Abstract: A light-emitting apparatus includes a plurality of packages each including a first substrate, and a single second substrate on which the plurality of packages are arrayed. The first substrate includes a first light source and a second light source. The first light source includes a first light-emitting section that emits light having a first wavelength, and first and second electrodes that are coupled to the first light-emitting section. The second light source includes a second light-emitting section that emits light having a second wavelength, and third and fourth electrodes that are coupled to the second light-emitting section. The second substrate includes first connection which is coupled to both the first electrode in a first package and the first electrode in a second package, second connection coupled to both the third electrode in the first package and the third electrode in the second package, and a driving circuit.

Abstract: Channels may be formed in the inlay substrate of a transponder, such as by laser ablation, and the antenna wire may subsequently be laid in the channels. Laying the wire in a channel ensures that it substantially fully embedded in the substrate, thereby eliminating a need for pressing the wire into the substrate. The channels may be tapered, or profiled, to enhance adhesion of a self-bonding wire. A recess for the chip module can also be formed using laser ablation, and insulation may be removed from end portions of the antenna wire using laser ablation. Laser ablation may also be used to create various mechanical and security features.

Abstract: A plating fixture that affords improved control and process repeatability of the placement of material on a surface of a terminal lead is described. The thereby plated terminal lead is further incorporatable into an electrochemical cell. The plating fixture consists of a membrane that prevents migration of the electroplating chemicals along areas of the lead that are not desired. Furthermore, the fixture utilizes a setup plate that controls the length of the lead that is plated.

Abstract: Numerous electrochemical fabrication methods and apparatus are provided for producing multi-layer structures (e.g. having meso-scale or micro-scale features) from a plurality of layers of deposited materials using adhered masks (e.g. formed from liquid photoresist or dry film), where two or more materials may be provided per layer where at least one of the materials is a structural material and one or more of any other materials may be a sacrificial material which will be removed after formation of the structure. Materials may comprise conductive materials that are electrodeposited or deposited in an electroless manner. In some embodiments special care is undertaken to ensure alignment between patterns formed on successive layers.

Abstract: Solar cells are produced using a method for producing solar cells, wherein silicon containing vitreous substrates is provided, wherein each substrate is provided with an electrically conductive material on at least one side thereof. In the method, at least a portion of each substrate is successively transported through an electrolytic solution that is present in an electrolytic bath, and the electrically conductive material as the cathode is connected during the transport of the substrates through the electrolytic bath for the purpose of electrodepositing material from the electrolytic solution onto the electrically conductive material during said transport, wherein the substrates are suspended from a conveyor element during transport and extend in the transport direction.

Abstract: This invention relates generally to an apparatus and method for electroplating selected portions of a connector part, such as a pin or a socket. The selective plating apparatus of the present invention is capable of continuously depositing plating solution on precisely the right contact surface of the connector part irrespective of its shape and center of gravity. According to the preferred embodiment of the present invention, the selective plating apparatus is capable of plating either side of the connector part, such as a pin or a socket, allowing plating of different type of metals on each side of the machined or stamped parts. The parts are handled automatically with minimum physical stress resulting in more consistent and reliable plating deposits.

Abstract: A device and a method for chemically or electrolytically treating work pieces (1) are proposed in an effort to avoid irregular contours of finest conductive structures, pads and lands as well as bridges (shorts) on the one side or breaks on printed circuit boards on the other side. The device comprises processing tanks (2) for the treating of work pieces and a conveyor system for the transport thereof. The conveyor system comprises at least one transport carriage (18), at least one holding element (14, 25) and at least one connection means (12, 13, 35) between the transport carriage(s) and the holding element(s). The processing tanks adjoined with a clean room zone (3). The work pieces are conveyed through the clean room zone using the conveyor system.

