Abstract: A zinc electroplating bath includes zinc ions and a brightening agent. The brightening agent is a polyamine or a mixture of polyamines that include a quaternary ammonium group.

Abstract: An apparatus (12) for applying a zinc or zinc-alloy electroplate to a workpiece comprises an electroplating bath (16) having a pH more than about 14. The electroplating bath includes zinc ions and an additive. A cathode workpiece (18) is in the bath. An anode assembly (20) contacts the bath. The anode assembly includes an anolyte and an insoluble metal anode in the anolyte. The additive is capable of electrolytically breaking down upon contact with the anode. The anode assembly inhibits the electrolytic breakdown of the additive.

Abstract: Techniques for electrodepositing zinc (Zn)-containing films are provided. In one aspect, a method of preparing a Zn electroplating solution is provided. The method includes the following steps. The solution is formed from a mixture of at least one zinc salt, a sulfonic acid and a solvent. The sulfonic acid is quenched with a base. A pH of the solution is adjusted to be either less than about 3.5 or greater than about 8.0. The pH of the solution can be adjusted by adding additional sulfonic acid to the solution to adjust the pH of the solution to be less than about 3.5 or by adding a second base to the solution to adjust the pH of the solution to be greater than about 8.0. A Zn electroplating solution and an electroplating method are also provided.

Abstract: A galvanization system comprising an alkaline galvanization bath, a positive electrode, and a negative electrode is provided. The alkaline galvanization bath comprises galvanizing solution including about 7 to about 60 g/l of Zn, about 70 to about 200 g/l of alkali hydroxide and about 0.01 to about 5 g/l of additives. The positive electrode is insoluble in the galvanizing solution, having an opposed surface to an object which is supposed to be set in the alkaline galvanization bath and galvanized. The opposed surface of the positive electrode is formed in a rectangular pattern having a side equal to or less than 30 mm or in a circular pattern having a diameter equal to or less than 30 mm. The galvanization system can produce a galvanization membrane of excellent appearance.

Abstract: A galvanization system comprising an alkaline galvanization bath, a positive electrode, and a negative electrode is provided. The alkaline galvanization bath comprises galvanizing solution including about 7 to about 60 g/l of Zn, about 70 to about 200 g/l of alkali hydroxide and about 0.01 to about 5 g/l of additives. The positive electrode is insoluble in the galvanizing solution, having an opposed surface to an object which is supposed to be set in the alkaline galvanization bath and galvanized. The opposed surface of the positive electrode is formed in a polygonal pattern having a side equal to or less than 30 mm, which connects arbitrary two apexes of the pattern, in a polygonal pattern having a vertical line equal to or less than 30 mm, drawn between an arbitrary apex and an arbitrary side of the pattern, or in a circular pattern having a diameter equal to or less than 30 mm. The galvanization system can produce a galvanization membrane of excellent appearance.

Abstract: An aqueous alkaline non-cyanide zinc electroplating bath containing zinc ions for producing bright electrodeposits of zinc and a brightening agent comprising a polymeric quaternary amine and a reducing sugar, and a compound that forms a reducing sugar upon hydrolysis.

Abstract: An aqueous alkaline non-cyanide zinc electroplating bath containing zinc ions for producing bright electrodeposits of zinc and a brightening agent comprising a polymeric quaternary amine and a reducing sugar, and a compound that forms a reducing sugar upon hydrolysis.

Abstract: An aqueous alkaline cyanide-free bath for the galvanic deposition of zinc or zinc alloy coatings on substrate surfaces is described, which contains in addition to a source of zinc ions and optionally a source of further metal ions, also hydroxide ions and a polymer of the general formula A that is soluble in the bath as well as optionally conventional additives. The bath may furthermore contain a quaternary derivative of a pyridine-3-carboxylic acid of the formula B and/or a quaternary derivative of a pyridine-3-carboxylic acid of the formula C A process for the galvanic deposition of zinc coatings and zinc alloy coatings using the aforedescribed bath is also described. By using the baths according to the invention it is possible to produce coatings that exhibit a uniform layer thickness combined with a high gloss, and which do not exhibit any tendency to exfoliate.

Abstract: According to one aspect of the disclosure, the present invention provides methods and arrangements for milling the substrate of a semiconductor device and exposing a selected region in the substrate. A laser is directed at a selected area of the back side of the device to create a small marker to be used for alignment during the milling process. The substrate is then milled to expose the selected area within the substrate, using the marker as alignment.

Abstract: This invention provides a composite foil comprising an aluminum carrier layer and an ultra-thin copper foil having a protective layer disposed between them comprising a porous copper layer and an interpenetrating zinc layer. A process for producing such composite foils comprises the steps of preparing the surface of the aluminum carrier, electrodepositing a porous copper layer on the aluminum carrier layer followed by electrodepositing a zinc layer, and then electrodepositing two layers of copper to form the ultra-thin copper foil. The composite foil provides a uniform bond strength between the aluminum carrier and the protective layer which is adequate to prevent separation of the carrier and ultra-thin copper foil during handling and lamination, but which is significantly lower than the peel strength of a copper/substrate bond, so that the carrier can easily be removed after lamination of the composite foil to an insulating substrate.

Abstract: There is disclosed an aqueous chemical solution that consists essentially of zinc ions, a source of hydroxides, and silicon ions. The ratio of silicon to zinc (Si:Zn) is, by weight from about 1:5 to about 1:250. Within the ratio range, the silicon ions inhibit precipitation of zinc from the chemical solution. This is particularly useful when the chemical solution is an electrolyte for the deposition of zinc or a zinc containing compound onto a metallic structure where a critical zinc content must be maintained to impart adequate adhesion of a coated substrate to a polymer adhesive.

Abstract: An aqueous bath for electrodepositing zinc and zinc alloys wherein the alloying metals are selected from the group consisting of iron, cobalt and nickel and containing an effective additive amount of a quaternary ammonium polymer to produce enhanced deposits. A process for electrodepositing zinc and zinc alloys using the baths of the invention is also disclosed.