Abstract: The invention relates to a cyanide-free formulation for the electrodeposition of a layer of gold and silver on electrically conductive substrates, wherein the formulation respectively contains a complexing agent from the group of sulfites and thiosulfates and is characterized in that at least one transition metal from the 5th or 6th sub-group is added in the form of the soluble oxygen acid thereof in order to increase the bath stability.

Abstract: The present invention provides a technology for, in copper electrolytic plating containing silver ions as an alloy component, obtaining a copper electrolytic plating film in which co-deposition of sulfur can be significantly suppressed and which is excellent in physical properties such as strength and hardness even after a high-temperature heat treatment at about 200° C. or higher. The present invention is a copper electrolytic plating bath comprising copper ions, an acid, chloride ions, and a complexing agent, wherein the copper electrolytic plating bath further comprises silver ions as an alloy component, and wherein methionine or a derivative thereof is contained as the complexing agent.

Abstract: A method for the galvanoplastic deposition of a gold alloy on an electrode dipped into a bath including gold metal, organometallic compounds, a wetting agent, a sequestering agent and free cyanide, the alloy metals being copper metal and silver metal allowing a mirror-bright yellow gold alloy to be deposited on the electrode characterized in that the bath respects a proportion of 21.53% gold, 78.31% copper and 0.16% silver.

Abstract: The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. In many cases the material is a metal and the substrate is a semiconductor wafer, though the embodiments are no so limited. Typically, the embodiments herein utilize a channeled plate positioned near the substrate, creating a cross flow manifold defined on the bottom by the channeled plate, on the top by the substrate, and on the sides by a cross flow confinement ring. During plating, fluid enters the cross flow manifold both upward through the channels in the channeled plate, and laterally through a cross flow side inlet positioned on one side of the cross flow confinement ring. The flow paths combine in the cross flow manifold and exit at the cross flow exit, which is positioned opposite the cross flow inlet. These combined flow paths result in improved plating uniformity.

Abstract: Indium compositions including hydrogen suppressor compounds and methods of electrochemically depositing indium metal from the compositions onto substrates are disclosed. Articles made with the indium compositions are also disclosed.

Abstract: Silver electroplating baths having certain sulfide compounds and methods of electrodepositing a silver-containing layer using these baths are disclosed. Such electroplating baths are useful to provide silver-containing solder deposits having reduced void formation and improved within-die uniformity.

Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.

Abstract: The invention concerns the field of galvanic depositions and relates to a method of galvanoplastic deposition of a gold alloy on an electrode dipped into a bath including metal gold in alkaline aurocyanide form, organometallic compounds, a wetting agent, a sequestering agent and free cyanide. According to the invention, the alloy metals are copper, in double copper and potassium cyanide form, and silver in cyanide form, allowing a mirror bright yellow gold alloy to be deposited on the electrode.

Abstract: The invention relates to a make-up solution for a galvanic bath comprising organometallic components, a wetting agent, a complexing agent and free cyanide, wherein the make-up solution further comprises copper in the form of copper II cyanide and potassium, and complex indium allowing, after addition of alkaline aurocyanide, to galvanically depositing a gold alloy.

Abstract: The invention is an apparatus and method for forming highly uniform layers of metal on a substrate by electro-deposition. The substrate is electroplated in a bath composed of a quiescent (i.e., no external agitation) electrolyte solution using an effective constant current density carefully selected to match the chemical composition of the electrolyte.

Abstract: Presented are one or more aspects and/or one or more embodiments of catalysts, methods of preparation of catalyst, methods of deoxygenation, and methods of fuel production.

Abstract: Presented are one or more aspects and/or one or more embodiments of catalysts, methods of preparation of catalyst, methods of deoxygenation, and methods of fuel production.