Abstract: A method for producing a connector has first to fifth processes. In the first process, a contact unit having a plurality of contacts and a tying part, is formed with the contacts tied at each axial direction middle part of the contacts by the tying part and with the contacts arranged parallel to each other. In the second process, a plating layer is formed on a part of the contact unit by soaking the contact unit in a plating bath from an axial direction one end side of the contact unit to an axial direction middle part of the tying part. In the third process, the contacts are isolated by cutting the tying part. In the fourth process, a part where the plating layer is formed, of the contact is inserted into a hole of a circuit board. In the fifth process, the contacts are soldered to the circuit board.

Abstract: A self-arranging, luminescence-enhancement device 101 for surface-enhanced luminescence. The self-arranging, luminescence-enhancement device 101 for surface-enhanced luminescence includes a substrate 110, and a plurality 120 of flexible columnar structures. A flexible columnar structure 120-1 of the plurality 120 includes a flexible column 120-1A, and a metallic cap 120-1B coupled to the apex 120-1 C of the flexible column 120-1A. At least the flexible columnar structure 120-1 and a second flexible columnar structure 120-2 are configured to self-arrange into a close-packed configuration with at least one molecule 220-1 disposed between at least the metallic cap 120-1B and a second metallic cap 120-2B of respective flexible columnar structure 120-1 and second flexible columnar structure 120-2.

Abstract: An apparatus and method is disclosed for simultaneously electroplating at least two parts in a series electrical configuration in an electroplating system using a shared electrolyte with excellent consistency in thickness profiles, coating weights and coating microstructure. Parts in high volume and at low capital and operating cost are produced as coatings or in free-standing form.

Abstract: A robotic device has a base and at least one finger having at least two links that are connected in series on rotary joints with at least two degrees of freedom. A brushless motor and an associated controller are located at each joint to produce a rotational movement of a link. Wires for electrical power and communication serially connect the controllers in a distributed control network. A network operating controller coordinates the operation of the network, including power distribution. At least one, but more typically two to five, wires interconnect all the controllers through one or more joints. Motor sensors and external world sensors monitor operating parameters of the robotic hand. The electrical signal output of the sensors can be input anywhere on the distributed control network. V-grooves on the robotic hand locate objects precisely and assist in gripping. The hand is sealed, immersible and has electrical connections through the rotary joints for anodizing in a single dunk without masking.

Abstract: This invention relates generally to a method and apparatus for electroplating selected portions of a high contact force, high elastic response range pin-receiving and cylindrical electrical contact having a pair of spaced apart cantilever beams which extend forwardly from a base to a pin-receiving end. In accordance with the invention at least one plating cell is provided including a cavity type of enclosure thereof in general matching the outer contour of the lower portion and pin receiving end of the contact whereas plating solution is ejected towards the pin receiving end including at least one conducting device for electric current is provided adjacent to the opposite region of the contact for engaging with thereof whereas electric current is being conducted.

Abstract: This invention relates generally to a method and apparatus for electroplating selected portions of elongate and generally cylindrical metallic articles pre assembled and held in spaced-apart fashion into a nonconductive support member encircled by a metallic tube like member one portion of article extending from one side of support member with the opposing portion of article extending from the opposing end of support member including a locating device to receive the articles so the portion of the articles to be electroplated extends downwardly. At least one plating cell is provided adjacent the lower region for contacting the downwardly extending portion of the articles with plating liquid whereas the plating liquid is ejected towards the articles including at least one conducting device for electric current is provided adjacent to the upper region for engaging with the portion of article extending upwardly whereas the electric current is being distributed to articles evenly and complete.

Abstract: A method of electrochemical deposition uses microdroplets of electrolytic solution over a targeted small circuit element. Only the targeted circuit element is electrically biased so that deposition occurs on the surface of that element, underneath the microdroplet, and nowhere else unless it is under other microdroplet(s). The invented method achieves extremely accurate and selective electrochemical deposition with a tiny amount of electrolytic solution, compared to conventional submersive and/or immersive methods, and eliminates the need for masking or etching, reducing the costs of manufacture and amount of waste electrolytic solution produced.

