Abstract: In the manufacture of a printed circuit board a sacrificial tin-lead layer is deposited on the surface of the board by electroplating. Holes are then formed in the board by UV laser ablation. Debris from the ablation process is adsorbed on the sacrificial layer. The sacrificial layer is then removed by means of a chemical stripping process, along with the debris.

Abstract: One method for fabricating solderable pads (406) onto a substrate (220) for direct chip attachment uses a multilayer metallization coating (500). The coating has a bottom layer (202) of indium-tin oxide, with an intermediate layer (204) of copper and a top layer (206) of indium-tin oxide. A masking layer (208) is deposited on the active display area (402) of the substrate, leaving the bonding pads uncovered. The revealed bonding pads are then plasma etched, using the polyimide as an etch resist, and the top layer of ITO is selectively removed to reveal the underlying copper layer. The exposed copper layer (204) is then plated with a solderable metal to the desired thickness to form bonding pads that may be used with direct chip attachment schemes.

Abstract: Black- or brown-oxidised copper laminates that are to be integrated into an electrical multilayer laminate in a subsequent process step are electrochemically reduced in order to avoid the formation of so-called "pink rings". To that end, they are connected as the cathode of an electrolysis in a suitable electrolyte. The atomic hydrogen produced in statu nascendi during the electrolysis completely or partially reduces the copper oxide layer on the metallic regions of the copper laminates, whereby the resistance of the surfaces of the metallic regions of the copper laminates to subsequent acid attack is considerably improved. The electrochemical reduction may optionally be coupled with a chemical reduction or precede a chemical reduction.

Abstract: A process for patterned electroplating involves the steps of: (i) coating a substrate with a layer of hydroxyquinoline which acts as an adhesion promoter; (ii) coating the adhesion layer with a radiation sensitive polymeric resist; (iii) imagewise exposing the film to radiation; (iv) developing the image to patternwise expose the substrate; (v) electroplating metal onto the exposed portions of the substrate; and (vi) removing the remaining polymeric film from the substrate.

Abstract: A tool and process for electroetching metal films or layers on a substrate employs a linear electrode and a linear jet of electrolyte squirted from the electrode. The electrode is slowly scanned over the film by a drive mechanism. The current is preferably intermittent. In one embodiment a single wafer surface (substrate) is inverted and the jet is scanned underneath. In another embodiment wafers are held vertically on opposite sides of a holder and two linear electrodes, oriented horizontally and on opposite sides of the holder, are scanned vertically upward at a rate such that the metal layers are completely removed in one pass. The process is especially adapted for fabricating C4 solder balls with triple seed layers of Ti-W (titanium-tungsten alloy) on a substrate, phased Cr-Cu consisting of 50% chromium (Cr) and 50% copper (Cu), and substantially pure Cu. Solder alloys are through-mask electrodeposited on the Cu layer. The seed layers conduct the plating current.

Abstract: According to a method of manufacturing a microwave tube collector of this invention, a copper plating layer in which powder particles of a material having a secondary electron emissivity of not more than 1 are dispersed and precipitated is formed on a surface of a collector electrode. Only the copper plating layer is selectively etched for a predetermined period of time to increase the degree of exposure and the surface area of the powder particles of the material having a secondary electron emissivity of 1 or more in the copper plating layer.

Abstract: A wiring pattern forming method in which side etch of a wiring pattern at the time of etching the substrate copper foil of a copper plating pattern is reduced to hold down an increase in line resistance, the wiring pattern forming method including the steps of: providing a plating resist pattern of which open area comprises a wiring pattern on the surface of a copper-clad laminate which is obtained by providing a copper foil on an insulating substrate; plating such open area with copper to form a copper plating pattern; then plating a crevice between the copper plating pattern and the plating resist pattern with a solder film by alternately repeating application of a current for a predetermined time period and suspension of the current application for a predetermined time period; and etching away the copper foil by using the solder film as an etching resist to form the wiring pattern.