Abstract: The invention relates to an anti-fretting layer (5) for a multi-layer plain bearing (1), the anti-fretting layer being composed of a copper-based alloy, which in addition to copper as the main alloying element contains at least one element from the group comprising germanium, tin, indium, zinc, nickel, cobalt, bismuth, lead, silver and antimony and unavoidable impurities originating from production, wherein the total fraction of said alloying elements is at least 1 wt. % and at most 30 wt. %, and wherein copper mixed-crystal grains comprising copper and the at least one element are present in the copper alloy, wherein the copper mixed-crystal grains are oriented in such a way that an orientation index M{hkl} according to formula (I) M ? { hkl } = I ? { hkl } ? ? I 0 ? { hkl } I 0 ? { hkl } ? ? I ? { hkl } of each of the lattice plane sets {hkl} has a value of less than 3.

Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.

Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.

Abstract: Compositions and methods for depositing gold alloys are disclosed. The compositions include certain dithiocarboxylic acids, salts and esters thereof and mercapto group containing compounds which provide bright gold alloy deposits with uniform color.

Abstract: A method and apparatus for electrolytically producing oxidation reduction potential water from aqueous salt solutions for use in disinfection, sterilization, decontamination, wound cleansing. The apparatus includes an electrolysis unit having a three-compartment cell (22) comprising a cathode chamber (18), an anode chamber (16), and a saline solution chamber (20) interposed between the anode and cathode chambers. Two communicating (24, 26) membranes separate the three chambers. The center chamber includes a fluid flow inlet (21a) and outlet (21b) and contains insulative material that ensures direct voltage potential does not travel through the chamber. A supply of water flows through the cathode and anode chambers at the respective sides of the saline chamber. Saline solution flows through the center chamber, either by circulating a pre-prepared aqueous solution containing ionic species, or, alternatively, by circulating pure water or an aqueous solution of, e.g.

Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.

Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.

Abstract: To develop stable, non-cyanide silver and silver alloy plating baths. The present invention is a silver and silver alloy plating bath, comprises: (A) a soluble salt, comprising a silver salt or a mixture of a silver salt and a salt of a metal selected from the group consisting of tin, bismuth, cobalt, antimony, iridium, indium, lead, copper, iron, zinc, nickel, palladium, platinum, and gold; and (B) at least one aliphatic sulfide compound comprising a functionality selected from the group consisting of an ether oxygen atom, a 3-hydroxypropyl group, and a hydroxypropylene group, with the proviso that the aliphatic sulfide compound does not comprise a basic nitrogen atom.

Abstract: The invention relates to a method of galvanoplastic deposition of a gold alloy on an electrode dipped into a bath including metal gold in alkaline aurocyanide form, organometallic compounds, a wetting agent, a sequestering agent and free cyanide. According to the invention, the alloy metals are copper, in double copper and potassium cyanide form, and silver in cyanide form, allowing a mirror bright yellow gold alloy to be deposited on the electrode. The invention concerns the field of galvanic depositions.

Abstract: A method of electroplating conductive material on semiconductor wafers controls undesirable surface defects by reducing the electroplating current as the wafer is being initially immersed in a plating bath. Further defect reduction and improved bottom up plating of vias is achieved by applying a static charge on the wafer before it is immersed in the bath, in order to enhance bath accelerators used to control the plating rate. The static charge is applied to the wafer using a supplemental electrode disposed outside the plating bath.

Abstract: A stable FePt plating solution is provided. Further, a process for electroplating is provided for producing an FePt magnetic material having an especially strong coercive force and excellent properties by using the plating solution. The plating solution contains ionic Fe, ionic Pt, and a complex agent, at a molar ratio (Fe/Pt) of the ionic Fe to the ionic Pt ranging from 0.75 to 3.

Abstract: To develop stable, non-cyanide silver and silver alloy plating baths. The present invention is a silver and silver alloy plating bath, comprises: (A) a soluble salt, comprising a silver salt or a mixture of a silver salt and a salt of a metal selected from the group consisting of tin, bismuth, cobalt, antimony, iridium, indium, lead, copper, iron, zinc, nickel, palladium, platinum, and gold; and (B) at least one aliphatic sulfide compound comprising a functionality selected from the group consisting of an ether oxygen atom, a 3-hydroxypropyl group, and a hydroxypropylene group, with the proviso that the aliphatic sulfide compound does not comprise a basic nitrogen atom.