Abstract: A continuous plating system with mask registration is disclosed herein that uses drums and rollers with protruding pins which engage with guide holes in a masking belt and a lead frame. Through engagement with the pins the masking belt is keyed to the lead frame as the lead frame passes through a plating solution tank.

Abstract: A method of making electromagnetic wave shielded read and write wires is provided. The method includes forming a bottom insulation layer on a bottom shield layer formed on a substrate. Then, forming electrically conductive wire material into openings in a first forming layer to form first and second read wires and first and second write wires. Forming a top insulation layer on the bottom insulation layer and on the wires. Then, forming a second forming layer on the top insulation layer with first, second, third, fourth and fifth openings down to the top insulation layer. Ion milling portions of the top insulation layer exposed by the openings in the second forming layer down to the bottom shield layer, then removing the second forming layer. Then, forming nonmagnetic electrically conductive middle shield layers in the openings in electrical contact with the bottom shield layer and forming a top shield layer on top of the middle shield layer.

Abstract: An electroplating system (30) and process makes electrical current density across a semiconductor device substrate (20) surface more uniform during plating to allow for a more uniform or tailored deposition of a conductive material. The electrical current density modifiers (364 and 37) reduce the electrical current density near the edge of the substrate (20). By reducing the current density near the edge of the substrate (20), the plating becomes more uniform or can be tailored so that slightly more material is plated near the center of the substrate (20). The system can also be modified so that the material that plates on electrical current density modifier portions (364) of structures (36) can be removed without having to disassemble any portion of the head (35) or otherwise remove the structures (36) from the system. This in-situ cleaning reduces the amount of equipment downtime, increases equipment lifetime, and reduces particle counts.

Abstract: Improvements in methods for plating metal on substrates are obtained by providing media in the plating solution in sizes that are less than 60% to 80% smaller than the average dimension of the substrates to be plated. It is also advantageous for the substrates and media to be present in the solution at a volume ratio of above 1/1 to about 5/1. Another embodiment of the invention relates to an apparatus for electroplating a metal deposit on electroplatable substrates.

Abstract: A tool for electroplating a portion of the surface of each of a plurality of pieces includes a first plate having a plurality of holes, and a second plate having a plurality of retaining elements. Each of the holes is configured to receive a piece that is to be electroplated, and to mask a portion of the surface and expose another portion of the surface of the piece. The first and second plates are held together, and a mechanism is provided for shifting one of the plates with respect to the other between a first orientation in which the retaining elements are disengaged from pieces received in the holes and a second orientation in which the retaining elements are engaged with pieces received in the holes. This arrangement allows the pieces to be quickly and easily retained for an electroplating operation and released after the electroplating operation.

Abstract: The invention relates to a method for combinatorially producing a library of materials by means of an electrochemical deposition in an array. The inventive library is made from an array of containers that consist of an electroconductive material, are open to the top and are electroconductively connected to a shared current supply device and is made from a corresponding array of auxiliary electrodes that are electroconductively connected to a shared current supply device and are arranged in such a way that an auxiliary electrode plunges into a container respectively or can be introduced therein without touching said container. The inventive method comprises the following steps: filling the containers with electrolytes having different compositions and containing electrolytically separable elements and applying an electric voltage between the current supply devices of the containers and auxiliary electrodes for obtaining an electrolytic deposition on the surfaces of the containers.

Abstract: A fabricating method and apparatus of an zinc phosphate coating for a varistor has a insulation formed on a surface of a body which does not include two opposite ends of the body formed two outer terminals. The insulation has anti-etch feature for the electrolyte, so that the exposed surface of the body prevents to be etched and to be electroplated a metal material on it. Therefore the varistor has a great fabricating yield and the great shape after electroplating the two outer terminals step.

