to induce a magnetic flux in the yoke when an electrical current is caused to flow through the coil.

Abstract: A major problem in Lead Overlay design for GMR structures is that the magnetic read track width is wider than the physical read track width. This is due to high interfacial resistance between the leads and the GMR layer which is an unavoidable side effect of prior art methods. The present invention uses electroplating preceded by a wet etch to fabricate the leads. This approach requires only a thin protection layer over the GMR layer to ensure that interface resistance is minimal. Using wet surface cleaning avoids sputtering defects and plating is compatible with this so the cleaned surface is preserved Only a single lithography step is needed to define the track since there is no re-deposition involved.

Abstract: A process for fabricating a vertical spiral inductor within a multichip module package is disclosed. The process consists of depositing a pattern of bottom lines by electroplating copper on a substrate and then depositing an insulation pattern. Next, depositing a pattern of permeable material to form a core and then depositing polyimide to define vias and permeable core insulation. The vias are filled by electroplating copper. The vertical spiral inductor is formed and defined by next depositing a pattern of top metal (e.g. copper) lines by electroplating wherein the top metal lines are staggered with respect to the bottom metal lines. Lastly a top protective layer is deposited. The core is made from a permeable or non-permeable material.