Abstract: Annular grooves having substantially V-shaped cross sections are formed on the front surface and the rear surface of a grille body. A through hole communicating to the front surface and the rear surface of the grille body is also formed so that the front aperture may be smaller than the rear aperture. A protrusion is formed on the rear surface of the grille body, which is located inner than the groove. The grille body is immersed into a chemical plating solution to form a chemical plating layer on the entire surface of the grille body except for the bottoms of the grooves.

Abstract: A method and apparatus for continuously forming primed circuits, the apparatus including a cylindrical drum rotatable about a generally vertical axis and a tank for holding an electrolytic plating solution. The tank is dimensioned to surround a lower portion of the drum and immerse the lower portion of the drum in the electrolytic plating solution. Means for introducing electrolytic solution into the tank are provided, and a plurality of metallic anodes are disposed within the tank surrounding and facing the lower portion of the drum defining a generally uniform gap therebetween. A plurality of cathodes are disposed above the tank and facing an upper portion of the drum, the cathodes being biased toward the drum. The apparatus is adapted to receive a movable continuous flexible web having a thin layer of conductive metal on one side thereof. The metal layer is masked to expose a plurality of patterns aligned along the web and a continuous strip of exposed metal along one edge of the web.

Abstract: A method of providing selective silver plating to a lead frame structure 10 performs the silver plating operation prior to etching the lead frame, thereby avoiding mechanical damage to the lead frame during plating, and producing finished silver spots 24 on the top surface of the lead frame only, with no plating on the gauge. The disclosed method includes the steps of applying a layer of photoresist 42 to a surface of a sheet of lead frame material 40, exposing areas of the photoresist such as to define selected regions 44, developing the photoresist 42 to uncover the lead frame material 40 at the selected regions 44, and plating the surface of the sheet defined by the layer of photoresist 42 with an electrically conductive material 46.

Abstract: A micromachined valve and valve array having one or more pores which are electrochemically opened and closed by dissolving and redepositing a barrier layer across a tiny opening or pore in substrate. The pore is spanned by two electrodes which apply a voltage to an electrolytic barrier layer material which dissolves in an electrolyte. Each open pore has a distinct flow rate related to its minimal cross-sectional area which together can form a binary sized array with each subsequent member in the array having a flow rate twice as large as the preceding member in the array. Any integral multiple of the smallest flow rate may be achieved by opening an appropriate combination of the pores with addressing logic. In a preferred embodiment, each bit in a binary representation of the desired flow rate acts as a switch for a pore having a flow rate corresponding to the bit position.

Abstract: An electrochemical fine processing method for forming a pattern of a substance having different etching resistance against an etching solution from that of an article by bringing the minute forward end of the counter electrode close to the surface of the article. The counter electrode is applied a predetermined electric potential and the electrochemical reaction is repeating in a minute region of the article in the vicinity of the counter electrode to form an optional pattern. After forming the pattern, the article is etched in an etching solution having a property of different etching rate for the pattern forming portion and a portion other than the pattern forming portion. It become possible to form a fine pattern directly onto the surface of an article to be processed having surface unevenness.

Abstract: A new metallization is described which is a composite of subsequent metal layers beginning with a layer of titanium and having in an ascending order the following composition: Ti--TiPd--Cu--Ni--Au. TiPd is an alloy of titanium and palladium containing from 0.3 to 14 weight percent Pd, by the weight of the alloy. The TiPd alloy is etchable in an aqueous HF solution containing from 0.5 to 2.0 and higher, preferably from 0.5 to 1.2 weight percent HF. The use of the TiPd alloy avoids the occurrence of Pd residues remaining after the etching of Ti layer and lift-off (rejection etching) of Pd layer in a prior art Ti--Pd--Cu--Ni--Au metallization. Ti and TiPd layers are present in a thickness ranging from 100 to 300 nm and from 50 to 300 nm, respectively, and in a total minimum thickness needed to maintain bonding characteristics of the metallization.