Abstract: A plating method according to the present invention is capable of plating a substrate with a plated film of a metal such as copper or the like with high adhesion to a seed layer without producing voids in the plated film at a high throughput, not only in recesses having a large width and a small aspect ratio, but also in recesses having a small width and a large aspect ratio, even when relatively narrow recesses and relatively broad recesses are co-present in the substrate. The plating method is performed by preparing a substrate having a relatively narrow recess and a relatively broad recess defined in a surface thereof, performing first plating under plating conditions for filling a metal in the narrow recess, and then performing second plating under plating conditions for filling a metal in the broad recess.

Abstract: A light-transmitting electromagnetic wave-shielding material includes a hydrophilic transparent resin layer laminated on a transparent substrate. An electroless plating layer is laminated on the hydrophilic transparent resin layer in a pattern, and a black pattern section is formed on the hydrophilic transparent resin layer under the electroless plating layer. Therefore, a black electroplating layer is formed to cover the electroless plating layer laminated in a pattern.

Abstract: Methods and apparatuses for in-situ cleaning of semiconductor electroplating electrodes to remove plating metal without requiring !the manual removal of the electrodes from the semiconductor plating equipment. The electrode is placed into the plating liquid and, an electrical current having reverse polarity is passed between the electrode and plating liquid. Plating deposits which have accumulated on the electrode are electrochemically dissolved and removed from the electrode.

Abstract: An apparatus and process for electroplating a pin grid array device having a plurality of pins, the pins having a side surface and an extremity. The apparatus comprises a contact plate defining a plane and having a plurality of electrically conductive flexible contact fingers extending from the contact plate away from the plane, the contact fingers adapted to flex when contacted by the pins. The process comprises contacting each of the plurality of pins with a flexible contact finger extending from a single electrically conductive plate, the conductive plate defining a plane, wherein the flexible contact fingers extend away from the plane.

Abstract: An electroplating system (30) and process makes electrical current density across, a semiconductor device substrate (20) surface more uniform during plating to allow for a more uniform or tailored deposition of a conductive material. The electrical current density modifiers (364 and 37) reduce the electrical current density near the edge of the substrate (20). By reducing the current density near the edge of the substrate (20), the plating becomes more uniform or can be tailored so that slightly more material is plated near the center of the substrate (20). The system can also be modified so that the material that electrical current density modifier portions (364) on structures (36) can be removed without having to disassemble any portion of the head (35) or otherwise remove the structures (36) from the system. This in-situ cleaning reduces the amount of equipment downtime, increases equipment lifetime, and reduces particle counts.

Abstract: A method of anodizing an aluminum substrate comprising heating the substrate to a first temperature of 200° C. to about 380° C.; suspending the substrate into a first electrolyte and applying a first anodizing current to the first electrolyte; rinsing the substrate; heating the substrate to a second temperature of 200° C. to about 380° C.; and suspending the substrate into a second electrolyte and applying a second anodizing current to the second electrolyte, wherein the first electrolyte and second electrolyte each comprise an aqueous solution of at least one salt of alpha-hydroxy acid.

Abstract: The object of the invention is to provide a process for electroplating a work piece (1) which is coated with an electrically conducting or modified polymer, wherein, independently of the work piece to be electroplated, it is possible to simultaneously reduce the current density and shorten the electroplating time. The invention includes, as a first step, that the work piece is connected to a current source (8) by multiple adjoining contact elements (5) and covered with a thin metallic coat, except at the points covered by the contact elements and that subsequently, in a second step, the contact elements are removed and an unbroken metal coat (10) is formed.

Abstract: A method and an apparatus for restricting the areas of contact between components to be plated or coated and liquid solutions containing plating or coating agents, without the use of masking tape. Components made of electrically conductive material are suspended underneath a hood or bell housing which is sized and shaped to receive those portions of the components that should not be plated (or coated). Then the suspended components and the hood or bell housing are fully immersed in a bath of plating (or coating) solution, forming an air pocket under the hood or bell housing. This air pocket surrounds those portions of the components which are not to be plated (or coated) and prevents the liquid solution in the bath from touching those portions. The air acts as a mask that prevents paint or metal from contacting or adhering to surfaces not to be plated (or coated).