Abstract: A method of forming an Sn—Ag—Cu ternary alloy thin-film of the present invention forms the ternary alloy thin-film by electroplating. A plating bath contains an Sn compound, an Ag compound, a Cu compound, an inorganic chelating agent and an organic chelating agent. The inorganic chelating agent is one of a polymerized phosphate-based chelating agent and a chelating agent represented by a chemical formula (I): MFX(X—Y)— . . . (I) where M is an arbitrary metal, X is an arbitrary natural number and Y is an oxidation number of M. The organic chelating agent is one of porphyrins, dipivaloylmethane, phthalocyanines and a compound represented by a chemical formula (II): R—(CH2CH2O)n-A . . . (II) where R is an alkyl group having a carbon number of 8 to 30, A is CH2COONa or CH2SO4Na and n is a natural number.

Abstract: Compositions and methods for depositing gold alloys are disclosed. The compositions include certain dithiocarboxylic acids, salts and esters thereof and mercapto group containing compounds which provide bright gold alloy deposits with uniform color.

Abstract: The invention is a method for the production of a composite multilayer material having a backing layer, a bearing metal layer of a copper alloy or an aluminum alloy, a nickel intermediate layer and an overlay consisting of about 0-20 wt. % copper and about 0-20 wt. % silver, the combined maximum wt. % of copper and silver being about 20 wt. %, the rest being bismuth, and the layer thickness of the nickel layer amounts to more than 4 ?m by electrodeposition, in which the overlay is deposited from methyl sulphonic acid-based electrolyte.

Abstract: An electrolytic plating method, including: preparing a plating solution including water which is a primary medium, a sulfonic acid, and tin, copper, and silver ions, and a complexing agent, concentrations of the sulfonic acid, and tin, copper, and silver ions being 0.5 to 5 mol/L, 0.21 to 2 mol/L, 0.002 to 0.02 mol/L, and 0.01 to 0.1 mol/L, respectively, a mole ratio of the silver-ion concentration to the copper-ion concentration being in a range of 4.5 to 5.58; and separating a solution around a soluble anode containing 90 percent or more of tin from the plating solution on a cathode side by a non-ionic micro-porous membrane having a pore diameter of 0.01 to 0.05 ?m and a thickness of 5 to 100 ?m.

Abstract: The invention relates to the regeneration of an electrolysis bath for the production of I-III-VI<SB>Y</SB> compounds in thin layers, where y is approaching 2 and VI is an element including selenium, whereby selenium is regenerated in the form Se(IV) and/or with addition of oxygenated water to reoxidise the selenium in the bath to give the form Se(IV).

Abstract: A method for plating a homogenous copper-palladium alloy. The method includes providing a plating solution to an electrochemical plating cell. The plating solution includes a copper ion source at a concentration of between about 0.1 M and about 1.0 M and a palladium ion source at a concentration of between about 0.0005 M and about 0.1 M. The method further includes supplying an electrical deposition bias to a plating surface. The electrical deposition bias is configured to simultaneously deposit copper ions and palladium ions onto the plating surface.

Abstract: A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as the ductility, micro-throwing power and macro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.

Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfate electroplating baths has a number of unexpected benefits including wider useful current density range, improved appearance and in the case of tin improved oxidative stability. The metals and alloys include but are not limited to tin, nickel, copper, chromium, cadmium, iron, rhodium, ruthenium, iron/zinc and tin/zinc.

Abstract: A metal plating bath and method for plating a metal on a substrate. The metal plating bath contains hydroxylamines that inhibit the consumption of additive bath components to improve the efficiency of metal plating processes. The additive bath components are added to metal plating baths to improve brightness of plated metal as well as the micro-throwing and macro-throwing power of the bath. In addition to brighteners, the additive bath components may include levelers, suppressors, hardeners, and the like. The hydroxylamines that inhibit additive consumption may be employed in metal plating baths for plating copper, gold, silver, platinum, palladium, cobalt, cadmium, nickel, bismuth, indium, tin, rhodium, iridium, ruthenium and alloys thereof.