Abstract: A method of manufacturing a screen printing plate which can be obtained without using a mother mesh sheet and a resist film including a step of providing a non-plating area on the roll and exposing the roll coated with high-sensitivity photosensitive film by a multiple number of laser beams. The multiple number of laser beams are controlled by preset electric data so that the desired halftone points of negative halftone image are exposed on the roll.

Abstract: A method of producing a thin-film magnetic head on a carrier (1) comprising depositing an electrically conducting plating-base (2) and electroplating flux conductors (4a, 4b) and a magnetically insulating layer (8) on the plating-base. This provides a planar structure on which an electrically insulating layer (9) and a magneto-resistance element (10) are applied. The plating-base (2) also constitutes the gap layer.

Abstract: A process and apparatus for advanced semiconductor applications which involves the selective electrodeposition of metal on a semiconductor wafer is described. The present invention has significant economic and performance advantages over the current state of the art. It addresses problems associated with cleanliness (a major issue with sub-micron processing) , metal thickness uniformity, step coverage and environmental concerns.A metal with better device performance capabilities compared to the standard aluminum is also employed. The hardware allows the selective deposition to occur without allowing the electrolyte to contact the rear of the wafer or the electrodes contacting the front wafer surface. A virtual anode improves the primary current distribution improving the thickness uniformity while allowing optimization of other film parameters with the remaining deposition variables.

Abstract: This invention relates to a process for preparing a magnetic disk, which comprises (a) subjecting a substrate having an anodized aluminum film to mirror surface-finishing, (b) widening pores of the anodized aluminum film by chemical dissolution treatment so that the total area of pores becomes from 20 to 80% of the entire surface area, thereby retaining crystalline alumina of the anodized aluminum film extruded after the chemical dissolution treatment, and (c) coating the resultant substrate with a magnetic continuous thin film.

Abstract: A roller for a printing machine is formed having oleophilic metal cells and hydrophilic ceramic cross pieces. The ceramic material is applied to the outer surface and is then ground away to again expose the metal. An upper portion of the metal is then removed to leave the elevated hydrophilic ceramic cross pieces.

Abstract: A method for producing a tin free steel having double layers consisting of a lower layer of flatly deposited metallic chromium and an upper layer of insoluble hydrated chromium oxide which is characterized by a dissolution of soluble hydrated chromium oxide after the formation of three layers consisting of a bottom layer of metallic chromium, a middle layer of insoluble hydrated chromium oxide and an upper layer of soluble hydrated chromium oxide on a steel base by using a chromic acid electrolyte with a small amount of fluoride compound.By using this tin free steel, a welded can body can be produced at high speed without the removal of the plated layer in the welded part because this tin free steel has an excellent weldability.

Abstract: A method for fabricating conductors in dielectric trenches in a self-aligned manner. Interconnect modules with a high conductor density are achieved by using a copper-polyimide system as a versatile packaging approach. A photosensitive polyimide is applied to a substrate and lithographically patterned to form polyimide steps having a characteristic positive slope, between which are defined trenches in which the substrate is exposed. A thin electroplating seed layer is deposited over the polyimide steps and the substrate. Copper is electroplated into trenches, but does not plate onto the tops of the polyimide steps, since the electroplating seed layer at that location is not electrically connected to the electroplating seed layer in the bottom of the trenches. The electroplating seed layer on top of the polyimide steps is then removed by chemical etching, plasma machining, or ion-milling.

Abstract: This invention relates to a process for preparing a magnetic disk, which comprises (a) subjecting a substrate having an anodized aluminum film to mirror surface-finishing, (b) widening pores of the anodized aluminum film by chemical dissolution treatment so that the total area of pores becomes from 20 to 80% of the entire surface area, thereby retaining crystalline alumina of the anodized aluminum film extruded after the chemical dissolution treatment, and (c) coating the resultant substrate with a magnetic continuous thin film.