Abstract: An apparatus is disclosed having at least one cathode adapted to maintain a line of contact with at least one substrate surface during relative movement therebetween. There is at least one anode located in a spaced relationship to the cathode and an electronically insulating member located between the at least one anode and the at least one cathode adapted to provide a gap between the substrate surface and the insulating member. When placed in a plating bath, the electric field is directed toward conducting patterns on a substrate to uniformly plate the patterns while minimizing plating on the electrode. The same device may also be used for electroetching by reversing the polarity of the electrodes.

Abstract: An efficient method for producing a high-precision, very small metal ball, such as a Cu ball having an outer diameter not greater than 1 mm, comprising the steps of: cutting metal wire having a diameter not greater than 0.3 mm into a predetermined length; melting and solidifying the metal wires to form starting metal pieces (11); charging a plating apparatus having a double-tank structure comprising an outer splash-proofing tank (8) and an inner plating tank (3), comprising a cathode (4) located at a horizontally turning peripheral portion and an anode centrally located inside the tank; turning the inner tank (3) in a forward and reverse direction while plating solution is discharged to the outer tank (8) due to a high speed rotation of the inner tank at 50 to 800 rpm; and electroplating the starting material to form a film of predetermined thickness without generating aggregation of plated product.

Abstract: The invention provides an apparatus and a method for achieving reliable, consistent metal electroplating or electrochemical deposition onto semiconductor substrates. More particularly, the invention provides uniform and void-free deposition of metal onto metal seeded semiconductor substrates having sub-micron, high aspect ratio features. The invention provides an electrochemical deposition cell comprising a substrate holder, a cathode electrically contacting a substrate plating surface, an electrolyte container having an electrolyte inlet, an electrolyte outlet and an opening adapted to receive a substrate plating surface and an anode electrically connect to an electrolyte. Preferably, a vibrator is attached to the substrate holder to vibrate the substrate in at least one direction, and an auxiliary electrode is disposed adjacent the electrolyte outlet to provide uniform deposition across the substrate surface.

Abstract: An apparatus and process for electroplating a pin grid array device having a plurality of pins, the pins having a side surface and an extremity. The apparatus comprises a contact plate defining a plane and having a plurality of electrically conductive flexible contact fingers extending from the contact plate away from the plane, the contact fingers adapted to flex when contacted by the pins. The process comprises contacting each of the plurality of pins with a flexible contact finger extending from a single electrically conductive plate, the conductive plate defining a plane, wherein the flexible contact fingers extend away from the plane.

Abstract: The current density with which the process is used is of essential importance for the economy of a method of electrolytically treating materials. Normally only low or medium current densities are used, as the speed of replacement of consumed materials in the direct vicinity of the surface of the material for treatment has a restrictive effect on the magnitude of the current density at which a usable process result can still be achieved. However, a low current density leads to long electrolysis times and to complex treatment installations.

Abstract: A process and apparatus for the selective electroplating of electrical coct elements, used for coating at least one contact surface of a metal base for the contact elements with an electrolyte, containing a material with a higher conductivity as compared to the base. The electrolyte is applied with a long stretched-out plastic electroplating tip which has a plurality of channel passages through which the electrolyte passes and which are arranged at a right angle to the tip. The plurality of channel passages terminates at and empties into at least one discharge opening which extends along the entire length of the tip. The electroplating tip, when it is in the operating position, is arranged such that the at least one discharge opening is positioned on the bottom and extends horizontally. The electrolyte is supplied to the electroplating tip from above.

Abstract: A method and two-part plating apparatus for plating groups of elongated objects. The plating apparatus includes a fixture and a fixture support. The fixture is configured to loosely retain a group of elongated articles in a generally vertical orientation where the upper ends are contained within a cavity and the lower ends are in contact with a support surface. The cavity includes an electrode which is electrically connected to the upper ends of the elongated articles. The fixture is configured to be placed onto and partially through a fixture support which is in contact with a container of plating solution. The fixture support has a base and an agitation element which moves the fixture with respect to the base, thus shifting and exposing surfaces of the elongated articles to facilitate plating.