Abstract: A process for the electrolytic deposition of a metal, preferably copper or an alloy of copper, directly onto a barrier layer coated on a dielectric layer. The process is advantageous because it electrolytically deposits metal in a pattern that is either the duplicate of a first conductive pattern under the dielectric or the inverse image of the first conductive pattern, depending on the first conductive pattern shape. Thus, metal is deposited on the barrier layer duplicating a first conductive pattern under the dielectric layer when the first pattern is a serpentine pattern and the metal deposits in the spaces between the conductive lines of a first conductive pattern of a discrete passive element such as a spiral.

Abstract: A method for forming a quaternary alloy film of Co—W—P—Au for use as a diffusion barrier layer on a copper interconnect in a semiconductor structure and devices formed incorporating such film are disclosed. In the method, a substrate that has copper conductive regions on top is first pre-treated by two separate pre-treatment steps. In the first step, the substrate is immersed in a H2SO4 rinsing solution and next in a solution containing palladium ions for a length of time sufficient for the ions to deposit on the surface of the copper conductive regions. The substrate is then immersed in a solution that contains at least 15 gr/l sodium citrate or EDTA for removing excess palladium ions from the surface of the copper conductive regions.

Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfate electroplating baths has a number of unexpected benefits including wider useful current density range, improved appearance and in the case of tin improved oxidative stability. The metals and alloys include but are not limited to tin, nickel, copper, chromium, cadmium, iron, rhodium, ruthenium, iron/zinc and tin/zinc.

Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy halide electroplating baths has a number of unexpected benefits including wider useful current density range and improved appearance. The metals and metal alloys include but are not limited to tin, lead, copper, nickel, zinc, cadmium, tin/zinc, zinc/nickel and tin/nickel.

Abstract: An aqueous solution for the reductive deposition of metals comprising, besides water, (A) a phosphine of the general formula (1)  in which R1, R2, and R3 denote lower alkyl groups, at least one of which being hydroxy-or amino-substituted lower alkyl group, and (B) a soluble compound of a metal or a compound of a metal solubilized through the formation of a soluble complex by said phosphine.

Abstract: A process for producing a copper-indium-sulfur-selenium thin film which comprises subjecting an electro-conductive substrate to an electrodeposition treatment in the presence of copper sulfate, indium sulfate, selenium dioxide, and thiourea. A process for producing a chalcopyrite crystal which comprises subjecting an electro-conductive substrate to an electrodeposition treatment in the presence of copper sulfate, indium sulfate, selenium dioxide, and thiourea, and then conducting a heat treatment.

Abstract: Electrolyte for electroplating of chromium based coatingThe electrolyte consists of:a liquid component, containing hexavalent ions of chromiuma metal component, chosen from the group II of the Periodical Tablea particulate solid component, comprising a compound of refractory metal of the groups IVb, Vb of VIb of the Periodical Table.Chromium based coating is electroplated from an electrolytic bath, containing said electrolyte. The coating consists of a matrix, presented by solid solution of chromium with said metal component and of distributed within said matrix particles of a solid component. The coating has improved wear resistance, corrosion resistance and plasticity and it can be deposited both on metallic and non-metallic substrates.

Abstract: A solution for use in electroplating which comprises at least one monovalent metal such as copper, silver or gold which is complexed by a thiosulfate ion; and a stabilizer of an organic sulfinate compound such as, for example, one having the formula R-SO.sub.2 -X wherein R is an alkyl, heterocyclic or aryl moiety and X is a monovalent cation. The stabilizer is present in an amount sufficient to stabilize the thiosulfate ion when the solution is operated at an acidic pH of less than 7. Also, the solution is substantially free of cyanide.