Abstract: A process is provided for producing an abrasive coating on a substrate surface by applying a bond coat by low pressure plasma spraying and anchoring to the bond coat abrasive particles by electroplating and embedding the particles into an oxidation resistant matrix by entrapment plating.

Abstract: A method and apparatus for monitoring electrodes for the electrodeposition of paint onto metallic workpieces includes detecting current from the electrodes and displaying a plot of current versus time. A method and apparatus for controlling electrodeposition of paint onto metallic workpieces includes monitoring current from electrodes over time and adjusting a rate of current increase over time. The monitor and/or control may be performed for each electrode individually or for the electrodes as a group. The monitor and/or control allows bad and/or poorly positioned electrodes to be located. The monitor and/or control may be used to stop the electrodeposition coating after a sufficiently thick coating has been obtained.

Abstract: A process for electrochemical treating flow channels of metal workpieces uses a tool extending into the workpieces and an electrolyte flow between the tool and the flow channel. Either volume flow of the electrolyte, or pressure of the electrolyte, or both, are measured in a reference sample workpiece calibrated previously with test oil under high pressure and the determined electrolyte value is stored as a nominal value and used for a subsequent series treatment of the workpieces. This value is used as a regulating variable for termination of the treatment. The pressure of the electrolyte during the electrochemical series treatment of the workpieces is maintained at about 100 bars.

Abstract: A fabrication method for a chip size semiconductor package includes the steps of bonding conductive wires on bonding pads formed on an upper surface of a semiconductor chip, putting the semiconductor chip including the bonded conductive wires in an electrolyzer containing an electrolytic solution in such a manner that one end of each of the conductive wires is exposed outside of the electrolytic solution, attaching a plating electrode to an inner wall of the electrolyzer, attaching a conductive plate to serve as a common electrode to the exposed one end of each of the conductive wires; and connecting the conductive plate and the outer wall of the electrolyzer to an electric current source.

Abstract: A method and apparatus for performing high speed chemical treatment of v type cylinder blocks. First the cylinder bores of one bank are treated. Then those of the other bank are treated. This permits a simple but compact treating plant.

Abstract: A method and apparatus for depositing emitter material (3) on a wire cathode by means of electrodeposition. An amount (13) of a suspension comprising an alkaline-earth compound is transferred by a drop holder (11) which is positioned around the wire (2), by movement in a direction transverse to a longitudinal axis of the wire (2), whereafter an electric voltage is applied to the drop holder (11) and the wire (2) to deposit the emitter material (3) on the wire (2), after which the drop holder (11) is withdrawn from the wire (2) again. During the electrodeposition process the drop holder (11) and the wire (2) can be moved with respect to each other along sections of the wire (2) where the emitter material (3) has to be deposited.

Abstract: A method of and apparatus for producing abrasive tips on compressor or turbine rotor blades by electrolytic or electroless deposition in which the blades are mounted in a hollow jig with the tips of the blades extending through sealed openings in the jig and abrasive tips are formed on the tips. The parts of the blades within the hollow jig are isolated from the electrolyte without the need for wax masking. Preferably the jig is cylindrical with the blades extending radially through at least one circumferential row of apertures. The jig may comprise two end discs and at least one ring in which a circumferential row of apertures is formed. The ring is positioned between the end discs and means are provided for securing the discs and ring together.

Abstract: The invention relates to a method and an apparatus for selectively electroplating apertured products. The products are masked in accordance with the intended plating and subsequently exposed to an electrolyte in order to electroplate the products. For masking purposes a fully closed photoresist layer is electrophoretically applied to the products, and after drying of the photoresist layer, the products are covered with a photomask in accordance with the locations to be plated, after which exposure takes place. Then the photoresist layer is partially removed, while the remaining part of the photoresist layer remains behind on the products, to serve as a mask for the metal products upon electroplating.

Abstract: An electrolytic cell comprised of a tank for holding electrolytic solution, and a drum rotatable about a horizontal axis having a non-conductive cylindrical outer surface disposed within the tank, and a plurality of elongated, like anodes arranged about the outer surface of the drum. The anodes together form a generally continuous cylindrical surface spaced from, and generally conforming to, the outer surface of the drum. Each of the anodes has at least one end projecting through the tank. A plurality of power sources is provided together with connection means for connecting groups of one or more of the projecting ends of the anodes to each power source.

Abstract: The present invention relates to a method and apparatus for forming abrasive surfaces on the tips of a plurality of workpieces such as the tips of gas turbine airfoil blades. The method broadly comprises the steps of providing a mechanical masking device having a plurality of openings arranged around the circumference of the device, installing an array containing a plurality of workpieces to be coated within the mechanical masking device so that portions of the workpieces including the tips thereof extend through the openings, immersing the mechanical masking device with the installed array of workpieces in a tank containing a plating bath with a matrix material and an abrasive grit material in slurry form so that the workpieces lie in a substantially horizontal plane, and applying a current through the plating bath to form the abrasive surfaces on the tips of the workpieces. The mechanical masking device protects portions of the array from the coating operation.

Abstract: An inexpensive method for fabricating a staggered edge connector for a circuit board. The method is cost effective and includes numerous advantages over the prior art, including allowing more area for signal routing and removing the problems associated with capacitive stubs on edge connector traces associated with prior art designs. The method begins with creating a staggered plurality of blades or fingers. A plating bus is formed on these staggered blades by connecting a gold plating bus to one of the contact pads and then shorting together or connecting the signal lines via a shorting bus. The shorting bus is placed flush with the innermost edge of the edge connector well outside of the actual wipe area of the connectors. The board then undergoes a standard semi-additive process, as well as a final etch and subsequent gold plating. The shorting bar is then drilled out.

Abstract: The invention starts with a process for improving the electrolytic coating of work pieces (3) that are arranged one after the other as a row at a distance from each other on cathode rails (1) or on cathode frames in a bath, whereby the cathode treatment current (I) of the rail or the frames runs parallel to the direction of the above mentioned series of work pieces (3). In order to prevent the large differences in layer thickness in the edge area of adjacent work pieces, e.g. circuit boards, that occurs with the state of the art, without having to go to disadvantageous effort to decrease the voltage drop in the cathode rail or a corresponding frame carrier rod (63), it is provided that the direction of the cathode current flow (I) at least in the cathode rail (1) or the cathode frame carrier rod (63) is changed at least once during a treatment process.

Abstract: The invention relates to an apparatus for selectively electroplating apertured products. The products are masked in accordance with the intended plating and subsequently exposed to an electrolyte in order to electroplate the products. For masking purposes a fully closed photoresist layer is electrophoretically applied to the products, and after drying of the photoresist layer, the products are covered with a photomask in accordance with the locations to be plated, after which exposure takes place. Then the photoresist layer is partially removed, while the remaining part of the photoresist layer remains behind on the products, to serve as a mask for the metal products upon electroplating.

Abstract: The invention provides an apparatus and a method for achieving reliable, consistent metal electroplating or electrochemical deposition onto semiconductor substrates. More particularly, the invention provides uniform and void-free deposition of metal onto metal seeded semiconductor substrates having sub-micron, high aspect ratio features. The invention provides an electrochemical deposition cell comprising a substrate holder, a cathode electrically contacting a substrate plating surface, an electrolyte container having an electrolyte inlet, an electrolyte outlet and an opening adapted to receive a substrate plating surface and an anode electrically connect to an electrolyte. Preferably, a vibrator is attached to the substrate holder to vibrate the substrate in at least one direction, and an auxiliary electrode is disposed adjacent the electrolyte outlet to provide uniform deposition across the substrate surface.